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Supplier: Imego
Description: IQA10 is a micromachined three-axis accelerometer. It uses Imego's patented Quad Slanted Beam principle to obtain symmetric sensitivity for all three axes with near-zero cross coupling. Its compact single-chip design completely avoids any risk for axis misalignment and allows for a
- Device Type: Sensor / Transducer
- Features: Other
- Maximum Shock: 1500 g
- Number of Axes: Triaxial
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Supplier: Silicon Designs, Inc.
Description: cold extremes for extended periods of time where environmental conditions require a hermetic package. ?The SDI Models 2240 and 2480 contain a single or three orthogonally mounted, proprietary SDI Model 1522 accelerometer LCC chips, making them even less sensitive to temperature changes
- Acceleration: 2 to 400 g
- Device Type: Sensor / Transducer
- Features: Sealed
- Frequency Range: 0.0 to 4200 Hz
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Supplier: PCB Piezotronics, Inc.
Description: Shock accelerometer, 60 kg, MEMS sensor installed in chip carrier (SMT)
- Acceleration: 60000 g
- Maximum Shock: 100000 g
- Operating Temperature: -65 to 250 F
- Sensor Mounting: Other
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Supplier: PCB Piezotronics, Inc.
Description: Shock accelerometer, 20 kg, MEMS sensor installed in chip carrier (SMT)
- Acceleration: 20000 g
- Maximum Shock: 60000 g
- Operating Temperature: -65 to 250 F
- Sensor Mounting: Other
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Supplier: Silicon Designs, Inc.
Description: chip and SDI's proprietary electronics for extra-low noise performance and inertial-grade stability. The rugged, anodized aluminum, 1-inch square package provides all the same durability and reliability of SDI's industrial accelerometers, along with the convenience of a 4-wire pigtail
- Acceleration: 5 to 50 g
- Device Type: Sensor / Transducer
- Frequency Range: 0.0 to 1800 Hz
- Maximum Shock: 2000 to 5000 g
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Supplier: Shenzhen Rion Technology Co., Ltd
Description: AKE392B-Wireless three-axis accelerometer sensor series products is RION company imported the Switzerland patented technology to produce for using widely, suitable for vibration testing, impact testing and more fields. The product uses a digital interface output, RS232/485/TTL optional, can
- Acceleration: 1 to 40 g
- Device Type: Sensor / Transducer
- Frequency Range: 5 to 300 Hz
- Number of Axes: Triaxial
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Supplier: Shenzhen Rion Technology Co., Ltd
Description: AKE390B voltage type accelerometer sensor series products is RION company imported the Switzerland patented technology to produce for using widely, suitable for vibration testing, impact testing and more fields. This series products with firm structure,low power consumption, excellent
- Acceleration: 1 to 40 g
- Device Type: Sensor / Transducer
- Number of Axes: Triaxial
- Operating Temperature: -40 to 185 F
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Supplier: Silicon Designs, Inc.
Description: The Model 1531 is an industrial-grade surface mount MEMS DC accelerometer that is specifically designed for use in higher-temperature applications. Its performance specifications are virtually identical to those of the SDI Model 1521, yet with the further incorporation of higher
- Operating Temperature: -55 to 175 C
- Package Type / Mounting: Surface Mount (SMD)
- Sensor Grade / Operating Range: Automotive, Industrial, Military, Other
- Sensor Type: Acceleration Sensor
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Supplier: Silicon Designs, Inc.
Description: The Model 1522 is an industrial-grade surface mount MEMS DC accelerometer with enhanced temperature performance and a low-cost design. Like the SDI Model 1521, it is designed for use between -55°C and +125°C, however, the Model 1522 has only half the bias and scale-factor temperature
- Operating Temperature: -55 to 125 C
- Package Type / Mounting: Surface Mount (SMD)
- Sensor Grade / Operating Range: Automotive, Industrial, Military, Other
- Sensor Type: Acceleration Sensor
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Supplier: ROHM Semiconductor USA, LLC
Description: digital protocol is used to communicate with the chip to configure and check for updates to the orientation, Directional TapTM detection, Free fall detection and activity monitoring algorithms. With user-selectable I2C address assignment, as many as 4 accelerometers can be placed on
- Number of Axes: Triaxial
- Operating Temperature: -40 to 185 F
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Supplier: ROHM Semiconductor USA, LLC
Description: digital protocol is used to communicate with the chip to configure and check for updates to the orientation, Directional TapTM detection, Free fall detection and activity monitoring algorithms. With user-selectable I2C address assignment, as many as 4 accelerometers can be placed on
- Number of Axes: Triaxial
- Operating Temperature: -40 to 185 F
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Supplier: ROHM Semiconductor USA, LLC
Description: The KXSS5 is a high-performance, low-power, digital tri-axis accelerometer with integrated freefall and high-g drop detection algorithms, either of which can flag a drop event. The accelerometer can use either I2C or SPI digital interfaces to communicate with the chip to trigger
- Number of Axes: Triaxial
- Operating Temperature: -40 to 185 F
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Supplier: ROHM Semiconductor USA, LLC
Description: The KX123-1039 is a tri-axis +/-2g, +/-4g or +/-8g silicon micromachined accelerometer with integrated 2048 byte buffer, orientation, tap/double tap, activity detecting, and Free fall algorithms. The sense element is fabricated using Kionix’s proprietary plasma micromachining process
- Number of Axes: Triaxial
- Operating Temperature: -40 to 185 F
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Supplier: Shenzhen Rion Technology Co., Ltd
Description: AKE398B current type accelerometer sensor series products is RION company imported the Switzerland patented technology to produce for using widely, suitable for vibration testing, impact testing and more fields. This series products with firm structure,low power consumption, excellent
- Acceleration: 1 to 40 g
- Device Type: Sensor / Transducer
- Number of Axes: Triaxial
- Operating Temperature: -40 to 185 F
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Supplier: Kionix, Inc.
Description: The KXTG9 series adds a flexible programmable motion-interrupt chip with fast SPI interface into the Kionix suite of products. These sensors can accept supply voltages between 1.8V and 3.6V. Sensitivity is factory programmable allowing customization for applications requiring from 1.5g to
- Acceleration: 3 g
- Device Type: Sensor / Transducer
- Features: Sealed, Self Test / Diagnostics / Self Calibrating
- Maximum Shock: 5000 to 10000 g
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Supplier: RS Components, Ltd.
Description: Piezoelectric Accelerometer 805 - Sensor ICs - Accelerometer ICs
- Operating Temperature: -40 C
- Package Type / Mounting: Other
- Sensor Type: Acceleration Sensor
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Supplier: VAST STOCK CO., LIMITED
Description: Bluetooth Modules (802.15.1) BLE Sensor Beacon Temp & Accelerometer
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Supplier: RS Components, Ltd.
Description: iNEMO Inertial Module: Accel.&Gyro LGA28 - Sensor ICs - Accelerometer ICs
- Package Type / Mounting: Other
- Sensor Type: Acceleration Sensor
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Supplier: VAST STOCK CO., LIMITED
Description: GPS Modules LoRaWAN GPS Tracker with 9-axis accelerometer-LGT92- 868MHz
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Supplier: RS Components, Ltd.
Description: iNEMO Inertial Module: Accel.&Gyro LGA28 - Sensor ICs - Accelerometer ICs Delivery on production packaging - Punnet. This product is non-returnable.
- Package Type / Mounting: Other
- Sensor Type: Acceleration Sensor
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Supplier: DigiKey
Description: V50024-17-02 NavChip™ Accelerometer, Gyroscope, Temperature, 6 Axis Sensor Evaluation Board
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Supplier: DigiKey
Description: V50024-17-02 NavChip™ Accelerometer, Gyroscope, Temperature, 6 Axis Sensor Evaluation Board
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Supplier: RS Components, Ltd.
Description: MEMS accelerometers and iSensor MEMS accelerometer subsystems from Analog Devices to accurately detect and measure acceleration, tilt, shock and vibration in performance-driven applications. Signal conditioning technology is integrated into every MEMS accelerometer, gyroscope,
- Package Type / Mounting: Other
- Sensor Type: Acceleration Sensor
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Supplier: Win Source Electronics
Description: Manufacturer: NXP Win Source Part Number: 234971-MMA7455L Accessory Type: Accelerometer Categories: RF/IF and RFID Status: Obsolete(EOL) Is this a common-used part?: Yes Popularity: High Fake Threat In the Open Market: 49 pct. Supply and Demand Status: Limited
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Supplier: Win Source Electronics
Description: Manufacturer: TDK InvenSense Win Source Part Number: 811547-ICM-20648 Packaging: Reel Mounting Style: Surface Mount Output Type: I2C, SPI Sensor Type: Accelerometer, Gyroscope, Temperature, 6 Axis Supplier Device Package: 24-QFN (3x3) Temperature Range - Operating
- Operating Temperature: -40 to 85 C
- Sensor Type: Inertial Sensor
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Supplier: First Sensor AG
Description: capacitive inclinometers and accelerometers are based on single crystal silicon sensor elements and utilize state-of-the-art micromachining technology to achieve large signal-to-noise ratios and excellent stability over temperature. Therefore, they are able to detect extremely small changes
- Form Factor: Integrated Chip (IC)
- Operating Temperature: -40 to 248 F
- Supply Voltage: 2.7 to 5.2 volts
- Tilt Angle: -90 to 90 degrees
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Supplier: QUALCOMM, Incorporated
Description: -enabled Bluetooth low energy devices. It provides Gyroscopic, Magnetic, Temperature, Pressure, Humidity and Acceleration MEMS sensors. Environmental Sensor Board specs Development Board Hardware Chipset CSR1011 Sensors Accelerometer
- Bluetooth Component: Bluetooth® Development Kits
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Supplier: Win Source Electronics
Description: Alternative Parts (Cross-Reference): Cross Manufacturer: AMIS Category: Integrated Circuits (ICs)>Data Acquisition>Analog to Digital Converters (ADC) Product Status: Preliminary Connector Type: Receptacle Number of Positions: 5 Pitch: 0.200" (5.08mm) Mounting Type: Fixed Features:
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Highly integrated 3-in-1 sensor reduces component count and PCB space, simplifying hardware design for engineers. Configurable ranges for accelerometer (read more)
Browse Sensor Chips Datasheets for Win Source Electronics
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AKF392B MEMS Digital Accelerometer
AKE392B-Wireless three-axis accelerometer sensor series products is RION company imported the Switzerland patented technology to produce for using widely, suitable for vibration testing, impact testing and more fields. The product uses a digital interface output, RS232/485/TTL optional, can be set
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
1-GHz processor, OmniVision's 1.3-megapixel sensor Among the hottest products at www.eeProductCenter.com are a new processor line that offers 1-GHz performance, a family of three-axis accelerometers and a camera chip sensor that enables thinner camera phones. DiBcom wins socket in Tata Elxsi mobile
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
accelerometers a run for their money as the microelectromechanical systems of choice in a new breed of consumer gadgets, thanks to the advent of low-cost gyros from a MEMS startup. Slow growth may push analog, FPGA firms private The semiconductor industry is headed for an era of single-digit growth
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Trying to make sense of the cyclical semiconductor industry? Gathered here is a compendium of recent stories on IC forecasts, August chip data, DRAMs, PCs, and semiconductor equipment. Micrel latest to reduce forecast amid sales lull Chip maker Micrel Inc. on Friday (Oct. 1) lowered its revenue
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
1-GHz processor, OmniVision's 1.3-megapixel sensor Among the hottest products at www.eeProductCenter.com are a new processor line that offers 1-GHz performance, a family of three-axis accelerometers and a camera chip sensor that enables thinner camera phones. Home net group embraces copy protection
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
performance, a family of three-axis accelerometers and a camera chip sensor that enables thinner camera phones. DiBcom wins socket in Tata Elxsi mobile TV French fabless chip company DiBcom SA has formed a partnership with Tata Elxsi Ltd., the embedded product design arm of the Tata Group (Bangalore, India
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
million battery packs used in Docomo's 3G handsets. MEMS gyroscopes eye projected CE windfall Gyroscopes may soon give accelerometers a run for their money as the microelectromechanical systems of choice in a new breed of consumer gadgets, thanks to the advent of low-cost gyros from a MEMS startup
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Agilent: Five Hints for Debugging Microcontroller-Based Designs
Hint 1: Verifying quadrature encoder signals in a motion control system Using a mixed analog and digital signal oscilloscope to simultaneously monitor the signal levels of a quadrature encoder, an LS7083 converter chip, and a motor's positive lead. Hint 2: Implementing a simple voltage follower
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Packaging effects on the performances of MEMS for high-G accelerometer: frequency-domain and time-domain analyses
the frequency-domain and time-domain analyses for high-G accelerometer packaging have been discussed for a simplified configuration, which included an accelerometer chip , a superfine alumina ceramic bulk, and two pieces of seal adhesive fixing the chip in the bulk in …
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A study of packaging effects on the performances of MEMS for high-G accelerometer
In-order to obtain the conceptive conclusions, the real sensor assembly was simplified to a simple configuration, which included an accelerometer chip , a superfine alumina ceramic hulk, and two pieces of seal adhesive fixing the chip in the bulk in the direction …
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Springer Handbook of Nanotechnology
Figure 12.21 presents a photo of such a system containing a dual-axis gyroscope, a z-axis gy- roscope, and a three-axis accelerometer chip integrated with microelectronic circuitry.
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http://dspace.mit.edu/bitstream/handle/1721.1/43545/38502766-MIT.pdf?sequence=2
Since the accelerometer chip , including electrical and mechanical test structures, is .
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Monolithic integration of capacitive sensors using a double-side CMOS MEMS post process
SEM micrograph of a typical fabricated monolithic three-axes accelerometer chip . .
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Fabrication and characterization of a piezoelectric accelerometer
Three zinc oxide based accelerometer chips , of which one is encapsulated, are shown in figure 2.
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Implementation of a Monolithic Single Proof-Mass Tri-Axis Accelerometer Using CMOS-MEMS Technique
The die size of this ac- celerometer chip containing the MEMS structure and sensing circuits is 1.78 × 1.38 mm, a reduction of nearly 50% in chip size.
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Practical Applications of Intelligent Systems
The core component of combined triaxial high-g accelerometer is made up of three orthogonal assembly of the high-g accelerometer chip , so the natural frequencies of each chip directly affect the overall stability of the accelerometer.