Products & Services
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Supplier: Aries Electronics, Inc.
Description: life 4-point edge male contacts provide accurate mating Socket locating posts provide accurate socket location to board Bottom contact allows for via in center of PCB pad Available in pitch sizes from 0.20mm GENERAL SPECIFICATIONS SOCKET BODY MATERIAL: Torlon PAI HARDWARE:
- Contact Resistance: 40 milliohms
- Contacts Pitch: 0.2 to 0.8 mm
- Socket Type: BGA, DIP, Test / Prototyping Socket
- Features: Clamshell Socket, Other, Solderless
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Supplier: Accuris
Description: Production Ball Grid Array (BGA) Socket Test Specification
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Supplier: Advanced Interconnections Corp.
Description: Our Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top™ BGA Sockets require no
- Number of Contacts: 4 to 1,764
- Contacts Pitch: 1 to 1.27 mm
- Socket Type: BGA, LGA, Test / Prototyping Socket
- Features: Clamshell Socket, Machined Pins, Open Top Socket, Other
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Supplier: Advanced Interconnections Corp.
Description: BGA Socketing Systems from Advanced offer an economical and dependable alternative to direct device attach. Our patented SMT designs are field-proven in production, development, programming and test applications. Compact designs and patented features offer you cost effective solutions
- Number of Contacts: 4 to 1,936
- Contacts Pitch: 0.8 to 1.27 mm
- Socket Type: BGA, LGA, Receptacle, Test / Prototyping Socket
- Contact Plating: Gold Plating
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Supplier: JC Cherry, Inc.
Description: High Current High Speed Interface Manual/Handler/Burn in ●Test socket for CCD and CMOS sensor. ●Customizable for various package such as BGA, LGA, PGA. ●Using our high reliable spring probes, stamping pins and socket pins. ●We manufacture test sockets for
- Voltage Rating: 100 volts
- Current Rating: 0.5 amps
- Contact Resistance: 200 milliohms
- Operating Temperature: -40 to 150 C
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Supplier: Aries Electronics, Inc.
Description: KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, high-current, reliable, durable) Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent choice for low cost hand test
- Current Rating: 4 amps
- Operating Temperature: -55 to 200 C
- Contacts Pitch: 10.16 mm
- Socket Type: BGA, LGA, QFN, Test / Prototyping Socket
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU29 Frame / BGA pkg Size 29x30.6mm / 1.14"x1.20" Can also be used as Burn in Socket ●High reliability ●Cost competitive ●Temperature: -40 to +150℃ For BGA Device How to order for Custom design GQ29-BGAxxxxxxx *P/N will be informed after
- Product Type: IC Socket
- Socket Type: Test / Prototyping Socket
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Supplier: Molex Signal Tech Industrial Ltd.
Description: bench test, and HVM Production Test using the same socket Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm Floating base or Hi Low configuration to protect spring probes during use Benefits Tested to 500K Short contact path for
- Socket Type: BGA, LGA, QFN, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU78 Frame / BGA pkg Size 78x116.7mm / 3.07"x4.59" Can also be used as Burn in Socket ●High reliability ●Cost competitive ●Temperature: -40 to +150℃ For BGA Device How to order for Custom design GU78-BGAxxxxxxx *P/N will be informed after
- Product Type: IC Socket
- Socket Type: Test / Prototyping Socket
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Supplier: Aries Electronics, Inc.
Description: for low-cost hand test applications MECHANICAL CONTACT LENGTH (compressed): 0.45mm PITCH: Released to <0.4mm – Mixed Pitch Available PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and Partial Arrays Available STRUCTURE: Silmat® Interposer with Patented Core INTERPOSER MATERIALS: Ag
- Operating Temperature: -67 to 392 C
- Contacts Pitch: 2.54 mm
- Socket Type: BGA, CSP, LGA, QFN, Test / Prototyping Socket
- Features: Clamshell Socket, Other
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Supplier: Aries Electronics, Inc.
Description: FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm 4-point crown insures “scrub” on solder oxides Single Point Probes available for small land area contact pads Signal path during test only 0.077 [1.96] Socket is
- Operating Temperature: -55 to 150 C
- Contacts Pitch: 5.08 to 20.32 mm
- Socket Type: BGA, CSP, Test / Prototyping Socket
- Features: Clamshell Socket, Other, Solderless
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Supplier: Accuris
Description: Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
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Description: IEC 60191-6-16:2007 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
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Supplier: CSA Group
Description: IEC 60191-6-16:2007 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU22 Frame Series Size 22x22mm / 0.87"x0.87" Can also be used as Burn in Socket ●Highly reliable M-pin Probes as contact parts ●High Frequency For BGA Device, QFN Device 0.4mm/0.016" Pitch : 16x16 Contact Max 0.5mm/0.020" Pitch : 10x10 Contact Max
- Voltage Rating: 100 volts
- Current Rating: 1 amps
- Contact Resistance: 100 milliohms
- Operating Temperature: -40 to 150 C
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Supplier: Molex Signal Tech Industrial Ltd.
Description: Highly precised top and bottom array simultaneous test capable socket for effective package on package test. Customized socket design is capable to test high speed signals in lab, engineering, SLT and ATE applications. Controlled impedance loop-back with PCB for
- Socket Type: BGA, LGA, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Molex Signal Tech Industrial Ltd.
Description: with gold plated for better grounding RF bandwidth > 84 GHz @ -1dB IL Short signal path 4.90 mm test height Impedance tuned to match system Consistent stable contact resistance 55 mΩ (Avg.) Hi-coplanarity accommodation Tri-temp socket design to support -55 °C to +150 °C Designed for
- Current Rating: 3 to 3.7 amps
- Contact Resistance: 80 milliohms
- Operating Temperature: -55 to 150 C
- Contacts Pitch: 0.65 to 0.8 mm
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Supplier: Twilight Technology Inc.
Description: solutions. Our customers benefit from our broad experience and expertise in design, IC packaging, component reliability, and quality testing. With 25 years of design experience, our engineering staff solves problems with footprint conversions, RoHS, BGA and flip chip reliability, CTE
- Product Type: IC Headers, IC Socket
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Supplier: AENOR
Description: Mechanical standardization of semiconductor devices -- Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
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Supplier: CSA Group
Description: IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and
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The Levan Elastomeric socket family is engineered specifically with precision. The elastomeric grid of Levan features conductive columns that guarantee accurate and consistent test results across a spectrum of devices. The conductive columns in the elastomeric grid ensure accurate and (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
, Kepler is the only solution that provides two-axis of motion during a single actuation of the socket, an innovation set to pioneer the semiconductor test industry. As a result, Kepler provides a boosted first pass yield (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
At Smiths Interconnect, we are constantly striving to exceed the evolving demands of the semiconductor industry. The Davinci 112 test socket, and expansion of the DaVinci Series, is designed to tackle some of the most complex challenges in testing Application Specific Integrated Circuits (ASICs (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
Smiths Interconnect, a division of Smiths Group plc, announces that it has completed the acquisition of Plastronics Sockets & Connectors (“Plastronics”), a leading supplier of burn-in test sockets and patented spring probe contacts for the semiconductor test market segment (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
) PCB Hardware SMT test points & cable management clips Fixed & removable jumper links Coin cell holders Terminals & spacers (read more)
Browse IC Sockets and Headers Datasheets for Harwin Plc -
OEM to handle these tasks, companies focus their resources on other business areas requiring more attention. Using advanced equipment and OEM tools like socket sets speeds up the production process, ensuring that components get delivered on time. This (read more)
Browse Drive Sockets and Adapters Datasheets for Lowell Corporation
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BGA Socket Considerations - Prototype to Reality
For many products designed with todays high-performance integrated circuits, BGA socketing systems are an essential option during the design, testing, and/or production phases of a new product development process. In response to these demanding needs, sockets featuring a wide variety of contacting
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BGA Sockets To Solve All Your Electronics Testing Needs
Plastronics, a Smiths Interconnect technology brand, is a global provider of innovation for semiconductor reliability testing, meeting the industry 's burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production
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Socket-Adapter Systems: A Practical Test Alternative (.pdf)
Traditional one-piece, clam¬shell-design test sockets are useful diagnostic tools for establishing or evaluating device functionality. However, they tend to be less satisfactory for validating fine-pitch packages such as ball grid ar¬ray (BGA) and land grid array (LGA), which are gaining popularity
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Spring Pin Socket User Manual
SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted on to a PCB using supplied hardware
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BGA Socket Adapter System Provides Reliable Test Equipment Connection for Engine Performance Analysis (.pdf)
A major electronics test equipment manufacturer developed a new engine control unit test board to calibrate embedded semiconductor automotive engine control devices. These automotive engine control devices are critical to the power train performance of the vehicle and must be accurately calibrated
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
on marketing. IC-packaging and test subcontractors appear to be in the best financial shape in recent memory and are chanting the famous line in the movie classic Network: "I'm mad as hell, and I'm not going to take it anymore! " Hot products: 10-GHz BGA socket, automotive MCU Among the hottest
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Design and fabrication of a mems test socket with an attached tip for a ball-grid-array integrated circuit package
Electri- cal characterization of BGA test socket for high-speed appli- cations, Proc. IEEE Int.
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BGA Test Socket
BGA Test Sockets .
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Design and fabrication of MEMS test socket for BGA IC packages
Abstract—We developed a novel ball grid array ( BGA ) test socket for an integrated circuit (IC) package test.
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Reliability and wear-out characterization of BGA production sockets
A ball grid array ( BGA ) test socket plays a key role as a contact interface in final testing of BGA-type package.
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uBGA
BGA Test Sockets .
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System Level Test / BGA Test Sockets
Cascade Microtech has developed BGA test sockets to specifically address the demanding high-performance signal integrity requirements for high-frequency component and system-level testing.
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Cascade Microtech, Inc.
Cascade Microtech has developed BGA test sockets to specifically address the demanding high-performance signal integrity requirements for high-frequency component and system-level testing.
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New ball grid array module test sockets
… fine-pitch leaded packages, such as the Quad Flat Pack (QFP) To be able to test these modules, which encompass a wide range of lead counts, pitches, sizes and footprints, we have designed and fabricated BGA test sockets , which have the capability …
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Development of a wafer-level burn-in test socket for fine-pitch BGA interconnect
Technit offers a Micro- BGA test socket , specifically for Tessera’s package.
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CSP Test Sockets
• BGA Test Sockets (4 .