Alloy E Solder

Description: Indium9.0E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.

• Alloy: Other
• Approvals / Conformance: Other
• Form / Shape: Paste

Description: Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.

• Approvals / Conformance: Other

Description: Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu,Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium

• Form / Shape: Paste
• Lead Free: Yes

Description: )Benzen e) Diethylamine Hydrochloride (DEA-HCL) Diethylamine Hydrobromide Dimethylamine Hydrochloride (DMA-HCL) Glutaric Acid (1,3-Propanedicarbox ylic Acid) Triethanolamine Hydrochloride Triethylamine Hydrochloride Mono Ethanolamine HCL (61%)

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu,Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium

• Form / Shape: Paste
• Lead Free: Yes

Description: -temperature alloy applications. The alloy also yields very low voiding in BGA solder joints, even when a traditional SAC alloy sphere is used. All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallics,

Description: A zero-halogen, low-temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175°C. Product Overview ALPHA OM-565 HRL3 low-temperature solder paste is designed to mitigate warpage induced defects in temperature-sensitiv e chip

Description: This Standard establishes specifications for cast copper alloy solder joint drainage fittings, designed for use in drain, waste, and vent (DWV) systems. These fittings are designed for use with seamless copper tube conforming to ASTM B306, Copper Drainage Tube (DWV), as well as

Description: This Standard establishes specifications for cast copper alloy solder joint drainage fittings, designed for use in drain, waste, and vent (DWV) systems. These fittings are designed for use with seamless copper tube conforming to ASTM B306, Copper Drainage Tube (DWV), as well as

Description: This Standard establishes specifications for wrought copper and copper alloy seamless pressure fittings designed for use by soldering or brazing with seamless copper tube conforming to ASTM B88 (water and general plumbing systems), ASTM B280 (air conditioning and refrigeration

Description: This Standard establishes specifications for wrought copper and copper alloy seamless pressure fittings designed for use by soldering or brazing with seamless copper tube conforming to ASTM B88 (water and general plumbing systems), ASTM B280 (air conditioning and refrigeration

Description: This Standard provides requirements for fitting ends of suitable depth to achieve required pressure ratings when joined by either soldering or brazing. It establishes requirements for the following: (a) pressure–temperature ratings (b) abbreviations

Description: This Standard provides requirements for fitting ends of suitable depth to achieve required pressure ratings when joined by either soldering or brazing. It establishes requirements for the following: (a) pressure–temperature ratings (b) abbreviations

Description: IEC 62739-3:2017(E) describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are

Description: The Kester 950-E no clean flux is another quality product from Kester.

• Approvals / Conformance: Other
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: The Kester 950-E no clean flux is another quality product from Kester.

• Approvals / Conformance: Other
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: The Kester 950-E no clean flux is another quality product from Kester.

• Approvals / Conformance: Other
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Series LF4001E Lead Free* Dielectric Unions feature a female iron pipe thread to solder connection. Compliant to American Society of Sanitary Engineering ASSE Standard 1079-2005. These unions are designed to be installed between pipe made from dissimilar metals to prevent accelerated

• Category: Union
• Connection: Threaded, Weld
• English Size: 0.5000 to 2 inch
• Material: Brass/Bronze, Carbon & Alloy Steel

Description: The Techspray E-Line 1621 flux remover is sold 12 per case and is another quality product from Techspray. Use caution when purchasing products in this category as some may be flammable. This particular flux remover is flammable.

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: solders. Standard and special compositions are Bismuth alloyed with either Antimony, Cadmium, Copper, Indium, Lead or Tin. Category Forms: Bismuth is offered in a variety of forms such as Ingot, Lumps, Shot, Granular, Powder, Pellets or Needles. Bismuth Alloys are available in

• Metal / Alloy Types: White / Low Melting (UNS L), Bismuth / Bismuth Alloys
• Shape / Form: Other

Description: This specification covers the requirements for preparation of aluminum and aluminum alloys for soldering by zinc immersion pre-treatment followed by copper plating and tin or tin-zinc alloy plating.

Description: This guide establishes the requirements and test methods for liquid and paste fluxes for joining by soldering of copper and copper alloy tube and fittings in plumbing, heating, air conditioning, mechanical, fire sprinkler, and other similar systems. There shall be a clear indication

Description: 1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper- silver, tin-antimony-coppers ilver-nickel, tin-silver, tin-copper-silver, and lead

Description: 1.1 This specification covers solder metal alloys (commonly known as soft solders), including zinc-aluminum, zinc-aluminum-copper , zinc-tin, zinc-tin-copper, zinc-cadmium-tin, zinc-cadmium, tin-zinc, cadmium-zinc, cadmium-zinc-silver, and cadmium-silver, used for the purpose of

Description: MG Chemicals 425NS is a No Clean Super Wick with a flux residue that is both non-conductive and non-corrosive. The flux residue remaining on board does not have to be cleaned. 5ft bobbin, desoldering braid. Product Benefits Conforms to MIL-F-14256E RMA flux and J-STD-004

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: MG Chemicals 426NS is a No Clean Super Wick with a flux residue that is both non-conductive and non-corrosive. The flux residue remaining on board does not have to be cleaned. 5ft bobbin, desoldering braid. Product Benefits Conforms to MIL-F-14256E RMA flux and J-STD-004

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: This Standard provides requirements for fitting ends of suitable depth to only be joined by brazing. Fittings manufactured to this Standard are not suitable for joining by soldering. This Standard covers (a) pressure–temperature ratings (b

Description: This Standard provides requirements for fitting ends of suitable depth to only be joined by brazing. Fittings manufactured to this Standard are not suitable for joining by soldering. This Standard covers (a) pressure–temperature ratings (b

Description: Heated, Bi58 solder alloy, Sleeve size = 2, No preinstalled wire. 100 solder sleeves/pack MANUFACTURER : Sumitomo MANUFACTURER PART NUMBER : E-C4-2 AVAILABILITY : Contact 800-633-6339 for Availability SERIES : E-C Series SIZE : 2 OPERATING TEMPERATURE : 125°C

• Operating Temperature: 125 C

Description: Heated, Bi58 solder alloy, Sleeve size = 5, No preinstalled wire. 100 solder sleeves/pack MANUFACTURER : Sumitomo MANUFACTURER PART NUMBER : E-C4-5 AVAILABILITY : Contact 800-633-6339 for Availability SERIES : E-C Series SIZE : 5 OPERATING TEMPERATURE : 125°C

• Operating Temperature: 125 C

Description: Heated, Bi58 solder alloy, Sleeve size = 3, No preinstalled wire. 100 solder sleeves/pack MANUFACTURER : Sumitomo MANUFACTURER PART NUMBER : STS E-C4-3 AVAILABILITY : Contact 800-633-6339 for Availability SERIES : E-C Series SIZE : 3 OPERATING TEMPERATURE : 125°C

• Operating Temperature: 125 C

Description: Heated, Bi58 solder alloy, Sleeve size = 4, No preinstalled wire. 100 solder sleeves/pack MANUFACTURER : Sumitomo MANUFACTURER PART NUMBER : E-C4-4 AVAILABILITY : In Stock SERIES : E-C Series SIZE : 4 OPERATING TEMPERATURE : 125°C HEATING METHOD : Convection Heated

• Operating Temperature: 125 C

Description: components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder

Description: PA&E offers vacuum brazing processes to join dissimilar materials such as titanium, alumina, Zirconia, and more. Bonding Solutions for Electronic Packaging Our experienced staff of material scientists and process engineers can meet the highest demands for quality

• Additional Services: CAD / CAM Support, Design Assistance, Fixture Design / Fabrication, Low to Mid Volume Production, Machining, Testing and Inspection
• Dissimilar Materials: Yes
• Industry Served: Aerospace / Avionics, Electrical Parts / Assemblies (Contacts, Connectors, etc.), Heat Sinks / Thermal Management, Medical Devices / Health Care
• Location: North America, United States Only, Northwest US Only

Description: -1, "Performance Standard for High Performance Electronic Systems Containing Pb-Free Solder." This document also contains lessons learned from previous experience with Pb-Free aerospace electronic systems. The lessons learned give specific references to solder alloys and other

Description: elements to the molten alloys from the remelting furnace is permitted before casting. Pure metals, recycled materials, and master alloys can also be used to make the alloys as long as the chemical composition can be analyzed and adjusted to conform to the requirements prior to

Description: components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder

Description: IEC/PAS 62647-23:2011(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional

Description: alloy conductors assures uniform conductivity with excellent solderability. A durable PTFE laser-markable jacket protects the cable against abrasion and environmental effects while maintaining flexibility for ease of installation. E13226 is suitable for airborne 10/100 Base-T

• Application: Networking
• Cable Type: Cat 5/Cat 5E, Twisted Pair
• Ethernet Type: 10Base-T, 100Base-TX
• Operating Temperature: -55 to 200 C

Description: The E10422 is a 2 pair, 10/100 Base-T CAT5e cable (exceeding ANSI/TIA-568-C.2 CAT 5e Channel Requirements) with a smaller overall diameter and weight while retaining performance and required operating parameters up to 328 ft. The twisted-pair construction of silver-plated copper

• Application: Networking
• Cable Type: Cat 5/Cat 5E, Twisted Pair
• Ethernet Type: 10Base-T, 100Base-TX
• Operating Temperature: -55 to 200 C

Description: applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys. The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts). The

Description: The E20224 is a 1 pair, 10/100 Base-T CAT5e cable (exceeding ANSI/TIA-568-C.2 CAT 5e Channel Requirements) with a smaller overall diameter and weight while retaining performance and required operating parameters up to 273 ft. The twisted-pair construction of silver-plated copper

• Application: Networking
• Cable Type: Cat 5/Cat 5E, Twisted Pair
• Ethernet Type: 10Base-T, 100Base-TX
• Operating Temperature: -55 to 200 C

Description: alloy conductors assures uniform conductivity with excellent solderability. The 100% foil and 90% braided shielding provide mechanical strength and EMI protection and maintain weight and flexibility. A durable ETFE laser-markable jacket protects the cable against abrasion and

• Application: Networking
• Cable Type: Cat 5/Cat 5E, Twisted Pair
• Ethernet Type: 10Base-T, 100Base-TX
• Operating Temperature: -55 to 200 C

Description: reliability performance comparable to higher-silver SAC alloys (e.g., SAC305, SAC405). The SACX 0800 variant is used to stabilize or reduce the copper content in the wave solder bath, depending on process conditions. The proprietary Vaculoy process is used to remove certain

Description: IEC/TS 62647-23:2013(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional

Description: Latex gel designed to mask PCB holes and edge contacts prior to soldering. Ideal for temporary sealing of areas requiring further hand soldering or assembly at a later date. Cures at room temperature (typically 2 hours at ambient temperature or 40 minutes at 80°C for a 2mm layer).

• Lead Free: Yes

Description: Flexible, solvent resistant latex for masking components, connectors and other items (e.g. pin connectors, adjustable pots, IC sockets) protecting areas against ingress of conformal coating. Also ideal as spot mask for wave soldering applications. Can be peeled by hand without breaking

• Lead Free: Yes

Description: IEC/TS 62647-23:2013(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional

Description: OMEGADYNE® offers K-Series Tee Rosettes for Axial strain transducer designs. Precision Karma material offers excellent temperature and fatigue characterisitcs. K-Series gages have plated solder pads which make soldering quick and easy. No special solders or fluxes are required.

• Active Gauge Length (Grid Length): 5 inch
• Arrangement (If Applicable): Tee Rosette
• Construction: Electrical Resistance
• Nominal Resistance: 350

Description: The linear pattern strain gages are available in a variety of styles and sizes. OMEGADYNE® offers miniature linear patterns for strain measurement of a stress concentration or high gradient areas. The terminations are offered both at one end of the grid, or with one at each end of the grid. Wide or

• Active Gauge Length (Grid Length): 1.51 inch
• Arrangement (If Applicable): Uniaxial
• Construction: Electrical Resistance
• Nominal Resistance: 350

Description: This specification covers electrical connections made with single, solid, round copper or copper alloy wire wrapped around copper alloy terminals without the use of solder.

Description: The 443E Series is a Nano2®, 250 V fuse. It is a surface mount Universal Modular Fuse (UMF) that complies with IEC 60127-4. It is RoHS-compliant and fully compatible with lead-free solder alloy and higher temperature profiles associated with lead-free assembly. 250 VAC/VDC

• Approvals / Standards: VDE Approval
• Features: Time Lag
• Material: Ceramic, Other
• Mounting: Solderable (surface mount)

Description: temperature and fatigue characterisitcs. K-Series gages have plated solder pads which make soldering quick and easy. No special solders or fluxes are required.

• Active Gauge Length (Grid Length): 3.2 inch
• Arrangement (If Applicable): Dual Linear
• Construction: Electrical Resistance
• Nominal Resistance: 350

Description: OMEGADYNE® offers K-Series strain gages in dual linear patterns in a halfbridge design with a common tab. Precision Karma material offers excellent temperature and fatigue characterisitcs. K-Series gages have plated solder pads which make soldering quick and easy. No special

• Active Gauge Length (Grid Length): 1.5 inch
• Arrangement (If Applicable): Dual Linear
• Construction: Electrical Resistance
• Nominal Resistance: 350

Description: : 45 PCB Mount Orientation : Vertical Rows Loaded : A,B,C,D,E Contact Features Contact Base Material : Copper Alloy Contact Type : Receptacle

• Contact Pitch: 2.54 mm
• Number of Contacts: 80 #

Description: : 48 PCB Mount Orientation : Vertical Contact Features Contact Base Material : Copper Alloy Contact Type : Receptacle Dimensions Connector Height (MM

• Number of Contacts: 48 #

Description: : Vertical Rows Loaded : Z, D Contact Features Contact Base Material : Copper Alloy Contact Type : Receptacle Dimensions Connector Height

• Number of Contacts: 15 #

Description: : 64 PCB Mount Orientation : Vertical Rows Loaded : A, B Contact Features Contact Base Material : Copper Alloy Contact Type : Receptacle Dimensions

• Number of Contacts: 64 #