Dielectric Constant Adhesive

Description: As one of the largest UK manufacturers of PTFE sheet and tape, at Fluorocarbon, we constantly work to ensure every product is tailored to meet customer requirements. Uniquely, we offer etching on one or both sides of the material if required. We can provide same day delivery on all

• Backing: Fluoropolymer, Plastic / Polymer
• Features: Abrasion / Scratch Resistant, Dielectric / Insulating
• Thickness: 0.0051 to 0.0197 inches
• Type: Single-Sided

Description: Length - 60 yards Specifications Dielectric Strength (V/mil) - 690 Dielectric Constant - 2.72 Steel Adhesion (oz/in) - 92 What are Adhesive Transfer Tapes? Adhesive transfer tapes are rolls of pressure sensitive adhesive pre

• Adhesive: Acrylic, Pressure Sensitive (PSA)
• Features: Dielectric / Insulating
• Peel Strength / Adhesion: 5.75 lbs/in
• Type: Transfer

Description: .2 Mil 58 lb. polycoated kraft paper liner 9.4 Mil Total Thickness Roll Length - 60 yards Specifications Dielectric Strength (V/mil) - 674 Dielectric Constant - 3.32 Steel Adhesion (oz/in) - 108 What are Adhesive

• Adhesive: Acrylic, Pressure Sensitive (PSA)
• Features: Dielectric / Insulating
• Peel Strength / Adhesion: 6.75 lbs/in
• Type: Transfer

Description: traditional melt-processable method. Excellent non-stick properties, low frictional properties, and water and oil repellency (high contact angle) Low dielectric constant (2.1) and low dissipation factor (0.001)

• Chemical / Polymer System Type: Specialty / Other
• Dielectric Constant (Relative Permittivity): 2.1
• Elongation: 460 %
• Features: Laminating / Composites

Description: higher temperatures. Tensile shear strengths in excess of 3,500 psi and T-peel strengths of over 30 pli are readily obtained. Supreme 10HTCL has a number of outstanding processing advantages; no mixing is necessary prior to use, the viscosity remains constant with time (i.e. it will not

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 25 µin/in-F
• Elongation: 4.2 %
• Features: Anti-static / ESD Control, Electrically Conductive Compound (Adhesive, Grease), Electrical Insulation / Dielectric Material, EMI / RFI Shielding Material

Description: volatiles low content of uncured polymer almost constant properties between -40 °C and +180 °C low ion content Application Because of the thixotropic behaviour, SEMICOSIL® 911 A/B is specially recommended for local encapsulation of delicate electronic components.

• Compound Type: Encapsulating / Potting
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Industry: Electronics
• Use Temperature: -40 to 356 F

Description: low content of uncured polymer low ion content almost constant properties between -50 °C and +180 °C Application Because of the thixotropic behavior, SEMICOSIL® 924 is specially recommended for local encapsulation of delicate electronic components, e.g. bonded chips on hybrid components which

• Compound Type: Encapsulating / Potting
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Industry: Electronics
• Use Temperature: -58 to 356 F

Description: vulcanization almost constant properties between -40 °C and +180 °C low ion content transparent self adhesive Application encapsulation of optical components encapsulation of electronic components fully automatic molding process of optical parts

• Applications: Electronics / Microelectronics
• Applications & Features: Dielectric
• Index of Refraction: 1.41 #
• Material Density (Theoretical): 1.04 g/cc

Description: Specifications Tensile Strength (PSI) - 700 Minimum Elongation (%) - 300 Dielectric Strength (VPM) 200 - 400 Dielectric Constant (1 KHz) - 2.95 Dissipation Factor (1 KHz) <.0004 Insulation Resistance (ohms/cm) - 3 X 10^14 Moisture Absorption - 3% Max By Weight

• Backing: Rubber, Silicone, Specialty / Other
• Features: Dielectric / Insulating, Permanent
• Temperature Resistance: -17.78 to 316 C
• Width: 1 to 2 inches

Description: logos Electronic displays Panel to frame Stiffener to panel Specifications Tensile Strength (lb/in) - 90 Dynamic Shear (lb/in) - 90 Steel Adhesion (oz/in) - 17 Dielectric Constant - 2.14 Thermal Conductivity - 0.05

• Adhesive: Acrylic, Pressure Sensitive (PSA)
• Features: Dielectric / Insulating, Permanent
• Peel Strength / Adhesion: 1.06 lbs/in
• Width: 0.5000 to 2 inches

Description: DW 350CL is an unpigmented PTFE coated foil that features uniform thickness throughout and combine the properties of PTFE such as chemical resistance, wide operating temperatures, low coefficient of friction and low dielectric constant with the foil. Clear PTFE Coating Easy

• Adhesive: None / Non-adhesive
• Backing: Fluoropolymer, Metal Foil / Sheet, Plastic / Polymer, Specialty / Other
• Temperature Resistance: 260 C
• Thickness: 0.0047 to 0.0052 inches

Description: other panels. This closed-cell polyurethane foam does not absorb water, ensuring signal performance. Standard densities are available in 3, 4 and 6 pounds per cubic foot, and other densities can be provided to meet specific dielectric constant and loss tangent requirements. These

• Application: Other
• Bulk Density: 6 lbs/ft³
• Foam Type: Closed Cellular, Rigid
• Form / Shape: Stock Shape (Bar, Sheet, etc.), Board / Block / Bun

Description: many engineering plastics. It is chemically inert and has a low dielectric constant (2.1) over a wide temperature and frequency range. This material does not ignite and can prevent the spread of flames. It has excellent weather resistance, low friction coefficient, and can be used from

• Elongation: 200 %
• Material Type / Grade: Dielectric / Electrically Insulating
• Overall Thickness: 0.0012 to 0.0059 inch
• Tensile Strength (Break): 2843 psi

Description: flowable almost constant properties between -40 °C and +180 °C primerless adhesion Application versatile interface material for heat sink applications for the electronics industry thermally conductive adhesive material applicable as thin interface layer between PCB and metal housings

• Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Elongation: 90 %
• Features: Electrical Insulation / Dielectric Material

Description: procedures appear in the following order: (1) Procedure for Testing Adhesives Before Use: Section Power Factor and Dielectric Constant of Liquid Adhesives 7 Direct-Current Conductivity 8 Extract Conductivity 9 Acidity and Alkalinity 10 pH Value 11 Section Power Factor and

Description: in liquids with a dielectric constant from 1.5. Your benefit Long lifetime and low maintenance requirement through robust mechanical construction Minimum time and cost expenditure thanks to simple setup without medium Exact switching point even with strong buildup

• Meter Technology: Capacitive/RF Admittance

Description: %. The material can be rendered hydrophilic through surface treatments and by plasma surface modification. Application areas include gas and liquid filtration, medical diagnostic test kits, wicks, low dielectric constant wrap for microwave cables, batteries and other applications where

• Adhesive: None / Non-adhesive
• Dielectric Strength: 1.18E8 V/m
• Features: Single-Sided, Thermally Insulating / Insulative, Dielectric / Insulating
• Materials of Construction: Plastic / Polymer

Description: . Not affected by UV light. Resistant to PCB cleaning solvents. Medium strength cure allows component removal for rework. Hardness (shore) 85. Dielectric constant 3.5 @ 1 kHz Type = Thermal Conductive Adhesive Product Material = Epoxy Package Type = Syringe Package Size = 10 ml

• Features: Thermal / Heat Conductive
• Thermal Conductivity: 0.2500 to 0.3000 W/m-K
• Use Temperature: -40 to 266 F

Description: LOCTITE STYCAST 4640, Silicone, Flexible, Potting or Encapsulant LOCTITE® STYCAST 4640 RTV condensation cure silicone rubber syntactic foam is engineered to yield a flexible, low density material with a low dielectric constant and dissipation factor. It is designed for airborne potting

• Compound Type: Caulk / Grout
• Cure Type / Technology: Two Component System
• Tensile Strength (Break): 200 psi
• Use Temperature: 85 to 500 F

Description: not stressed. Medium strength cured bond allows removal of components for reworking. Colour Red. Consistency Thixotropic paste . Dielectric constant 3.5 @ 1kHz. Filler diameter <10 microns. Hardness (shore) 85. Suitable dispensing needles stock nos. 690-811 Package Type = Syringe

• Chemical / Polymer System Type: Silicone
• Industry: Semiconductors / IC Packaging
• Use Temperature: 284 F

Description: for marine electronic devices. Additionally, its low water absorption allows for potential use both above and below the surface. Specialized fillers maintain a low dielectric constant, making it perfect for sensors. UR5118 is an excellent choice for applications subject to radio

• Compound Type: Encapsulating / Potting
• Industry: Aerospace, Automotive, Electronics, Marine, Semiconductors / IC Packaging

Description: strength, elongation, dielectric strength, dielectric constant, volume resistivity, outgassing characteristics, total mass loss, volatile condensable material, and storage life.

Description: strength, elongation, dielectric strength, dielectric constant, volume resistivity, outgassing characteristics, total mass loss, volatile condensable material, and storage life.

Description: strength, elongation, dielectric strength, dielectric constant, volume resistivity, outgassing characteristics, total mass loss, volatile condensable material, and storage life.

Description: , conductive products. The VEGACAP 98 works in products from a dielectric constant of 1.5. The process fitting is a G1½ thread. Your benefit Long lifetime and low maintenance requirement through robust mechanical construction Minimum time and cost expenditure thanks to simple setup

• Meter Technology: Capacitive/RF Admittance

Description: requirements. Features High melting point High electrical insulation Low dielectric constant Higher mechanical strength Superior corrosion resistance against molten metal Thermal and chemical stability High thermal conductivity (170-220w/mk)Similar coefficient of thermal expansion to

• Applications: Other
• Material Type: Aluminum Nitride, Specialty Ceramic
• Performance Features: Specialty / Other
• Shape / Form: Wafer / Substrate

Description: changes without changing Its properties. Dielectric constant 100 Hz (ASTM D 1450): 5.5 Dimensions = 19.05 x 12.7 x 0.23mm Thickness = 0.23mm Length = 19.05mm Width = 12.7mm Material = Silicone Self-Adhesive = Yes Material Trade Name = In-Sil-8 Colour = Grey Series = 1889

Description: changes without changing Its properties. Dielectric constant 100 Hz (ASTM D 1450): 5.5 Dimensions = 1.59 x 27.94 x 0.23mm Thickness = 0.23mm Length = 40.39mm Width = 27.94mm Material = Silicone Self-Adhesive = Yes Material Trade Name = In-Sil-8 Colour = Grey Series = 1889

Description: Description: Daburn FEP ribbon cable reduces crosstalk, compared to PVC constructions. It provides hi-fidelity and dense signal transmission with low dielectric constant. Its low coefficient of friction and excellent abrasion resistance provide a unique non-adhesive and self

• North American (AWG): 28 AWG
• Number of Conductors: 9 to 64 #
• Operating Temperature: -65 to 200 C
• Product Category: Bulk Cable

Description: following: Fluorinated Ethylene Propylene (FEP) offers an excellent combination of properties that include: exceptional dielectric properties, a low dielectric constant over a wide frequency range, chemical inertness including transformer oils and dielectric fluids, heat

• Cable Insulation: Silicon Rubber, Teflon?
• North American (AWG): 28 AWG
• Rated Voltage: 18 kilovolts

Description: following: Fluorinated Ethylene Propylene (FEP) offers an excellent combination of properties that include: exceptional dielectric properties, a low dielectric constant over a wide frequency range, chemical inertness including transformer oils and dielectric fluids, heat

• Cable Insulation: Silicon Rubber, Teflon?
• North American (AWG): 22 AWG
• Rated Voltage: 20 kilovolts

Description: following: Fluorinated Ethylene Propylene (FEP) offers an excellent combination of properties that include: exceptional dielectric properties, a low dielectric constant over a wide frequency range, chemical inertness including transformer oils and dielectric fluids, heat

• Cable Insulation: Silicon Rubber, Teflon?
• North American (AWG): 24 AWG
• Rated Voltage: 18 kilovolts

Description: following: Fluorinated Ethylene Propylene (FEP) offers an excellent combination of properties that include: exceptional dielectric properties, a low dielectric constant over a wide frequency range, chemical inertness including transformer oils and dielectric fluids, heat

• Cable Insulation: Silicon Rubber, Teflon?
• North American (AWG): 20 AWG
• Rated Voltage: 25 kilovolts

Description: -layer PCBs used in high-frequency PCBs, which operate typically at gigahertz. Teflon or polyphenylene oxide (PPO) is used to create the boards. When selecting high-frequency single-layer PCBs, there are a few things to keep in mind, including thermal expansion, dielectric loss, water

• Thickness: 0.0157 inches
• Type: Film / Flexible Substrate