Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Description: Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
-
Description: Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving production costs and waste. It is suitable for automatic adhesive dispensing, with excellent
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
-
Description: Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
-
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND 3781UV, Acrylate, Device Assembly, Structural Bonding LOCTITE® 3128NH edgebond material is designed to add reliability to chip scale packages and other electronic components. It is a low temperature cure adhesive ideal for use on heat sensitive components. One
- Cure Type / Technology: UV / Radiation Cured (EB, Light), Single Component System
- Viscosity: 12000 cP
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 6200, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK 6200 B-stageable adhesive is designed for use in flex or laminated based substrates. This material is ideal for chip scale packages where tolerance and bleed need to be minimized. Stencil printing Low
- Coeff. of Thermal Expansion (CTE): 52.22 µin/in-F
- Viscosity: 21000 cP
-
Supplier: ODG (Origin Data Global)
Description: SPRAYABLE HOT MELT ADHESIVE 6111
-
Supplier: Powell Electronics, Inc.
Description: 3M Hot Melt Adhesive 3748, Black, Chips
-
Supplier: Powell Electronics, Inc.
Description: 3M Hot Melt Adhesive 3731, Tan, Chips,
-
Supplier: ODG (Origin Data Global)
Description: HOT MELT ADHESIVE 3748-B OFF-WHI
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 6202C, Proprietary Hybrid Chemistry, Low Modulus, Die Attach Adhesive LOCTITE® ABLESTIK 6202C B-stageable adhesive is ideal for chip scale packages where tolerance and bleed need to be minimized. This low modulus adhesive is recommended for large die
- Coeff. of Thermal Expansion (CTE): 38.89 µin/in-F
- Viscosity: 28000 cP
-
Supplier: Henkel Corporation - Industrial
Description: solvent carrier. Once the material is fully cured and the solvent is evaporated, the adhesive has an extremely high silver loading. LOCTITE ABLESTIK 2600BT adhesive provides very low thermal resistance between chip to case, nearing solder and eutectic-type materials. High
- Coeff. of Thermal Expansion (CTE): 22.22 µin/in-F
- Features: Thermal / Heat Conductive
-
Supplier: Protavic America, Inc.
Description: The PROTAVIC® PNE 40824-A and PROTAVIC® PNE 40824-B is a two-component system, solvent free, electrically insulating epoxy adhesive, which is specially designed for protecting the devices from heat, humidity and mechanical damages. The PROTAVIC® PNE 40824-A and PROTAVIC® PNE
- Coeff. of Thermal Expansion (CTE): 83.33 to 88.89 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Filled, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
-
Supplier: ODG (Origin Data Global)
Description: THERMOSET CHIP GLUE (RED) - 30CC
-
Supplier: ODG (Origin Data Global)
Description: THERMOSET CHIP GLUE (RED) - 10CC
-
Supplier: R. S. Hughes Company, Inc.
Description: Technomelt yellow 2787 hot melt adhesive is compatible with cardboard materials. Additionally, this hot melt adhesive is a high melt adhesive with a melting point of +230 F.
- Cure Type / Technology: Thermoplastic / Hot Melt
- Viscosity: 4800 cP
-
Supplier: R. S. Hughes Company, Inc.
Description: 3M Scotch-Weld 3798 amber hot melt adhesive is compatible with paper materials. Additionally, this hot melt adhesive is a low melt adhesive with a melting point of +190.4 F.
- Cure Type / Technology: Thermoplastic / Hot Melt
- Viscosity: 9500 cP
-
Supplier: DigiKey
Description: THERMOSET CHIP BONDING EPOXY (RE
-
Supplier: DigiKey
Description: THERMOSET CHIP BONDING EPOXY (RE
-
Supplier: DigiKey
Description: THERMOSET CHIP BONDING EPOXY (RE
-
Supplier: DigiKey
Description: THERMOSET CHIP BONDING EPOXY (RE
-
Description: compressible, soft, reducing assembly stress and protecting sensitive and fragile components. ? Self-adhesive for easy application and rework. ? Customizable die-cut shapes to meet specific customer needs. ? Exceptional tensile strength and abrasion resistance
- Dielectric Constant (Relative Permittivity): 9
- Dielectric Strength: 2.03E-4 kV/in
- Elongation: 30 %
- Features: Thermal / Heat Conductive
-
Supplier: R. S. Hughes Company, Inc.
Description: 3M 3748B off-white hot melt adhesive is compatible with abs, acrylic, chipboard, coated cardboard, fabric, foam, paper, polyethylene, pvc and uncoated cardboard materials. Additionally, this hot melt adhesive is a high melt adhesive with a melting point of +291.2 F. Delivers
- Cure Type / Technology: Thermoplastic / Hot Melt
- Viscosity: 5000 cP
-
Supplier: R. S. Hughes Company, Inc.
Description: 3M 3731 B off-white hot melt adhesive is compatible with abs, acrylic, chipboard, coated cardboard, paper, polyethylene, polypropylene and pvc materials. Additionally, this hot melt adhesive is a high melt adhesive with a melting point of +314.6 F. Delivers great performance
- Cure Type / Technology: Thermoplastic / Hot Melt
- Viscosity: 12000 cP
-
Supplier: Saint-Gobain Tape Solutions
Description: CHR C661 is manufactured from electrically deposited copper foil backing with acrylic adhesive. The copper foil surface of C661 is electrically conductive, conformable and easy to apply. Applications: Shielding applications Typically IC chips, electrical cabinets, cables, motors and
- Adhesive: Acrylic
- Backing: Metal Foil / Sheet
- Features: Anti-static / ESD Control
- Temperature Resistance: -40 C
-
Supplier: Ellsworth Adhesives
Description: 3M 3748 B Hot Melt Off-White, formerly known as Jet-Melt, is a 100% solids thermoplastic resin designed for low surface energy coatings and plastics such as polyolefins. Includes high temperature stability, thermal shock resistance, and quick bond strength. 22 lb Case.
- Cure Type / Technology: Thermoplastic / Hot Melt, Single Component System
- Substrate / Material Compatibility: Plastic, Textiles / Fabrics, Wood / Wood Product
- Viscosity: 5000 cP
-
Supplier: Ellsworth Adhesives
Description: 3M 6111HT B Hot Melt Tan is a sprayable, 100% solids adhesive with a higher heat resistance compared to the 3M 6111. Ideal for most dark colored fabrics, foams, particle board, and thin metals. 22 lb Case.
- Cure Type / Technology: Thermoplastic / Hot Melt, Single Component System
- Viscosity: 2500 to 4500 cP
-
Supplier: MacDermid Alpha Electronics Solutions
Description: One-component UV cure system designed for fast curing and bonding in various applications, including coating and component fixing. Product Overview ALPHA HiTech UP44-5566T is particularly suitable for mobile wireless charger chip coating. It is halogen-free and complies with the RoHS
- Cure Type / Technology: UV / Radiation Cured (EB, Light)
- Industry: Electronics, Semiconductors / IC Packaging
-
Supplier: Accuris
Description: ADHESIVE TAPE, POLYURETHANE, CLEAR, PAINTABLE, STONE CHIP RESISTANT
-
Supplier: Ellsworth Adhesives
Description: Bostik H284-332 Hot Melt Adhesive Amber has an excellent pick-up bond that cools to a brittle bond. Its 100% solid resin consistency makes it safe, clean and easy to use with no wasted powder or chips. 35 lb Case.
- Cure Type / Technology: Thermoplastic / Hot Melt, Single Component System
- Viscosity: 525 cP
-
Industrial Adhesives - Bostik Thermogrip HMY-1505 Hot Melt Adhesive Amber 35 lb Case -- HMY-1505-BBLSupplier: Ellsworth Adhesives
Description: Bostik Thermogrip HMY-1505 Amber is a high performing, general purpose hot melt adhesive in chip form offering clean machining, production flexibility and outstanding thermal stability. Excellent cold and heat resistance allows for performance in a range of shipping conditions. 35 lb
- Cure Type / Technology: Thermoplastic / Hot Melt, Single Component System
- Viscosity: 1200 to 2450 cP
-
Supplier: Master Bond, Inc.
Description: Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound dimensional stability. Its inherent toughness allows it to withstand the most intense
- Coeff. of Thermal Expansion (CTE): 15 to 16.67 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): Over 4.6
- Dielectric Strength: Over 450 kV/in
-
Supplier: MacDermid Alpha Electronics Solutions
Description: substrate attachment in hybrid or multi-chip modules (MCMs). Its reworkable formulation provides key advantages in applications where thermoset adhesives are typically less effective.
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Filled / Reinforced: Yes
- Industry: Electronics, Semiconductors / IC Packaging
-
Supplier: ThreeBond International, Inc.
Description: conductive resins, it is easy to find the right appearance, viscosity, volume resistivity, chip bonding strength, and cure time that you need for your manufacturing application. Most often used in consumer electronics, EV and fuel cell manufacturing, and in the automotive manufacturing
- Cure Type / Technology: Anaerobic
- Features: Electrically Conductive Compound (Adhesive, Grease), Filled / Reinforced
- Industry: Automotive, Electronics
- Substrate / Material Compatibility: Rubber / Elastomer
-
Supplier: Accuris
Description: TAPE WITH CLEARCOAT, URETHANE, PRESSURE SENSITIVE, CHIP RESISTANT, EXTERIOR, 0.43 MM NOMINAL THICKNESS, 0.13 MM ADHESIVE THICKNESS
-
Supplier: LED Cool Lights
Description: -Bright 5050 2 Chip surface mount LEDs available in White, Warm white, Red, Green, Blue and Amber. (Custom Colors Available Upon Request.) Highly flexible circuit board with integral 3M high-bond adhesive tape can be applied to most accessible surfaces. Clips available upon request.
-
Supplier: LED Cool Lights
Description: Description LED Cool Lights, 5050 Tape Light with Protective Coating, introduces a Revolution in Lighting with the LED Adhesive Ribbon which features the latest energy efficient LED technology in an extremely low profile that will make you wonder where the light is coming from. Flexible and
-
Supplier: MacDermid Alpha Electronics Solutions
Description: . Suitable for die and/or substrate attach in hybrid or multi-chip modules (MCMs), its reworkable thermoplastic system offers key advantages in applications traditionally unsuited to thermoset adhesives.
- Cure Type / Technology: Thermoplastic / Hot Melt, Thermosetting / Crosslinking
- Industry: Electronics, Semiconductors / IC Packaging
-
Supplier: Henkel Corporation - Electronics
Description: (Known as ABLESTIK ABLEBOND 3005 ) LOCTITE ECCOBOND 3005 adhesive is designed for lid attach in flip chip BGA applications. The combination of product features result in superior flip chip BGA reliability.
- Industry: Electronics
- Thermal Conductivity: 0.5000 W/m-K
- Viscosity: 37000 cP
-
Supplier: VAST STOCK CO., LIMITED
Description: CPU & Chip Coolers -10C +90C 5VDC With Adhesive
-
Supplier: Surface Armor LLC
Description: often have the company logo inlaid in a custom stone floor or mural. Protecting the Rock Bottom Line These are the high-class details that wow the end user but can be a headache for suppliers. During transport or final finishing, one scratch or chip is going to send the contractor or
- Backing: Paper, Plastic / Polymer, PET / Polyester, PVC / Vinyl, Specialty / Other
- Features: Abrasion / Scratch Resistant, Removable, Transparent, UV / Weather Resistant
- Type: Single-Sided
-
Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL ECCOBOND CT4042-1 A/B ) LOCTITE ABLESTIK CT4042-1 PTA is a two component silver-filled, easy to apply, conductive epoxy paste adhesive. It is recommended for chip bonding in microelectronics applications. It is a lower viscosity version of LOCTITE ABLESTIK CT4042
- Industry: Electronics
-
Description: , ensuring efficient heat transfer. ? Excellent wetting properties ensure that there is no risk of spillage after thermal cycling, making them a viable alternative to thermal grease/thermal paste. ? Self-adhesive for easy application and rework. ? Complies with RoHS, Halogen
- Dielectric Constant (Relative Permittivity): 3
- Features: Thermal / Heat Conductive
- Industry: Electronics
- Thermal Conductivity: 3.5 W/m-K
-
Description: , ensuring efficient heat transfer. ? Excellent wetting properties ensure that there is no risk of spillage after thermal cycling, making them a viable alternative to thermal grease/thermal paste. ? Self-adhesive for easy application and rework. ? Complies with RoHS, Halogen
- Dielectric Constant (Relative Permittivity): 4
- Features: Thermal / Heat Conductive
- Industry: Electronics
- Thermal Conductivity: 5 W/m-K
-
Description: , ensuring efficient heat transfer. ? Excellent wetting properties ensure that there is no risk of spillage after thermal cycling, making them a viable alternative to thermal grease/thermal paste. ? Self-adhesive for easy application and rework. ? Complies with RoHS, Halogen
- Chemical / Polymer System Type: Starch
- Features: Thermal / Heat Conductive
- Industry: Electronics
- Thermal Conductivity: 4 W/m-K
-
Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol ECCOBOND CE3126 ) Snap curable anisotropic adhesive is especially suited in applications where throughtput is critical. This product is typically used for very fine pitch flip chip interconnections where electrical conductivity is desired in only one direction.
- Industry: Electronics
- Viscosity: 16300 cP
-
Supplier: Henkel Corporation - Electronics
Description: Thermosetting, dielectric adhesive developed for GaN chip bonding for high-brightness LEDs. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
- Industry: Electronics
Find Suppliers by Category Top
Featured Products Top
-
bonding (chip bonding) machines. Our product portfolio includes nozzles manufactured from stainless steel, tungsten steel, and ceramic, and they are fully compatible with industry-leading platforms such as ESEC (BESI) and ASM die bonding machines. Technical Advantages of Ceramic Dispensing Nozzles (read more)
Browse Semiconductor Wire and Wedge Bonders Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Take your electrical design to the next level with performance where it matters. 3M™ Electrically Conductive Tape is a family of XYZ-axis electrically conductive pressure-sensitive adhesive (PSA) tapes. Protect your systems and achieve efficient and reliable operations with these solutions (read more)
Browse Cable and Electrical Tapes Datasheets for Heilind Electronics, Inc. -
outward, can provide an efficient polishing and grinding. Long Life Owing to high-strength adhesive formula, the product has good heat resistance and chip removal performance, which can provide long-lasting grinding force. Tailor-made for Many Applications and on a Multitude of (read more)
Browse Abrasive Rolls and Abrasive Sheets Datasheets for Beijing Grish Hitech Co., Ltd. -
SARCON® EGR30A makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient transfer of heat to nearby components or heat (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
. Whether marking temporary lanes on a new overlay, delineating chip seals, or reinforcing permanent striping, each product line delivers a specialized solution for specific roadway conditions. Temporary Overlay Markers (TOMs): Bright, Flexible (read more)
Browse Traffic Safety Equipment Datasheets for Pexco -
-radiation, high-temperature, and high-pressure environments. It supports four isolated channels in a single chip, ensuring superior signal clarity and system resilience in aerospace, energy, and communication infrastructure (read more)
Browse Resistors Datasheets for Win Source Electronics -
depend on the application). For applications below -40°C, a clamping plate should be installed over the heater so that its structure will not be affected by the change in adhesive properties under cold conditions (read more)
Browse Flexible Heaters Datasheets for Pelonis Technologies, Inc. -
Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
, and they have chip detectors included in the engine for safety purposes. Aviation hydraulics are also another area of concern for oil analysis. The hydraulics need fire resistance for prevention of fires resulting from any accidents. Phosphate esters are widely used in those (read more)
Browse Oil Sensors and Analyzers Datasheets for AMETEK Spectro Scientific
Conduct Research Top
-
Flip Chip Packaging Underfill Bonding Adhesive Die Attach And Its Advantages
pads of the substrate. During flip chip mounting, the inverted chip brings the chip adhesive into contact with circuit board directly, thus allowing smaller chip assembly and higher and direct signal density.
-
How to find the right chip bonding adhesive for smart card chip and microchip
In flip chip mounting, the chip has to be inverted so that the adhesive is in contact directly with the circuit board. This allows smaller chip assembly as well as direct signal density. In chip assembly, we can use electrically conductive adessives to act as a replacement for solder where
-
Epoxy Underfill Chip Level Adhesives
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. One-component epoxy resin adhesive
-
DeepMaterial Adhesive Solutions for Industrial
Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials
-
Industrial Adhesive Applications
DeepMaterial is low temperature cure bga flip chip underfill pcb epoxy process adhesive glue material manufacturer,supply industrial appliance structural bonding epoxy adhesive glue,low refractive index epoxy resin adhesive glue,high refractive index optical adhesive glue,best glue for magnet
-
When To Use Surface Mount Adhesive Glue To Bond SMT Components And Bottom Side Underfill Chip Bonding
Several situations call for the use of an adhesive to bond SMT components. Find out how you can determine which type of adhesive is needed and what conditions will require a different bonding method altogether.
-
Micro LED adhesive solutions that work for lens and displays optical contact bonding
A lot of research has been put into the development of the best adhesives for use in different applications. Micro LED adhesive is one of them. Different techniques have been introduced to cater to the issues in the micro-LED industry such as massive chip transfer and heterogeneous micro-LED
-
Silicone Optical Adhesive use in LED Packaging Solid Crystal
Silicone optical adhesive is commonly used in LED packaging solid crystal applications. LED packaging refers to the process of encapsulating the LED chips in a protective material to enhance their performance, reliability, and optical characteristics.
More Information Top
-
http://dspace.mit.edu/bitstream/handle/1721.1/50398/40606893-MIT.pdf?sequence=2
FLIP CHIP ADHESION ...............................................................
-
Adhesive flip chip bonding on flexible substrates
This paper presents three approaches to a flip chip adhesive process based on flexible .
-
Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates
His current research interest concen- trates on the reliability and the failure mechanism of flip- chip adhesive joints and the bondability of wire bonding, especially the microstructure analysis of materials using scanning electron microscopy (SEM), transmission electron microscopy (TEM), and other surface …
-
44th Electronic Components and Technology Conference
AbshaetFlip-chip-on-glass (FCOG)is susceptibleto electrical opens for a variety of reasons including, but not limited to, movement in the Z-axis caused by flip- chip adhesive CTE and water absorption of the adhesive.
-
Package cooling designs for a dual-chip electronic package with one high power chip
Thermal interface materials for the single-chip packages include thermal paste [1,4], direct- chip adhesive attach [5,6] and phase change materials [7].
-
Surface Texturing of Drill Bits for Adhesion Reduction and Tool Life Enhancement
In another study, Sugihara et al. [20] found reductions in chip adhesion and friction force resulting from banded nano-/micro-textures in a face-milling experiment on alu- minum alloy machining.
-
Advances in Abrasive Technology XV
During dry grinding of titanium alloy, workpiece burn and chips adhesion phenomenon always takes place, which influences the surface quality of the machined components.
-
Advances in Materials Processing X
Fig.10 (a) is the tool- chip adhering shape feature of the cutting area.
Indicates content that may require registration and/or purchase.