Halide Free Solder

Description: Indium6.3 is a halide free, low voiding, water soluble solder paste. Indium6.3 has excellent wetting and solder joint appearance, exceptional printing and response to pause with a wide reflow profile window. Indium6.3 has outstanding slump resistance

• Form / Shape: Paste

Description: NC-SMQ92J is a halide free, air reflow, no-clean solder paste formulated to leave a benign, probe testable residue. The residue is easily penetrated and will not clog multi-point probes. In addition, NC-SMQ92J offers excellent wetting, unsurpassed stencil life, and consistent

• Form / Shape: Paste

Description: NC-SMQ92J is a halide free, air reflow, no-clean solder paste formulated to leave a benign, probe testable residue. The residue is easily penetrated and will not clog multi-point probes. In addition, NC-SMQ92J offers excellent wetting, unsurpassed stencil life, and consistent

• Alloy: Tin-Lead (Sn-Pb)
• Form / Shape: Paste

Description: Wave Solder Flux 1081 is a water wash organic flux suitable for all conventional tin-lead alloys. 1081 exhibits excellent solderability with low ionic residues after aqueous cleaning

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Handy Flo 800 is a flux/binder system for solder alloys. These low temperature flux-binder systems are intended for soldering applications. Suitable heating methods include torch, induction, resistance, infrared, hot plate or oven, and clean-up is easily accomplished with a hot water

• Fluxes & Cleaners: Soldering Flux / Rosin
• Form / Shape: Paste
• Melting Range: 300 to 525 F

Description: Multicore LF318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste which has excellent humidity resistance and a broad process window both for reflow and printing. View or Download the High Reliability PB-Free Solder Alloy

Description: MULTICORE LF600 is a halide-free, no-clean, solder paste that exhibits excellent thermal stability; it is capable of being print cycled on 0.5 mm pitch CSP apertures for 24 hours in conditions of 33C/75%RH. LF600 also shows almost zero hot slump, reducing the likelihood of bridging and

Description: MulticoreLF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent

Description: Modest residue level, halide-free solder paste recommended for Pb-free soldering and Sn/Pb soldering for printing and reflow in air. LOCTITE® CR 32 is formulated as a modest residue level, halide-free solder paste recommended for Pb-free

• Form / Shape: Paste

Description: residue Difficult-to-solder surfaces Enhanced wetting Extended reflow cycle times (> 6 min.) Fine pitch Gap filling and/or vertical surfaces General purpose Halide-free Lead-free shiny fillet Low residue Pin

• Approvals / Conformance: Other
• Form / Shape: Paste

Description: LOCTITE LF 620, Solder paste, Halide-free, No clean, Low voiding, Pb-free soldering LOCTITE® LF 620 is a halide-free, no clean, low voiding Pb-free solder paste, which has excellent humidity resistance and a broad process window both for printing and

• Form / Shape: Paste

Description: MULTICORE LF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent

Description: LOCTITE LF 318, Solder paste, Pb-free soldering LOCTITE® LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This

• Form / Shape: Paste

Description: LOCTITE LF 318M, Solder paste, Halide-free, No clean, Low voiding, Pb-free soldering LOCTITE LF 318M is a halide-free, no clean, low voiding Pb-free solder paste which has excellent humidity resistance and a broad process window both for printing and

• Form / Shape: Paste

Description: High-performing ORL0, halide-free, VOC-free no-clean flux for hole-fill and low-defect soldering in lead-free assemblies. Product Overview ALPHA EF-2100 is a non-toxic, VOC-free, halide-free, rosin/resin-free, low-solids, no-clean liquid flux designed

• Fluxes & Cleaners: Soldering Flux / Rosin
• Lead Free: Yes

Description: is classified as Type ROL0 flux under J-STD-004B specifications. Kester 268 is zero-halogen and halide-free with no intentional addition of bromine and chlorine, conforming to the strictest requirements of IEC 61249-2-21, JPCA-ES-01 and IPC-410B specifications. Low Occurrence of Solder

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Lead free solder designed for hand soldering applications. 3% halide-activated non-corrosive rosin flux Wire Diameter = 0.5mm Product Form = Wire Melting Point = +227 - +240°C Percent Tin = 99% Flux Type = Halide Activated Resin Product Weight = 250g Flux Content

• Form / Shape: Wire
• Melting Range: 441 to 464 F

Description: A careful balance of resins and activators provides clear residues without the need for cleaning in most applications. Crystalâ?¢ 400 is halide-free and is suitable for soldering copper, brass and nickel (RS 229-4263). Crystalâ?¢ 511 is suitable for badly

• Alloy: Tin-Lead (Sn-Pb)
• Form / Shape: Wire
• Melting Range: 361 to 370 F

Description: A careful balance of resins and activators provides clear residues without the need for cleaning in most applications. Crystalâ?¢ 400 is halide-free and is suitable for soldering copper, brass and nickel (RS 229-4263). Crystalâ?¢ 511 is suitable for badly

• Alloy: Tin-Lead (Sn-Pb)
• Form / Shape: Wire
• Melting Range: 361 to 370 F

Description: A careful balance of resins and activators provides clear residues without the need for cleaning in most applications. Crystalâ?¢ 400 is halide-free and is suitable for soldering copper, brass and nickel (RS 229-4263). Crystalâ?¢ 511 is suitable for badly

• Alloy: Tin-Lead (Sn-Pb)
• Form / Shape: Wire
• Melting Range: 361 to 370 F

Description: -splattering Non-corrosive residues Non-conductive residues Halide free About 14% longer by weight than leaded solder wires Suitable for Use in Food Facilities as a Non-Food Chemical—Canadian and NFS recognition letters available on request

• Form / Shape: Wire
• Lead Free: Yes

Description: Our fastest wetting and lowest spattering, Halogen Free and Halide Free cored wire offering. Product Overview ALPHA Telecore HF-850 is suitable for use in any electronic or industrial no-clean soldering application that specifies compliance to the IPC J-STD-004 ROL0

Description: Rosin-based, no-clean flux, halide-free, ROL0, for BGA/PGA and rework. Product Overview Kester TSF-6522RH is a rosin-based, no-clean tacky soldering flux formulated to meet the IEC 61249-2-21 definition for halide-free materials. It can be applied using a doctor blade, drum

Description: . Non-corrosive, non-hygroscopic, halide free and RoHS compliant. Product Benefits Superior fluxing ability Instant wetting After soldering, the rosin residue is non corrosive, non conducting, moisture resistant, and fungus resistant For precision application of rosin flux, in a

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: SiC MOSFET Full-Bridge Al2O3 DBC Thermistor Options with Pre-Applied Thermal Interface Material (TIM) and without Pre-Applied TIM Options with Solderable Pins and Press-Fit Pins These Devices are Pb-Free, Halide Free and are RoHS Compliant Applications Solar Inverter

• Package Type: Other