-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK QMI3555, Silver Glass, Die Attach LOCTITE® ABLESTIK QMI3555 is formulated using a Polymodal Metal Flake distribution technology which utilizes a combination of specifically selected silver flakes that, in conjunction with a unique glass, maximizes adhesion to gold
- Thermal Conductivity: 80 W/m-K
- Viscosity: 35000 cP
-
Description: LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI shielding Electrically conductive in x, y, z axes Excellent electrical and
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
- Thermal Conductivity: 6.5 W/m-K
-
Supplier: Henkel Corporation - Electronics
Description: (Known as Ablestik CDF 815P6B ) LOCTITE ABLESTIK CDF 800 Series are high filled, conductive die attach adhesive film designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It exhibits strong
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
-
-
Supplier: MacDermid Alpha Electronics Solutions
Description: . It offers typical Argomax reliability while enabling lower temperature and pressure lamination, which results in faster processing and accommodates larger DTF component sizes. This product is compatible with leading bonders for die attach film and supports both spacers and
- Applications: Electronics / Microelectronics
-
Supplier: MacDermid Alpha Electronics Solutions
Description: Die Transfer Film (DTF) processes, it supports a wide range of surfaces and is customized for fast, easy die and clip lamination. The film forms a pure silver bond line that provides high thermal and electrical conductivity. Designed for low-pressure sintering, it
-
Supplier: MacDermid Alpha Electronics Solutions
Description: Sinter silver film for die and spacer lamination on silver surfaces, using pick-and-place equipment. Product Overview With proven reliability for SiC die attach in EV traction applications, ALPHA Argomax 8020 Film offers a ready-to-laminate solution that eliminates
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ECF 561E, Rubberized Epoxy, Assembly, Electrically Conductive Die Attach Adhesive LOCTITE® ABLESTIK ECF 561E electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion. When
- Adhesive: Epoxy
- Backing: Specialty / Other
- Thickness: 1.00E-3 inches
-
Supplier: MacDermid Alpha Electronics Solutions
Description: for die attach and/or substrate attach in hybrid or multi-chip modules (MCMs). The unique reworkable nature of this thermoplastic adhesive system provides significant advantages in applications typically challenging for thermoset adhesives.
- Applications: Electronics / Microelectronics
-
Supplier: Henkel Corporation - Electronics
Description: Single layer format, fast cure die attach film (5 µm).
- Industry: Electronics
-
Supplier: Henkel Corporation - Electronics
Description: ABLESTIK C100 Series (C115 and C130) die attach adhesive film is suitable for tight geometry (<100µm) leadframe packages where high electrical performance is required. This material was originally sampled as development product CDA1155-33A.
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Form: Film / Sheet
- Industry: Electronics
-
Supplier: Henkel Corporation - Electronics
Description: (Known as Ablestik ATB-120 ) LOCTITE ABLESTIK ATB 120 is a single layer format die attach film (20 µm).
- Industry: Electronics
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE® ABLESTIK ATB 125 adhesive film is formulated for use in wafer lamination proceses. It combines process ease with the proven reliability of a hybrid chemistry-based die attach material. Excellent wettability Easy die pick up Excellent package reliability
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 8700K, Epoxy, Die attach LOCTITE ABLESTIK 8700K adhesive provides excellent adhesion to thin film and thick film gold surfaces. This adhesive retains its dispensed height after cure, without slumping. Non-conductive Excellent adhesion
- Coeff. of Thermal Expansion (CTE): 11.11 µin/in-F
- Features: Electrically Insulating / Dielectric
- Thermal Conductivity: 0.5000 W/m-K
- Viscosity: 45000 cP
-
Supplier: Cymbet Corporation
Description: The EnerChip is the world’s first solid state thin film battery created on a silicon substrate. The CBC050-BDC can be placed directly on a PCB or inside a packaged part with other integrated circuits. It can be attached using standard wire bonds or solder bumps for flip chip assembly
- Capacity, Amp Hours (AH): 5.00E-5 ampere-hr
- Operating Temperature: -4 to 158 F
- Specialty Cells: Thin Film
- Standard Battery Sizes: Other
-
Supplier: Cymbet Corporation
Description: The EnerChip is the world’s first solid state thin film battery created on a silicon substrate. The CBC005-BDC can be placed directly on a PCB or inside a packaged part with other integrated circuits. It can be attached using standard wire bonds or solder bumps for flip chip assembly
- Capacity, Amp Hours (AH): 5.00E-6 ampere-hr
- Operating Temperature: -4 to 158 F
- Specialty Cells: Thin Film
- Standard Battery Sizes: Other
-
Supplier: Knowles Precision Devices
Description: potential of shorting during die attach. Bordered area improves contrast for vision recognition. Thin Film Technology. Easily Customized.
- Capacitance Range: 3.00E-8 to 0.0024 microF
- Capacitance Type: Fixed
- Configuration / Form Factor: Surface Mount / Chip Capacitor
- DC Rated Voltage Range (WVDC): 25 to 100 volts
-
Supplier: Argent International, Inc.
Description: We make sure you get the most from your die-cut product. With the capability to produce unlimited part configurations and the largest available selection of products, features, and finishing options, we'll produce a self-adhesive solution optimized for both your application and assembly
- Cutting: CNC Cutting, Laser Cutting, Other
- Location: North America, United States Only, Southern US Only, Midwest US Only, Other
- Materials: Metals, Plastics, Rubber, Composites, Foam, Other
- Services Offered: CAD / CAM Support, Design Assistance, Prototype Services, Low Volume Production, High Volume Production, Inspection / Quality Control
-
Supplier: Indium Corporation
Description: LED TACFlux® 007 is the leading die-attach flux for the light-emitting diode (LED) industry. It was specifically designed for die-to-sub-mount applications with sputtered film or solder preform alloys, with melting points that range from from tin-silver (Sn/ Ag), SAC (Sn/Ag/Cu)
- Fluxes & Cleaners: Soldering Flux / Rosin
-
Supplier: Materion Corporation
Description: of adhesive strength between the thick film and ceramic substrate. The Ni plating provides a surface that is compatible with brazing (e.g., with CuAg eutectic braze) or subsequent plating. A gold plating atop the Ni provides a surface compatible with Au or Al wire bonding, and die
- Applications: Dielectric / Electrical Insulation
- Material Type: Alumina / Aluminum Oxide, Beryllia / Beryllium Oxide
- Shape / Form: Bar Stock
-
Supplier: Skyworks Solutions, Inc.
Description: The ATN3590 family of fixed resistive attenuators are integrated circuits comprising thin film resistors and through-die vias that provide excellent attenuation flatness from low frequency to 40 GHz or higher. These attenuators are available from 0 to 30 dB. The ATN3590 attenuator
- Attenuation: 30 dB
- Attenuator Type: Fixed
-
Supplier: Skyworks Solutions, Inc.
Description: The ATN3590 family of fixed resistive attenuators are integrated circuits comprising thin film resistors and through-die vias that provide excellent attenuation flatness from low frequency to 40 GHz or higher. These attenuators are available from 0 to 30 dB. The ATN3590 attenuator
- Attenuation: 4 dB
- Attenuator Type: Fixed
-
Supplier: Skyworks Solutions, Inc.
Description: The ATN3590 family of fixed resistive attenuators are integrated circuits comprising thin film resistors and through-die vias that provide excellent attenuation flatness from low frequency to 40 GHz or higher. These attenuators are available from 0 to 30 dB. The ATN3590 attenuator
- Attenuation: 8 dB
- Attenuator Type: Fixed
-
Supplier: Skyworks Solutions, Inc.
Description: The ATN3590 family of fixed resistive attenuators are integrated circuits comprising thin film resistors and through-die vias that provide excellent attenuation flatness from low frequency to 40 GHz or higher. These attenuators are available from 0 to 30 dB. The ATN3590 attenuator
- Attenuation: 20 dB
- Attenuator Type: Fixed
-
Supplier: VPT, Inc.
Description: applications. The HTD Series utilizes thick film hybrid microcircuit technology that provides superior reliability in high temperature applications. Bare semiconductor die are integrated with passive components using thick film conductors on a ceramic substrate. Component
- DC Input Voltage: 14 to 40 volts
- DC Output Current: 0.0 to 300 amps
- DC Output Power: 1.5 watts
- DC Output Voltage: 5 to 12 volts
-
Supplier: SAE International
Description: frequency square-wave oscillator based on an SOI 555 Timer with a special high temperature ceramic packaging technology from room temperature to 375°C. The timer die was attached to a 96% aluminum oxide substrate with high temperature durable gold (Au) thick-film metallization,
-
Supplier: IES2000
Description: prevent the absorption of water. Both pad material and adhesive can withstand temperatures between -22 F and 248 F and are highly resistant to aging. Soundamp E should be cut to the desired size and shape before the backing paper is removed. It may be cut with scissors, knife, or die. Remove
- Application: Acoustics / Sound Proofing, Automotive / Transportation, Marine
- Foam Type: Flexible
- Form / Shape: Stock Shape (Bar, Sheet, etc.), Film / Sheet
- Special Features: Chemical / Fuel Resistant, UL Approved / Listed, Waterproof
Find Suppliers by Category Top
Conduct Research Top
-
Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination
surfaces. The wafer mounting film is analyzed by Fourier Transform Infrared Spectroscopy. A process related failure in conductive die attach systems is described and corrective actions are presented. This analytical approach can be extended to other epoxy attach materials systems.
-
Electronic Device Repair Die Cuts
An electronic device repair company was using a double-sided acrylic film tape to attach a face onto an Apple Watch. The customer wanted the rolls of tape slit to 2mm and 8mm widths. The converter they were previously working with could not consistently slit to such narrow widths and the rolls were
More Information Top
Indicates content that may require registration and/or purchase.
-
A quality assurance program for simulators in radiotherapy
Thereafter, the Lichffeld is exposed on phantom fixed films on that and its axis through tingling is labeled became.
-
Studies on ionization and pressure during the explosions of solid explosives
the now in return auI a exposed a corresponding curve on film strips fixed to the drum.
-
The Kathodophosphoreszenz of erbium in calcium oxide
The spectrum was fokusiert therefore on the same periphery and the calf ltuf photographed film strips fixed to an l h g s of the edge of the circular disc.
-
Over the excitation of friction electricity between metals and nonconductors in dependence of the pressure of the surrounding gas as well as of the degassing s...
With aid of the electromagnet M, this glass rod with the film fixed to it could and is withdrawn from the rubbing disc as well as become on this herangefiihrt.
-
Progresses in the photograph in last 10 years
The Verschlui3 remains thereby geoffnet permanently serves as light source the electrical sparks konnen that are generated rnit of any frequency, maintaining, a cylinder with the film fixed on it with 3000 revolutions in the minute rotates.
-
Building materials and components effectively against moistening protect!
… the masonry components are to mount receiving of soil moisture (covering with films or tarpaulins, sufficient distance of the bottom) at volleying risk oberseitig with It is to ensure to protect effectively against wind or films fixed to storm that components accumulate …
-
Compressive strength of masonry in parallel with the storage joints
… the masonry components are to mount receiving of soil moisture (covering with films or tarpaulins, sufficient distance of the bottom) at volleying risk oberseitig with It is to ensure to protect effectively against wind or films fixed to storm that components accumulate …
-
Residue analytics of pesticides: multi methods versus active substance diversity
The SPME belongs to (solidly phase micro extraction) it and the SBSE (stir bar sorptive extraction) by that instead of a solvent a film fixed to a carrier of a viscous liquid is used in that the compounds at the contact to …
-
Education drafts mathematics Sekundarstufe I
Becomes in the third phase of the method the in the center the film fixed to Placemat through a pupil described while the other results in its folder hold.
-
Contribution for study of the pupil enlargement after stimulation of the Halssympathicus; at the same time as attempt for the measurement of the line speed in ...
That 1 cm wide gap was closely located before the film and dutch became a cylindrical lens ausgeftillt in focal line of which the Kymographion with the film fixed on the drum was set.