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Supplier: Boyd
Description: which provides greater design flexibility. Instead, each fin is cut separately using the same tool which allows for lower tooling costs. Additionally skived heat sinks can be constructed of aluminum or copper allowing for full, one-piece copper solutions for high performance
- Device: Passive Heat Sink
- Heat Sink Fin Style: Other
- Height: 10 to 60 mm
- Length: 150 to 200 mm
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Supplier: Ecopower Inc.
Description: ThermaCool™ Heat Sinks have been sized for each of our standard products and to accommodate a range of desired operating conditions. Proper heat sink sizing is determined by a number of factors, including those listed below: Power Dissipated (Watts) - Determined by the
- Device: Passive Heat Sink
- Heat Sink Fin Style: Straight Fin
- Height: 0.0381 mm
- Mounting: Mounting Holes
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Supplier: Boyd
Description: For high volume production, Aavid zipper fins are the most cost efficient method for high fin density heat sinks. These fins are made from a stamped material, typically aluminum or copper, and are folded into shape with interlocking grooves. The fins are then typically soldered,
- Device: Passive Heat Sink
- Heat Sink Fin Style: Other
- Material: Aluminum, Copper
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Supplier: Boyd
Description: The Aavid portfolio of folded fins includes over 3,000 different configurations that are manufactured for high heat transfer. Folded fins provide more surface area and design flexibility than extruded heat sinks and other fabrications. These fins can be purchased
- Device: Passive Heat Sink
- Heat Sink Fin Style: Folded Fin
- Height: 0.7600 to 50.8 mm
- Material: Aluminum, Copper, Mixed Material, Other Materials
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Supplier: Boyd
Description: for mounting holes, screws or rivets while optimizing the contact and thermal efficiency of the heat sink. Max Clips™ are quick, robust attachments that save on labor and hardware costs and increase design flexibility. Max Clips apply consistent, uniform pressure at the
- Device: Passive Heat Sink
- Heat Sink Fin Style: Straight Fin
- Height: 5.1 to 48 mm
- Length: 16.5 to 37.4 mm
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Supplier: Ohmite Manufacturing Co.
Description: Ohmite introduces the powerful B60/ C60 series heatsink with cam clip (Pat. Pending) or custom mounting. The B60/C60 series offers flexibility, high performance, and a compact heat sink design with exchangeable cam clip system for TO-247 and TO-264 devices. The B60 series can be
- Device: Passive Heat Sink
- Height: 41 mm
- Length: 75 mm
- Material: Aluminum, Mixed Material
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Supplier: Richardson RFPD
Description: joints as they are formed. The vacuum-brazing process creates an exceptionally strong joint and does not require any brazing flux. The vacuum-brazed cold plate has unparalleled flexibility in its design, as it is not limited by the bending radius limitations of Wakefield Thermal standard tube
- Device: Liquid Cooler/Cold Plate
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Supplier: Flexible Circuit Technologies, Inc.
Description: selected to provide the desired resistance value based on the supply voltage. Benefits: Flexible heaters offer very good heat transfer to the heat sink in a very low profile and low mass package. Because they are flexible, they can also conform to, and heat,
- Heater Style: Etched Foil Elements
- Sleeve (Sheath) Material: Polyimide
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Supplier: RS Components, Ltd.
Description: Ohmite M series high performance, configurable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides easy assembly, large surface area and small footprint. It is the ideal type of heat sink for high
- Height: 38.6 mm
- Length: 27 mm
- Material: Aluminum
- Mounting: Clips, Other
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Supplier: RS Components, Ltd.
Description: Ohmite M series high performance, configurable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides easy assembly, large surface area and small footprint. It is the ideal type of heat sink for high
- Height: 38.6 mm
- Length: 55 mm
- Material: Aluminum
- Mounting: Clips, Other
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Supplier: RS Components, Ltd.
Description: Dimensions = 58 x 32 x 46.3mm Mounting = Clip Series = C40 Surface Area = 41180mm² Special Features = Compact Heat Sink with Cam Clip, Flexible, High Performance Material = Aluminium
- Height: 46.3 mm
- Length: 58 mm
- Material: Aluminum
- Mounting: Clips, Other
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Supplier: RS Components, Ltd.
Description: Dimensions = 58 x 32 x 46.3mm Mounting = Clip Colour = Black Special Features = Compact Heat Sink with Cam Clip, Flexible, High Performance Finish = Black Anodized Material = Aluminium
- Height: 46.3 mm
- Length: 58 mm
- Material: Aluminum
- Mounting: Clips, Other
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Supplier: Xoxide
Description: Features Compatible with mainstream north bridge. Dual sintered powder heatpipes, high performance. Flexible clips to ensure wide compatibility. All copper fins dissipate heat very quickly. Modding looking
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Description: composite materials for heat sinks, die tabs and heat spreaders provide our customers with significant advantages over more conventional laminate or MMC materials. DiaCoolTM materials deliver a device-friendly coefficient of thermal expansion (CTE) and very high thermal
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Supplier: Xoxide
Description: Features Compatible with mainstream north bridge. Adding a 40mm fan to the heatsink to achieve better cooling performance. Flexible clips to ensure wide compatibility. Application For Compatible with mainstream north bridge
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Supplier: Corsair Memory
Description: cooling efficiency and a custom-designed fan ensure operation that's both cooler and quieter than most stock CPU fans. The small form factor and flexible tubing allow the Hydro Series H40 to fit in most PC gaming systems. It works with most modern AMD and Intel sockets, and the illustrated
- Device: Liquid Cooler/Cold Plate
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Supplier: Xoxide
Description: 2.5" HDD/SDD into 3.5" bays. Efficiency High efficiency. Cooling and noise reduction due to 2 mm Heatsink structure with Thermal Conductive Sheets. Flexible Mounting Adjustment Position of Anti-Vibration Screw Blocks can be adjusted by sliding to fit
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Supplier: Xoxide
Description: cooling for your gaming rig, take a look at the H40. Quiet, Compact and Compatible. Liquid cooling efficiency and a custom-designed fan ensure operation that's both cooler and quieter than most stock CPU fans. The small form factor and flexible tubing allow the Hydro Series H40 to
- Device: Cold Plate
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Supplier: Ohmite Manufacturing Co.
Description: Ohmite introduces the CR series heatsink with cam clip (Pat. Pending). The CR series offers flexibility, high performance, and is comparable to popular Aavid MAX-clip heatsinks. The cam clip system for TO-247 and TO-264 devices is proprietary and provides tool or fixture free assembly. The CR
- Device: Passive Heat Sink
- Heat Sink Fin Style: Other
- Height: 50.04 to 74.93 mm
- Length: 25 to 75 mm
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Description: standards. ? Excellent flexibility, resilience, and thermal stability. ?Applications? ? 5G Base Station RRU ? Chips ? Capacitors ? Memory/Graphics Memory Particles ? Hard Drives ? Control Boards ? Shunts ? Relays
- Dielectric Strength: 0.0025 kV/in
- Elongation: 10 %
- Features: Thermal / Heat Conductive
- Industry: Electronics
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Description: standards. ? Excellent flexibility, resilience, and thermal stability. ?Applications? ? 5G Base Station RRU ? Chips ? Capacitors ? Memory/Graphics Memory Particles ? Hard Drives ? Control Boards ? Shunts ? Relays
- Dielectric Strength: 0.0025 kV/in
- Elongation: 20 %
- Features: Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Benchmark Thermal Corp.
Description: bonded or cemented to heat sinks or other parts to be heated. They can be virtually any size, shape and configuration and are the ideal solution for many low- and medium-temperature applications that do not conform to standard heater shapes, sizes and dimensions. Custom products
- AC Voltage Required: 115 volts
- Length: 12 to 48 inch
- Maximum Operating (Sheath) Temperature: -70 to 450 F
- Sleeve (Sheath) Material: Rubber
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Supplier: Benchmark Thermal Corp.
Description: bonded or cemented to heat sinks or other parts to be heated. They can be virtually any size, shape and configuration and are the ideal solution for many low- and medium-temperature applications that do not conform to standard heater shapes, sizes and dimensions. Custom products
- AC Voltage Required: 115 volts
- Maximum Operating (Sheath) Temperature: -70 to 450 F
- Sleeve (Sheath) Material: Rubber
- Watt Density: 2.5 to 10 W/in²
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Supplier: Minco
Description: ) Custom resistance options up to 25 /in² (3.9 /cm²) Factory forming techniques offer three dimensional packaging capabilities Integral temperature sensors Custom profiled heat density and mechanical clamping offers uniform heat sink temperature which can improve processing
- AC Voltage Required: 18 volts
- Length: 8 inch
- Maximum Operating (Sheath) Temperature: -238 to 1112 F
- Watt Density: 0.7290 W/in²
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Supplier: Minco
Description: capability allows higher wattage levels Optional custom profiled heat density creates a uniform heat sink temperature which can improve processing yields High temperature capability to 235°C (455°F) Custom shapes and sizes to 22" x 90" (560 x 2285 mm) Custom
- AC Voltage Required: 115 volts
- Length: 6 inch
- Maximum Operating (Sheath) Temperature: -26 to 212 F
- Watt Density: 10 W/in²
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 32.78 to 120 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.42
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Supplier: Thermal Circuits, Inc.
Description: adhesives that are matched to the dielectric’s physical and chemical properties; and element alloys that have been developed to increase capabilities at lower costs. Frequently, Thermal Circuits develops its heater components into turn-key assemblies with added value extensions including heat
- Industry Served: Aerospace, Automotive, Electronics, Food and Beverage, General Industrial, Medical, Military, Other
- Location: North America, United States Only, Northeast US Only
- Services: Design Assistance
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Supplier: Birk Manufacturing, Inc.
Description: Birk's silicone rubber heaters are rugged, flexible and chemical-resistant. Our rugged flexible heaters can be combined with many components. Thermostats, fuses, thermocouples, RTDs, thermistors, connectors, heat sinks, wiring harnesses, motors and any other desired
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Supplier: OMEGA Engineering, Inc.
Description: bare 3-wire leads as a standard configuration (connector optional), it can be customized for use in a wide variety of applications. The sensor can be easily applied with its selfadhesive backing, or positioned permanently with OMEGABOND cements. Use the SA1-RTD to monitor chip, heat
- Bare or Insulated Lead Wires: Yes
- Basic Element Used: RTD
- Element Configuration: Single Element
- Probe Configuration: Flexible Probe, Flat/Ribbon
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 563K, Epoxy Film, Assembly LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high strength
- Features: Thermal / Heat Conductive
- Thermal Conductivity: 1.1 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: temperatures – maintains adhesion strength up to temperatures as high as 175°C; extreme environment capable High electrical and thermal conductivity – superior grounding and minimum thermal resistance to heat sink Compatible with temperature
- Features: Thermal / Heat Conductive
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Description: LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high strength over a wider temperature range than is
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
- Thermal Conductivity: 1.1 W/m-K
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Description: and 80°C. ? Flexible Application, allows easy integration into diverse products and surfaces. ? Complies with RoHS, Halogen-Free, and REACH environmental and safety standards. ?Applications? ? Bonding heat sinks to electronic components ? Attaching power transistors to
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Description: temperature and 80°C. ? Flexible Application, allows easy integration into diverse products and surfaces. ? Complies with RoHS, Halogen-Free, and REACH environmental and safety standards. ?Applications? ? Bonding heat sinks to electronic components ? Attaching power transistors
- Carrier / Backing Material: Acrylic / Acrylate, Plastic / Polymer
- Dielectric Strength: 4.00E6 V/m
- Features: Other
- Peel Strength / Adhesion: 4.03 lbs/in
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Supplier: Henkel Corporation - Industrial
Description: substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion. Low temperature cure Flexible Good adhesion
- Adhesive: Epoxy
- Backing: Specialty / Other
- Thickness: 0.0020 inches
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Supplier: Tekscan, Inc.
Description: unobtrusively measure pressure distribution in a variety of applications. Molds Gaskets Heat Sinks Sealing Bars Pinch Rollers & Nips
- Category of Device: Sensor / Transducer
- Force Measured: Compression
- Operating Temperature: 400 F
- Sensor Output: Digital
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Supplier: ToneCooling Technology Co., Ltd
Description: dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat
- Device: Liquid Cooler/Cold Plate
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Supplier: Visual Sound, Inc.
Description: 600W/ch stereo or 1200W of 70V mono power. Reliability - Massive power toroid and heat sinks; heavy 14-gauge chassis; patented Back-Slope? AC voltage stabilization; Clip limiters, DC voltage, over-current, and thermal protection circuits. *3 modes of operation: Stereo (4-ohm), Dual
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Supplier: Visual Sound, Inc.
Description: 600W/ch stereo or 1200W of 70V mono power. Reliability - Massive power toroid and heat sinks; heavy 14-gauge chassis; patented Back-Slope? AC voltage stabilization; Clip limiters, DC voltage, over-current, and thermal protection circuits. *3 modes of operation: Stereo (4-ohm), Dual
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Supplier: Richardson RFPD
Description: effect that can reduce the external thermal resistance by up to 20 %, thus making it possible to increase the current by up to 15 % or reduce the chip temperature by 15...20 K. If these advantages are not made use of, less complex heat sink designs than those in sixpacks are possible.
- Package Type: Other
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Supplier: MacDermid Alpha Electronics Solutions
Description: Nano-silver paste for large-area attachments (module to baseplate, heat sink) with a thick, reliable bond line. Product Overview ALPHA Argomax 2047 is a nano-silver sintering paste developed to meet the growing demand for large-area attachment applications, such as module
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Supplier: Birk Manufacturing, Inc.
Description: heat sinks to provide superior heat transfer. In many cases, Birk's Kapton® film heaters are designed to provide immediate integration into assemblies, which include sensors, heat sinks, fuses, probes and electronics. Many of these products are completely assembled
- Fuel / Energy Source: Electric
- Heater Type: Other
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Supplier: Nutfield Technology
Description: Nutfield Technology’s QS-7 Open Frame 2-Axis Scan Heads are compact and provide flexibility for mounting in OEM applications or pro ducts. The scan head includes two galvanometers with mirrors mounted in optimized XY configuration, two servo amplifiers (require mounting to heat
- Automation / Control: Windows / PC Control
- Options / Components: Galvanometer Scanner, Laser Head / Focusing Unit, Laser Optics / Beam Delivery
- Process / Operation: Laser Marking, Other
- Type: Component / Subsystem
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Description: We know that our customers need options when designing hermetic packages to protect sensitive electronics. Our thermal titanium composite packaging technology with Cu/Mo heat sinks was developed to address the evolving needs of our customers. These housings use titanium as the primary
- Materials: Other
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Supplier: Ellsworth Adhesives
Description: and flexibility make it ideal for bonding large area substrates, components and heat sinks where thermal management is critical. EG7655 exhibits reduced bond strength at 80 to 100 ºC for simple rework. Once cured the adhesive is flexible with 80 A hardness and tensile
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 750 kV/in
- Thermal Conductivity: 1.7 W/m-K
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Description: High electrical and thermal conductivity – superior grounding and minimum thermal resistance to heat sink Compatible with temperature-sensitiv e substrates and components – cures at a low temperature of 125°C Flexible – allows use of material combinations with CTE mismatches
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 11.39 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
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Supplier: Samtec Inc.
Description: of end connectors and data rate Multiple heat sink options Patent pending FireFly™ evaluation kit available. Active optical cable assembly sold separately For more information, contact
- Bending Radius: 7.5 mm
- Cable Type: Simplex, Duplex, Multifiber Cable
- Connector Type: None, MTP, Other
- Fiber Mode: Multimode
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Supplier: Canoga Perkins Corporation
Description: metallic case which serves as a heat sink for the electronics. Outdoor mounting in NEMA 4 class boxes and pedestals gives the HS8000 the flexibility needed for a wide range of deployments in power, wireless, military, utility, pipeline, security/ surveillance, highway management
- Area Network Type: Local Area Network (LAN)
- Features: Ruggedized
- Form Factor: Rack Mount
- Number of Ports: 10 #
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Supplier: Wacker Chemical Corp.
Description: /mK Low minimum bond line thickness (90-100 µm) Emphasized thermal stability in cured state Primerless adhesion to metal, Al, based heat sinks, to ceramics, FR4. Flexibility in application method superior dispensing performance, screen printability suitable for automated bonding
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 8.33 µin/in-F
- Cure Type / Technology: Single Component System
- Dielectric Strength: 279 kV/in
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Supplier: DuPont Electronics & Imaging
Description: to bond flexible circuits to rigid boards during the fabrication of rigid-flex circuits, as well as to bond stiffeners and heat sinks. Construction and Certification for Sheet Adhesive: Adhesive thickness: 12, 25, 50, 75 and 100um Certified to IPC 4203A/18
- Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
- Features: Encapsulating / Potting
- Industry: Electronics, OEM / Industrial
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Supplier: DuPont Electronics & Imaging
Description: -flex circuits, as well as to bond stiffeners and heat sinks. Construction and Certification for Sheet Adhesive: Adhesive thickness: 12, 25, 50, 75 and 100um Certified to IPC 4203A/18
- Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
- Features: Encapsulating / Potting, UL Approved
- Industry: Electronics, OEM / Industrial
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Featured Products Top
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Our Custom Black Aluminum Heat Sink is engineered to deliver superior thermal management for high-power memory modules, combining precision design with advanced materials. With compact dimensions of (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Our custom heat sinks provide superior thermal performance and precise heat management for a wide range of applications. Engineered for efficient cooling, these heat sinks are ideal for electronics that demand high thermal control and reliability. Key features include (read more)
Browse Heat Pipes Datasheets for ToneCooling Technology Co., Ltd -
of military and commercial aircraft, weapon systems, some U.S. Navy ships and NASA’s Space Shuttle fleet. Photochemical etching is a very effective solution for producing heat transfer and dissipation components that are used in applications including LED lighting, chilling systems, RF (read more)
Browse Datasheets for Conard Corporation (The) -
Flexible heaters offer very good heat transfer to the heat sink in a very low profile and low mass package. Because they are flexible, they can also conform to, and heat, irregular surfaces that other types of heaters cannot. TCR (Temperature Coefficient of Resistance) of custom heater alloys (read more)
Browse Flexible Heaters Datasheets for Flexible Circuit Technologies, Inc. -
Coolserver provides flexible cooling products engineered for data centers, high-performance computing, and industrial server environments. These solutions ensure efficient heat removal, stable operation, and prolonged component life (read more)
Browse CPU Coolers Datasheets for ToneCooling Technology Co., Ltd -
assemblies. The cured material is not self-bonding but remains flexible, allowing for a good interface between components or PCB’s and heat sinks or enclosures. They are easily applied and provide a very efficient path for heat dissipation between uneven surfaces, while removing air gaps that (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for CHT USA Inc. -
Roll Formed Heat Transfer Plates Heat transfer plates are ideally and economically produced using our roll forming processes. Critical to home and industrial heating systems, PEX is fast becoming the chosen alternative to rigid metal (read more)
Browse Datasheets for MP Metal Products -
Flexible heaters are single layer flexible circuits that utilized resistive alloys, such as Inconel and Cupro-nickel, rather than copper to form conductive paths. As electrical current is driven through the higher resistance conductors, heat is generated. Conductor width and thickness are (read more)
Browse Industrial Heaters Datasheets for Flexible Circuit Technologies, Inc. -
ideal balance of softness and rigidity, offer an innovative solution for heat management in automotive wireless chargers. Compared to metal heat sinks, thermal conductive silicone pads are lightweight, thin, and flexible, allowing them to adhere tightly to heat-generating areas for seamless (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
combine heat conduction, flexibility, and electrical insulation in one material. In wireless chargers, thermal silicone pads help bridge the gap between heat (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd.
Conduct Research Top
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
added a flexible multicore processing technology and new runtime optimizations to the latest release of PrimeTime static timing analysis tool. Heat sinks claim unparalleled cooling power Flared-pin-fin heat sinks from Cool Innovations provide an innovative alternative for natural convection
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Webb Abrasives Clog Resistant Technology
by a precise combination of backing, grit, adhesives and coating. It uses a heat-resistant adhesive that prevents grit from sinking into the adhesive during friction. This flexible adhesive also allows the grit to sweep back and forth like a broom allowing an aggressive cut. A thin clear coat of polymer
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Thermally conductive electrically insulating aromatic silicone film adhesive for the New Horizons mission
This paper describes the characterization of a thermally conductive, electrically insulating aromatic silicone film adhesive used in a flexible heat sink assembly that is part of an optical telescope aboard the planned New Horizons mission to Pluto and the Kuiper Belt.
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http://dspace.mit.edu/bitstream/handle/1721.1/76819/825771320-MIT.pdf?sequence=2
by designing a flexible heat sink , a wider range of individuals may comfortably wear the harvester.
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Evaluation of flexible Bi2Te2.5Se0.5 and Bi0.5Sb1.5Te3 thermopile generator
Flexible heat sink sheet .
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Fabrication of flexible thermopile generator
Flexible heat sink sheet .
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A cooling system for samples for studying their surfaces in ultrahigh vacuum
The carriage is connected to the platform by flexible heat sink 4, for which a copper bundle with a total cross section of ~25 mm2 is used.
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Polymer based smart flexible thermopile for power generation
Finally, the FTG is com- pleted by setting the wavy thermopile sheet between the flexible heat sink and absorber sheets.
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Dynamic Nanofin Heat Sinks
This work demonstrates the creation of dynamically controlled flexible heat sink concept by utilizing magnetophoretically pat- terned CrO2 nanoparticles within a microfluidic system.
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Direct marketing of electricity from biogas and biomethane: an economic analysis of several business models in Germany
Thus, a flexible heat sink or heat storage at the place of electricity generation is a requirement.4 In the case of biomethane feed-in, an on-site biogas storage tank is not necessary, as the upgraded biomethane is fed into the …
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Enhanced Performance Evaporative Heat Sinks for Space Applications
Ease of manufacture and operation results in a cost effective, reliable and flexible heat sink option.
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Thermal signal behaviour for air flow measurements as fundamentals to Time-of-Flight
The dimensions of the simulated heat source and the flexible heat sink are identical with the real filament and thermocouple utilised for the experiment.