Epoxy Resin Characteristics

Description: It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact

• Viscosity: 9,000 to 12,000 cP
• Use Temperature: -40 to 302 F
• Industry: Electronics
• Chemical System: Epoxy (EP)

Description: 20-3061 is a 100% reactive epoxy resin system which does not contain any solvents or additives which downgrade physical, thermal, and electrical insulation properties. This is a filled low viscosity system which provides good flow and wet out characteristics. 20-3061 is designed

• Use Temperature: -76 to 320 F
• Thermal Conductivity: 0.33172417 W/m-K
• Coeff. of Thermal Expansion (CTE): 21.11111111111111 µin/in-F
• Tensile Strength (Break): 8,250 psi

Description: NP512 combines a woven glass fabric and an epoxy resin system. The product provides high flexural, impact, and tensile strength at room temperatures along with a very high flexural modulus. NP512 is suitable for applications requiring enhanced flexural modulus and physical strength

• Use Temperature: 284 F
• Water Absorption: 0.1 %
• Tensile Strength (Break): 32,000 to 40,000 psi
• Dielectric Strength: 750.0000000000013 to 799.9999999999995 kV/in

Description: NP500A (NEMA G-10) is a glass fabric combined with a halogen-free epoxy resin system. The product offers a combination of excellent electrical characteristics and superior physical properties. In addition, it is not flame retardant and meets NEMA G-10 requirements. NP500A is

• Temperature Resistance: 130 to 140 C
• Materials: Cloth / Fabric (Woven), Glass / Fiberglass

Description: Master Bond Polymer System EP19HTLV is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnates and liners. It feature remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures

• Use Temperature: -60 to 300 F
• Tensile Strength (Break): 10,200 psi
• Elongation: 3.5 %
• Dielectric Constant (Relative Permittivity): 3.9

Description: Miller-Stephenson EPON™ 815C Yellow is a low-viscosity, liquid epoxy resin blend diluted with HELOXY 61 – Butyl Glycidyl Ether, which provides superb wetting characteristics. 1 qt Bottle.

• Substrate Compatibility: Composites
• Chemical System: Epoxy (EP)
• Cure / Technology: Single Component System

Description: Parker LORD® 304-1 General Purpose Epoxy Adhesive Resin Part A Gray is a two component, high viscosity adhesive used for gap filling or non-sag characteristics on a vertical surface. It offers durability, resists moisture and weathering, and contains no solvent. 1 gal Can.

• Viscosity: 40,000 to 400,000 cP
• Tensile Strength (Break): 4,360 psi
• Elongation: 10 %
• Chemical System: Epoxy (EP)

Description: Parker LORD® 306-1 General Purpose Epoxy Adhesive Resin Part A Gray is a two component, high viscosity adhesive. It is used for gap filling or non-sag characteristics on a vertical surface. It offers durability, resists moisture and weathering, and contains no solvent. 1 gal

• Viscosity: 40,000 to 400,000 cP
• Tensile Strength (Break): 4,360 psi
• Elongation: 10 %
• Chemical System: Epoxy (EP)

Description: This specification covers two-component, epoxy-resin bonding systems for application to Portland-cement concrete, which are able to cure under humid conditions and bond to damp surfaces. The epoxy-resin bonding systems are classified according to type, grade, class, and

Description: It is a two-component epoxy resin structural adhesive. At room temperature (25°C), the operating time is 20 minutes, the curing position is 90 minutes, and the curing is complete in 24 hours. After being fully cured, it has the characteristics of high shear, high peeling, and

• Chemical System: Epoxy (EP)
• Features: Room Temperature Curing
• Cure / Technology: Two Component System

Description: products offer the same high quality and superior performance of other name brand products at a cost saving of Up to 40% Vibra-Tite epoxies can be used in a wide range of applications and exhibit strong bonding characteristics.

• Use Temperature: -55 to 300 F
• Industry: Building / Construction
• Substrate Compatibility: Ceramic / Glass, Metal, Wood / Wood Product
• Chemical System: Epoxy (EP)

Description: Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient

• Use Temperature: -60 to 500 F
• Tensile Strength (Break): 5,200 to 10,200 psi
• Elongation: 2.4 to 6.9 %
• Electrical Resistivity: 1,800,000,000,000,000 to 150,000,000,000,000,000 ohm-cm

Description: Master Bond Polymer System EP30-3 is a two component, low viscosity, epoxy resin system featuring optical clarity, high physical strength properties, outstanding chemical resistance and superior high temperature properties. Excellent mechanical strength characteristics and

• Use Temperature: -60 to 250 F
• Deflection Temperature (@ 264 psi, 1.8 MPa): 298 F
• Coeff. of Thermal Expansion (CTE): 16 µin/in-F
• Tensile Strength (Break): 8,500 psi

Description: MG Chemicals 832HT is a high temperature epoxy designed for encapsulating and potting electronics in high temperature environments. It is also an ideal encapsulant for very chemically aggressive environments and applications where extreme physical strength is required. It protects against

• Industry: Electronics
• Chemical System: Epoxy (EP)

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are

• Use Temperature: 482 F
• Thermal Conductivity: 1.4 W/m-K
• Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 83.33333333333333 µin/in-F
• Viscosity: 800 to 1,600 cP

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are

• Use Temperature: 482 F
• Thermal Conductivity: 2.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 28.88888888888889 to 49.44444444444444 µin/in-F
• Viscosity: 25,000 to 45,000 cP

Description: Electrically Conductive Resins These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are electro-conductive resins made up of synthetic

• Viscosity: 25,000 cP
• Cure / Technology: Anaerobic
• Industry: Automotive, Electronics
• Features: Electrically Conductive

Description: Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures

• Use Temperature: -60 to 250 F
• Thermal Conductivity: 0.721 W/m-K
• Coeff. of Thermal Expansion (CTE): 19 to 22 µin/in-F
• Tensile Strength (Break): 8,000 psi

Description: The products are designed with a high level of tolerance in order to accommodate ships with a variety of operational characteristics; low to high activity and deep-sea to coastal. The SIGMA ALPHAGEN 230 and SIGMA ALPHAGEN 240 products comply with productivity requirements of the Asian new

• Features: Coating, Protective
• Chemistry: Epoxy, Resin Base / Polymer Binder
• Industry: Marine, OEM / Industrial
• Type: Primer

Description: amino, thiol, or hydroxyl groups. These groups couple to the epoxy groups on the support, which is then used for the purification of proteins, carbohydrates, or DNA. Profinity epoxide resin is based on UNOsphere beads, which have structural characteristics that result in superb

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are

• Use Temperature: 527 F
• Thermal Conductivity: 10.9 to 23 W/m-K
• Coeff. of Thermal Expansion (CTE): 29.444444444444443 to 44.44444444444444 µin/in-F
• Viscosity: 3,500 to 6,000 cP

Description: CONAPOXY® FR-1046 is a low cost, epoxy potting and casting system. Major characteristics include: low viscosity, low shrinkage, low exotherm, excellent resistance to thermal shock, and very good electrical insulation properties. When cured with any of the hardeners presented below, a

• Features: Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)

Description: prepreg system outperforms the competition while maintaining the familiar handling and flow characteristics of traditional epoxy prepregs.

Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock insulation and

• Industry: Electronics (PCB / SMT Assembly)
• Chemical System: Epoxy (EP)

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are

• Use Temperature: 617 F
• Thermal Conductivity: 3.2 W/m-K
• Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 58.888888888888886 µin/in-F
• Viscosity: 3,000 to 4,000 cP

Description: MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)

Description: Pro Industrial Precatalyzed Waterbased Epoxies are revolutionary, single-component pre-catalyzed water-borne acrylic epoxies that offers the adhesion, durability, and resistance to stains and most cleaning solvents usually characteristic of two-component waterborne acrylic epoxy

• Wet / Applied Thickness: 0.004 inch
• Cure / Dry Temperature: 77 F
• Chemistry: Acrylic / Latex, Epoxy, Resin Base / Polymer Binder
• Substrate: Aluminum, Concrete / Masonry, Metal, Steel, Wood

Description: chemicals. Product Benefits Optically Clear (allows visual inspection) UV Stable (non-yellowing) Convenient 2:1 mix ratio Excellent electrical insulation characteristics Good adhesion for a wide variety of substrates Broad service temperature range (-40°C to +140°C) Solvent free Extreme

• Industry: Electronics (PCB / SMT Assembly)
• Chemical System: Epoxy (EP)

Description: RTB326X is a composite of an extra-fine weave woven cotton fabric combined with an epoxy resin system to produce a tube product that has superior machining capability with smooth, fiber free surface. Typical uses could include retainers for ball-bearing and applications that require

• Features: Other
• Type: Plastic Tubing, Structural / Mechanical Tubing

Description: CoroBond™ 100 EPOXY PRIMER/SEALER is a high solids, low VOC, low viscosity, penetrating epoxy primer/sealer formulated specifically for use over concrete surfaces in secondary containment environments. Helps prevent "blow-back" and "outgassing" Low viscosity Low VOC Fast dry Superior

• Wet / Applied Thickness: 0.004 to 0.006 inch
• Cure / Dry Temperature: 77 F
• Operating / Use Temperature: 55 to 100 F
• Dispensing Method: Brush / Roll-on, Sprayable

Description: Nitomortar FC is a two-component thixotropic material based on high quality solvent-free epoxy resin systems. The colour coded material is supplied in pre-weighed quantities ready for on-site mixing and use. Nitomortar FC can be applied to damp surfaces and quickly cures to form a

Description: The products are designed with a high level of tolerance in order to accommodate ships with a variety of operational characteristics; low to high activity and deep-sea to coastal. The SIGMA ALPHAGEN 230 and SIGMA ALPHAGEN 240 products comply with productivity requirements of the Asian new

• Type: Clear Coat / Top Coat, Primer
• Features: Coating, Corrosion Inhibiting / Rust Preventive, Protective
• Chemistry: Epoxy, Resin Base / Polymer Binder
• Industry: Marine, OEM / Industrial

Description: COR-COTE E.N. 7000 is a 100% solids, two component, high build, epoxy novolac coating designed to protect substrates against severe chemical attack. Low viscosity and excellent adhesion characteristics ensure a tight bond to properly prepared concrete and steel surfaces. High build

• Use Temperature: 55 to 100 F
• Substrate Compatibility: Concrete / Masonry, Metal
• Chemical System: Epoxy (EP), Phenolics / Formaldehyde Resins
• Industry: OEM / Industrial

Description: NP114B pre-preg is composed of an electrical grade of epoxy resin (Tg = 175°C) combined with an aramid paper substrate. This grade of pre-preg does not use halogen flame retardants to obtain its flame retardant characteristics. This is essential since it cannot contain bromine

• Filler: Aramid Fiber
• Chemical System: Epoxy
• Type: Molding Resin, Thermoset