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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ALPHA Argomax 8021 Film offers a ready-to-laminate solution that removes the need for printing, dispensing, and drying process steps. Optimized for use in Die Transfer Film (DTF) processes, it supports a wide range of surfaces and is customized for fast, easy
- Thick Film Type: Conductor
- Applications: Die Bonding, Electronics / Microelectronics
- Material: Silver / Silver Alloy
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Supplier: Henkel Corporation - Electronics
Description: (Known as Ablestik CDF 815P6B ) LOCTITE ABLESTIK CDF 800 Series are high filled, conductive die attach adhesive film designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It exhibits strong
- Type: Electrically Conductive
- Industry: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK QMI3555, Silver Glass, Die Attach LOCTITE® ABLESTIK QMI3555 is formulated using a Polymodal Metal Flake distribution technology which utilizes a combination of specifically selected silver flakes that, in conjunction with a unique glass, maximizes adhesion to gold
- Viscosity: 35,000 cP
- Thermal Conductivity: 80 W/m-K
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Description: LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI shielding Electrically conductive in x, y, z axes Excellent electrical and
- Thermal Conductivity: 6.5 W/m-K
- Chemical System: Epoxy (EP)
- Industry: OEM / Industrial
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ATROX conductive die attach products provide a comprehensive solution with a reduced total cost of ownership, ushering in a new era of high-performance materials. Product Features Thermal Conductivity The ATROX 558-2C31 offers good thermal conductivity, greater than 5
- Thermal Conductivity: 5 W/m-K
- Form / Shape: Die Bonding Adhesive / Compound, Grease / Paste
- Features: Electrically Conductive, Film / Sheet, Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ECF 561E, Rubberized Epoxy, Assembly, Electrically Conductive Die Attach Adhesive LOCTITE® ABLESTIK ECF 561E electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion. When
- Thickness: 0.001 inches
- Adhesive: Epoxy
- Features: Specialty / Other
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Supplier: Henkel Corporation - Electronics
Description: Single layer format, fast cure die attach film (5 µm).
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: (Known as Ablestik ATB-130 ) LOCTITE ABLESTIK ATB 130 is a single layer format die attach film (30 µm).
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: (Known as Ablestik ATB-120 ) LOCTITE ABLESTIK ATB 120 is a single layer format die attach film (20 µm).
- Industry: Electronics
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE® ABLESTIK ATB 125 adhesive film is formulated for use in wafer lamination proceses. It combines process ease with the proven reliability of a hybrid chemistry-based die attach material. Excellent wettability Easy die pick up Excellent package reliability
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Supplier: MacDermid Alpha Electronics Solutions
Description: Aluminum Nitride-filled Thermally Enhanced Film Product Overview STAYSTIK 682 thermoplastic adhesive film is designed for use in a variety of electronic applications, and is characterized by excellent bonding. This film can be used for die attach and/or substrate
- Industry: Electronics, Semiconductors / ICs
- Form / Shape: Film / Sheet
- Features: Thermoplastic
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 8700K, Epoxy, Die attach LOCTITE ABLESTIK 8700K adhesive provides excellent adhesion to thin film and thick film gold surfaces. This adhesive retains its dispensed height after cure, without slumping. Non-conductive Excellent adhesion
- Viscosity: 45,000 cP
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 11.11111111111111 µin/in-F
- Features: Electrically Insulating / Dielectric
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Supplier: MacDermid Alpha Electronics Solutions
Description: Aluminum Nitride-filled Thermally Enhanced Film Product Overview STAYSTIK 611 thermoplastic adhesive film is ideal for applications where resistance to high temperature excursions is desired. This adhesive film can be used for die attach in solder sealed, hermetic
- Form / Shape: Film / Sheet
- Industry: Semiconductors / ICs
- Features: Thermoplastic
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Supplier: Knowles Precision Devices
Description: High Performance and High Frequency Single Layer Capacitors for RF Microwave and Millimeter-Wave Applications. The Border-Cap is a conventional parallel plate capacitors with recessed metallization on one or both sides. Benefits: Recessed metallization reduces potential of shorting during die
- Capacitance Range: 0.00000003 to 0.0024000000000000002 microF
- DC Rated Voltage Range (WVDC): 25 to 100 volts
- Electrostatic Capacitors: Ceramic
- Capacitance Type: Fixed
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Supplier: Indium Corporation
Description: LED TACFlux® 007 is the leading die-attach flux for the light-emitting diode (LED) industry. It was specifically designed for die-to-sub-mount applications with sputtered film or solder preform alloys, with melting points that range from from tin-silver (Sn/ Ag), SAC
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Cymbet Corporation
Description: operation, the EnerChip bare die is charged from a controlled voltage source. The EnerChip CBC005-BDC can be cycled through >5000 recharge cycles. Designers can take advantage of the fast recharge time of the EnerChip in their designs. The CBC005-BDC bare die are available in wafers,
- Voltage: 3.8 volts
- Capacity, Amp Hours (AH): 0.000005 ampere-hr
- Operating Temperature: -4 to 158 F
- Features: Other, Rechargeable (Secondary) Batteries
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Supplier: Skyworks Solutions, Inc.
Description: The ATN3590 family of fixed resistive attenuators are integrated circuits comprising thin film resistors and through-die vias that provide excellent attenuation flatness from low frequency to 40 GHz or higher. These attenuators are available from 0 to 30 dB. The ATN3590 attenuator
- Attenuation: 20 dB
- Attenuator Type: Fixed
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Supplier: Materion Corporation
Description: between the thick film and ceramic substrate. The Ni plating provides a surface that is compatible with brazing (e.g., with CuAg eutectic braze) or subsequent plating. A gold plating atop the Ni provides a surface compatible with Au or Al wire bonding, and die attach with AuSi
- Material Type: Alumina / Aluminum Oxide, Beryllia / Beryllium Oxide
- Shape / Form: Bar Stock
- Features: Dielectric Ceramic
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Supplier: Argent International, Inc.
Description: We make sure you get the most from your die-cut product. With the capability to produce unlimited part configurations and the largest available selection of products, features, and finishing options, we'll produce a self-adhesive solution optimized for both your application and assembly
- Services Offered: CAD / CAM Support, Design Assistance, High Volume Production, Inspection / Quality Control, Low Volume Production, Prototype Services
- Cutting: CNC Cutting, Laser Cutting
- Materials: Composites, Foam, Metals, Plastics, Rubber
- Specialty Cutting: Film / Sheet, Tapes / Adhesives, Textiles
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Supplier: VPT, Inc.
Description: applications. The HTD Series utilizes thick film hybrid microcircuit technology that provides superior reliability in high temperature applications. Bare semiconductor die are integrated with passive components using thick film conductors on a ceramic substrate. Component
- DC Input Voltage: 6 to 20 volts
- DC Output Voltage: 5 volts
- DC Output Current: 0 to 240 amps
- DC Output Power: 1.2000000000000002 watts
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Supplier: SAE International
Description: oscillator based on an SOI 555 Timer with a special high temperature ceramic packaging technology from room temperature to 375°C. The timer die was attached to a 96% aluminum oxide substrate with high temperature durable gold (Au) thick-film metallization, and interconnected with Au
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Supplier: Palomar Technologies, Inc
Description: bonding. High Vacuum Furnace Applications MEMS Package Sealing Infrared Sensor Package Sealing Crystal Oscillator Package Sealing Hermetic Package Sealing Wafer Level Packaging Void-Free Eutectic Die Attach Low Moisture Package Sealing Nobel Gas Miniature Lamp Sealing Military
- Type: Factory / Free Standing
- Vacuum / Pressure Range: High Vacuum (< 10-3, >10-8 torr)
- Features: Integral Process Controller, MEMS, Other
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Supplier: IES2000
Description: prevent the absorption of water. Both pad material and adhesive can withstand temperatures between -22 F and 248 F and are highly resistant to aging. Soundamp E should be cut to the desired size and shape before the backing paper is removed. It may be cut with scissors, knife, or die. Remove
- Use Temperature: -22 to 248 F
- Applications: Acoustics / Sound Proofing, Automotive / Transportation, Marine
- Features & Approvals: Chemical / Fuel Resistant, UL Approved / Listed, Waterproof
- Form / Shape: Film / Sheet, Stock Shape (Bar, Sheet, etc.)
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Conduct Research Top
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Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination
surfaces. The wafer mounting film is analyzed by Fourier Transform Infrared Spectroscopy. A process related failure in conductive die attach systems is described and corrective actions are presented. This analytical approach can be extended to other epoxy attach materials systems.
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Electronic Device Repair Die Cuts
An electronic device repair company was using a double-sided acrylic film tape to attach a face onto an Apple Watch. The customer wanted the rolls of tape slit to 2mm and 8mm widths. The converter they were previously working with could not consistently slit to such narrow widths and the rolls were
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A quality assurance program for simulators in radiotherapy
Thereafter, the Lichffeld is exposed on phantom fixed films on that and its axis through tingling is labeled became.
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Studies on ionization and pressure during the explosions of solid explosives
the now in return auI a exposed a corresponding curve on film strips fixed to the drum.
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The Kathodophosphoreszenz of erbium in calcium oxide
The spectrum was fokusiert therefore on the same periphery and the calf ltuf photographed film strips fixed to an l h g s of the edge of the circular disc.
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Over the excitation of friction electricity between metals and nonconductors in dependence of the pressure of the surrounding gas as well as of the degassing s...
With aid of the electromagnet M, this glass rod with the film fixed to it could and is withdrawn from the rubbing disc as well as become on this herangefiihrt.
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Progresses in the photograph in last 10 years
The Verschlui3 remains thereby geoffnet permanently serves as light source the electrical sparks konnen that are generated rnit of any frequency, maintaining, a cylinder with the film fixed on it with 3000 revolutions in the minute rotates.
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Building materials and components effectively against moistening protect!
… the masonry components are to mount receiving of soil moisture (covering with films or tarpaulins, sufficient distance of the bottom) at volleying risk oberseitig with It is to ensure to protect effectively against wind or films fixed to storm that components accumulate …
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Compressive strength of masonry in parallel with the storage joints
… the masonry components are to mount receiving of soil moisture (covering with films or tarpaulins, sufficient distance of the bottom) at volleying risk oberseitig with It is to ensure to protect effectively against wind or films fixed to storm that components accumulate …
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Residue analytics of pesticides: multi methods versus active substance diversity
The SPME belongs to (solidly phase micro extraction) it and the SBSE (stir bar sorptive extraction) by that instead of a solvent a film fixed to a carrier of a viscous liquid is used in that the compounds at the contact to …
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Education drafts mathematics Sekundarstufe I
Becomes in the third phase of the method the in the center the film fixed to Placemat through a pupil described while the other results in its folder hold.
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Contribution for study of the pupil enlargement after stimulation of the Halssympathicus; at the same time as attempt for the measurement of the line speed in ...
That 1 cm wide gap was closely located before the film and dutch became a cylindrical lens ausgeftillt in focal line of which the Kymographion with the film fixed on the drum was set.