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Supplier: Henkel Corporation - Electronics
Description: and operational limitations. To address this, the Faraday cage is applied at the package level. Typical Packaging Structure and Solutions Henkel has developed innovative material technologies that provide effective protection at the package level with compartmental shielding and conformal
- Form / Function: Conformal / Encapsulating Coating
- Type: EMI / RFI Shielding Material, Electrically Conductive
- Industry: Electronics (PCB / SMT Assembly)
- Features: Liquid
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Supplier: Quarktwin Technology Ltd.
Description: RF EMI Absorbing Sheet AB5000S Polymer Resin, Metal Flakes Non-Conductive, Single Sided 1.000" (25.40mm) X X 0.005" (0.13mm)
- Features: Other
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Supplier: DigiKey
Description: "RF EMI Absorbing Sheet EFR Polymer Resin, Magnetic Powder 9.449"" (240.00mm) X 9.449"" (240.00mm) X 0.039"" (1.00mm)"
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Supplier: Master Bond, Inc.
Description: Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The
- Deflection Temperature (@ 264 psi, 1.8 MPa): 180 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
- Tensile Strength (Break): 7,600 psi
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Supplier: Master Bond, Inc.
Description: Master Bond MB600S is an aqueous based sodium silicate coating formulated for applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required. Tested according to IEEE 299, 2006 methods, MB600S was as effective as the aluminum reference with
- Use Temperature: 0 to 700 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate Compatibility: Ceramic / Glass, Composites, Dissimilar Substrates, Metal, Plastic, Porous Surfaces
- Features: Conformal / Encapsulating Coating, EMI / RFI Shielding Material, ESD Control / Anti-static, Electrically Conductive, Filled, Liquid, Non-corrosive Cure, Other, Specialty / Other, Thermal Compound / Interface (Thermally Conductive), Water Based / Latex Dispersion
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Supplier: Win Source Electronics
Description: Manufacturer: 3M Win Source Part Number: 900570-EM15TP-010-1 Series: EM15TP Operating Temperature Range: -25°C ~ 90°C Features: RF EMI Absorbing Sheet series Polymer Resin, Metal Flakes Non-Conductive, Single Sided - X - X Package: Box Family Name: EM15TP Categories: RF/IF and RFID
- Operating Temperature: -25 to 90 C
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1181835-IBF10GAB 115X115XP16 Category: RF/IF and RFID>RFI and EMI - Shielding and Absorbing Materials Series: iBF Type: Flexible Ferrite Sheet Package: Bulk Length: 4.528" (115.00mm) Standard Package: 20 Material: Polymer Resin, Metal Flakes Shape: Sheet
- Operating Temperature: -40 to 85 C
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: EMI Absorber Sheet, Metal/Polymer/Resin, -30°C to 105°C Product overview: AB6005S from 3M is an EMI RFI Filter for EMI/RFI suppression, power line filtering, signal conditioning, noise reduction, and compliance-oriented designs. It is useful for engineers and buyers
- Filter Category: Active Filter
- Standards and Certifications: RoHS Compliant
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Supplier: Master Bond, Inc.
Description: Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably from other heat resistant epoxies in that it has far more toughness and
- Use Temperature: 400 to 500 F
- Coeff. of Thermal Expansion (CTE): 27.77777777777778 µin/in-F
- Tensile Strength (Break): 4,600 psi
- Elongation: 120 %
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Supplier: Fujipoly® America Corp.
Description: Applications: RFI/EMI gaskets and shielding Electrostatic discharge (ESD) Electrical and Electronic parts used in: - cameras - computers - switches - instrumentation - displays - controls Complex shapes of silicone rubber consisting of different properties such as conductive and
- Features: EMI / RFI Shielding, Extrusion Grade Resin
- Type: Elastomer / Rubber
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Description: similar to aluminum or hard plastic. In addition, we can custom mold materials to shape, and can supply 2-component liquid resins for casting in place. These materials have been used to produce waveguide loads and absorptive housings, and they can be cast directly into RF device packages to
- Features: Casting Resin, EMI / RFI Shielding
- Chemical System: Epoxy, Silicone
- Type: Thermoset
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Supplier: Teknor Apex Company
Description: Material Status Commercial: Active Availability Africa & Middle East Asia Pacific Europe Latin America North America Additive Antistatic Plasticizer Features Antistatic Conductive Electromagnetic Shielding (EMI) Ethylene Oxide Sterilizable Non-DEHP Plasticizer Radio Frequency
- Tensile Strength (Break): 1,200 psi
- Industry: Electronics
- Features: Extrusion Grade Resin
- Form / Shape: Pellets
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Supplier: MAST Technologies
Description: standard off the shelf products but specializes in customizing these materials for targeted applications, levels of resistivity, and environmental attributes. NOTE: This material is based on a silicone resin, other resin systems are available upon request .
- Features: Caulk / Grout, EMI / RFI Shielding Material
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and mechanical
- Use Temperature: 482 F
- Thermal Conductivity: 2.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 28.88888888888889 to 49.44444444444444 µin/in-F
- Viscosity: 25,000 to 45,000 cP
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Supplier: Epoxy Technology
Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs. More recently, solar cells require our UV curing resin
- Use Temperature: 527 F
- Thermal Conductivity: 0.44 W/m-K
- Coeff. of Thermal Expansion (CTE): 31.11111111111111 to 111.11111111111111 µin/in-F
- Viscosity: 500 to 1,000 cP
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The
- Use Temperature: -100 to 250 F
- Deflection Temperature (@ 264 psi, 1.8 MPa): 160 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Tensile Strength (Break): 1,000 psi
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues.
- Applied Thickness / Gap Fill: 0.01968505 to 0.393701 inch
- Use Temperature: -76 to 356 F
- Thermal Conductivity: 5 W/m-K
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Laminating Adhesive / Composite Resin, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: Quantaflex Printed Electronics Inc.
Description: dangers of overheating. When you’re finalizing the design of your electronic device, your custom converting expert can be a helpful partner in selecting the right materials for thermal interface and EMI shielding. ABLE’s stock of raw materials along with our technical expertise
- Features: EMI / RFI Shielding Material, Film / Sheet, Gap Filling Compound, Liquid, Specialty / Other, Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Henkel Corporation - Electronics
Description: such as electronic circuitry, flexible conductive coatings for plastics, EMI shielding, flexographic and rotogravure printed circuits and Bio medical sensors.
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Supplier: Techsil Limited
Description: Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primerless adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for electronics that need
- Features: Electrically Conductive
- Industry: Electronics
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: Takachi Electronics Enclosure Co., Ltd.
Description: Strong impact resistant enclosure with tough silicone boot protectors. Specifically designed with heat dissipation effect, EMC shielding and IP68 rating. PCB or chassis can be horizontally mounted by sliding into an inner grooved body frame. Suitable for measuring instruments, outdoor
- Length / Height: 4.0944904 to 13.4645742 inch
- Width/Diameter: 2.85039524 to 8.42126439 inch
- Depth: 2.11023736 to 3.74409651 inch
- Height: 4.0944904 to 13.4645742 inch
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and mechanical
- Viscosity: 1,800 to 2,800 cP
- Use Temperature: 572 F
- Thermal Conductivity: 3.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 17.22222222222222 to 66.66666666666667 µin/in-F
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and mechanical
- Viscosity: 25,000 to 45,000 cP
- Use Temperature: 482 F
- Thermal Conductivity: 2.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 51.99999999999999 to 88.99999999999999 µin/in-F
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Supplier: Techsil Limited
Description: mechanical shocks; and provides the low resistivity needed for many operating conditions. Primarily used a cold solder, 8330 allows for quick cold soldering repairs and is effective at bonding heat sinks to other components and PCBs. It also provides excellent EMI/RFI shielding and is
- Features: Electrically Conductive, Thermal / Heat Conductive
- Industry: Electronics
- Chemical System: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: effective at bonding heat sinks to other components and PCB's. 8331 also provides excellent EMI/RFI shielding and is very effective at filling seams between metal plates. Product Benefits Electrical resistivity: 0.007 O·cm Thermal conductivity: 0.90 W/(m·K) 1:1 mix ratio Working time:
- Features: Electrically Conductive, Thermal / Heat Conductive
- Industry: Electronics
- Chemical System: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: American High Voltage, Inc.
Description: applications. They are shielded in a metal housing which guarantees low radiated EMI for noise sensitive applications. They are rugged, arc resistant, and virtually burn-out proof. The output voltage of the AQ power supply is directly proportional to the input voltage. The power supply will
- DC Output Voltage: 0 to 3,000 volts
- DC Output Current: 0 to 0.0005 amps
- DC Output Power: 1.5 watts
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rear) for touchscreens and displays; a set of opening tools; hardboard protection plates, adhesive foils and anti-slide feet for desktop use. OKW can supply SMART-PANEL fully customized. Services include CNC machining, printing, laser marking, RFI/EMI shielding and installation/assembly of accessories. (read more)
Browse Electronic and Instrument Enclosures Datasheets for OKW Enclosures, Inc.
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Indicates content that may require registration and/or purchase.
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Preparation and characterization of electromagnetic interference shielding polyimide foam
… considerable attentions have been devoted to the development of effective EMI shielding materials.1–4 Polymer with carbon nanotubes (CNTs) or fibers are effective EMI shielding materials.5,6 Compared with conventional metal-based and polymer resin EMI shielding materials,7 electrically conduc …
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EMI and RFI Shielding
EMI shielding casting resin materials can be cast into stock or custom shapes to be used as shielding for a system.
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New functional conductive polymer composites containing nickel coated carbon black reinforced phenolic resin
This leads to the increase of the charge carrier density and the EMI shielding of the resin composites.
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The dependence of resistivity of carbon fibers/ABS resin composites on the temperature
More and more reports have appeared recently on the electrical conductivity and electromagnetic interfer- ence ( EMI ) shielding coefficient of resin -based com- posites filled with various conductive fillers [1–3].
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Injection molding of ribbed plastic plates with a superplastic Zn–22% Al sheet
This aluminum/ resin housing offers good EMI shielding with reasonable weight; however, the aluminum sheet only allows little de- formation during this process.
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Dielectric properties of graphite‐based epoxy composites
Microwave experiments (see Fig. 5) show that the only but really effective additive for producing EMI shielding with graphite–epoxy resin composites is exfoliated graphite.
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Impedance analysis and electromagnetic interference shielding effectiveness of conductive carbon black reinforced microcellular EPDM rubber vulcanizates
Q.J. Krueger, ‘‘ EMI Shielding of Carbon Filled Conductive Resins ,’’ MS Thesis, Department of Chemical Engineering, Michigan Technological University, Houghton, MI (2002).
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The Electromagnetic Shielding Effectiveness of a Low-Cost and Transparent Stainless Steel Fiber/Silicone Resin Composite
[15] A. Hochberg and J. Versieck, “ Shielding for EMI and antistatic plastic resins with stainless steel fibres,” Plastics Additives Compounding, vol.
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ZCP2012MST0606
The coating was made of steel and acrylic resin , which shows controllable EMI shielding effectiveness and corrodes at a reasonable speed in marine environment, making it a suitable material for cumulative corrosion monitoring.
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Thermoset composites functionalized with carbon nanofiber sheets for EMI shielding
They can be utilized to prepare a kind of structure materials with good electrical conduc- tivity and EMI shielding performance, in which polyester resins penetrate the interconnected networks of CNF sheets.