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Supplier: DigiKey
Description: Heat Sink TO-263 (D²Pak) Copper 2.0W @ 30°C Top Mount
- Thermal Resistance: 11 °C / W
- Material: Copper
- Features: Other
- Device: Passive Heat Sink
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Supplier: Newark, An Avnet Company
Description: SURFACE MOUNT HEAT SINK FOR D2 PAK ROHS COMPLIANT: YES
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Supplier: Newark, An Avnet Company
Description: SMD HEAT SINK, COPPER, D2PAK/TO-263; Thermal Resistance:11°C/W; Packages Cooled:TO-263; External Width - Metric:19.38mm; External Height - Metric:11.43mm; External Length - Metric:25.4mm; External Diameter - Metric:-; Product Range:-RoHS Compliant: Yes
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Supplier: PUI - Projections Unlimited, Inc.
Description: Surface Mount 5733 is a series of surface mount board level heat sinks designed to cool D2 Pak and TO-263 devices.
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Supplier: TE Connectivity
Description: clip does not increase overall heat sink height., Heat sink assembly includes Two Leg Clip, Part Number 1542431-1. Product Type Features Accessory Type : Clip Device Type : BGA
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Supplier: SECO
Description: the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes etc). It is
- Device: Passive Heat Sink
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Supplier: Boyd
Description: Extruded aluminum is one of the most popular and cost efficient heat sink fabrication methods. Aavid maintains the world's largest portfolio of extruded heat sink profiles with over 5,000 tooled shapes. Aavid extruded heat sink profiles range from simple
- Width: 100 to 700 mm
- Material: Aluminum
- Device: Passive Heat Sink
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Supplier: Richardson RFPD
Description: Deltem™ D10650-40 Pin Fin Heat Sink
- Height: 10.159994513602964 mm
- Mounting: Adhesive / Tape
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Supplier: ODG (Origin Data Global)
Description: BOARD LEVEL HEATSINK .375" D2PAK
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Supplier: SECO
Description: the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes etc). It is
- Device: Passive Heat Sink
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Supplier: SECO
Description: the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes etc). It is
- Device: Passive Heat Sink
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Supplier: Newark, An Avnet Company
Description: Heat Sink, For D2-Pak, TO-263, 29.3 C/W, 10 mm, 8 mm, 17.8 mm RoHS Compliant: Yes
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Supplier: Heilind Electronics, Inc.
Description: Heat Sink Push PinSpringNat/Steel Heat Sink Push Pin/Spring Nat/Steel
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Supplier: Riedon, Inc.
Description: Resistances from 50Ohm Power Rating to 30Watt Resistance Tolerances to ±1% TCR to ±5ppm/K Load Stability to 0.01% Customized Resistance Values Twin Resistor Construction
- Resistance Range: 50 ohms
- Tolerance: 1 +/- %
- Temperature Coefficient (TCR): 5 ±ppm/°C
- Current Rating: 15 amps
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Supplier: SECO
Description: the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes etc). It is
- Device: Passive Heat Sink
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Supplier: TPS Elektronik GmbH
Description: D01-002 Aluminum Heat Sink part of D01 Series, crafted from 6063 alloy with high thermal conductivity and anodized finish.Ideal for inverters, power supplies, and UPS. Lightweight and machinable.
- Width: 120 mm
- Height: 40.00000000000001 mm
- Material: Aluminum
- Features: Other Materials
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Supplier: Richardson RFPD
Description: Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies.
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Supplier: Accuris
Description: Compound, Silicone, Heat Sink
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Supplier: Galco Industrial Electronics
Description: Heat Sink Compound, 2ml
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Supplier: LCSC Electronics Technology (HK) Limited
Description: 25*2.5*25MM 6063-T5 - Heat sink/heatsink ROHS
- Length: 25 mm
- Width: 2.5000000000000004 mm
- Height: 25 mm
- Material: Aluminum
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Supplier: Newark, An Avnet Company
Description: Heat Sink, Square, PCB, For D-Pak Devices, TO-263, 11 C/W, 11 mm, 19.38 mm, 25 mm RoHS Compliant: Yes
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Supplier: Accuris
Description: COMPOUND, SILICONE, HEAT SINK
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Supplier: Ohmite Manufacturing Co.
Description: Ohmite resistors or other devices. These powerful heat sinks can be thru-hole soldered as a single or dual unit. The dual unit can be mated to a 60mm fan for greater thermal performance. It is the ideal type of heat sink for high power density and small size (3U or 4U)
- Length: 75.00000000000001 mm
- Width: 69.5 to 70.7 mm
- Height: 41 mm
- Weight: 163 g
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1101523-1542003-2 Category: Fans, Thermal Management>Thermal - Heat Sinks Type: Top Mount Package: Tray Standard Package: 350 Material: Aluminum Shape: Cylindrical Package Cooled: BGA Attachment Method: Clip Diameter: 1.375" (34.92mm) OD Thermal Resistance @
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Supplier: New Yorker Electronics Co., Inc.
Description: STAMPED TYPE, SOT-32 (2 NOS) PAC
- Mounting: Socket Mount
- Heat sink Fin Style:: Stamped Metal
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Supplier: Win Source Electronics
Description: Manufacturer: Aavid, Thermal Division of Boyd Corporation Category: Fans, Thermal Management- Thermal- Heat Sinks Series: 5731 Package: Bulk Product Status: Active Type: Top Mount Package Cooled: TO-252 (DPak) Attachment Method: SMD Pad Length: 0.315" (8.00mm) Shape: Rectangular, Fins
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Description: cavity is returned to the heat source, and the evaporation/condensation is repeated in the near-ultrasonic speed. The action removes a lot of heat in a very short time. The technology is similar in principle to a heat pipe, but differs in the way it is conducted. The heat
- Length: 100 to 3,000 mm
- Width: 5.000000000000001 to 240 mm
- Height: 1 to 6 mm
- Material: Aluminum
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Supplier: Galco Industrial Electronics
Description: Heat Sink, Panel Mount, 1-2 Modules,
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Supplier: Galco Industrial Electronics
Description: HEAT SINK 5-1/2in. LONG FOR 0-25A MODU
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Supplier: Powell Electronics, Inc.
Description: SHRINK BOOTS - SHAPE MEMORY PRODUCTS
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Supplier: Win Source Electronics
Description: Manufacturer: Aavid Thermalloy Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 1194135-SW25-2G Type: Passive Color: Black Length: 34.5 mm Height: 25 mm Material: Aluminium Width: 12.5 mm Categories: Thermal - Heat Sinks Case / Package:
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Supplier: Sensata Technologies
Description: 0.7°C/W Thermal resistance Suitable for 1 or 2 single or dual Solid State Relays Panel mounting
- Thermal Resistance: 0.7 °C / W
- Material: Aluminum
- Mounting: Mounting Holes
- Device: Passive Heat Sink
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Supplier: Sensata Technologies
Description: 0.25°C/W Thermal resistance Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor Panel mounting
- Thermal Resistance: 0.25 °C / W
- Material: Aluminum
- Mounting: Mounting Holes
- Device: Passive Heat Sink
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Supplier: Sensata Technologies
Description: 1°C/W Thermal resistance Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor Panel mounting
- Thermal Resistance: 1 °C / W
- Material: Aluminum
- Mounting: Mounting Holes
- Device: Passive Heat Sink
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Supplier: Sensata Technologies
Description: 0.36°C/W Thermal resistance Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor Panel mounting
- Thermal Resistance: 0.36 °C / W
- Material: Aluminum
- Mounting: Mounting Holes
- Device: Passive Heat Sink
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As power density continues increasing in AI computing, semiconductor equipment, and next-generation energy systems, thermal solutions must move beyond conventional heat pipes and flat vapor chambers. The 3D Vapor Chamber (3DVC) combines vapor chamber and heat pipe technologies into a three (read more)
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Transient Thermal Analysis of Power Electronics
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