-
Supplier: Henkel Corporation - Electronics
Description: With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective
- Composition: Single Component System
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material
- Form: Liquid
- Industry: Electronics
-
Supplier: Quarktwin Technology Ltd.
Description: RF EMI Absorbing Sheet - Polymer Resin Conductive 3.150" (80.00mm) X 3.150" (80.00mm) X 0.118" (3.00mm)
- Foil / Sheet Thickness: Other
- Form Factor / Shape: Other
- Shielding Product: Other
-
Supplier: Quarktwin Technology Ltd.
Description: RF EMI Absorbing Sheet AB5100HF Polymer Resin, Metal Flakes Non-Conductive, Single Sided 2.000" (50.80mm) X X 0.039" (1.00mm)
- Foil / Sheet Thickness: Other
- Form Factor / Shape: Other
- Shielding Product: Other
-
-
Supplier: Quarktwin Technology Ltd.
Description: RF EMI Absorbing Sheet TEM96 Polymer Resin Conductive 6.299" (160.00mm) X 6.299" (160.00mm) X 0.020" (0.50mm)
- Foil / Sheet Thickness: 0.020", Other
- Form Factor / Shape: Other
- Shielding Product: Other
-
Supplier: Quarktwin Technology Ltd.
Description: RF EMI Absorbing Sheet AB5000S Polymer Resin, Metal Flakes Non-Conductive, Single Sided 2.000" (50.80mm) X X 0.005" (0.13mm)
- Foil / Sheet Thickness: Other
- Form Factor / Shape: Other
- Shielding Product: Other
-
Supplier: Master Bond, Inc.
Description: Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
- Compound Type: Casting Resin
- Deflection Temperature (@ 264 psi, 1.8 MPa): 180 F
-
Supplier: Master Bond, Inc.
Description: Master Bond MB600S is an aqueous based sodium silicate coating formulated for applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required. Tested according to IEEE 299, 2006 methods, MB600S was as effective as the aluminum reference with
- Chemical / Polymer System Type: Specialty / Other
- Composition: Single Component System, Filled, Water Based / Latex Dispersion
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Features: Anti-static / ESD Control, Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material, Thermal Compound / Interface (Thermally Conductive)
-
Description: stock, similar to aluminum or hard plastic. In addition, we can custom mold materials to shape, and can supply 2-component liquid resins for casting in place. These materials have been used to produce waveguide loads and absorptive housings, and they can be cast directly into RF device
- Chemical / Polymer System Type: Epoxy, Silicone
- Compound Type: Casting Resin
- Features: EMI / RFI Shielding
-
Supplier: DigiKey
Description: "RF EMI Absorbing Sheet EFR Polymer Resin, Magnetic Powder 9.449"" (240.00mm) X 9.449"" (240.00mm) X 0.020"" (0.50mm)"
-
Supplier: Fujipoly® America Corp.
Description: Applications: RFI/EMI gaskets and shielding Electrostatic discharge (ESD) Electrical and Electronic parts used in: - cameras - computers - switches - instrumentation - displays - controls Complex shapes of silicone rubber consisting of
- Features: EMI / RFI Shielding
- Material Type / Grade: Elastomer / Rubber
-
Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and mechanical
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 28.89 to 49.44 µin/in-F
- Compound Type: Casting Resin
- Features: Electrically Conductive, EMI / RFI Shielding, Thermally Conductive
-
Supplier: Win Source Electronics
Description: Win Source Part Number: 1181835-IBF10GAB 115X115XP16 Category: RF/IF and RFID>RFI and EMI - Shielding and Absorbing Materials Series: iBF Type: Flexible Ferrite Sheet Package: Bulk Length: 4.528" (115.00mm) Standard Package: 20 Material: Polymer Resin, Metal Flakes
- Operating Temperature: -40 to 85 C
-
Supplier: Epoxy Technology
Description: curing resin for harvesting sunlight, while providing watertight protection.?EPO-TEK® serves industries such as lifestyle, military, medical, scientific and alternative energy every day and the applications of our optical adhesives can be found everywhere. They are commonly used
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 31.11 to 111 µin/in-F
- Compound Type: Liquid
- Features: Electrically Conductive Compound, EMI / RFI Shielding, Optical Grade
-
Supplier: Master Bond, Inc.
Description: Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably from other heat resistant epoxies in that it has far more toughness and
- Chemical / Polymer System Type: Epoxy (EP)
- Coating Type: Electrically Conductive, Electrical Insulation / Dielectric, EMI / RFI Shielding Material, ESD Control / Anti-static
- Coeff. of Thermal Expansion (CTE): 27.78 µin/in-F
- Composition: Unfilled
-
Supplier: ARC Technologies, Inc.
Description: in a Lean Manufacturing environment. Solutions: Radar Absorbing Structures Composite Structures for Aircraft and Naval Applications Radar Camouflage Units (RCU's) Resin Transfer Molded Parts Radome Structures
- Material Type / Grade: EMI / RFI Shielding
-
Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues.
- Chemical / Polymer System Type: Silicone
- Features: Electrical Insulation / Dielectric Material, EMI / RFI Shielding Material, Thermal Compound / Interface (Thermally Conductive), UL Approved
- Form: Film / Sheet, Pad, Specialty / Other
- Industry: Optoelectronics / Photonics, Semiconductors / IC Packaging, Electronics, Electrical Power / HV
-
Supplier: MAST Technologies
Description: viscosities. MAST Technologies has standard off the shelf products but specializes in customizing these materials for targeted applications, levels of resistivity, and environmental attributes. NOTE: This material is based on a silicone resin, other resin systems are available upon
- Features: Caulk / Grout, EMI / RFI Shielding Material
-
Supplier: Teknor Apex Company
Description: Conductive Electromagnetic Shielding (EMI) Ethylene Oxide Sterilizable Non-DEHP Plasticizer Radio Frequency Shielding (RFI) Uses
- Industry: Electronics
- Material Type / Grade: Thermoplastic
- Pellets: Yes
- Process Type: Extrusion Grade Resin
-
Supplier: Graphene Laboratories, Inc.
Description: and fillers. G6E-SG™ epoxy has good electrical conductivity. A heating oven is recommended for faster curing times. Uses for G6E-SG™ epoxy include photovoltaic cells, EMI / RFI shielding, medical device assembly and repair, etc. FEATURES: · Silver
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material, Specialty / Other
-
Supplier: Techsil Limited
Description: that need EMI shielding. Technical Properties Colour: Black Uncured Consistency: Paste Supplied in a 30cc manual syringe
- Chemical / Polymer System Type: Silicone
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
-
Supplier: Master Bond, Inc.
Description: /70). Master Bond Polymer System EP34 is a high performance potting, encapsulating, and adhesive compound whose strength is maintained even after long exposures to temper-atures in the 400-450°F range. Unlike many other epoxy resin systems its performance is relatively insensitive to mixing
- Chemical / Polymer System Type: Epoxy (EP)
- Dissimilar Substrates: Yes
- Features: Anti-static / ESD Control, Electrically Conductive, Electrical Insulation / Dielectric, EMI / RFI Shielding Material, Flexible / Dampening
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Tooling / Mold Material
-
Electronic and Instrument Enclosures - IP68 Aluminum Enclosure With Silicone Protector -- AWP SeriesSupplier: Takachi Electronics Enclosure Co., Ltd.
Description: Strong impact resistant enclosure with tough silicone boot protectors. Specifically designed with heat dissipation effect, EMC shielding and IP68 rating waterproof. PCB or mounting plate can be horizontally mounted by sliding into an inner grooved body frame. Suitable for measuring
- Depth: 2.11 to 3.74 inch
- Features: EMI/RFI Coating
- Ingress Protection(IP) Rating Against Foreign Objects: Type 6
- Ingress Protection(IP) Rating Against Moisture: Type 8
-
Supplier: RS Components, Ltd.
Description: High attenuation and self healing properties. Metal case with synthetic resin terminals. Applications include broadband interference suppression for ac/dc supply lines in shielded rooms, telephone exchanges, electrical systems and power supplies. Compact dimensions Maximum Current
- Filter Type: Other
- Package / Mounting: Other
- Rated Current: 100 amps
- Rated Voltage: 250 to 600 volts
-
Supplier: RS Components, Ltd.
Description: Conductive flexible aluminim coated foil. Conductive synthetic resin glue. Self adhesive, highly conductive release tape. Easy application. High shielding effectiveness. Operating Temperature -25 to +85ºC. Applications in EMI-Protection of doors and housings Total Thickness =
- Adhesive: Specialty / Other
- Peel Strength / Adhesion: 2.57 lbs/in
- Performance Features: Anti-static / ESD Control
- Temperature Resistance: 155 C
-
Supplier: RS Components, Ltd.
Description: The two-part MG Chemicals 8331S is an economical, slow cure silver conductive epoxy adhesive designed to give good electrical and thermal conductivities. The conductive adhesive provides excellent EMI/RFI shielding. Package Type = Syringe Package Size = 15 g Cure Time = 50 min
- Features: Electrically Conductive
- Use Temperature: -40 to 302 F
-
Supplier: Henkel Corporation - Electronics
Description: applications such as electronic circuitry, flexible conductive coatings for plastics, EMI shielding, flexographic and rotogravure printed circuits and Bio medical sensors.
-
Supplier: American High Voltage, Inc.
Description: compact high voltage DC to DC converters which have been designed especially for PMT applications. They are shielded in a metal housing which guarantees low radiated EMI for noise sensitive applications. They are rugged, arc resistant, and virtually burn-out proof. The output voltage
Find Suppliers by Category Top
Featured Products Top
-
) Cross-linkable compounds Lower Permeation Compounds Unique Filler blends (CB, Graphene, CNTs, BN, etc.) Electrical (static dissipative) and thermal conductivity EMI Shielding Low Particle Count Color Masterbatches (in your formulation) High Temperature non-blooming slip additive masterbatches Pelletized elastomer compounds and masterbatches (read more)
Browse Specialty Polymers and Resins Datasheets for Cri-Tech, Inc. -
rear) for touchscreens and displays; a set of opening tools; hardboard protection plates, adhesive foils and anti-slide feet for desktop use. OKW can supply SMART-PANEL fully customized. Services include CNC machining, printing, laser marking, RFI/EMI shielding and installation/assembly of accessories. (read more)
Browse Electronic and Instrument Enclosures Datasheets for OKW Enclosures, Inc.
More Information Top
Indicates content that may require registration and/or purchase.
-
Preparation and characterization of electromagnetic interference shielding polyimide foam
… considerable attentions have been devoted to the development of effective EMI shielding materials.1–4 Polymer with carbon nanotubes (CNTs) or fibers are effective EMI shielding materials.5,6 Compared with conventional metal-based and polymer resin EMI shielding materials,7 electrically conduc …
-
EMI and RFI Shielding
EMI shielding casting resin materials can be cast into stock or custom shapes to be used as shielding for a system.
-
New functional conductive polymer composites containing nickel coated carbon black reinforced phenolic resin
This leads to the increase of the charge carrier density and the EMI shielding of the resin composites.
-
The dependence of resistivity of carbon fibers/ABS resin composites on the temperature
More and more reports have appeared recently on the electrical conductivity and electromagnetic interfer- ence ( EMI ) shielding coefficient of resin -based com- posites filled with various conductive fillers [1–3].
-
Injection molding of ribbed plastic plates with a superplastic Zn–22% Al sheet
This aluminum/ resin housing offers good EMI shielding with reasonable weight; however, the aluminum sheet only allows little de- formation during this process.
-
Dielectric properties of graphite‐based epoxy composites
Microwave experiments (see Fig. 5) show that the only but really effective additive for producing EMI shielding with graphite–epoxy resin composites is exfoliated graphite.
-
Impedance analysis and electromagnetic interference shielding effectiveness of conductive carbon black reinforced microcellular EPDM rubber vulcanizates
Q.J. Krueger, ‘‘ EMI Shielding of Carbon Filled Conductive Resins ,’’ MS Thesis, Department of Chemical Engineering, Michigan Technological University, Houghton, MI (2002).
-
The Electromagnetic Shielding Effectiveness of a Low-Cost and Transparent Stainless Steel Fiber/Silicone Resin Composite
[15] A. Hochberg and J. Versieck, “ Shielding for EMI and antistatic plastic resins with stainless steel fibres,” Plastics Additives Compounding, vol.
-
ZCP2012MST0606
The coating was made of steel and acrylic resin , which shows controllable EMI shielding effectiveness and corrodes at a reasonable speed in marine environment, making it a suitable material for cumulative corrosion monitoring.
-
Thermoset composites functionalized with carbon nanofiber sheets for EMI shielding
They can be utilized to prepare a kind of structure materials with good electrical conduc- tivity and EMI shielding performance, in which polyester resins penetrate the interconnected networks of CNF sheets.