PCB Ceramic Substrate

Description: systems, such as: Altimeters L1 and L2 GPS RF Communications (UHF/VHF) Traffic Avoidance Collision Systems (TCAS) Broadband WiFi Ceramic Components for Antennas, RF, & Microwave Metallized Antenna Components Severe-service ceramic-metal and metallized antenna components and arrays

• Features: Specialty / Other

Description: CoorsTek is the leader in custom and standard thin-film ceramic substrates. Four thin-film substrate material options combine smooth surface finish, strong flexural strength, and consistent electrical properties. Why Ceramic Thin-Film Substrates? Alumina is an

• Thickness: 0.005 to 0.06 inches
• Features: Dielectric / Insulating, Specialty / Other

Description: CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. Why Ceramic Thick-Film Substrates?

• Thickness: 0.01 to 0.14 inches
• Features: Dielectric / Insulating, Specialty / Other

Description: CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. Why Ceramic Thick-Film Substrates?

• Features: Dielectric / Insulating, Specialty / Other

Description: Silicon Nitride Substrate Description : Silicon nitride ceramic substrate is a ceramic substrate with silicon nitride (Si3N4) as the main crystal phase, also known as silicon nitride ceramic substrate. Silicon nitride ceramic is a kind of high

• Density: 3.1999979803934133 g/cc
• Thermal Conductivity: 15 to 20 W/m-K
• MOR / Flexural Strength: 87,022.1036143182 psi
• Compressive / Crushing Strength: 362,592.0983929925 psi

Description: Direct Plated Copper (DPC) is a newest development in the field of Ceramic Substrate PCBs, its process is by magnetron sputtering technology to deposit a metal layer (Ti/Cu target) on the surface of the ceramic substrate which result in copper thickness' ranging

• Features: Other, Specialty / Other, Specialty Ceramic

Description: Description What is the Ceramic PCB Substrate? FX PCB listed two kinds of Ceramic PCBs, which are Aluminum Nitride Ceramic PCB and Alumina Ceramic PCB (ALN and AI203) Properties for your reference: BECAUSE OF ITS HIGH THERMAL

• Thickness: 0.00984251968503937 to 0.014960629921259842 inches
• Electrical Resistivity: 10 ohm-cm
• Features: Specialty / Other

Description: Description Ceramic PCB Materials Properties: FX PCB use the ceramic material imported from Germany and Fujian Huaqing, all incoming material will be strictly checked for the material properties. See the capability of FX PCB for the Ceramic. Ceramic

• Thickness: 0.00984251968503937 to 0.11811023622047244 inches
• Electrical Resistivity: 10 ohm-cm
• Features: Specialty / Other

Description: Description Ceramic PCB Materials Properties: FX PCB use the ceramic material imported from Germany and Fujian Huaqing, all incoming material will be strictly checked for the material properties. See the capability of FX PCB for the Ceramic. Ceramic

• Thickness: 0.00984251968503937 to 0.11811023622047244 inches
• Electrical Resistivity: 10 ohm-cm
• Features: Specialty / Other

Description: Description Ceramic PCB Materials Properties: FX PCB use the ceramic material imported from Germany and Fujian Huaqing, all incoming material will be strictly checked for the material properties. See the capability of FX PCB for the Ceramic. Ceramic

• Thickness: 0.00984251968503937 to 0.11811023622047244 inches
• Electrical Resistivity: 10 ohm-cm
• Features: Specialty / Other

Description: in place so a secondary cure can effectively cure shadow areas without interruption to process flow. Bondable substrates include PCB, FR4, silicon, ceramic, and lead frame as well as many metals. Dymax materials have no solvents added and cure upon exposure to light. Their

• Viscosity: 110,000 cP
• Substrate Compatibility: Ceramic / Glass, Dissimilar Substrates, Rubber / Elastomer
• Features: Other
• Cure / Technology: UV / Radiation Cured (EB, Light)

Description: Dymax 9803 low shrinkage optical epoxy adhesive offers superior adhesion for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. The adhesive has the unique flexibility to cure in seconds with LED and/or UV/Visible light

• Viscosity: 80,000 cP
• Substrate Compatibility: Ceramic / Glass, Dissimilar Substrates, Metal
• Features: Other
• Cure / Technology: Single Component System, UV / Radiation Cured (EB, Light)

Description: product bonds rapidly and is recommended for surfaces and substrates including LCP, PCB, PPS, FPC, CAP, PS, FR-4 board, and glass. 9801 requires cold storage/cold shipping and should be kept between 1°C [34°F] and 5°C [41°F] in the original, unopened container. Dymax materials have no

• Viscosity: 60,000 cP
• Substrate Compatibility: Ceramic / Glass, Dissimilar Substrates
• Features: Other
• Cure / Technology: Single Component System, UV / Radiation Cured (EB, Light)

Description: Dymax 9309-SC adhesive cures upon exposure to UV/Visible light to quickly ruggedize circuit board components. This edgebond material is ideal for applications where shock attenuation or ruggedization is necessary. The material provides rapid bonding to leadframe, PCB, silicon, and

• Viscosity: 45,000 cP
• Substrate Compatibility: Ceramic / Glass, Dissimilar Substrates, Rubber / Elastomer
• Features: Other
• Cure / Technology: UV / Radiation Cured (EB, Light)

Description: Materials Ceramic Circuit Board is a high-performance electronic substrate made from ceramic materials, typically alumina (Al2O3), aluminum nitride (AlN).Features High Thermal Conductivity: Ceramic circuit boards offer superior heat dissipation compared to traditional

• Type: Component / Subsystem

Description: S to visually inspect and properly align the material. Circuit traces as small as 100 µm (4 mil) can be achieved with laminated PCB materials and 50 µm traces can be achieved, along with spacing of 25 µm when working with ceramics. Smaller features may be possible and results are

• X-axis Travel / Length Capacity: 9 inch
• Y-axis Travel / Width Capacity: 12 inch
• Z-axis / Vertical Travel: 0.4 inch
• Type: Complete / Turnkey System

Description: AdTech Ceramics is the leading manufacturer of custom designed multilayer aluminum nitride substrates. Aluminum nitride offers high thermal conductivity with an excellent coefficient of thermal expansion (CTE) match to silicon. The material system is stable from cryogenic to high

• Materials: Aluminum Foil / Cladding, Metal Foil / Cladding

Description: located in the substrate. It also provides a very short impedance path for the charge to the device from directly beneath it. Examples: Memory module substrates, Folded Stacked Die packages, CA TV Filters, Power modules, Chip package substrates, RF Filter & Receiver Modules, RF

• Thickness: 0.00031496062992125983 to 0.00047244094488188977 inches
• Electrical Resistivity: 12,000,000,000,000 to 19,000,000,000,000 ohm-cm
• Features: Dielectric / Insulating

Description: place discrete capacitors on the surface of the PCB, Module, or chip package. Space is a premium on many of these devices and there are few or no locations to place a capacitor with its vias, pad, and traces. By using Faradflex the device is etched into the copper and located in the

• Thickness: 0.0006299212598425197 to 0.000984251968503937 inches
• Features: Dielectric / Insulating

Description: This material is a single sided coated copper which contains a high Dk ceramic powder. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed circuits and other high

• Materials: Copper Foil / Cladding, Metal Foil / Cladding

Description: Our complete testing facility is available for any additional military testing requirements. Options available include thru-hole and surface mount lead styles, to make them suitable for mounting on ceramic substrates or epoxy PCBs. Consult the Sales Office if your specific

• Electrostatic Capacitors: Ceramic COG (NPO), Ceramic X7R
• Applications: High Frequency, High Voltage Capacitor, Power Supply
• Configuration / Form Factor: Leaded Capacitor, Surface Mount / Chip Capacitor
• Technology: Multilayer

Description: Our complete testing facility is available for any additional military testing requirements. Options available include thru-hole and surface mount lead styles, to make them suitable for mounting on ceramic substrates or epoxy PCBs. Consult the Sales Office if your specific

• Electrostatic Capacitors: Ceramic COG (NPO), Ceramic X7R
• Applications: High Frequency, High Voltage Capacitor, Power Supply
• Configuration / Form Factor: Leaded Capacitor, Surface Mount / Chip Capacitor
• Technology: Multilayer

Description: DC0114 epoxy underfill is suitable for high reliability applications due to its combination of properties. It can be applied to ceramic or organic substrates, including solder masks and polyimide.

• Coeff. of Thermal Expansion (CTE): 38.888888888888886 µin/in-F
• Viscosity: 20,000 cP
• Industry: Electronics (PCB / SMT Assembly)
• Form / Function: Gap Filling Compound

Description: Bussmann SMT Chip Fuses utilize metal film for superior fusing action and enhanced reliability. The fuse element is bonded to a ceramic substrate and encapsulated with glass, providing excellent short circuit performance and environmental integrity. The end terminations are over-plated

Description: Bussmann SMT Chip Fuses utilize metal film for superior fusing action and enhanced reliability. The fuse element is bonded to a ceramic substrate and encapsulated with glass, providing excellent short circuit performance and environmental integrity. The end terminations are over-plated

Description: UV Cure 60-7159 is a low viscosity conformal coating for Printed Circuit Boards (PCB's), components and various substrates. When exposed to long wave UV it forms a tough, clear and flexible coating. UV Cure 60- 7159 resists yellowing, vibration and impact.

• Viscosity: 450 cP
• Use Temperature: -58 to 311 F
• Tensile Strength (Break): 3,850 psi
• Substrate Compatibility: Ceramic / Glass, Metal, Plastic

Description: (Known as Hysol CB064/FP4653 ) LOCTITE ECCOBOND CB064 is high purity, low stress, liquid, self-leveling encapsulant material. This material is for cavity fill or dam and fill applications. The unique properties of CB064 allows for it to be “chocolate breakable" on pre-scored ceramic

• Coeff. of Thermal Expansion (CTE): 4.444444444444445 µin/in-F
• Viscosity: 80,000 cP
• Industry: Electronics (PCB / SMT Assembly)
• Form / Function: Gap Filling Compound

Description: (Known as Hysol FP0114 ) LOCTITE ECCOBOND FP0114 is a low viscosity, fast flow, epoxy based material designed for capillary underfill on flip chip applications. It has excellent wettability and adhesion to the typical surfaces encountered in flip chip applications. It can be applied to

• Coeff. of Thermal Expansion (CTE): 18.333333333333332 µin/in-F
• Viscosity: 5,000 cP
• Industry: Electronics (PCB / SMT Assembly)
• Form / Function: Gap Filling Compound

Description: AGH – series Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition variations: AGH-A-60 – 60%

• Type: Electrically Conductive
• Industry: Electronics (PCB / SMT Assembly)
• Features: Grease / Paste

Description: Trench IGBT Modules. Features • IGBT 4 Trench Gate Technology • Solder technology • VCE(sat) with positive temperature coefficient • Low inductance case • Isolated by Al2O3 DCB (Direct Copper Bonded) ceramic substrate • Pressure contact technology for thermal contacts • Spring contact

• Features: IGBT, Other

Description: Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics Excellent electrical insulating characteristics Extreme resistance to water and humidity (allows for submersion where needed) Solvent-free

• Industry: Electronics (PCB / SMT Assembly)
• Chemical System: Epoxy (EP)

Description: Immersion gold electrolyte for ENIG Gobright® TLA-77 is a special neutral immersion gold electrolyte. It is suitable for ENIG plating on PCB and ceramic substrates. The gold concentration in the electrolyte is just 0.4 g/l. This means a dramatically cost saving potential by

Description: Immersion gold electrolyte for ENIG Gobright® TLA-77 is a special neutral immersion gold electrolyte. It is suitable for ENIG plating on PCB and ceramic substrates. The gold concentration in the electrolyte is just 0.4 g/l. This means a dramatically cost saving potential by

Description: Thermal Clad Metal Core PCB’s (MCPCB’s) minimize thermal impedance and conduct heat more effectively than standard printed wiring boards (PWB's).These substrates are more mechanically robust than thick-film ceramic and direct bond copper construction. Thermal Clad is a

• Industry: Electronics

Description: environmental humidity, salt water and many harsh chemicals. Also available in clear. Product Benefits Convenient 2A:1B volume mix ratio Low mixed viscosity of 3 300 cP Extremely high compressive and tensile strength Excellent adhesion to a wide variety of substrates including metals,

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)