Products & Services
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Supplier: Henkel Corporation - Industrial
Description: Frekote 700-NC offers excellent release properties for the most demanding applications and is a great all-purpose release agent. Frekote 700-NC releases epoxies, polyester resins, thermoplastics, rubber compounds and most other molded polymers.
- Features: Specialty
- Operating / Use Temperature: 59 to 275 F
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Supplier: Henkel Corporation - Industrial
Description: Sacrificial mold release agent aerosol spray which offers superb release properties, choice of finish to meet specific molding requirements. LOCTITE® FREKOTE EXITT-I is a clear, solvent-based, sacrificial mold release agent aerosol spray which offers
- Features: Specialty
- Operating / Use Temperature: 68 to 140 F
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Supplier: Henkel Corporation - Industrial
Description: Clear, all-purpose, silicone-based mold release agent with a special lubricant, which provides optimum release along with surface conditioning. LOCTITE® FREKOTE® AC4368 is a clear, all-purpose, silicone-based mold release agent. It contains a special
- Chemistry / Constituents: Silicone
- Features: Specialty
- Operating / Use Temperature: 68 to 140 F
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Supplier: Henkel Corporation - Industrial
Description: Frekote EXITT-EM is a water based silicone emulsion that offers superb release properties, excellent part detail, and provides a water-based alternative to solvent-based products to meet your specific molding requirements. EXITT-EM sacrificial mold release agent can be
- Chemistry / Constituents: Silicone
- Operating / Use Temperature: 140 to 355 F
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Supplier: Aervoe Industries Incorporated
Description: Ideal for manufacturers of flexible and rigid polyurethane, easily removed
- Chemistry / Constituents: Wax / Stearate
- Features: Aerosol / Spray, Specialty
- Operating / Use Temperature: 40 to 110 F
- Type: Specialty / Other
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Supplier: Aervoe Industries Incorporated
Description: Ideal for manufacturers of flexible and rigid polyurethane, easily removed
- Chemistry / Constituents: Wax / Stearate
- Features: Aerosol / Spray, Specialty
- Operating / Use Temperature: 40 to 110 F
- Type: Specialty / Other
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Supplier: Techsil Limited
Description: Techsil 6088A is a semi-permanent, wax-free, release agent and lubricant in aerosol cans. It can be used for many types of moulding operations, especially where abrasion is a problem. Techsil 6088A incorporates a system to tightly bond the release film to the mould surface for
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Supplier: McGee Industries, Inc. / McLube Division
Description: MAC-971 is a solvent-based release agent that bonds to the surface of a mold but will not transfer to the molded part. Product will cure at room temperature and remain inert and thermally stable. Suitable for use with epoxies (thermosets and prepregs), phenolic,
- Chemistry / Constituents: Specialty / Other
- Operating / Use Temperature: 1000 F
- Type: Micro-dispersion, Solid / Dry Film Release
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Mold Releases and Release Agents - Semi-Permanent, Quick-Dry Release Agent for Composites -- MAC 973Supplier: McGee Industries, Inc. / McLube Division
Description: MAC-973 is a water-based emulsion of resin that will cure to form a clear, colorless release coating. Can cure at low temperatures and dries faster than most standard release agents. Effective with epoxy, polyester, thermoplastic, thermoset resins and fiberglass
- Operating / Use Temperature: 1000 F
- Type: Micro-dispersion, Solid / Dry Film Release, Water Soluble / Emulsion
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Supplier: DME Company
Description: A paintable non-silicone release that is approved for medical and food applications. Unlike vegetable-based releases, Pure Eze is based on a neutral white oil. It does not contain any lecithins, so it will not turn color or rancid over long periods of time. Pure Eze mold
- Applications / Function: Electrical / Electronic
- Features: Aerosol / Spray
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite MR 11 Mold Release Clear, formerly Emerson and Cuming, is a air drying, silicone based liquid that is used for coating polymer and epoxy systems. It is low viscosity, contains solvents, and has excellent non-sticking properties. 1 gal Pail.
- Chemistry / Constituents: Silicone, Synthetic / Semi-synthetic
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Frekote 55-NC Semi-Permanent Release Agent Clear is a non-migratory release system. It offers excellent release for various molding applications including epoxies, polyester resins, vinyl ester resins, thermoplastics, adhesives, and rotationally
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Supplier: Ellsworth Adhesives
Description: Miller-Stephenson MS-143XD PTFE Release Agent Dry Lubricant White is can be used on a variety of materials such as metal, plastic, wood, rubber, glass, and ceramics. As a release agent, it can mold epoxies, acrylics, urethanes, rubbers, plastics, and resins.
- Chemistry / Constituents: Fluoropolymer / PTFE (e.g., Teflon®), Specialty / Other
- Type: Solid / Dry Film Release
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Supplier: Ellsworth Adhesives
Description: Miller-Stephenson MS-122XD PTFE Release Agent Dry Lubricant White can be used on a variety of materials such as metal, plastic, wood, rubber, glass, and ceramics. As a release agent, it can mold epoxies, acrylics, urethanes, rubbers, plastics, and resins.
- Chemistry / Constituents: Fluoropolymer / PTFE (e.g., Teflon®), Specialty / Other
- Type: Solid / Dry Film Release
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Supplier: McGee Industries, Inc. / McLube Division
Description: MAC-716 is a proven, semi-permanent release agent for molded polyurethane parts. It provides fast, easy part removal with no transfer and multiple releases per application. This product does not require mixing before use. The product is suitable for cast urethane, foams,
- Chemistry / Constituents: Specialty / Other
- Features: Aerosol / Spray
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Supplier: Techsil Limited
Description: LOCTITE® FREKOTE 700-NC™ is a great all-purpose release agent. It releases epoxies, polyester resins, thermoplastics, rubber compounds and most other moulded polymers.
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Mold Releases and Release Agents - Mold Release & Mandrel Lubricant for Hose & Belts -- McLube 1733HSupplier: McGee Industries, Inc. / McLube Division
Description: McLube 1733H is a solvent dispersion of PTFE that dries in seconds and leaves a durable, colorless coating with excellent release and anti-stick characteristics. The coating is flexible and particularly suited for use on nonmetallic molds such as epoxy, polyester, and silicone.
- Chemistry / Constituents: Fluoropolymer / PTFE (e.g., Teflon®), Specialty / Other
- Features: Aerosol / Spray
- Operating / Use Temperature: 550 F
- Type: Micro-dispersion, Solid / Dry Film Release
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Supplier: RS Components, Ltd.
Description: Highly effective dry, non-silicone mould release agent for thermosetting plastics. Excellent release properties on polyurethane, epoxy resins and polyesters Maximum Operating Temperature = +180°C
- Operating / Use Temperature: 356 F
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Supplier: RS Components, Ltd.
Description: A modified silicone resin release system. Formulated to provide quick and effective release of rigid, integral skin and elastomeric polyurethaneâ??s. Also provides effective release of epoxy, polyester, PVC and many other plastics and rubbers. Does not build up in the
- Operating / Use Temperature: 392 F
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Supplier: Techsil Limited
Description: BJB RF-5215 is a water-soluble parting film (PVA) recommended for separation between polyester, epoxy and polyurethane resins from various mold surfaces. It is typically applied by a siphon cup spray gun, but can also be brushed or painted on. After the part has been separated from the
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Supplier: RS Components, Ltd.
Description: Resin Stop has been formulated using fluoropolymer technology to provide a film that once applied to the substrate, prevents most epoxy and polyurethane resins adhering.RST is ideally suited for coating machinery, jigs, moulds and many other substrates likely to come into contact with resin
- Operating / Use Temperature: 266 F
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Supplier: RS Components, Ltd.
Description: An extremely effective and powerful solvent blend, developed for use on polymer soiled tooling and moulds, to remove a wide variety of moulding deposits. Effective on ABS, Acetals, Acrylates, Epoxy resins (uncured), Polyamides, Polystyrenes, Polyurethanes, PVC, Rubbers and Silicone,
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Supplier: Master Bond, Inc.
Description: . This compound is 100% reactive and does not contain any solvents or other volatiles. It contains a special air release agent. Master Bond Polymer System EP30M3LV is particularly recommended where a low viscosity is required and cured castings must withstand severe environmental
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.1
- Dielectric Strength: Over 400 kV/in
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Supplier: Wacker Chemical Corp.
Description: Pourable, addition-curing, two-component silicone rubber that vulcanizes at room temperature. Special features very good flow excellent mould release; usually no further release agent required fast and non-shrink cure at room temperature which can be
- Chemical / Polymer System Type: Silicone
- Elongation: 330 %
- Industry: Tooling / Molds
- Material Type / Grade: Elastomer / Rubber
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Supplier: Bluestar Silicones USA Corp.
Description: , cures at room temperature to a strong, flexible silicone rubber for moldmaking and tooling. Molds made from Bluesil RTV-573 have been used to produce reproductions from filled or extended polyesters, epoxy, polyurethane and plaster casts. The high elongation and low hardness of
- Chemical / Polymer System Type: Silicone
- Compound Type: Liquid
- Elongation: 250 %
- Industry: Industrial, Tooling / Molds
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Supplier: Techsil Limited
Description: TSE3455 ST is a two part, addition cure mold making silicone rubber from Momentive Performance Materials. This grade will cure at room temperature with the addition of the curing agent. Potential applications include prototype mold making for electric & electronics industry such
- Chemical / Polymer System Type: Silicone
- Material Type / Grade: Elastomer / Rubber
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Supplier: Master Bond, Inc.
Description: Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at
- Coeff. of Thermal Expansion (CTE): Over 33 µin/in-F
- Dissimilar Substrates: Yes
- Elongation: 4 %
- Features: Thermal / Heat Insulating, Electrical Insulation / Dielectric, Non-corrosive Cure
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. Mold Release Agents: Due to their high chemical inertness, h-BN powders do not react with materials such as metals, glass, and ceramics and are released. They are commonly used as a release agent in processes such as metal casting, glass molding, and composite molding to reduce adhesion (read more)
Browse Ceramic Powders and Precursors Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
short lead times. In addition to affordability and availability, LAST-A-FOAM® tooling boards in particular, are exceptionally machinable and dimensionally stable which makes it easy to create intricate designs. It can be easily bonded to allow users to create monolithic tools and molds for large (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
finish, since it comes off the tool with a smooth or textured skin that is already sealed. Paint can even be pre-applied in the mold. For post-processing, you simply wipe off the mold release and remove the parting line, and the product is ready to go. If product durability and waterproofing are (read more)
Browse Plastic Molding Services Datasheets for General Plastics Manufacturing Co.
Conduct Research Top
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Tech Tip 22 - Using Mold Release Agents with Epoxy Adhesives
. These occasions are where a mold release agent can play an important role.
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Modeling of the residual stresses acting on a low-birefringence fiber Bragg grating sensor embedded in an epoxy matrix
Before pouring the epoxy, the walls of the mould are sprayed with epoxy mold release agent .
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LED Package-use Encapsulation Material Report - 2013
Lamp mold cup separation Injection of mold release agent Epoxy injection Lead frame injection / 1st coating on the reflecting cup 1st hardening starting point .
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Role of Nanofillers in Induction Motor Enamelled Wires Exposed to PWM-VSC Waveforms
mould release agent epoxy resin surface degradation", IEE Proc. Sci. along with the research group at GE, Peterborough, Canada for .
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Emulsion copolymerization of vinylidene chloride and butyl methacrylate, 83:17 in mol %
For mechanical studies,VDC-BMA copolymer latex films 3-4 mm thick were dried at 50°C in small polystyrene Petri dishes pretreated with a mold re- lease agent for epoxy resin (Parafilm,Brice-Driscoll Corp.) .
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Batch and semicontinuous emulsion copolymerization of vinylidene chloride and butyl methacrylate. II. Physical and mechanical properties of copolymer latex fil...
For mechanical studies VDC-BMA copolymer latex films 3-4 mm thick were dried at 50°C in small polystyrene plastic petri dishes pretreated with a mold release agent for epoxy resins (Parafilm,Brice- Driscoll Corp.) .
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Detection Of Mould Release Agent Contamination On The Surface Of Epoxy-Based Composites By Diffuse Reflectance Fourier Transform Infrared Spectroscopy
Transmission spectra of the mould release agents and epoxy resins were obtained by casting thin films on trans- parent windows (KBr or AgC1).
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Magnetic resonance imaging of gel-cast ceramic composites
The molds consisted of 1” high x 2” diameter cylinders of anodized aluminum which were treated with a mold release agent ( Epoxy Parfilm Ultra 11, Price Driscoll Corp.).
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Polyurethane intravaginal ring for controlled delivery of dapivirine, a nonnucleoside reverse transcriptase inhibitor of HIV‐1
Epoxy parafilm paintable mold releasing agent was purchased from Price- Driscoll Corporate (Waterford, CT).
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Recent advances in interpenetrating polymer networks
Epoxy novolac resin Mold release agent 1/16-in. milled glass fibers, silane-treated .
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Wafer level CSP process by VPES (vacuum printing encapsulation systems)
molding epoxy resin contains release agents in epoxy On this time, we tested VPES to wafer level CSP .
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