Die Attach Adhesive

Description: Electrically and thermally conductive adhesives for microelectronic applications Working in partnership with valued customers, we have carried out extensive development programmes to customize silver flakes and powders to suit many electronic applications. We are acknowledged as a leading

• Features: Electrically Conductive Compound (Adhesive, Grease)
• Industry: Electronics

Description: LOCTITE ABLESTIK 2030SCM, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK 2030SCM die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage

• Thermal Conductivity: 2.29 W/m-K
• Viscosity: 14000 cP

Description: LOCTITE ABLESTIK 2000T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2000T electrically conductive adhesive is designed for die attach applications. It features high thermal conductivity and high adhesion to a

• Coeff. of Thermal Expansion (CTE): 26.67 µin/in-F
• Features: Thermal / Heat Conductive

Description: LOCTITE ABLESTIK ABP 7000C, Epoxy, Die Attach, Dielectric Adhesive LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater

• Coeff. of Thermal Expansion (CTE): 61.89 µin/in-F
• Features: Electrically Insulating / Dielectric
• Viscosity: 4100 cP

Description: LOCTITE ABLESTIK QMI509, Bismaleimide Resin, Die Attach, Silver filled Conductive Adhesive LOCTITE® ABLESTIK QMI509 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. This adhesive also

• Coeff. of Thermal Expansion (CTE): 42.78 µin/in-F
• Thermal Conductivity: 2.8 W/m-K
• Viscosity: 8500 cP

Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It’s

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Single Component System, Specialty / Other
• Dielectric Strength: 635 kV/in
• Elongation: 170 %

Description: LOCTITE® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications Electrically conductive Thermally conductive Good dispensing characteristics Hydrophobic

• Coeff. of Thermal Expansion (CTE): 34.44 µin/in-F
• Features: Electrically Conductive Compound (Adhesive, Grease)
• Industry: Electronics, OEM / Industrial
• Tensile Strength (Break): 107037 psi

Description: (Known as ABLESTIK ABP 8611 Die attach adhesive ) LOCTITE ABLESTIK ABP 8611 adhesive is designed for die attach applications as well as component attach. Its high dielectric property helps eliminate current leakage and short circuit occurence in the

• Industry: Electronics

Description: EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional

• Coeff. of Thermal Expansion (CTE): 1.33E7 to 1.56E7 µin/in-F
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Dissimilar Substrates: Yes
• Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Non-corrosive Cure, Thermal / Heat Conductive

Description: LOCTITE® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. Electrically conductive Long work life Bonds

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 27.78 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking
• Industry: Electronics

Description: LOCTITE® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive High thermal conductivity Solvent-free formulation Low viscosity

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking
• Form: Specialty / Other
• Industry: Electronics

Description: Dow DOWSIL™ ME-1070 Silicone Die Attach Adhesive Black is a one component, heat curing, microelectronics adhesive that provides high temperature stability, stress relief, seals packaging, and bonds with a variety of substrates. It offers unprimed adhesion, high strength,

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Single Component System
• Features: Electrically Insulating / Dielectric
• Viscosity: 18000 cP

Description: LOCTITE ABLESTIK SSP 2020 is a sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated from power devices. It maintains high adhesion at operating temperatures as

• Features: Electrically Conductive Compound (Adhesive, Grease)
• Industry: Electronics

Description: Henkel Loctite Ablestik 84-1 LMINB1 Epoxy Die Attach Adhesive Silver is used to bond difficult-to-wet surfaces. It offers a long work life, electric conductivity, and reduces capacitor shorting problems caused by resin bleed. 2.5 cc/5 cc Syringe.

• Cure Type / Technology: Single Component System
• Features: Electrical Insulating / Dielectric
• Thermal Conductivity: 3.9 W/m-K
• Viscosity: 50000 cP

Description: LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI shielding Electrically conductive in x, y, z axes Excellent electrical and

• Cure Type / Technology: Thermosetting / Crosslinking
• Industry: OEM / Industrial
• Thermal Conductivity: 6.5 W/m-K

Description: Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures.

• Chemical / Polymer System Type: Epoxy (EP), Polysulfide
• Coeff. of Thermal Expansion (CTE): 1.28E7 to 1.44E7 µin/in-F
• Dissimilar Substrates: Yes
• Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease), Encapsulanting / Potting, Leveling / Filling Compound, Non-corrosive Cure

Description: Henkel Loctite Ablestik 789-3 Epoxy Die Attach Adhesive Amber is a one component adhesive used for microelectronic applications. It offers good moisture resistance, high bond strength, and is non-conductive. 3 cc Syringe.

• Cure Type / Technology: Single Component System
• Features: Electrical Insulating / Dielectric
• Thermal Conductivity: 0.3000 W/m-K
• Viscosity: 36500 cP

Description: Master Bond EP17HTDA-2 is a one component, heat cured epoxy system for bonding, sealing, and die attach. It is recommended when its exceptionally high Tg of 185-190°C is a critical factor in die attach applications.

• Coeff. of Thermal Expansion (CTE): 11.11 to 13.89 µin/in-F
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): 4.4
• Dissimilar Substrates: Yes

Description: Single component Supreme 3HTND-2DA offers convenient processing and dispensing with no tailing or bleed out and only requires simple refrigeration for storage. It cures rapidly in 5-10 minutes at 150°C. This toughened system has high die shear strength, superior electrical insulation

• Coeff. of Thermal Expansion (CTE): 13.89 to 16.67 µin/in-F
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, Room Temperature Curing
• Dielectric Constant (Relative Permittivity): 4.5
• Dielectric Strength: 400 to 450 kV/in

Description: PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology

• Chemical / Polymer System Type: Epoxy (EP)
• Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
• Filled / Reinforced: Yes
• Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging

Description: PVIC ACE34030 electrically conductive die attach adhesive is designed for high reliability semiconductor or LED packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 35 to 147 µin/in-F
• Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
• Filled / Reinforced: Yes

Description: PVIC ACE24511 electrically conductive die attach adhesive is specially designed for tantalum condenser application. This single component, fast cure adhesive also can be snap cured in hot plate or in-line snap cure system and its excellent electrical conductivity and

• Chemical / Polymer System Type: Epoxy (EP)
• Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease), Flexible / Dampening
• Filled / Reinforced: Yes
• Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging

Description: (Known as Ablestik CDF 815P6B ) LOCTITE ABLESTIK CDF 800 Series are high filled, conductive die attach adhesive film designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It exhibits strong

• Features: Electrically Conductive Compound (Adhesive, Grease)
• Industry: Electronics

Description: Acrylic foam tapes are high-performance bonding tapes are effective at reducing buzz, squeak, and rattle because they absorb vibrations at the tape’s core instead of at the bond line. In addition, these tapes are also often used to: Replace mechanical fasteners Attach

• Backing: Foam, Plastic / Polymer, Acrylic / Acrylate

Description: Caliper-controlled liner for rotary die-cutting. For adhering, affixing, assembling, attaching, bonding, converting, cushioning, fastening, fixturing, gasketing, gluing, holding, identifying, ingress protecting, insulating, isolating, joining, labeling, laminating, marking

• Adhesive: Pressure Sensitive (PSA)
• Type: Transfer
• Width: 48 inches

Description: Conductive die attach pastes offer excellent performance to meet today's high reliability standards. Product Overview ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed for high power semiconductor

• Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
• Industry: Electronics, Semiconductors / IC Packaging

Description: ISO 16525-1:2014 specifies general test methods for isotropic electrically conductive adhesives used in wiring, die attach of semiconductors, and surface assembly of printed circuit boards.

Description: IEC/TR 62258-3:2010 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - and minimally or partially encapsulated die and

Description: Low-stress, thermally conductive die attach adhesive for high-power and exposed pad semiconductor packages. Product Overview ATROX® 590-4HT1: Silver-filled conductive adhesive offering excellent adhesion and electrical performance with controlled bleed-out.

• Features: Electrically Conductive, Thermal / Heat Conductive
• Filled / Reinforced: Yes
• Industry: Electronics, Semiconductors / IC Packaging

Description: Ultra-low stress, thermally conductive die attach for high-power, exposed pad semiconductor applications. Product Overview ATROX® 800HT6B: Conductive die attach paste providing a balance of thermal conductivity and mechanical flexibility for stress-sensitive components.

• Compound Type: Electrically Conductive, Thermally Conductive
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
• Material Form: Die Bonding Adhesive / Compound

Description: . Suitable for die and/or substrate attach in hybrid or multi-chip modules (MCMs), its reworkable thermoplastic system offers key advantages in applications traditionally unsuited to thermoset adhesives.

• Industry: Electronics, Semiconductors / IC Packaging

Description: . Solder repair. Conductive structural adhesions Quick solderless electronic connections. High strength conductive bonding. Ideal for bonding surface mount connections, track repair, die attach, static discharge and grounding. Bonds a wide variety of materials including solder alloys,

• Features: Electrically Conductive

Description: prevent the absorption of water. Both pad material and adhesive can withstand temperatures between -22 F and 248 F and are highly resistant to aging. Soundamp E should be cut to the desired size and shape before the backing paper is removed. It may be cut with scissors, knife, or die.

• Height: 54 inch
• Mounting: Adhesive / Tape
• Product Description: Foam Sheet / Roll
• Width: 40 inch

Description: We make sure you get the most from your die-cut product. With the capability to produce unlimited part configurations and the largest available selection of products, features, and finishing options, we'll produce a self-adhesive solution optimized for both your application and

• Cutting: CNC Cutting, Laser Cutting, Other
• Location: North America, United States Only, Southern US Only, Midwest US Only, Other
• Materials: Metals, Plastics, Rubber, Composites, Foam, Other
• Services Offered: CAD / CAM Support, Design Assistance, Prototype Services, Low Volume Production, High Volume Production, Inspection / Quality Control

Description: (Known as ABLESTIK ABP-8910T ) LOCTITE ABLESTIK ABP 8910T die attach adhesive is formulated with a medium modulus using hybrid chemistry and is targeted for use on medium to large die sizes. It is electrically insulating and has high thermal conductivity.

• Industry: Electronics
• Thermal Conductivity: 0.3000 W/m-K