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Supplier: Protavic America, Inc.
Description: Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities.Passes NASA outgassing requirements.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Flexible / Dampening
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Flexible / Dampening
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require
- Coeff. of Thermal Expansion (CTE): 37.22 to 112 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 5.23
- Features: Encapsulating / Potting, Flexible / Dampening
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Supplier: Protavic America, Inc.
Description: PVIC ACE24511 electrically conductive die attach adhesive is specially designed for tantalum condenser application. This single component, fast cure adhesive also can be snap cured in hot plate or in-line snap cure system and its excellent electrical conductivity and flexibility
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Flexible / Dampening, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
- Substrate / Material Compatibility: Metal
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs.
- Coeff. of Thermal Expansion (CTE): 22.22 to 55.56 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Flexible / Dampening, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require
- Coeff. of Thermal Expansion (CTE): 43.33 to 123 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 8.23
- Features: Flexible / Dampening
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Supplier: Epoxies Etc...
Description: 10-3003 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3003 is also very safe to use due to the absence of harmful solvents and toxic chemicals
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.11
- Dielectric Strength: 550 kV/in
- Dissimilar Substrates: Yes
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Supplier: Epoxies Etc...
Description: 10-3008 is a filled, high performance structural epoxy adhesive. 10-3008 is a flexible adhesive with outstanding lap shear and peel strength. It is a great choice for bonding substrates of differing coefficients of thermal expansion. 10-3008 is also an excellent
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Features: Filled
- Industry: OEM / Industrial
- Tensile Strength (Break): 2700 to 3200 psi
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Supplier: Epoxies Etc...
Description: 10-3000 is a clear 2 part flexible adhesive. 10-3000 is water clear and its low viscosity allows maximum penetration of substrates. Its flexibility maintains a tenacious bond on parts with widely differing coefficients of expansion. 10-3000 cures at room temperature or can be
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dissimilar Substrates: Yes
- Industry: Electronics, OEM / Industrial, Other
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Epoxies Etc...
Description: 10-3003 HV is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3003 HV is also very safe to use due to the absence of harmful solvents and toxic
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.11
- Dielectric Strength: 550 kV/in
- Dissimilar Substrates: Yes
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Coeff. of Thermal Expansion (CTE): 32.78 to 120 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.42
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
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Supplier: Techsil Limited
Description: Techsil® EP20860 is a two part, rapid curing epoxy adhesive that cures at room temperature with low shrinkage and forms an ultra-clear bond line. Techsil® EP20860 offers a flexible and impact resistant bond that is resistant to a wide range of chemicals with excellent electrical
- Cure Type / Technology: Thermosetting / Crosslinking
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Description: LOCTITE® ABLESTIK ECF 561 is designed for bonding materials with mismatched coefficients of thermal expansion. Electrically conductive Flexible Removable
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
- Thermal Conductivity: 1.6 W/m-K
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive DP125 is a flexible, gray, two-part epoxy. 1:1 mix ratio, 25 minute work life and handling strength in 2.5 hours. 3M™ Scotch-Weld™ EPX™ 200 mL applicator. 3M™ Scotch-Weld™ Epoxy Adhesive DP125 has medium viscosity that allows
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 6.3
- Dielectric Strength: 680 to 765 kV/in
- Elongation: 120 to 150 %
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Supplier: DigiKey
Description: BLACK FLEXIBLE EPOXY
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Features: Encapsulating / Potting
- Index of Refraction: 1.51
- Industry: Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive 2216 is a flexible, two-part epoxy. 2:3 mix ratio, 90 minute work life and handling strength in 10 hours. This kit contains parts A and B. 3M™ Scotch-Weld™ Epoxy Adhesive 2216 cures at room temperature and provides high
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 5.51 to 14.17
- Dielectric Strength: 408 to 630 kV/in
- Industry: Aerospace, OEM / Industrial
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Supplier: Master Bond, Inc.
Description: room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough, flexible bonds which are remarkably resistant to thermal cycling and chemicals including
- Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 2.9
- Dielectric Strength: 360 to 450 kV/in
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Description: A flexible, two-part, room temperature curing epoxy with high peel and shear strength. Is identical to 3M™ Scotch-Weld™ Epoxy Adhesive EC-2216 B/A in chemical composition. Has been labeled, packaged, tested, and certified for aircraft and aerospace applications. May be
- Coeff. of Thermal Expansion (CTE): 81 to 207 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 5.51 to 14.17
- Dielectric Strength: 408 to 630 kV/in
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Supplier: Master Bond, Inc.
Description: substrates. Also, the highly flexible EP21TDCNFL is easier to remove than most nickel epoxies, making it well suited for repair type applications. Parts A and B are both colored nickel. Master Bond EP21TDCNFL adhesive is widely used in the electronic, electrical, computer,
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 360 to 450 kV/in
- Dissimilar Substrates: Yes
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Supplier: Master Bond, Inc.
Description: Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems.
- Applied Thickness / Gap Fill: 0.0040 to 0.0060 inch
- Coeff. of Thermal Expansion (CTE): 3.06E7 to 3.33E7 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.9
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 360 to 450 kV/in
- Dissimilar Substrates: Yes
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Supplier: DigiKey
Description: EPOXY POTTING COMPOUND, FLEXIBLE
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 561, Epoxy Film, Assembly LOCTITE® ABLESTIK 561 is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561 adhesive can be debonded by heating
- Dielectric Constant (Relative Permittivity): 0.0
- Thermal Conductivity: 0.3000 W/m-K
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Supplier: DigiKey
Description: EZ SAND FLEXIBLE PARTS REPAIR, 0
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ECF 561, Epoxy Film, Adhesive Film LOCTITE® ABLESTIK ECF 561 is designed for bonding materials with mismatched coefficients of thermal expansion. Electrically conductive Flexible Removable
- Thermal Conductivity: 1.6 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK CF 3366, Epoxy Film, Assembly LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme
- Features: Thermal / Heat Conductive
- Thermal Conductivity: 7 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: Room temperature-cure, toughened, medium viscosity, industrial grade structural epoxy adhesive with a medium working life. LOCTITE® EA E-40FL is a gray, opaque, room temperature-cure, toughened, medium viscosity, industrial grade structural epoxy adhesive with a medium
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Rubber / Elastomer, Wood / Wood Product
- Viscosity: 70000 cP
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-FRP™ is a flexible version of our G6E-P™ general purpose epoxy. G6E-FRP™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Flexible / Dampening
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 248 F
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-FXSG™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG™ is well suited for bonding of dissimilar
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Flexible / Dampening
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 320 F
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-FXNS™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS™ is developed based on advanced proprietary
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Flexible / Dampening
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 302 F
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Supplier: Ellsworth Adhesives
Description: ResinLab Armstrong™ Epoxy Resin Adhesive C-4 is a two component epoxy that is used to bond glass, thermoplastics, concrete, ceramics, and metals. It has the ability to have a flexible or rigid bond depending on the mix ratio. It offers excellent chemical and solvent
- Cure Type / Technology: Two Component System
- Elongation: 5.7 to 8.8 %
- Industry: Aerospace, Photonics / Optoelectronics
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST EE 4186 Epoxy Adhesive Resin Tan is a two component cure epoxy system resistant to thermal and mechanical shock. It is flexible and used in the assembly of transformers and rotating parts where high temperatures are expected. 1 gal Can.
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 9950 psi
- Viscosity: 150000 cP
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Supplier: DigiKey
Description: OUR 3M EZ SAND FLEXIBLE PART
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Supplier: Ellsworth Adhesives
Description: ResinLab Armstrong™ Epoxy Resin Adhesive A-12 is a two component epoxy that is used on hard to bond surfaces such as plastic, wood, ceramics, and metals. It has the ability to have a flexible or rigid bond depending on the mix ratio. 1:1 Ratio. 50 mL Mixpac Cartridge.
- Cure Type / Technology: Two Component System
- Elongation: 6 to 30 %
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Wood / Wood Product
- Tensile Strength (Break): 2500 to 5000 psi
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Supplier: Ellsworth Adhesives
Description: ResinLab Armstrong™ A-12 Epoxy Adhesive is a two component epoxy that is used on hard-to-bond surfaces such as plastic, wood, ceramics, and metals. It has the ability to have a flexible or rigid bond depending on the mix ratio. Part A (Resin): 60 g Tube, Part B
- Cure Type / Technology: Two Component System
- Elongation: 6 to 30 %
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Wood / Wood Product
- Tensile Strength (Break): 2500 to 5000 psi
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Featured Products Top
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Two part epoxy, Master Bond EP88FL, is a low viscosity, optically clear system featuring good flexibility for high performance bonding, coating, sealing and potting. It is easy to use, with a mixing ratio of one to one by weight or volume. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Streamline your electronics manufacturing with 3M™ Scotch-Weld™ 6101 and 6102 one-part epoxies. These fast-curing, no-mix adhesives deliver quick, energy-efficient bonding for sensitive electronics. Ideal for plastics, metals, and composites, they create strong, flexible, and water (read more)
Browse Epoxy Adhesives Datasheets for Ellsworth Adhesives -
Easypoxy®product range of adhesives for industrial applications are versatile epoxy systems that can bond a wide variety of materials. Epoxylite® Hi-Temp adhesives and potting materials have been used in the aerospace industry since the (read more)
Browse Epoxy Adhesives Datasheets for ELANTAS North America LLC -
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm. The adhesive can also undergo a secondary heat curing for (read more)
Browse UV Curing Adhesives Datasheets for Master Bond, Inc. -
controllers, drive systems, and power units. Thermal potting adhesives are typically two-component composite materials based on silicone, epoxy, or polyurethane resins, filled with high thermal conductivity powders. These materials offer excellent (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Fluon+™ PFA EA-2000 Adhesive Resins Serve as PCB Coatings to Speed Up Communication Rates in Autonomous Vehicles By 2025, it is projected that the global market (read more)
Browse Resins and Compounds Datasheets for AGC Chemicals Americas, Inc. -
, which can cause malfunction and premature failure such as vibration, shock, and stress caused by temperature fluctuation during thermal cycling. Material options for electronic protection include silicones, epoxies, polyurethanes, and other various polymers. Silicones are extremely durable (read more)
Browse Conformal Coatings Datasheets for CHT USA Inc. -
continuous raised ridge to assist in securing flexible ducting. An integral white epoxy powder-coated steel grille with 62% open area to promote proper airflow an protect the filter element. About Envirco As Innovators in (read more)
Browse Fans and Blowers (industrial) Datasheets for Envirco -
Gripper/Grabber base pattern, doubling the adhesive surface area compared to hollow markers. Compatible with factory-applied butyl pads, epoxy, or hot-melt bitumen, these markers stay put long after installation. Planning Ahead Winter may pause (read more)
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As a silicone, MasterSil 910Med delivers high flexibility and has an elongation of 400-600%. This imparts reliable thermal cycling and mechanical shock resistance. Bond strength to metals, composites, glass ceramics, rubbers, plastics and other silicone substrates is excellent. It is serviceable (read more)
Browse Silicone Adhesives and Sealants Datasheets for Master Bond, Inc.
Conduct Research Top
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Which is Stronger, Epoxy or Resin?
Epoxy is a material that consists of two parts: a resin and a hardener. When these two parts are mixed, they create a strong, durable, and flexible material that can be used for various purposes. Epoxy is widely used in the manufacturing industry, as it can be used to create strong and lightweight
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Optical Transmission Properties of Adhesives
of wavelengths ranging from 400 to 3000 nm for these adhesives: EP30, MasterSil 151, MB600 and UV15. EP30 shows very good optical clarity with superior light transmission when compared to many other epoxies. It is a low viscosity, two part epoxy, widely used for bonding, coating, sealing and casting
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Best top 10 optical bonding adhesive manufacturers in china with high refractive index epoxy adhesive glue for electronics and automotive displays
liquid optically clear adhesives or optically clear resin for this. They offer design flexibility and can stay clear even as time passes.
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The Importance of Quality Control in Electronic Assembly Adhesive Selection
Epoxies are commonly used in electronic assembly due to their high strength and resistance to chemicals and temperature. They are ideal for bonding metals, ceramics, and plastics. Acrylics are known for their fast curing time and excellent adhesion to a variety of substrates, including metals
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Importance of Hardness Testing
Measuring hardness is a simple yet powerful test to ensure proper curing and evaluate the performance of adhesive materials. The hardness scales for epoxy and silicone formulations range from rigid to flexible. Commonly used hardness scales are A and D. Shore A is used for softer materials, whereas
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Handbook of Adhesives and Sealants, Second Edition > BONDING AND SEALING SPECIFIC SUBSTRATES
These adhesives include polyvinyl butyl phenolic butyral, phenolic nitrile, neoprene, polysulfide, silicone, vinyl acetate, and flexible epoxy adhesives .
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Uses of Epoxy Resins
Technique (3) has been developed to a practical scale in Italy, where small railway insulators are being made from a polyester extruded rod core with PTFE sheds sealed to the core with a flexible epoxy adhesive .
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Flexible epoxy adhesive
Flexible epoxy adhesive .
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Use of Sucrose‐based Epoxy Formulations and Cellulosic Fibers in the Design, Preparation, and Screening of New Composite Insulation Materials
Flexible Epoxy Adhesive Formulations and Characterization .
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A Modified Pressure Plate Apparatus
Klute (1986) suggested that the ceramic plate could be mounted with flexible epoxy adhesive in the acrylic backing.
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Evaluation of thermally conductive adhesives for bonding heat sinks to electronic packages
The results of this testing shows that the flexible epoxy adhesive is a excellent choice for applications where the adherends have a large mismatch in CTE.
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Handbook of Adhesives and Sealants, Second Edition > STRESS AND JOINT DESIGN
Tough, flexible epoxy adhesives that are specifically formulated for high peel stress resistance could provide peel strength values in the range of 25 to 50 piw.
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Physical Properties of Polymers Handbook
R. D. Hermansen, Room-Temperature Stable, One-Component, Thermally-Conductive, Flexible Epoxy Adhesives , EP 0 754 741 B1 (2001).
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Thiol modification of difunctional castor oil and its utility as room temperature setting elastomeric material
The effect of increased tensile strength and elon- gation up to 50%addition of CODT in synpol200epoxyresin indicate that these combinations may find uses as flexible epoxy adhesives , coatings, as water- proofing materials, potting, laminates, etc.
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Totem Pole and House Post Conservation
A flexible epoxy adhesive , mixed with micro-balloons and fumed silica, secured the new repairs and loose mortise and tenon joints.