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  • Flip Chip Packaging Underfill Bonding Adhesive Die Attach And Its Advantages
    pads of the substrate. During flip chip mounting, the inverted chip brings the chip adhesive into contact with circuit board directly, thus allowing smaller chip assembly and higher and direct signal density.
  • How to find the right chip bonding adhesive for smart card chip and microchip
    In flip chip mounting, the chip has to be inverted so that the adhesive is in contact directly with the circuit board. This allows smaller chip assembly as well as direct signal density. In chip assembly, we can use electrically conductive adessives to act as a replacement for solder where
  • Epoxy Underfill Chip Level Adhesives
    This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. One-component epoxy resin adhesive
  • DeepMaterial Adhesive Solutions for Industrial
    Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials
  • Industrial Adhesive Applications
    DeepMaterial is low temperature cure bga flip chip underfill pcb epoxy process adhesive glue material manufacturer,supply industrial appliance structural bonding epoxy adhesive glue,low refractive index epoxy resin adhesive glue,high refractive index optical adhesive glue,best glue for magnet
  • When To Use Surface Mount Adhesive Glue To Bond SMT Components And Bottom Side Underfill Chip Bonding
    Several situations call for the use of an adhesive to bond SMT components. Find out how you can determine which type of adhesive is needed and what conditions will require a different bonding method altogether.
  • Micro LED adhesive solutions that work for lens and displays optical contact bonding
    A lot of research has been put into the development of the best adhesives for use in different applications. Micro LED adhesive is one of them. Different techniques have been introduced to cater to the issues in the micro-LED industry such as massive chip transfer and heterogeneous micro-LED
  • Silicone Optical Adhesive use in LED Packaging Solid Crystal
    Silicone optical adhesive is commonly used in LED packaging solid crystal applications. LED packaging refers to the process of encapsulating the LED chips in a protective material to enhance their performance, reliability, and optical characteristics.

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