Halide Free Fluxes

Description: Features Excellent cleanability, residue can be removed with room temperature DI water Stencil-printable, high tack Offers high yields in BGA bumping process Halide-free with excellent solderability Wide process window Introduction

• Fluxes & Cleaners: Soldering Flux / Rosin
• Halogen / Halide Free: Yes

Description: Wave Solder Flux 1081 is a water wash organic flux suitable for all conventional tin-lead alloys. 1081 exhibits excellent solderability with low ionic residues after aqueous cleaning

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Wave Solder Flux 1072 is a halide-free, VOC-free, rosin flux specifically developed for wave soldering, surface mount, mixed technology and through-hole electronic assemblies. This unique formulation is a new advancement in flux chemistry, combining the benefits of

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: 1075-EXR 30 VOC-Free is a non-halide, synthetic resin flux specifically developed for wave soldering of surface-mount, mixed-technology and through-hole electronic assemblies. 1075-EXR 30 VOC-Free is a water based, non-flammable formulation that eliminates special storage

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Handy Flo 800 is a flux/binder system for solder alloys. These low temperature flux-binder systems are intended for soldering applications. Suitable heating methods include torch, induction, resistance, infrared, hot plate or oven, and clean-up is easily accomplished with a hot water

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: -corrosive, non-hygroscopic, halide free and RoHS compliant. Product Benefits No-clean residue does not need to be removed for typical applications. Low residues, leaving the board and joints shiny and bright. Excellent wettability Usable for both lead free and leaded alloys

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: High-performing ORL0, halide-free, VOC-free no-clean flux for hole-fill and low-defect soldering in lead-free assemblies. Product Overview ALPHA EF-2100 is a non-toxic, VOC-free, halide-free, rosin/resin-free, low-solids, no-clean liquid flux

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: is classified as Type ROL0 flux under J-STD-004B specifications. Kester 268 is zero-halogen and halide-free with no intentional addition of bromine and chlorine, conforming to the strictest requirements of IEC 61249-2-21, JPCA-ES-01 and IPC-410B specifications. Low Occurrence of Solder

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: . Non-corrosive, non-hygroscopic, halide free and RoHS compliant. Product Benefits Superior fluxing ability Instant wetting After soldering, the rosin residue is non corrosive, non conducting, moisture resistant, and fungus resistant For precision application of rosin

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: (Known as MULTICORE MF210 Liquid Flux ) LOCTITE MF 210 is a no clean, resin-free, halide-free liquid flux designed for surfaces with poor solderability. It is recommended for consumer electronics and general electrical soldering applications, particularly where high

• Approvals / Conformance: Other
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Halide-free, No-clean, SnPbSnPb, halide-free solder paste designed for high speed printing. Extended printed open time and tack life. Resistant to both hot and cold slump.

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Halide-free, No-clean, SnPbSnPb, halide-free, high activity solder paste that displays resistance to high temperature and humidity environments. Suitable for a large range of assembly processes, including rheo pump, proflow, large, high-density.

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Ideal for BGA rework applications requiring No-Clean Flux. Formulated for No-Clean applications. Syringe applicator provides exact delivery of flux to surface. Long tack time. Extended shelf life. Refrigeration not required. Noncorrosive, halide and halogen free. Meets

Description: Specifically formulated for the higher temperature requirements of lead free applications. Syringe applicator provides exact delivery of flux to surface. Long tack time, extended shelf life. No refrigeration required. Noncorrosive, halide and halogen free. Meets IPC

Description: Formulated for No-Clean applications. Syringe applicator provides exact delivery of flux to surface. Long tack time, extended shelf life. No refrigeration required. Noncorrosive, halide and halogen free. Meets IPC requirements for ROL0, No Clean. Excellent consistency with

Description: Halide-free, No-clean, Pb-freePb-free solder paste with excellent resistance to solder balling and suitable for fine pitch, stencil printing applications.Also available in SnPb formulation

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Rosin-based, no-clean flux, halide-free, ROL0, for BGA/PGA and rework. Product Overview Kester TSF-6522RH is a rosin-based, no-clean tacky soldering flux formulated to meet the IEC 61249-2-21 definition for halide-free materials. It can be applied using a doctor blade,

Description: Water-soluble paste flux for wafer-level ball attach in Fan-in and Fan-out applications. Product Overview ALPHA WS9180-MHV water-soluble, halide-free flux is engineered for use in the attachment of lead-free or tin-lead eutectic spheres onto BGA or CSP components, as well

Description: No-clean flux dispenser pen applies a non-corrosive, halide free, organic no-clean flux. Rosin flux dispenser pen applies a non-corrosive Type R flux. Chisel tip marker provides controlled and accurate delivery Package Type = Pen Package Size = 9g

• Type: Defluxer / Flux Remover, Cleaner / Cleaning Agent

Description: wire. Non-corrosive and non-conductive, halide free. Product Benefits Lead free & no clean Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements Flux meets J-STD-004B The resin spreads like rosin-activated flux Virtually non

• Form / Shape: Solid Wire
• Lead Free: Yes
• Welding Process / Form: Flux Cored Wire

Description: process window for Sn/Pb and Pb-free soldering Suitable for fine pitch, stencil printing applications Excellent slump resistance Good tack performance and open time Probe testable residues with reduced false failures Halide free flux classification: ROL0 to ANSI/J-STD-004

• Form / Shape: Paste

Description: surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper. 4 hours between print abandon time even on small CSP apertures. Very low hot slump. Colorless residues for easy post-reflow inspection Suitable for fine pitch, high speed printing up to 150mm/s (6"/s) Halide

• Form / Shape: Paste

Description: tack force to resist component movement during high speed placement and long printer abandon times. It shows excellent solderability over a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper. It has Halide free flux classification: ROL0

• Form / Shape: Paste

Description: LOCTITE NC-OO, Halogen-free, No-clean desoldering wick LOCTITE® NC-OO WICK is designed for static-free desoldering applications and repair of PC boards, without the need for subsequent clean-up. It is formulated using a special halide free, vacuumised, no-clean,

Description: virtually no slumps or drips. It is available in different alloys, alloy particle sizes, and flux types — including lead-free formulations. Whether you’re soldering to stainless steel or assembling a flex circuit, EFD printing paste’s long stencil life, good print transfer

• Form / Shape: Paste