Products & Services
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Supplier: DigiKey
Description: HOT MELT ADHESIVE 3731 B OFF-WHI
- Cure / Technology: Thermoplastic / Hot Melt
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Supplier: ODG (Origin Data Global)
Description: HOT MELT ADHESIVE 3748-B OFF-WHI
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Supplier: Powell Electronics, Inc.
Description: 3M Hot Melt Adhesive 3731, Tan, Chips,
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Supplier: Newark, An Avnet Company
Description: 3609 RED ADHESIVE CHIP BONDER, 10 ML EFD SYRINGE
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Supplier: R. S. Hughes Company, Inc.
Description: Technomelt yellow 2787 hot melt adhesive is compatible with cardboard materials. Additionally, this hot melt adhesive is a high melt adhesive with a melting point of +230 F.
- Viscosity: 4,800 cP
- Cure / Technology: Thermoplastic / Hot Melt
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Supplier: Win Source Electronics
Description: Manufacturer: AMIS Category: Tapes, Adhesives, Materials - Glue, Adhesives, Applicators Part Status: Obsolete Capacitance: 0.22μF Tolerance: ±20% Voltage - Rated: 6.3V Type: Header, Male Pins, Shrouded (4 Side) ESR (Equivalent Series Resistance): 100mOhm @ 100kHz Operating Temperature:
- Capacitance Range: 0.22000000000000003 microF
- Capacitance Tolerance: 20 (+/- %)
- DC Rated Voltage Range (WVDC): 6.3 volts
- AC Rated Voltage (WVAC): 6.3 volts
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Description: Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic
- Features: Electrically Conductive, Specialty / Other
- Chemical System: Epoxy (EP), Silicone
- Industry: Semiconductors / IC Packaging
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Supplier: R. S. Hughes Company, Inc.
Description: 3M Scotch-Weld 3798 amber hot melt adhesive is compatible with paper materials. Additionally, this hot melt adhesive is a low melt adhesive with a melting point of +190.4 F.
- Viscosity: 9,500 cP
- Cure / Technology: Thermoplastic / Hot Melt
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 6202C, Proprietary Hybrid Chemistry, Low Modulus, Die Attach Adhesive LOCTITE® ABLESTIK 6202C B-stageable adhesive is ideal for chip scale packages where tolerance and bleed need to be minimized. This low modulus adhesive is recommended for large die
- Viscosity: 28,000 cP
- Coeff. of Thermal Expansion (CTE): 38.888888888888886 µin/in-F
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Supplier: R. S. Hughes Company, Inc.
Description: 3M 3748B off-white hot melt adhesive is compatible with abs, acrylic, chipboard, coated cardboard, fabric, foam, paper, polyethylene, pvc and uncoated cardboard materials. Additionally, this hot melt adhesive is a high melt adhesive with a melting point of +291.2 F. Delivers
- Viscosity: 5,000 cP
- Cure / Technology: Thermoplastic / Hot Melt
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Supplier: R. S. Hughes Company, Inc.
Description: 3M 3748-B off-white hot melt adhesive is compatible with abs, acrylic, chipboard, coated cardboard, fabric, foam, paper, polyethylene, pvc and uncoated cardboard materials. Additionally, this hot melt adhesive is a high melt adhesive with a melting point of +291.2 F. Delivers
- Viscosity: 5,000 cP
- Cure / Technology: Thermoplastic / Hot Melt
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND 3781UV, Acrylate, Device Assembly, Structural Bonding LOCTITE® 3128NH edgebond material is designed to add reliability to chip scale packages and other electronic components. It is a low temperature cure adhesive ideal for use on heat sensitive components. One
- Viscosity: 12,000 cP
- Cure / Technology: Single Component System, UV / Radiation Cured (EB, Light)
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 84-1LMI, Epoxy, Die attach LOCTITE® ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand probe. Electrically conductive Low bleed Low outgassing
- Viscosity: 30,000 cP
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System
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Supplier: Accuris
Description: ADHESIVE TAPE, POLYURETHANE, CLEAR, PAINTABLE, STONE CHIP RESISTANT
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Supplier: Saint-Gobain Tape Solutions
Description: CHR C661 is manufactured from electrically deposited copper foil backing with acrylic adhesive. The copper foil surface of C661 is electrically conductive, conformable and easy to apply. Applications: Shielding applications Typically IC chips, electrical cabinets, cables, motors and
- Thickness: 0.0035039370078740156 inches
- Temperature Resistance: -40 C
- Adhesive: Acrylic
- Features: Anti-static / ESD Control, Cable, Electrical, Single-Sided Adhesive
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Supplier: Ellsworth Adhesives
Description: 3M 3748 B Hot Melt Off-White, formerly known as Jet-Melt, is a 100% solids thermoplastic resin designed for low surface energy coatings and plastics such as polyolefins. Includes high temperature stability, thermal shock resistance, and quick bond strength. 22 lb Case.
- Viscosity: 5,000 cP
- Substrate Compatibility: Plastic, Textiles / Fabrics, Wood / Wood Product
- Cure / Technology: Single Component System, Thermoplastic / Hot Melt
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview STAYSTIK 181 Thermoplastic Silver-Filled Paste is designed for a range of electronic applications and delivers excellent bonding performance. Ideal for die and/or substrate attach in hybrid or Multi-Chip Modules (MCMs), its unique reworkable thermoplastic adhesive
- Industry: Electronics, Semiconductors / IC Packaging
- Features: Filled / Reinforced
- Form / Shape: Grease / Paste
- Cure / Technology: Thermoplastic / Hot Melt, Thermosetting / Crosslinking
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ALPHA HiTech UP44-5566T is particularly suitable for mobile wireless charger chip coating. It is halogen-free and complies with the Restriction of Hazardous Substances (RoHS) Directive 2015/863/EU.
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: The PROTAVIC® PNE 40824-A and PROTAVIC® PNE 40824-B is a two-component system, solvent free, electrically insulating epoxy adhesive, which is specially designed for protecting the devices from heat, humidity and mechanical damages. The PROTAVIC® PNE 40824-A and PROTAVIC® PNE 40824-B is
- Viscosity: 13,000 cP
- Use Temperature: -55 to 200 F
- Coeff. of Thermal Expansion (CTE): 83.33333333333333 to 88.88888888888889 µin/in-F
- Features: Ceramic / Glass, Conformal / Encapsulating Coating, Electrical Insulation / Dielectric, Encapsulating / Potting, Metal, OEM / Industrial, Thermal / Heat Conductive
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Supplier: Ellsworth Adhesives
Description: 3M 6111HT B Hot Melt Tan is a sprayable, 100% solids adhesive with a higher heat resistance compared to the 3M 6111. Ideal for most dark colored fabrics, foams, particle board, and thin metals. 22 lb Case.
- Viscosity: 2,500 to 4,500 cP
- Cure / Technology: Single Component System, Thermoplastic / Hot Melt
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Supplier: IPC International, Inc.
Description: This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB,
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and wiring during
- Viscosity: 360,500 cP
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System
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Industrial Adhesives - Bostik Thermogrip HMY-1505 Hot Melt Adhesive Amber 35 lb Case -- HMY-1505-BBLSupplier: Ellsworth Adhesives
Description: Bostik Thermogrip HMY-1505 Amber is a high performing, general purpose hot melt adhesive in chip form offering clean machining, production flexibility and outstanding thermal stability. Excellent cold and heat resistance allows for performance in a range of shipping conditions. 35 lb
- Viscosity: 1,200 to 2,450 cP
- Cure / Technology: Single Component System, Thermoplastic / Hot Melt
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview A versatile, high-performance underfill adhesive specifically developed for electronics assembly applications. This single-component adhesive provides excellent reliability and protection for delicate components, particularly in Surface-Mount Technology (SMT) and
- Industry: Electronics, Semiconductors / IC Packaging
- Form / Shape: Grease / Paste
- Composition: Single Component System
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Supplier: Ellsworth Adhesives
Description: Bostik H284-332 Hot Melt Adhesive Amber has an excellent pick-up bond that cools to a brittle bond. Its 100% solid resin consistency makes it safe, clean and easy to use with no wasted powder or chips. 35 lb Case.
- Viscosity: 525 cP
- Cure / Technology: Single Component System, Thermoplastic / Hot Melt
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Description: protecting sensitive and fragile components. ◆ Self-adhesive for easy application and rework. ◆ Customizable die-cut shapes to meet specific customer needs. ◆ Exceptional tensile strength and abrasion resistance. ◆ Excellent electrical insulation properties. ◆ Superior flame resistance,
- Use Temperature: -58 to 392 F
- Thermal Conductivity: 6 W/m-K
- Tensile Strength (Break): 4.35110518071591 psi
- Elongation: 30 %
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Supplier: Newark, An Avnet Company
Description: RF ANTENNA, PATCH, 2.69GHZ, ADHESIVE ROHS COMPLIANT: YES
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Supplier: Accuris
Description: TAPE WITH CLEARCOAT, URETHANE, PRESSURE SENSITIVE, CHIP RESISTANT, EXTERIOR, 0.43 MM NOMINAL THICKNESS, 0.13 MM ADHESIVE THICKNESS
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Supplier: Win Source Electronics
Description: Mfr: TE Connectivity Aerospace, Defense and Marine Category: Fans, Thermal Management>Thermal>Adhesives, Epoxies, Greases, Pastes Packaging: Bulk Part Status: Obsolete Capacitance: 0.22μF Tolerance: ±20% Voltage - Rated: 1.3VDC Temperature Coefficient: Y6P Operating Temperature: -40°C ~ 85°C
- Capacitance Range: 0.22000000000000003 microF
- Capacitance Tolerance: 20 (+/- %)
- Packing Method: Bulk Pack
- Features: Other
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Supplier: Win Source Electronics
Description: Manufacturer: AMIS Category: Tapes, Adhesives, Materials - Tape Dispensers Packaging: Bulk Part Status: Obsolete Capacitance: 0.22μF Tolerance: ±20% Voltage - Rated: 6.3V Mounting Type: Fixed Package / Case: 4-SMD, No Lead Operating Temperature: -40°C ~ 85°C Features: 1.5 kOhms ±5% 1W
- Machine Type: Tape Dispensers
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Supplier: LED Cool Lights
Description: Description LED Cool Lights, 5050 Waterproof Tape Light introduces a Revolution in Lighting with the LED Adhesive Ribbon which features the latest energy efficient LED technology in an extremely low profile that will make you wonder where the light is coming from. Flexible and available in a
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Supplier: Newark, An Avnet Company
Description: ANTENNA, 2.4GHZ - 7.125GHZ, ADHESIVE ROHS COMPLIANT: YES
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Supplier: Newark, An Avnet Company
Description: RF ANTENNAS, 0.698 TO 4GHZ, ADHESIVE, 5W ROHS COMPLIANT: YES
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Supplier: VAST STOCK CO., LIMITED
Description: CPU & Chip Coolers -10C +90C 5VDC With Adhesive
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Supplier: Buckaroos, Inc.
Description: Economically priced - great for adhesives for rubber and polyethylene insulations
- Mounting: None / Handheld
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Featured Products Top
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bonding (chip bonding) machines. Our product portfolio includes nozzles manufactured from stainless steel, tungsten steel, and ceramic, and they are fully compatible with industry-leading platforms such as ESEC (BESI) and ASM die bonding machines. Technical Advantages of Ceramic Dispensing Nozzles (read more)
Browse Semiconductor Wire and Wedge Bonders Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
outward, can provide an efficient polishing and grinding. Long Life Owing to high-strength adhesive formula, the product has good heat resistance and chip removal performance, which can provide long-lasting grinding force. Tailor-made for Many Applications and on a Multitude of (read more)
Browse Abrasive Rolls and Abrasive Sheets Datasheets for Beijing Grish Hitech Co., Ltd. -
Take your electrical design to the next level with performance where it matters. 3M™ Electrically Conductive Tape is a family of XYZ-axis electrically conductive pressure-sensitive adhesive (PSA) tapes. Protect your systems and achieve efficient and reliable operations with these solutions (read more)
Browse Cable and Electrical Tapes Datasheets for Heilind Electronics, Inc. -
SARCON® EGR30A makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient transfer of heat to nearby components or heat (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
. Whether marking temporary lanes on a new overlay, delineating chip seals, or reinforcing permanent striping, each product line delivers a specialized solution for specific roadway conditions. Temporary Overlay Markers (TOMs): Bright, Flexible (read more)
Browse Traffic Safety Equipment Datasheets for Pexco -
-radiation, high-temperature, and high-pressure environments. It supports four isolated channels in a single chip, ensuring superior signal clarity and system resilience in aerospace, energy, and communication infrastructure (read more)
Browse Resistors Datasheets for Win Source Electronics -
depend on the application). For applications below -40°C, a clamping plate should be installed over the heater so that its structure will not be affected by the change in adhesive properties under cold conditions (read more)
Browse Flexible Heaters Datasheets for Pelonis Technologies, Inc. -
Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
, and they have chip detectors included in the engine for safety purposes. Aviation hydraulics are also another area of concern for oil analysis. The hydraulics need fire resistance for prevention of fires resulting from any accidents. Phosphate esters are widely used in those (read more)
Browse Oil Sensors and Analyzers Datasheets for AMETEK Spectro Scientific
Conduct Research Top
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Flip Chip Packaging Underfill Bonding Adhesive Die Attach And Its Advantages
pads of the substrate. During flip chip mounting, the inverted chip brings the chip adhesive into contact with circuit board directly, thus allowing smaller chip assembly and higher and direct signal density.
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How to find the right chip bonding adhesive for smart card chip and microchip
In flip chip mounting, the chip has to be inverted so that the adhesive is in contact directly with the circuit board. This allows smaller chip assembly as well as direct signal density. In chip assembly, we can use electrically conductive adessives to act as a replacement for solder where
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Epoxy Underfill Chip Level Adhesives
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. One-component epoxy resin adhesive
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DeepMaterial Adhesive Solutions for Industrial
Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials
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Industrial Adhesive Applications
DeepMaterial is low temperature cure bga flip chip underfill pcb epoxy process adhesive glue material manufacturer,supply industrial appliance structural bonding epoxy adhesive glue,low refractive index epoxy resin adhesive glue,high refractive index optical adhesive glue,best glue for magnet
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When To Use Surface Mount Adhesive Glue To Bond SMT Components And Bottom Side Underfill Chip Bonding
Several situations call for the use of an adhesive to bond SMT components. Find out how you can determine which type of adhesive is needed and what conditions will require a different bonding method altogether.
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Micro LED adhesive solutions that work for lens and displays optical contact bonding
A lot of research has been put into the development of the best adhesives for use in different applications. Micro LED adhesive is one of them. Different techniques have been introduced to cater to the issues in the micro-LED industry such as massive chip transfer and heterogeneous micro-LED
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Silicone Optical Adhesive use in LED Packaging Solid Crystal
Silicone optical adhesive is commonly used in LED packaging solid crystal applications. LED packaging refers to the process of encapsulating the LED chips in a protective material to enhance their performance, reliability, and optical characteristics.
More Information Top
Indicates content that may require registration and/or purchase.
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http://dspace.mit.edu/bitstream/handle/1721.1/50398/40606893-MIT.pdf?sequence=2
FLIP CHIP ADHESION ...............................................................
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Adhesive flip chip bonding on flexible substrates
This paper presents three approaches to a flip chip adhesive process based on flexible .
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Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates
His current research interest concen- trates on the reliability and the failure mechanism of flip- chip adhesive joints and the bondability of wire bonding, especially the microstructure analysis of materials using scanning electron microscopy (SEM), transmission electron microscopy (TEM), and other surface …
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44th Electronic Components and Technology Conference
AbshaetFlip-chip-on-glass (FCOG)is susceptibleto electrical opens for a variety of reasons including, but not limited to, movement in the Z-axis caused by flip- chip adhesive CTE and water absorption of the adhesive.
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Package cooling designs for a dual-chip electronic package with one high power chip
Thermal interface materials for the single-chip packages include thermal paste [1,4], direct- chip adhesive attach [5,6] and phase change materials [7].
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Surface Texturing of Drill Bits for Adhesion Reduction and Tool Life Enhancement
In another study, Sugihara et al. [20] found reductions in chip adhesion and friction force resulting from banded nano-/micro-textures in a face-milling experiment on alu- minum alloy machining.
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Advances in Abrasive Technology XV
During dry grinding of titanium alloy, workpiece burn and chips adhesion phenomenon always takes place, which influences the surface quality of the machined components.
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Advances in Materials Processing X
Fig.10 (a) is the tool- chip adhering shape feature of the cutting area.