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Supplier: Techsil Limited
Description: Techsil® RTV12 is a two-component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 has been designed to achieve primerless adhesion to many substrates, including metals
- Form / Function: Encapsulant / Potting Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Momentive clear TSE392 potting & encapsulating compound is compatible with ceramic, copper, glass and plastic materials with a 7 day cure time.
- Dielectric Strength: 559 kV/in
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 0.1800 W/m-K
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Supplier: R. S. Hughes Company, Inc.
Description: Momentive white TSE3843 potting & encapsulating compound is compatible with ceramic, glass, metal and plastic materials with a 7 day cure time.
- Dielectric Strength: 533 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Momentive clear TSE392 potting & encapsulating compound is compatible with ceramic, copper, glass and plastic materials with a 7 day cure time.
- Dielectric Strength: 559 kV/in
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 0.1800 W/m-K
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Supplier: R. S. Hughes Company, Inc.
Description: Momentive brown TSE3826 potting & encapsulating compound is compatible with ceramic, glass, metal and plastic materials with a 7 day cure time.
- Dielectric Strength: 584 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond R-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 8000 to 14000 cP
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Supplier: Techsil Limited
Description: Techsil® RTV12 is a two-component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 has been designed to achieve primerless adhesion to many substrates, including metals
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: Techsil® RTV12 is a two-component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 has been designed to achieve primerless adhesion to many substrates, including metals
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: Techsil® RTV12 is a two-component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 has been designed to achieve primerless adhesion to many substrates, including metals
- Form / Function: Encapsulant / Potting Compound
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Supplier: Protavic America, Inc.
Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST ES 1904, Epoxy, Potting and Encapsulating LOCTITE® STYCAST ES 1904 is an opaque, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications, excellent structural, mechanical and electrical properties are required. This two-part
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 37.78 µin/in-F
- Cure Type / Technology: Two Component System
- Viscosity: 25000 cP
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Supplier: Sauereisen, Inc.
Description: Sauereisen Zircon Potting Cement No. 13 is primarily used where high electrical insulation and thermal conductivity are desired. No. 13 cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock. Formulated as an economical, zircon
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 2.6 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Sauereisen, Inc.
Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal Potting Cement No. 11 is
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 3.4 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG Epoxylite® E 5302 HI TEMP Epoxy Potting Compound is a two-component system that consists of a liquid resin and a powder hardener. It has excellent adhesion to metals, ceramics, and most plastics. It is used for bonding and sealing of electrical components requiring
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 560 kV/in
- Elongation: 2 %
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Supplier: Dymax
Description: Multi-Cure® 921-T is a high-tensile-strengt h, UV-curable resin that is especially well suited when rigid adhesive bonds or potting areas are desired. Multi-Cure® 921-T was designed to bond a wide variety of substrates including metal, glass, ceramic, and
- Cure Type / Technology: UV / Radiation Cured (also EB, Light)
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 3000 cP
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Supplier: Dymax
Description: Dymax Multi-Cure® 921-GEL is designed for rapid rigid adhesive bonding and shallow potting (0.25 in/6mm) in a wide variety of substrates including metal, glass, ceramic, and many thermoset plastics. This material is formulated to cure primarily with UV/Visible light and includes
- Cure Type / Technology: UV / Radiation Cured (also EB, Light)
- Elongation: 30 %
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 25000 cP
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound is a two-component system used for potting and sealing of electrical and electronic components requiring resistance to high temperatures. It has excellent adhesion to metals, ceramics, and most plastics. It is
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 600 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Dymax
Description: Dymax Multi-Cure® 921-VT is a high-tensile-strengt h, UV-curable resin that is especially well suited when rigid adhesive bonds or potted areas are desired. Multi-Cure® 921-VT was designed to bond a wide variety of substrates including metal, glass, ceramic
- Cure Type / Technology: UV / Radiation Cured (also EB, Light)
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 11500 cP
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Supplier: Ellsworth Adhesives
Description: Sauereisen Zircon Potting Cement Powder No. 13 Off-White is a zircon-based cement that is used for potting applications, metal, glass, and ceramics. It is easy to use, odorless, heat conductive, electrical and thermal shock resistant. 1 gal Can.
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Cure Type / Technology: Single Component System
- Dielectric Strength: 55 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: (telecom and certain aerospace applications). Sil-pads are constructed with ceramic-filled polyester resins coatings either side of a fiberglass carrier or a film carrier. The SIL PAD family offers a complete range of performance characteristics to match individual applications. Options and
- Dielectric Constant (Relative Permittivity): 0.0055
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 0.9000 W/m-K
- Use Temperature: 68 to 302 F
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Supplier: Henkel Corporation - Industrial
Description: applications). SIL PADS are constructed with ceramic-filled polyester resins coating either side of a fiberglass carrier or a film carrier. The SIL PAD family offers a complete range of performance characteristics to match individual applications. Options and Configurations Standard thickness
- Dielectric Constant (Relative Permittivity): 0.0045
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.2 W/m-K
- Use Temperature: 68 to 302 F
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Supplier: Henkel Corporation - Industrial
Description: silicone contamination is a concern (telecom and certain aerospace applications). SIL PADS are constructed with ceramic-filled polyester resins coating either side of a fiberglass carrier or a film carrier. The SIL PAD family offers a complete range of performance characteristics to match
- Dielectric Constant (Relative Permittivity): 0.0037
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.3 W/m-K
- Use Temperature: 68 to 302 F
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Supplier: Epoxies Etc...
Description: 10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.11
- Dielectric Strength: 550 kV/in
- Dissimilar Substrates: Yes
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Supplier: Aremco Products, Inc.
Description: used to improve moisture resistance. Two-part systems consist of a powder and liquid binder system. Materials set at room temperature in several hours, then cured at ~250 °F in 2-4 hours. Sil-Bond™, a silicone-ceramic potting compound for optimal moisture resistance, is now
- Chemical / Polymer System Type: Silicone, Ceramic / Inorganic Cement
- Composition: Filled
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: combination of superb physical properties and convenient processing enable EP30HV to be used not only for bonding and coating, but also for potting and encapsulation, especially of electronic or optical assemblies. Master Bond Polymer System EP30HV produces high strength, rigid bonds which
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Master Bond, Inc.
Description: Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation with a free flowing viscosity.
- Applied Thickness / Gap Fill: 0.0030 to 0.0050 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dissimilar Substrates: Yes
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Supplier: RS Components, Ltd.
Description: A semi-rigid potting compound, useful for encapsulating or adhering materials of different coefficients of thermal expansion, e.g. glass, metal, ceramics and many plastic materials. Product Material = Epoxy Package Type = Pack Package Size = 500 g Special Properties = Semi Rigid
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Use Temperature: -40 to 248 F
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Supplier: Hernon Manufacturing, Inc.
Description: Tuffbond® 318 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond® 318 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 318 is also recommended for
- Chemical / Polymer System Type: Ceramic / Inorganic Cement, Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
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Supplier: Epoxies Etc...
Description: UV Cure 60-7114 is a low viscosity urethane adhesive, potting compound and coating. This UV Curable Resin is formulated to provide excellent water and chemical resistance. It is a good choice for potting electronic assemblies exposed to excessive moisture. UV Cure 7114 has very
- Chemical / Polymer System Type: Rubber Based / Elastomeric, Polyurethane (PU, PUR)
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Single Component System
- Features: Encapsulanting / Potting
- Industry: OEM / Industrial
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Supplier: Henkel Corporation - Electronics
Description: HYSOL ES1904 is an opaque, medium-viscosity epoxy resin system recommended for small potting and laminating applications where excellent structural, mechanical and electrical properties are required. This two-part adhesive exhibits good wetting, cures at room temperature and develops strong,
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...
Description: 20-3652\40 is a filled epoxy casting, potting, and encapsulating resin system. This is a lower viscosity version of the 20-3652. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3652\40 is easily machined and exhibits outstanding adhesion to metals,
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxies Etc...
Description: UV Cure 60-7105 is a low viscosity urethane adhesive, coating and potting compound. This UV curable resin exhibits outstanding adhesion, toughness, and exterior durability. UV Cure 60-7105 does not contain any solvents and is therefore a 100% solids system. This material is a good
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Rubber Based / Elastomeric
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Single Component System
- Elongation: 20 %
- Features: Encapsulating / Potting Compound
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Supplier: Monocrystal, Inc.
Description: AGH – series Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Description: of 7 mils almost instantaneously. With strong black fluorescence, it has good adhesion to the surface of various metals, ceramics and glass filled epoxy resins, and meets the needs of the most demanding environmentally friendly applications.
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured
- Form / Function: Conformal / Encapsulating Coating
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flexibility and adhesion to substrates such as PCBs, ceramics, lead frames, flex circuits, and silicon. Its low modulus and low glass-transition temperature help absorb mechanical stress, reducing strain on delicate wire bonds and fine interconnects. Dual-Cure Processing Flexibility (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
temperatures. The minimum curing schedule is 20-30 minutes at 250°F or 5-10 minutes at 300°F. This is a filled system with low shrinkage upon curing and sound dimensional stability. It bonds well to a wide variety of substrates used in electronics including metals, composites, ceramics and many (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Well suited for large potting and encapsulation applications, Master Bond EP29LPAO is a cost effective, two part system with a low viscosity, excellent flow properties and heat dissipation properties. Featuring convenient processing, this epoxy has a forgiving 100 to 50 mix ratio by weight and a (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
product line consists of advanced adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins. Each compound is designed to meet specific application needs and requirements. Master Bond manufactures over 3,000 grades of specially designed formulations. We also offer replacements for competitors’ discontinued products. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
21LSCL-2Med bonds well to a wide variety of substrates including metals, glass, composites, ceramics as well as many rubber and plastic materials. EP21LSCL-2Med is a superb electrical insulator. This property, combined with its low exotherm, makes it highly effective in larger potting and (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
EP30HV Master Bond EP30HV is a lower viscosity, two component epoxy system for high performance bonding, sealing, coating and potting. It is formulated to cure at room temperature or more rapidly at elevated temperatures. The optimum (read more)
Browse Conformal Coatings Datasheets for Master Bond, Inc. -
latter property is particularly useful in potting and encapsulation applications. Also, the compound allows for precise alignment with minimal fixturing and simple curing. Its service temperature range is from 4K to +300°F. The color of Part A is light cream and Part B is similar, but slightly darker (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
x height). The plastic case is not encapsulated, avoiding quality risks associated with silicone potting compounds during reflow soldering. Over-current protection and remote on/off is standard, with a -5/+10% output voltage adjustment range on single outputs only. Input to output isolation (read more)
Browse DC Power Supplies Datasheets for TDK-Lambda Americas Inc.
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Electrochemical corrosion rate probes for high temperature energy applications
A second and more likely possibility is that, at the test temperature, the ceramic potting compound surrounding the sensor electrodes was sufficiently electrically conductive to act as the electrolyte for the electrochemical measurement of corrosion rate.
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CERAMIC ABSTRACTS
ceramic potting compound containing orthophosphoric acid, aluminum hy- droxide, mcta-aluminum phosphate, bentonite, and aluminum .
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CERAMIC ABSTRACTS
ceramic potting compound , in slurry form, can be poured directly around electronic components.
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Journal of Aircraft > Fabrication and full-scale structural evaluation of glass-fabric reinforced plastic shells.
The curved-panel compressive specimens were reinforced on the loaded ends with an epoxy- ceramic potting compound and, in some cases, with thin, narrow strips of laminate bonded to the facings.
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Journal of Spacecraft and Rockets > PAET Entry Heating and Heat Protection Experiment
CERAMIC POTTING COMPOUND .
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SNAP-8, THE FIRST ELECTRIC PROPULSION POWER SYSTEM
… developed which will incorporate design modifications to improve the basic performance of the machine anci which will place emphasis on the inclusion of those features required to provide mercury ewironment capability* Meanwhile, laboratory evaluation of ceramic potting compounds , glass ceramic insulation, ceramic …
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SPONGE FUEL EVALUATION. Phase II Report, August 23, 1961 to January 31, 1963
The leads were still solidly attached at the connections, but the ceramic potting compound had come out of the holes through which it was applied.
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Zirconium hydride reactor control reflector systems: summary report
The windings are ceramic-insulated, nickel-clad copper wire (AWG No. 32), encapsulated with phosphate-bonded ceramic potting compound .
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New Products & Processes
Ceramic Potting Compound .
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Motorsport Sensor Technology
These parts are encapsulated with a ceramic based potting compound , because the thermal expansion coefficient of epoxy based materials is too high and they do not offer sufficient mechanical support at very high temperature.