ASTM B32 Solder

Description: purpose of joining together two or more metals at temperatures below their melting points. Included here are solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbons, wires, and solder pastes. Electronic grade solder

Description: Specification for Paste Solder

Description: Specification for Silver Solders (Withdrawn 1952)

Description: Specification for Rosin Flux-Core Solder

Description: To eliminate the chance of contaminating Pb-free solder with Pb, ingots come in two shapes to designate the alloy. All bar solder complies with the requirements of ASTM B-32, J-Std 006 (formerly QQS-571F) and JIS Z 3282. Indium Corporation also features RoHS compliant Sn995

• Approvals / Conformance: ASTM / UNS, JIS
• Solder Alloy: Lead Free, Tin-Lead (Sn-Pb)
• Features: Other

Description: To eliminate the chance of contaminating Pb-free solder with Pb, ingots come in two shapes to designate the alloy. All bar solder complies with the requirements of ASTM B-32, J-Std 006 (formerly QQS-571F) and JIS Z 3282. Indium Corporation also features RoHS compliant Sn995

• Approvals / Conformance: ASTM / UNS, JIS
• Solder Alloy: Lead Free, Tin-Lead (Sn-Pb)
• Features: Other

Description: be assembled with soldering materials conforming to ASTM B32, or tapered pipe thread conforming to ASME B1.20.1. This Standard is allied with ASME B16.29, Wrought Copper and Wrought Copper Alloy Solder Joint Drainage Fittings — DWV. It provides requirements for fitting ends

Description: be assembled with soldering materials conforming to ASTM B32, or tapered pipe thread conforming to ASME B1.20.1. This Standard is allied with ASME B16.29, Wrought Copper and Wrought Copper Alloy Solder Joint Drainage Fittings — DWV. It provides requirements for fitting ends

Description: This Standard establishes specifications for wrought copper and copper alloy seamless pressure fittings designed for use by soldering or brazing with seamless copper tube conforming to ASTM B88 (water and general plumbing systems), ASTM B280 (air conditioning and refrigeration

Description: This Standard establishes specifications for wrought copper and copper alloy seamless pressure fittings designed for use by soldering or brazing with seamless copper tube conforming to ASTM B88 (water and general plumbing systems), ASTM B280 (air conditioning and refrigeration

Description: This standard for wrought copper and wrought copper alloy solder-joint drainage fittings, designed for use with copper drainage tube conforming to ASTM B-306, covers description, pitch (slope), abbreviations for end connections, sizes and method of designating openings for reducing

Description: This standard for wrought copper and wrought copper alloy solder-joint drainage fittings, designed for use with copper drainage tube conforming to ASTM B-306, covers description, pitch (slope), abbreviations for end connections, sizes and method of designating openings for reducing

Description: Ultrapure® is the industry standard bar solder for use in high tech electronic applications where lower surface tension and hole filling ability are essential. The purity of Kester Ultrapure® far exceeds the requirements of QQ-S-571-F, ASTM B32 and IPC/J-STD-006. Kester

Description: Ultrapure® is the industry standard bar solder for use in high tech electronic applications where lower surface tension and hole filling ability are essential. The purity of Kester Ultrapure® far exceeds the requirements of QQ-S-571-F, ASTM B32 and IPC/J-STD-006. Kester

Description: antimony (Sb) allowed as impurities in section 3.3 Alloy Impurities Transfer all information references on solder powder particle size distribution and solder paste products to IPC J-STD-005, Requirements for Solder Pastes Remove Table 3-1 “Particle Size Distributions of

Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidification

• Features: Flux Cored Wire, Solid Wire
• Solder Alloy: Tin-Silver (Sn-Ag)

Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidification

• Features: Flux Cored Wire, Solid Wire
• Solder Alloy: Tin-Silver (Sn-Ag)

Description: 1/2-hard per UNS C36000 ASTM B16/B16M-05 PIN BODY PLATING: 10µ [0.25µ] min. Au per MIL-G-45204 or 200µ [5.08µ] min. 93/7 Sn/Pb per ASTM B545 or 200µ [5.08µ] min. Sn per ASTM B545 Type 1 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290B 4-FINGER COLLET CONTACT: BeCu per UNS C17200

• Current Rating: 3 amps
• Operating Temperature: 125 C
• Number of Contacts: 6 to 64
• Contacts Pitch: 2.54 mm

Description: either 10µ [0.25µ] min. Au per MIL-G-45204 or 200µ [5.08µ] min. 93/7 Sn/Pb per ASTM B545 or 200µ [5.08µ] min. Sn per ASTM B545 Type 1 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290B 4-FINGER COLLET CONTACT: BeCu per UNS C17200 ASTM B194-08 CONTACT PLATING: either 200µ [5.08µ]

• Current Rating: 3 amps
• Operating Temperature: 125 C
• Number of Contacts: 2 to 64
• Contacts Pitch: 2.54 mm

Description: positions desired GENERAL SPECIFICATIONS BODY MATERIAL: black UL 94V-0 glass-filled 4/6 Nylon PIN BODY: Brass 360 1/2-hard per UNS C36000 ASTM B16/B16M-05 PIN BODY PLATING: either 10µ [0.25µ] min. Au per MIL-G-45204 or 200µ [5.08µ] min. 93/7 Sn/Pb per ASTM B545 or 200µ [5.08µ] min. Sn

• Current Rating: 3 amps
• Operating Temperature: 125 C
• Number of Contacts: 1 to 25
• Contacts Pitch: 2.54 mm

Description: SPECIFICATIONS LATCH AND BODY: black UL-94V-0 glass-filled 4/6 Nylon PIN BODY: Brass 360 1/2-hard per UNS C36000 ASTM B16/B16M-05 PIN BODY PLATING: either 10µ [0.25µ] min. Au per MIL-G-45204 or 200µ [5.08µ] min. 93/7 Sn/Pb per ASTM B545 or 200µ [5.08µ] min. Sn per ASTM B545 Type

• Current Rating: 3 amps
• Operating Temperature: -55 to 125 C
• Number of Contacts: 14 to 40
• Contacts Pitch: 2.54 mm

Description: Stranded wire run to QQ-W-343 Type S, ASTM-B-33, ASTM-B-49, ASTM-B258, MIL-W-3861 Type S, A-A-59551, dip coated or pure electrolytic copper, annealed for softness, and tinned for quick soldering. STD. P-U: 100',1000'

• North American (AWG): 24 to 14 AWG
• Cable Conductor: Copper and Copper Alloys
• Features: Other
• Conductor Type: Stranded

Description: Wire is run to QQ-W-343 Type S, ASTM-B-33, ASTM-B-49, ASTM-B258, MIL-W-3861 Type S, A-A-59551, dip coated or pure electrolytic copper, annealed for softness, and tinned for quick soldering. STD. P-U: 100',1000'

• North American (AWG): 44 to 4 AWG
• Cable Conductor: Copper and Copper Alloys
• Features: Other
• Conductor Type: Solid

Description: Wire is run to QQ-W-343 Type S, ASTM-B-33, ASTM-B-49, ASTM-B-246-51, ASTM-B-258, MIL-W-3861 Type S, A-A-59551 hard drawn dip coated or pure electrolytic copper, & tinned for quick soldering, cut into 2 foot straight lengths for hooking up all types of transmitters, short

• North American (AWG): 22 to 18 AWG
• Cable Conductor: Copper and Copper Alloys
• Features: Other
• Conductor Type: Stranded

Description: Indium Corporation is quickly becoming known as one of the highest quality, full line suppliers of flux-cored wire solder. Indium Corporation uses only "conflict-free" and grade A (per ASTM B32) metals, as well as other high purity metals for its flux-cored wire. Our materials

• Diameter / Thickness: 0.01 to 0.062 inch
• Features: Flux Cored Wire, Soldering Flux / Rosin

Description: C11000 Electrolytic Tough Pitch Copper CDA 110 ETP, ASTM B124, ASTM B152, ASTM B187, ASTM B188, ASTM B272 High electrical and thermal conductivity, good corrosion resistance and solderability. C11000 is used for welding fixtures, anodes, bus bar in electrical power

• UNS Number: 11,000
• AISI / AA / CDA Grade: 110
• Overall Width / OD: 0.5 to 8 inch
• Overall Thickness: 0.125 to 2 inch

Description: specifications. This solder provides a great alternative to leaded solders. It achieves a consistent solder and flux percentage through a state-of-the-art extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency,

• Features: Flux Cored Wire, Solid Wire
• Solder Alloy: Lead Free

Description: C11000 Electrolytic Tough Pitch Copper CDA 110 ETP, ASTM B124, ASTM B152, ASTM B187, ASTM B188, ASTM B272 High electrical and thermal conductivity, good corrosion resistance and solderability. C11000 is used for welding fixtures, anodes, bus bar in electrical power

• OD / Width: 0.1875 to 15 inch
• Length: 144 inch
• Thickness: 0.125 to 2 inch
• Conductivity: 101 %IACS

Description: following: Solder joint flanges, when made of ASTM B62, Copper Alloy UNS No. C83600, ASTM B584, Copper Alloy UNS Nos. C83600, C83800, and C84400, for rating Class 125 and Class 150. Threaded flanges and blind flanges, when made of ASTM B 584, Copper Alloy UNS Nos. C83600,

Description: Uses: Strain relief, jacketing material, component insulation. Meets MIL-I-23053/5A, Class 1,2 MIL-I-7444B, AMS 3636B, AMS 3637A, ASTM D876, ASTM D150, ASTM D257,ASTM D2671, ASTM D792.

• Diameter: 0.023 to 2 inch
• Operating Temperature: -55 to 135 C
• Shrink Temperature: 121.11111111111111 C
• Shrink Ratio: 2 :1

Description: from AURUNA® 5100 also exhibit a low hardness and a low contact resistance. Even under production conditions, the layers have a high gold purity of 99.99 wt. % Au. The coatings meet the requirements of ASTM B488-01, Type III, Code A/B. Advantages Neutral electrolyte for pure gold coatings

Description: from AURUNA® 5100 also exhibit a low hardness and a low contact resistance. Even under production conditions, the layers have a high gold purity of 99.99 wt. % Au. The coatings meet the requirements of ASTM B488-01, Type III, Code A/B. Advantages Neutral electrolyte for pure gold coatings

Description: An improved, simpler, less costly method of semiconductor mounting. Avoid soldering directly to the semiconductor. Easier to service, economical, more efficient. Semiconductor not included. Materials: Socket Base: Phenolic, XP Grade. Contacts: Brass, Tin Plate. Top Plate: Nylon per

Description: An improved, simpler, less costly method of semiconductor mounting. Avoid soldering directly to the semiconductor. Easier to service, economical, more efficient. Semiconductor not included. Materials: Socket Base: Phenolic, XP Grade. Contacts: Brass, Tin Plate. Top Plate: Nylon per

Description: Wrought Copper Solder-Joint Pressure Fittings This Standard Practice covers nominal size 1/8 through 8 straight and reducing size wrought copper solder joint seamless fittings, designed for use with copper water tube, ASTM B 88, at pressures and temperatures shown in Table A 1.