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Supplier: TE Connectivity
Description: Comment : Heat sink assembly includes Three Leg Standard Clip, Part Number 1542816-1., Mounting clip does not increase overall heat sink height. Product Type Features Accessory Type : Clip Device Type : BGA
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Supplier: TE Connectivity
Description: : No Other Air Velocity (LFM) : 200, 0, 400, 600 Comment : Heat sink assembly includes Four Leg Low Profile Clip, Part Number 1542385-1., Mounting clip does not increase overall heat sink height.
- Height: 9.06 mm
- Width: 34.92 mm
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Supplier: TE Connectivity
Description: Body Features Primary Product Material : Stainless Steel Product Type Features Device Type : CFP2
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Supplier: TE Connectivity
Description: Body Features Fin Style : Unidirectional Primary Product Material : Aluminum Primary Product Plating Material : Black Anodized Configuration Features Number of Fins : 2 Product Type Features Device Type : SFP+
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Supplier: Sensata Technologies
Description: 0.7°C/W Thermal resistance Suitable for 1 or 2 single or dual Solid State Relays Panel mounting
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Mounting Holes
- Thermal Resistance: 0.7000 °C / W
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Supplier: Sensata Technologies
Description: 1°C/W Thermal resistance Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor Panel mounting
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Mounting Holes
- Thermal Resistance: 1 °C / W
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Supplier: Sensata Technologies
Description: 1.0°C/W Thermal resistance Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor DIN rail or panel mounting
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Mounting Holes
- Thermal Resistance: 1 °C / W
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Supplier: Sensata Technologies
Description: 0.25°C/W Thermal resistance Suitable for 1, 2 or 3 single or dual Solid State Relays or one 3 Phase/Motor Reversing Solid State Contactor Panel mounting
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Mounting Holes
- Thermal Resistance: 0.2500 °C / W
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Description: conductivity, comparable to sound speed 2. The working medium does not freeze, the starting temperature is low, and it can work normally in the environment of -60 °C. 3. Can withstand high heat flux and eliminate system hot spots; 4. There is no dissimilar metal connection, repeated
- Device: Cold Plate
- Heat Sink Fin Style: Machined Plate
- Height: 1 to 6 mm
- Length: 100 to 3000 mm
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Supplier: Heilind Electronics, Inc.
Description: Heat Sink Push PinSpringNat/Steel Heat Sink Push Pin/Spring Nat/Steel
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Supplier: Win Source Electronics
Description: Category: Heatsink Win Source Part Number: 1403437-FUJITSU CA05950-2173 - Processor Heat Sink 2U Manufacturer: Fujitsu Electronics America, Inc.
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Supplier: Win Source Electronics
Description: Manufacturer: Aavid, Thermal Division of Boyd Corporation Category: Fans, Thermal Management- Thermal- Heat Sinks Series: 5731 Package: Bulk Product Status: Active Type: Top Mount Package Cooled: TO-252 (DPak) Attachment Method: SMD Pad Length: 0.315" (8.00mm) Shape: Rectangular, Fins
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1101523-1542003-2 Category: Fans, Thermal Management>Thermal - Heat Sinks Type: Top Mount Package: Tray Standard Package: 350 Material: Aluminum Shape: Cylindrical Package Cooled: BGA Attachment Method: Clip Diameter: 1.375" (34.92mm
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Supplier: Win Source Electronics
Description: Manufacturer: Wakefield-Vette Category: Fans, Thermal Management -Thermal- Heat Sinks Series: 217 Package: Bulk Product Status: Active Package Cooled: D²Pak (TO-263), SOL-20, SOT-223, TO-220 Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM Material: Copper Material
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Supplier: Riedon, Inc.
Description: Resistances from 0.001Ohm to 500Ohms Power Rating to 2500Watt Resistance Tolerances to ±0.1% TCR to ±15ppm/K Load Stability to 0.1% Very Low Inductance (<50nH)
- Features: Heat Sink
- Power Rating: 60 to 1200 watts
- Resistance Range: 1.00E-3 to 500 ohms
- Standard and Compliances: RoHS Compliant
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Supplier: Riedon, Inc.
Description: Resistances from 0.5 to 270Ohms Power Rating to 16000 Watt Low inductance
- Category / Application: Power Resistor
- Dielectric Strength: 0.2500 kilovolts
- Features: Heat Sink
- Power Rating: 100 watts
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Supplier: Riedon, Inc.
Description: Resistances from 50Ohm Power Rating to 30Watt Resistance Tolerances to ±1% TCR to ±5ppm/K Load Stability to 0.01% Customized Resistance Values Twin Resistor Construction
- Current Rating: 15 amps
- Features: Heat Sink
- Mounting / Packaging: Radial Leads
- Operating Temperature: -55 to 155 C
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Supplier: Heilind Electronics, Inc.
Description: HEAT SINK, PNL MT, 0.5C/W, 1, 2OR 3 SSRS
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Supplier: Heilind Electronics, Inc.
Description: HEAT SINK, PNL MT, 0.7C/W, 1 OR2 SSRS
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Supplier: DigiKey
Description: Heat Sink TO-263 (D²Pak) Copper Top Mount
- Device: Passive Heat Sink
- Material: Copper
- Thermal Resistance: 18 °C / W
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Supplier: Xoxide
Description: Enhance your cooling performance with the Thermalright AXP-140 Low Profile High Performance Heat Sink. This low profile CPU cooler incorporates a unique down draft style of air cooling that makes it perfectly ideal for an HTPC case. This innovative down draft air flow is built to cool
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Supplier: Boyd
Description: Extruded aluminum is one of the most popular and cost efficient heat sink fabrication methods. Aavid maintains the world's largest portfolio of extruded heat sink profiles with over 5,000 tooled shapes. Aavid extruded heat sink profiles range from simple
- Device: Passive Heat Sink
- Material: Aluminum
- Width: 100 to 700 mm
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Supplier: SECO
Description: temperature range. The operating temperature specified in the Technical Features of the module/board indicates the temperature range in which any and all parts of the heat spreader / heat sink must remain, in order for SECO to guarantee functionality. Hence, these numbers do not
- Device: Passive Heat Sink
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Supplier: Radwell International
Description: HEAT SINK FOR POWER SEMICONDUCTOR. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Dynatron Corp.
Description: CPU Support : Intel®P4 up to 3.4GHz & Overclocking & Celeron D 335/330/325/320 CPU Socket : 478 Solution : 70 x 70 x 15mm fan with PWM function, Copper Heatsink, 2U&Up server solution
- Device: Active Heat Sink
- Fan Airflow: 49.65 SCFM
- Fan Noise: 44.88 dB
- Fan Speed: 6000 rpm
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Supplier: Richardson RFPD
Description: Heat Sink Assemblies
- Height: 4.19 mm
- Mounting: Clips
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Supplier: Accuris
Description: COMPOUND, SILICONE, HEAT SINK
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Supplier: PUI - Projections Unlimited, Inc.
Description: Surface Mount 5733 is a series of surface mount board level heat sinks designed to cool D2 Pak and TO-263 devices.
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Supplier: Powell Electronics, Inc.
Description: SHRINK BOOTS - SHAPE MEMORY PRODUCTS
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Supplier: Galco Industrial Electronics
Description: Heat Sink Compound, 2ml
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Supplier: 3X Ceramic Parts Company Limited
Description: heat sink discs are widely used in the fields of heat dissipation basal plate , LED packaging Basal plate , semiconductor basal plate , thin film basal plate , power resistance basal plate and high power supply module . The thickness of this Aluminum nitride circle disc is
- Density: 3.22 g/cc
- MOR / Flexural Strength: 130533 psi
- Material Type: Aluminum Nitride, Specialty Ceramic
- Thermal Conductivity: 170 W/m-K
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Supplier: Ohmite Manufacturing Co.
Description: Ohmite introduces the powerful B60/ C60 series heatsink with cam clip (Pat. Pending) or custom mounting. The B60/C60 series offers flexibility, high performance, and a compact heat sink design with exchangeable cam clip system for TO-247 and TO-264 devices. The B60 series can be tapped
- Device: Passive Heat Sink
- Height: 41 mm
- Length: 75 mm
- Material: Aluminum, Mixed Material
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Supplier: LCSC Electronics Technology (HK) Limited
Description: 25*2.5*25MM 6063-T5 - Heat sink/heatsink ROHS
- Height: 25 mm
- Length: 25 mm
- Material: Aluminum
- Width: 2.5 mm
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Supplier: ODG (Origin Data Global)
Description: BOARD LEVEL HEATSINK .375" D2PAK
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Supplier: TONGYU Technology Co., Ltd.
Description: Name: Bending Steel Tubing for Heat Sink Cooling Item No.: TY-M08 Material: 316 Size: D6.0*T1.0*R10.0 Appearance: Bending place no creases, inner and outer surface clean, no impurities Parameters: Flat< 13%, pressure >5Mpa Application
- Application: Automotive, Other
- Material Choices: Metal Tubing
- Outside Diameter / Size: 0.2362 inch
- Pressure Rating: 725 psi
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When placed between high-power, heat generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This maximizes heat transfer and dissipation, thereby improving overall performance (read more)
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Transient Thermal Analysis of Power Electronics
A sil pad with a thermal resistance of 3.0 C/W was used to insulate the D2Pak for the heat sink plate.
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