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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST ES 1904, Epoxy, Potting and Encapsulating LOCTITE® STYCAST ES 1904 is an opaque, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications, excellent structural, mechanical and electrical properties are required. This two-part
- Viscosity: 25,000 cP
- Coeff. of Thermal Expansion (CTE): 37.77777777777778 µin/in-F
- Chemical System: Epoxy (EP)
- Features: Leveling / Filling Compound
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Supplier: Epoxies Etc...
Description: 10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion.
- Viscosity: 800 to 2,000 cP
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 0.4326837 W/m-K
- Tensile Strength (Break): 10,500 psi
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Supplier: Techsil Limited
Description: Techsil® RTV12 is a two-component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 has been designed to achieve primerless adhesion to many substrates, including metals,
- Features: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: Techsil® RTV12 is a two-component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 has been designed to achieve primerless adhesion to many substrates, including metals,
- Features: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: Techsil® RTV12 is a two-component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 has been designed to achieve primerless adhesion to many substrates, including metals,
- Features: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: Techsil® RTV12 is a two-component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 has been designed to achieve primerless adhesion to many substrates, including metals,
- Features: Encapsulant / Potting Compound
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Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond R-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval.
- Viscosity: 15,000 to 23,000 cP
- Features: Ceramic / Glass, Encapsulating / Potting Compound, Medical / Food (Sanitary / FDA), Metal, Plastic, Textiles / Fabrics, Wood / Wood Product
- Chemical System: Polyurethane (PU, PUR)
- Cure / Technology: Two Component System
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Supplier: R. S. Hughes Company, Inc.
Description: Devcon black potting & encapsulating compound is compatible with ceramic, concrete, metal and plastic materials with a 7 day cure time. Provides a 3 min working time. Works in a mix ratio of 4:1.
- Dielectric Strength: 350.0000000000002 kV/in
- Features: Encapsulant / Potting Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Momentive brown TSE3826 potting & encapsulating compound is compatible with ceramic, glass, metal and plastic materials with a 7 day cure time.
- Dielectric Strength: 584.2000000000012 kV/in
- Features: Encapsulant / Potting Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Momentive clear TSE392 potting & encapsulating compound is compatible with ceramic, copper, glass and plastic materials with a 7 day cure time.
- Thermal Conductivity: 0.18 W/m-K
- Dielectric Strength: 558.8000000000012 kV/in
- Features: Encapsulant / Potting Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Momentive clear TSE392 potting & encapsulating compound is compatible with ceramic, copper, glass and plastic materials with a 7 day cure time.
- Thermal Conductivity: 0.18 W/m-K
- Dielectric Strength: 558.8000000000012 kV/in
- Features: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound is a two-component system used for potting and sealing of electrical and electronic components requiring resistance to high temperatures. It has excellent adhesion to metals, ceramics, and most plastics. It is
- Thermal Conductivity: 0.3 W/m-K
- Dielectric Strength: 600 kV/in
- Features: Encapsulating / Potting Compound
- Chemical System: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG Epoxylite® E 5302 HI TEMP Epoxy Potting Compound is a two-component system that consists of a liquid resin and a powder hardener. It has excellent adhesion to metals, ceramics, and most plastics. It is used for bonding and sealing of electrical components requiring
- Tensile Strength (Break): 4,000 psi
- Elongation: 2 %
- Dielectric Strength: 560 kV/in
- Features: Encapsulating / Potting
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Supplier: Master Bond, Inc.
Description: Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.
- Applied Thickness / Gap Fill: 0.003 to 0.006 inch
- Viscosity: 40,000 to 80,000 cP
- Use Temperature: -100 to 400 F
- Coeff. of Thermal Expansion (CTE): 7,222,222.222222222 to 8,888,888.888888888 µin/in-F
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Supplier: Dymax
Description: Multi-Cure® 921-T is a high-tensile-strength, UV-curable resin that is especially well suited when rigid adhesive bonds or potting areas are desired. Multi-Cure® 921-T was designed to bond a wide variety of substrates including metal, glass, ceramic, and many thermoset plastics. This
- Viscosity: 3,000 cP
- Features: Encapsulant / Potting Compound
- Cure / Technology: UV / Radiation Cured (also EB, Light)
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Supplier: Sauereisen, Inc.
Description: Sauereisen Zircon Potting Cement No. 13 is primarily used where high electrical insulation and thermal conductivity are desired. No. 13 cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock. Formulated as an economical,
- Use Temperature: 2,600 F
- Thermal Conductivity: 1.1538232 to 1.5865069 W/m-K
- Coeff. of Thermal Expansion (CTE): 2.5999999999999996 µin/in-F
- Tensile Strength (Break): 740 psi
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Supplier: Protavic America, Inc.
Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and
- Viscosity: 20,000 cP
- Use Temperature: -55 to 150 F
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Ceramic / Glass, Electrical Insulating / Dielectric, Electrical Power / HV, Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Gap Filling Sealant / FIP Gasket, Liquid, Metal
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Supplier: Epoxies Etc...
Description: UV Cure 60-7105 is a low viscosity urethane adhesive, coating and potting compound. This UV curable resin exhibits outstanding adhesion, toughness, and exterior durability. UV Cure 60-7105 does not contain any solvents and is therefore a 100% solids system. This material is a good
- Viscosity: 3,000 cP
- Use Temperature: -58 to 311 F
- Tensile Strength (Break): 5,000 psi
- Elongation: 20 %
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Supplier: Epoxies Etc...
Description: UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an
- Viscosity: 5,000 cP
- Features: Ceramic / Glass, Dissimilar Substrates, Elastomeric, Electronics, Encapsulanting / Potting, Flexible / Dampening, Gap Filling Sealant / FIP Gasket, Liquid, Metal, UV / Radiation Cured (EB, Light)
- Form / Function: Die Bonding Adhesive / Compound
- Industry: OEM / Industrial
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Supplier: Protavic America, Inc.
Description: ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique
- Viscosity: 625 cP
- Use Temperature: -85 to 347 F
- Dielectric Constant (Relative Permittivity): 4.3
- Water Absorption: 1.5 %
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Supplier: Master Bond, Inc.
Description: Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity.
- Applied Thickness / Gap Fill: 0.003 to 0.005 inch
- Viscosity: 50 to 200 cP
- Use Temperature: -80 to 550 F
- Tensile Strength (Break): 11,000 to 12,000 psi
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Supplier: Dampney Company, Inc.
Description: Hi-Temp Lab-metal is ready-to-use right from the can. Developed for difficult repairs subject to excessive heat, Hi-Temp Lab-metal withstands temperatures as high as 1000ºF.
- Use Temperature: 1,000 F
- Thermal Conductivity: 1.7307348 to 3.4614696 W/m-K
- Features: Air Setting / Film Drying, Building / Construction, Ceramic / Glass, Filled / Reinforced, Leveling / Filling Compound, Metal, Other, Plastic, Specialty / Other, Wood / Wood Product
- Industry: Automotive
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Supplier: Ellsworth Adhesives
Description: Sauereisen Cement Liquid No. 31 Off-White is a ceramic cement that is used for sealing, cementing, insulating, and assembling metal, ceramics, porcelain, and glass. It is heat conductive, fireproof, gasproof, and resistant to electricity, most solvents, oil, acids, high temperatures,
- Tensile Strength (Break): 400 psi
- Dielectric Strength: 12.500000000000002 to 38 kV/in
- Features: Ceramic / Glass, Encapsulating / Potting Compound
- Chemical System: Ceramic / Inorganic Cement
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Supplier: Master Bond, Inc.
Description: Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting.
- Applied Thickness / Gap Fill: 0.003 to 0.006 inch
- Viscosity: 800 to 1,200 cP
- Use Temperature: -452.47 to 250 F
- Coeff. of Thermal Expansion (CTE): 38,888,888.88888889 to 44,444,444.44444444 µin/in-F
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Supplier: Henkel Corporation - Industrial
Description: certain aerospace applications). Sil-pads are constructed with ceramic-filled polyester resins coatings either side of a fiberglass carrier or a film carrier. The SIL PAD family offers a complete range of performance characteristics to match individual applications. Options and Configurations
- Use Temperature: 68 to 302 F
- Thermal Conductivity: 0.9 W/m-K
- Dielectric Constant (Relative Permittivity): 0.0055
- Features: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: combination of superb physical properties and convenient processing enable EP30HV to be used not only for bonding and coating, but also for potting and encapsulation, especially of electronic or optical assemblies. Master Bond Polymer System EP30HV produces high strength, rigid bonds which
- Use Temperature: -60 to 300 F
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Tensile Modulus: 360 to 380 ksi
- Electrical Resistivity: 10,000,000,000,000,000 ohm-cm
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Supplier: Ellsworth Adhesives
Description: Sauereisen Plastic Porcelain Powder No. 30 Tan is a chemically setting, magnesium oxide based powder that is used for assembling silverware, sealing conduits, potting applications, and insulating lead wires. This inorganic material cures into a porcelain-like substance and is good for filling
- Tensile Strength (Break): 200 psi
- Chemical System: Ceramic / Inorganic Cement
- Features: Encapsulating / Potting Compound
- Cure / Technology: Two Component System
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Supplier: Henkel Corporation - Electronics
Description: HYSOL ES1904 is an opaque, medium-viscosity epoxy resin system recommended for small potting and laminating applications where excellent structural, mechanical and electrical properties are required. This two-part adhesive exhibits good wetting, cures at room temperature and develops strong,
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Sauereisen, Inc.
Description: Sauereisen Flotemp Cement No. 4 is used for potting applications where high electrical insulation and thermal conductivity are required. No. 4 is specially formulated to limit the wicking nature of a porous substrate. This will prevent permeation of water into the substrate and the associated
- Use Temperature: 2,200 F
- Thermal Conductivity: 0.788926613 W/m-K
- Coeff. of Thermal Expansion (CTE): 6.18 µin/in-F
- Tensile Strength (Break): 345 psi
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Supplier: Sauereisen, Inc.
Description: Sauereisen Insultemp Cement No. 10 is primarily used where high electrical insulation and thermal conductivity are desired. No. 10 is a phosphate-bonded material that cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock. Formulated as
- Use Temperature: 2,400 F
- Thermal Conductivity: 1.442279 to 2.3076464 W/m-K
- Coeff. of Thermal Expansion (CTE): 5 µin/in-F
- Tensile Strength (Break): 300 psi
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Supplier: Sauereisen, Inc.
Description: high-temperature insulation. Insa-Lute Hi Temp Cement bonds well to metal, ceramic and glass. Upon curing, the cement resembles a durable ceramic and will resist high temperatures. Working properties of the cement exhibit a virtually unlimited pot life prior to exposure to air. This
- Use Temperature: 2,500 F
- Coeff. of Thermal Expansion (CTE): 6 µin/in-F
- Tensile Strength (Break): 400 psi
- Dielectric Strength: 1.3 to 51.00000000000001 kV/in
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Supplier: Dampney Company, Inc.
Description: Ready-to-use metal repair putty, dent filler and patching compound. Durable metal filler for fast, permanent repairs. A unique, quality problem-solver! Lab-metal ready-to-use repair compound spreads like paste and hardens quickly into metal.
- Use Temperature: -40 to 350 F
- Thermal Conductivity: 1.7307348 to 3.4614696 W/m-K
- Coeff. of Thermal Expansion (CTE): 15 µin/in-F
- Tensile Strength (Break): 650 psi
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Supplier: Aremco Products, Inc.
Description: moisture resistance. Two-part systems consist of a powder and liquid binder system. Materials set at room temperature in several hours, then cured at ~250 °F in 2-4 hours. Sil-Bond™, a silicone-ceramic potting compound for optimal moisture resistance, is now offered along with
- Use Temperature: 900 F
- Chemical System: Ceramic / Inorganic Cement, Silicone
- Features: Electronics, Encapsulating / Potting, Grease / Paste
- Composition: Filled
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Supplier: Henkel Corporation - Electronics
Description: DC0114 epoxy underfill is suitable for high reliability applications due to its combination of properties. It can be applied to ceramic or organic substrates, including solder masks and polyimide.
- Coeff. of Thermal Expansion (CTE): 38.888888888888886 µin/in-F
- Viscosity: 20,000 cP
- Industry: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound
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Supplier: Hernon Manufacturing, Inc.
Description: Tuffbond® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
- Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Chemical System: Ceramic / Inorganic Cement
- Features: Electrical Power / HV, Electronics, Encapsulating / Potting, Specialty / Other
- Cure / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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flexibility and adhesion to substrates such as PCBs, ceramics, lead frames, flex circuits, and silicon. Its low modulus and low glass-transition temperature help absorb mechanical stress, reducing strain on delicate wire bonds and fine interconnects. Dual-Cure Processing Flexibility (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
temperatures. The minimum curing schedule is 20-30 minutes at 250°F or 5-10 minutes at 300°F. This is a filled system with low shrinkage upon curing and sound dimensional stability. It bonds well to a wide variety of substrates used in electronics including metals, composites, ceramics and many (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Well suited for large potting and encapsulation applications, Master Bond EP29LPAO is a cost effective, two part system with a low viscosity, excellent flow properties and heat dissipation properties. Featuring convenient processing, this epoxy has a forgiving 100 to 50 mix ratio by weight and a (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
product line consists of advanced adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins. Each compound is designed to meet specific application needs and requirements. Master Bond manufactures over 3,000 grades of specially designed formulations. We also offer replacements for competitors’ discontinued products. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
21LSCL-2Med bonds well to a wide variety of substrates including metals, glass, composites, ceramics as well as many rubber and plastic materials. EP21LSCL-2Med is a superb electrical insulator. This property, combined with its low exotherm, makes it highly effective in larger potting and (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
EP30HV Master Bond EP30HV is a lower viscosity, two component epoxy system for high performance bonding, sealing, coating and potting. It is formulated to cure at room temperature or more rapidly at elevated temperatures. The optimum (read more)
Browse Conformal Coatings Datasheets for Master Bond, Inc. -
latter property is particularly useful in potting and encapsulation applications. Also, the compound allows for precise alignment with minimal fixturing and simple curing. Its service temperature range is from 4K to +300°F. The color of Part A is light cream and Part B is similar, but slightly darker (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
x height). The plastic case is not encapsulated, avoiding quality risks associated with silicone potting compounds during reflow soldering. Over-current protection and remote on/off is standard, with a -5/+10% output voltage adjustment range on single outputs only. Input to output isolation (read more)
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Electrochemical corrosion rate probes for high temperature energy applications
A second and more likely possibility is that, at the test temperature, the ceramic potting compound surrounding the sensor electrodes was sufficiently electrically conductive to act as the electrolyte for the electrochemical measurement of corrosion rate.
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CERAMIC ABSTRACTS
ceramic potting compound containing orthophosphoric acid, aluminum hy- droxide, mcta-aluminum phosphate, bentonite, and aluminum .
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CERAMIC ABSTRACTS
ceramic potting compound , in slurry form, can be poured directly around electronic components.
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Journal of Aircraft > Fabrication and full-scale structural evaluation of glass-fabric reinforced plastic shells.
The curved-panel compressive specimens were reinforced on the loaded ends with an epoxy- ceramic potting compound and, in some cases, with thin, narrow strips of laminate bonded to the facings.
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Journal of Spacecraft and Rockets > PAET Entry Heating and Heat Protection Experiment
CERAMIC POTTING COMPOUND .
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SNAP-8, THE FIRST ELECTRIC PROPULSION POWER SYSTEM
… developed which will incorporate design modifications to improve the basic performance of the machine anci which will place emphasis on the inclusion of those features required to provide mercury ewironment capability* Meanwhile, laboratory evaluation of ceramic potting compounds , glass ceramic insulation, ceramic …
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SPONGE FUEL EVALUATION. Phase II Report, August 23, 1961 to January 31, 1963
The leads were still solidly attached at the connections, but the ceramic potting compound had come out of the holes through which it was applied.
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Zirconium hydride reactor control reflector systems: summary report
The windings are ceramic-insulated, nickel-clad copper wire (AWG No. 32), encapsulated with phosphate-bonded ceramic potting compound .
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New Products & Processes
Ceramic Potting Compound .
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Motorsport Sensor Technology
These parts are encapsulated with a ceramic based potting compound , because the thermal expansion coefficient of epoxy based materials is too high and they do not offer sufficient mechanical support at very high temperature.