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Supplier: Epoxies Etc...
Description: 10-3008 is a filled, high performance structural epoxy adhesive. 10-3008 is a flexible adhesive with outstanding lap shear and peel strength. It is a great choice for bonding substrates of differing coefficients of thermal expansion. 10-3008 is also an excellent
- Viscosity: 96,000 cP
- Tensile Strength (Break): 2,700 to 3,200 psi
- Features: Epoxy (EP), Filled
- Industry: OEM / Industrial
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Supplier: Epoxies Etc...
Description: 10-3000 is a clear 2 part flexible adhesive. 10-3000 is water clear and its low viscosity allows maximum penetration of substrates. Its flexibility maintains a tenacious bond on parts with widely differing coefficients of expansion. 10-3000 cures at room temperature or can be quickly
- Viscosity: 650 cP
- Substrate Compatibility: Ceramic / Glass, Dissimilar Substrates, Metal, Plastic
- Industry: Electronics, OEM / Industrial
- Features: Epoxy (EP), Liquid, Other, Unfilled
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Supplier: Epoxy Technology
Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs. More recently, solar cells require our UV curing resin
- Viscosity: 250 to 325 cP
- Use Temperature: 482 F
- Coeff. of Thermal Expansion (CTE): 37.22222222222222 to 111.66666666666666 µin/in-F
- Dielectric Constant (Relative Permittivity): 5.23
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Supplier: Epoxies Etc...
Description: 10-3003 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3003 is also very safe to use due to the absence of harmful solvents and toxic chemicals in the
- Viscosity: 15,000 cP
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 0.4326837 W/m-K
- Tensile Strength (Break): 10,500 psi
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Supplier: Protavic America, Inc.
Description: Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities.Passes NASA outgassing requirements.
- Viscosity: 40,000 cP
- Use Temperature: -55 to 140 F
- Tensile Strength (Break): 4,500 psi
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Epoxies Etc...
Description: 10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding
- Viscosity: 800 to 2,000 cP
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 0.4326837 W/m-K
- Tensile Strength (Break): 10,500 psi
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive DP125 is a flexible, gray, two-part epoxy. 1:1 mix ratio, 25 minute work life and handling strength in 2.5 hours. 3M™ Scotch-Weld™ EPX™ 200 mL applicator. 3M™ Scotch-Weld™ Epoxy Adhesive DP125 has medium viscosity that allows
- Viscosity: 2,000 to 75,000 cP
- Thermal Conductivity: 0.1505739276 to 0.1540353972 W/m-K
- Tensile Strength (Break): 2,500 to 3,300 psi
- Elongation: 120 to 150 %
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Supplier: Protavic America, Inc.
Description: PVIC ACE24511 electrically conductive die attach adhesive is specially designed for tantalum condenser application. This single component, fast cure adhesive also can be snap cured in hot plate or in-line snap cure system and its excellent electrical conductivity and flexibility are
- Viscosity: 18,180 cP
- Thermal Conductivity: 8.61 W/m-K
- Features: Die Bonding Adhesive / Compound, Electrically Conductive, Epoxy (EP), Filled, Flexible / Dampening, Liquid, Thermal / Heat Conductive
- Industry: Electrical Power / HV, Electronics, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Clear unfilled epoxy in a one-part system that can be stored at room temperature for up to 6 months. This material is excellent for ferrite and ceramic bonding applications. Non-hazardous and safe to use. Requires heat assist to cure.
- Viscosity: 5,000 cP
- Use Temperature: -55 to 175 F
- Tensile Strength (Break): 2,600 psi
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Accuris
Description: KIT, ADHESIVE, EPOXY, FLEXIBLE
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Supplier: Allied Electronics, Inc.
Description: Clear Epoxy Adhesive 4 minute worklife High peel strength Flexible 1:1 mix ratio Epoxy adhesive DP-105 clear is supplied in larger containers. DP-105 clear is a fast setting, very flexible 1:1 mix ratio epoxy adhesive⁄sealant.
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
- Elongation: 5 %
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Supplier: Accuris
Description: BINDER, ADHESIVE, EPOXY RESIN, FLEXIBLE
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Supplier: Accuris
Description: ADHESIVE, EPOXY, MODIFIED, FLEXIBLE, TWO COMPONENT
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Standards and Technical Documents - ADHESIVE, EPOXY, MODIFIED, FLEXIBLE TWO COMPONENT -- MIL-A-46864Supplier: Accuris
Description: ADHESIVE, EPOXY, MODIFIED, FLEXIBLE TWO COMPONENT
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Supplier: Techsil Limited
Description: Techsil® EP20860 is a two part, rapid curing epoxy adhesive that cures at room temperature with low shrinkage and forms an ultra-clear bond line. Techsil® EP20860 offers a flexible and impact resistant bond that is resistant to a wide range of chemicals with excellent electrical
- Features: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST EE 4186 Epoxy Adhesive Resin Tan is a two component cure epoxy system resistant to thermal and mechanical shock. It is flexible and used in the assembly of transformers and rotating parts where high temperatures are expected. 1 gal Can.
- Viscosity: 150,000 cP
- Tensile Strength (Break): 9,950 psi
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 45 Clear, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, unfilled, epoxy adhesive system that is used for general purpose, assembly applications. It offers controlled flexibility, non-conductive properties, and is easy to use. 29 lb Pail.
- Viscosity: 20,000 to 21,000 cP
- Dielectric Strength: 406.40000000000083 kV/in
- Features: Epoxy (EP)
- Substrate Compatibility: Metal, Plastic
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 45 Clear, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, unfilled, epoxy adhesive system that is used for general purpose, assembly applications. It offers controlled flexibility, non-conductive properties, and is easy to use. 8 lb Pail.
- Viscosity: 36,000 to 37,000 cP
- Thermal Conductivity: 0.35 W/m-K
- Dielectric Strength: 355.60000000000076 kV/in
- Features: Epoxy (EP)
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Supplier: Master Bond, Inc.
Description: Also, the highly flexible EP21TDCNFL is easier to remove than most nickel epoxies, making it well suited for repair type applications. Parts A and B are both colored nickel. Master Bond EP21TDCNFL adhesive is widely used in the electronic, electrical, computer, semiconductor,
- Use Temperature: -452 to 250 F
- Thermal Conductivity: 1.441 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 6,000 psi
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive epoxy systems, the
- Use Temperature: -100 to 275 F
- Thermal Conductivity: 1.585 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 6,000 to 6,500 psi
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy
- Use Temperature: -452 to 250 F
- Thermal Conductivity: 1.585 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 6,000 to 6,500 psi
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Supplier: Ellsworth Adhesives
Description: ResinLab Armstrong™ Epoxy Adhesive A-12T is a two component epoxy that is used on hard to bond surfaces such as plastic, wood, ceramics, rubber, and metals. It has the ability to have a flexible or rigid bond depending on the mix ratio. Part A: 45 g Jar, Part B: 36.67 g
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic, Wood / Wood Product
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Description: LOCTITE® ABLESTIK ECF 561 is designed for bonding materials with mismatched coefficients of thermal expansion. Electrically conductive Flexible Removable
- Thermal Conductivity: 1.6 W/m-K
- Features: Epoxy (EP)
- Industry: OEM / Industrial
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Allied Electronics, Inc.
Description: components is a factor. 3M™ Scotch-Weld™ epoxy adhesive DP110 translucent and gray are two-part epoxy adhesives which combine a fast cure with flexibility.
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Supplier: Allied Electronics, Inc.
Description: components is a factor. 3M™ Scotch-Weld™ epoxy adhesive DP110 translucent and gray are two-part epoxy adhesives which combine a fast cure with flexibility.
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Supplier: Epoxy Technology
Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs. More recently, solar cells require our UV curing resin
- Viscosity: 450 to 850 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 43.333333333333336 to 123.33333333333333 µin/in-F
- Dielectric Constant (Relative Permittivity): 8.23
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Supplier: Newark, An Avnet Company
Description: Epoxy Potting Compound, Flexible (Ratio 1:1) / 57 fl oz Kit
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Supplier: ASTM International
Description: The specification covers a two-part modified epoxy paste adhesive for bonding metallic and nonmetallic materials. The adhesive should be suitable for forming bonds that can withstand environmental exposure to a certain temperature range when exposed to an expected combination of
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Supplier: ASTM International
Description: The specification covers a two-part modified epoxy paste adhesive for bonding metallic and nonmetallic materials. The adhesive should be suitable for forming bonds that can withstand environmental exposure to a certain temperature range when exposed to an expected combination of
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-FRP™ is a flexible version of our G6E-P™ general purpose epoxy. G6E-FRP™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components
- Viscosity: 285,000 to 295,000 cP
- Use Temperature: 77 to 248 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Flexible / Dampening, Grease / Paste, Other, Specialty / Other
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Supplier: Graphene Laboratories, Inc.
Description: curing. Uses for G6E-FXNS™ epoxy include flexible circuits, medical sensor assembly and repair, etc. FEATURES: · Flexible (after curing) · Silver-Carbon Filled (Non-Magnetic) · Very Good Electrical Conductivity · Resistant to Temperature Variations · Impact / Shock Resistant ·
- Viscosity: 210,000 to 220,000 cP
- Use Temperature: 302 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Flexible / Dampening, Grease / Paste, Other, Specialty / Other
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Supplier: Graphene Laboratories, Inc.
Description: durability, fatigue and crack resistance along with low electrical resistance. A heating oven is strongly recommended for curing. Uses for G6E-FXSG™ epoxy include flexible circuits, medical sensor assembly and repair, etc. FEATURES: · Flexible (after curing) · Silver-Graphene
- Viscosity: 110,000 to 125,000 cP
- Use Temperature: 77 to 320 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Flexible / Dampening, Grease / Paste, Other, Specialty / Other
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Supplier: Pexco
Description: SuperBundy™ Adhesive is perfect for permanently adhering larger objects like channelizer posts and curb sections (except the City Post Model GD). This non-toxic, zero-VOC adhesive is designed for use in areas that are subject to high-stress impacts. SuperBundy has resilient
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Supplier: DigiKey
Description: BLACK FLEXIBLE EPOXY
- Features: Epoxy (EP)
Find Suppliers by Category Top
Featured Products Top
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Two part epoxy, Master Bond EP88FL, is a low viscosity, optically clear system featuring good flexibility for high performance bonding, coating, sealing and potting. It is easy to use, with a mixing ratio of one to one by weight or volume. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Streamline your electronics manufacturing with 3M™ Scotch-Weld™ 6101 and 6102 one-part epoxies. These fast-curing, no-mix adhesives deliver quick, energy-efficient bonding for sensitive electronics. Ideal for plastics, metals, and composites, they create strong, flexible, and water (read more)
Browse Epoxy Adhesives Datasheets for Ellsworth Adhesives -
Easypoxy®product range of adhesives for industrial applications are versatile epoxy systems that can bond a wide variety of materials. Epoxylite® Hi-Temp adhesives and potting materials have been used in the aerospace industry since the (read more)
Browse Epoxy Adhesives Datasheets for ELANTAS North America LLC -
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm. The adhesive can also undergo a secondary heat curing for (read more)
Browse UV Curing Adhesives Datasheets for Master Bond, Inc. -
controllers, drive systems, and power units. Thermal potting adhesives are typically two-component composite materials based on silicone, epoxy, or polyurethane resins, filled with high thermal conductivity powders. These materials offer excellent (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Fluon+™ PFA EA-2000 Adhesive Resins Serve as PCB Coatings to Speed Up Communication Rates in Autonomous Vehicles By 2025, it is projected that the global market (read more)
Browse Resins and Compounds Datasheets for AGC Chemicals Americas, Inc. -
, which can cause malfunction and premature failure such as vibration, shock, and stress caused by temperature fluctuation during thermal cycling. Material options for electronic protection include silicones, epoxies, polyurethanes, and other various polymers. Silicones are extremely durable (read more)
Browse Conformal Coatings Datasheets for CHT USA Inc. -
continuous raised ridge to assist in securing flexible ducting. An integral white epoxy powder-coated steel grille with 62% open area to promote proper airflow an protect the filter element. About Envirco As Innovators in (read more)
Browse Fans and Blowers (industrial) Datasheets for Envirco -
the adhesive choice which fall into three groups: cyanoacrylate, silicone, and epoxy based. Cold bonding does not use dies instead the ends are pressed together by hand. It is generally used for low volume projects because it is more labor intensive and expensive than the other methods. In (read more)
Browse Edge Trims and Trim Seals Datasheets for Device Technologies, Inc. -
Gripper/Grabber base pattern, doubling the adhesive surface area compared to hollow markers. Compatible with factory-applied butyl pads, epoxy, or hot-melt bitumen, these markers stay put long after installation. Planning Ahead Winter may pause (read more)
Browse Traffic Safety Equipment Datasheets for Pexco
Conduct Research Top
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Which is Stronger, Epoxy or Resin?
Epoxy is a material that consists of two parts: a resin and a hardener. When these two parts are mixed, they create a strong, durable, and flexible material that can be used for various purposes. Epoxy is widely used in the manufacturing industry, as it can be used to create strong and lightweight
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Optical Transmission Properties of Adhesives
of wavelengths ranging from 400 to 3000 nm for these adhesives: EP30, MasterSil 151, MB600 and UV15. EP30 shows very good optical clarity with superior light transmission when compared to many other epoxies. It is a low viscosity, two part epoxy, widely used for bonding, coating, sealing and casting
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Best top 10 optical bonding adhesive manufacturers in china with high refractive index epoxy adhesive glue for electronics and automotive displays
liquid optically clear adhesives or optically clear resin for this. They offer design flexibility and can stay clear even as time passes.
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The Importance of Quality Control in Electronic Assembly Adhesive Selection
Epoxies are commonly used in electronic assembly due to their high strength and resistance to chemicals and temperature. They are ideal for bonding metals, ceramics, and plastics. Acrylics are known for their fast curing time and excellent adhesion to a variety of substrates, including metals
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Importance of Hardness Testing
Measuring hardness is a simple yet powerful test to ensure proper curing and evaluate the performance of adhesive materials. The hardness scales for epoxy and silicone formulations range from rigid to flexible. Commonly used hardness scales are A and D. Shore A is used for softer materials, whereas
More Information Top
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Handbook of Adhesives and Sealants, Second Edition > BONDING AND SEALING SPECIFIC SUBSTRATES
These adhesives include polyvinyl butyl phenolic butyral, phenolic nitrile, neoprene, polysulfide, silicone, vinyl acetate, and flexible epoxy adhesives .
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Uses of Epoxy Resins
Technique (3) has been developed to a practical scale in Italy, where small railway insulators are being made from a polyester extruded rod core with PTFE sheds sealed to the core with a flexible epoxy adhesive .
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Flexible epoxy adhesive
Flexible epoxy adhesive .
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Use of Sucrose‐based Epoxy Formulations and Cellulosic Fibers in the Design, Preparation, and Screening of New Composite Insulation Materials
Flexible Epoxy Adhesive Formulations and Characterization .
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A Modified Pressure Plate Apparatus
Klute (1986) suggested that the ceramic plate could be mounted with flexible epoxy adhesive in the acrylic backing.
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Evaluation of thermally conductive adhesives for bonding heat sinks to electronic packages
The results of this testing shows that the flexible epoxy adhesive is a excellent choice for applications where the adherends have a large mismatch in CTE.
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Handbook of Adhesives and Sealants, Second Edition > STRESS AND JOINT DESIGN
Tough, flexible epoxy adhesives that are specifically formulated for high peel stress resistance could provide peel strength values in the range of 25 to 50 piw.
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Physical Properties of Polymers Handbook
R. D. Hermansen, Room-Temperature Stable, One-Component, Thermally-Conductive, Flexible Epoxy Adhesives , EP 0 754 741 B1 (2001).
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Thiol modification of difunctional castor oil and its utility as room temperature setting elastomeric material
The effect of increased tensile strength and elon- gation up to 50%addition of CODT in synpol200epoxyresin indicate that these combinations may find uses as flexible epoxy adhesives , coatings, as water- proofing materials, potting, laminates, etc.
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Totem Pole and House Post Conservation
A flexible epoxy adhesive , mixed with micro-balloons and fumed silica, secured the new repairs and loose mortise and tenon joints.