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Supplier: Indium Corporation
Description: Features Excellent cleanability, residue can be removed with room temperature DI water Stencil-printable, high tack Offers high yields in BGA bumping process Halide-free with excellent solderability Wide process window Introduction WS-363 Interconnect Flux is a high viscosity
- Type: Halogen / Halide Free, Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Wave Solder Flux 1081 is a water wash organic flux suitable for all conventional tin-lead alloys. 1081 exhibits excellent solderability with low ionic residues after aqueous cleaning
- Type: Soldering Flux / Rosin
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Supplier: Allied Electronics, Inc.
Description: Features Flux is non-corrosive and halide-free Can be used for soldering with lead-free or tin/lead solders Excellent material compatibility Fast drying RoHS Compliant High thermal stability
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Supplier: Newark, An Avnet Company
Description: FLUX, SYRINGE, HALIDE FREE/NO CLEAN ROHS COMPLIANT: YES
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Supplier: Indium Corporation
Description: Indium Hi Grade Wave Solder Flux 1075 VOC-Free is a non-halide, rosin/resin free flux specifically developed for wave soldering, surface mount, mixed technology and through-hole electronic assembly.
- Features: Paste
- Type: Soldering Flux / Rosin
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Handy Flo 800 is a flux/binder system for solder alloys. These low temperature flux-binder systems are intended for soldering applications. Suitable heating methods include torch, induction, resistance, infrared, hot plate or oven, and clean-up is easily accomplished with a hot water rinse. Typical
- Melting Range: 300 to 525 F
- Features: Paste
- Type: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: flux. The glossy, even coating of the flux is durable so it can be used as a drop-in replacement in an automated assembly process. The LV-Series of flux coatings is versatile, allowing for the coating of unique geometries and sizes. The LV-Series is halide-free, meeting the ROL0
- Type: Halogen / Halide Free, Soldering Flux / Rosin
- Features: Other
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Supplier: MacDermid Alpha Electronics Solutions
Description: High-performing ORL0, halide-free, VOC-free no-clean flux for hole-fill and low-defect soldering in lead-free assemblies. Product Overview ALPHA EF-2100 is a non-toxic, VOC-free, halide-free, rosin/resin-free, low-solids, no-clean liquid flux
- Features: Lead Free
- Type: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: Conforms to Halogen-Free Requirement Conforms to halogen-free requirement with no intentionally added halogens and halides. Excellent Wetting Speed and Spread Clear Residue Resulting in Excellent Joint Aesthetics Optimized for Robotic and Manual Soldering Classified as ROL0 per
- Features: Flux Cored Wire
- Type: Soldering Flux / Rosin
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Supplier: Allied Electronics, Inc.
Description: Excellent wetting ability Long tack time Halide and halogen free Meets IPC ANSI-J-STD-006 requirements for ORL0, Water Soluble Excellent consistency Stable viscosity Conforms to ISO 9454
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Supplier: Henkel Corporation - Electronics
Description: (Known as MULTICORE MF210 Liquid Flux ) LOCTITE MF 210 is a no clean, resin-free, halide-free liquid flux designed for surfaces with poor solderability. It is recommended for consumer electronics and general electrical soldering applications, particularly where high throughput
- Features: Other
- Type: Soldering Flux / Rosin
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Supplier: Techsil Limited
Description: non-hygroscopic, halide free and RoHS compliant. Product Benefits No-clean residue does not need to be removed for typical applications. Low residues, leaving the board and joints shiny and bright. Excellent wettability Usable for both lead free and leaded alloys Rosin/Resin
- Type: Soldering Flux / Rosin
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Supplier: Allied Electronics, Inc.
Description: complement the newer generations of low residue liquid fluxes being used by the electronics industry. The use of in.245in. low residue flux results in visually acceptable assemblies
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Supplier: Allied Electronics, Inc.
Description: complement the newer generations of low residue liquid fluxes being used by the electronics industry. The use of in.245in. low residue flux results in visually acceptable assemblies
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Supplier: MacDermid Alpha Electronics Solutions
Description: Rosin-based, no-clean flux, halide-free, ROL0, for BGA/PGA and rework. Product Overview Kester TSF-6522RH is a rosin-based, no-clean tacky soldering flux formulated to meet the IEC 61249-2-21 definition for halide-free materials. It can be applied using a doctor blade,
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Supplier: Techsil Limited
Description: Non-corrosive, non-hygroscopic, halide free and RoHS compliant. Product Benefits Superior fluxing ability Instant wetting After soldering, the rosin residue is non corrosive, non conducting, moisture resistant, and fungus resistant For precision application of rosin flux, in a
- Type: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: Water-soluble paste flux for wafer-level ball attach in Fan-in and Fan-out applications. Product Overview ALPHA WS9180-MHV water-soluble, halide-free flux is engineered for use in the attachment of lead-free or tin-lead eutectic spheres onto BGA or CSP components, as well as
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Supplier: Henkel Corporation - Electronics
Description: Halide-free, No-clean, SnPbSnPb, halide-free solder paste designed for high speed printing. Extended printed open time and tack life. Resistant to both hot and cold slump.
- Features: Lead Free, Other, Paste
- Type: Soldering Flux / Rosin
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Supplier: Henkel Corporation - Electronics
Description: Halide-free, No-clean, SnPbSnPb, halide-free, high activity solder paste that displays resistance to high temperature and humidity environments. Suitable for a large range of assembly processes, including rheo pump, proflow, large, high-density.
- Features: Lead Free, Other, Paste
- Type: Soldering Flux / Rosin
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Supplier: Henkel Corporation - Electronics
Description: Halide-free, No-clean, Pb-freePb-free solder paste with excellent resistance to solder balling and suitable for fine pitch, stencil printing applications.Also available in SnPb formulation
- Features: Lead Free, Other, Paste
- Type: Soldering Flux / Rosin
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Supplier: Newark, An Avnet Company
Description: DESOLDERING BRAID; Braid Material:Copper; Width:2.5mm; Length:5ft; Product Range:Techspray 181; Braid Colour:Blue; Braid Size:#4; Features:No-clean flux, halide-free and non-conductive residue; Flux Type:No Clean; Roll Length:5ft RoHS Compliant: Yes
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE LF 318M, Solder paste, Halide-free, No clean, Low voiding, Pb-free soldering LOCTITE LF 318M is a halide-free, no clean, low voiding Pb-free solder paste which has excellent humidity resistance and a broad process window both for printing and reflow.
- Joining Process / Product Form: Paste
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE NC-OO, Halogen-free, No-clean desoldering wick LOCTITE® NC-OO WICK is designed for static-free desoldering applications and repair of PC boards, without the need for subsequent clean-up. It is formulated using a special halide free, vacuumised, no-clean,
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Supplier: Nordson EFD
Description: Clear residue Difficult-to-solder surfaces Enhanced wetting Extended reflow cycle times (> 6 min.) Fine pitch General purpose Halide-free Lead-free shiny fillet Reduced slump Restricted residue
- Joining Process / Product Form: Paste
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Supplier: Nordson EFD
Description: cycle times (> 6 min.) Fine pitch Gap filling and/or vertical surfaces General purpose Halide-free Lead-free shiny fillet Low residue Pin transfer or dipping (low viscosity) Rapid reflow cycle time (< 5 sec.) Reduced slump Restricted residue UV-traceable
- Features: Other
- Joining Process / Product Form: Paste
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The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA
For halide free flux , a larger volume of flux is needed but consideration has to be taken since when more flux is used, as it will create more flux residue after the reflow process.
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Lead-Free Electronic Solders
None were observed for the halide free flux .
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Processing and material issues related to lead-free soldering
None were observed for the halide free flux .
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Metallurgy of low temperature Pb-free solders for electronic assembly
fluxes are replaced by relatively low activity, halide free fluxes and the residues are left on the substrate and solder joint.
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Implementation of novel reflow profile of no-clean fluxes to enhance flux stability and oxide layer removal of the high lead solder bump
For halide free flux . a larger volume of flux is needed but consideration have to be taken since when more flux is used as it will create more flux residue after reflow process.
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Soldering: Understanding the Basics
Halide - free fluxes are recommended for materials that are sensitive to stress-corrosion cracking.
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CR4 - Thread: Desperately Seeking Solder
" Halide - free fluxes are available, but there is a significant misunderstanding surrounding them.
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Wafer-Level Chip-Scale Packaging
Halide - free fluxes are also preferred which are designated by a 0, while 1 means the presence of halides.
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Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications
The activity in a soldering flux is generally provided by halides (chlorides, bromides) present in the flux, although there are some halide - free fluxes containing amino acids or other organic acids (Ref 17).
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Joining: Understanding the Basics
Halide - free fluxes are recommended for materials that are sensitive to stress corrosion cracking.