Halide Free Solder

Description: Indium6.3 is a halide free, low voiding, water soluble solder paste. Indium6.3 has excellent wetting and solder joint appearance, exceptional printing and response to pause with a wide reflow profile window. Indium6.3 has outstanding slump resistance

• Product Form: Paste

Description: SOLDER PASTE, HALIDE FREE/NO CLEAN, 500G

Description: Wave Solder Flux 1081 is a water wash organic flux suitable for all conventional tin-lead alloys. 1081 exhibits excellent solderability with low ionic residues after aqueous cleaning

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Handy Flo 800 is a flux/binder system for solder alloys. These low temperature flux-binder systems are intended for soldering applications. Suitable heating methods include torch, induction, resistance, infrared, hot plate or oven, and clean-up is easily accomplished with a hot water rinse.

• Melting Range: 300 to 525 F
• Joining Process / Product Form: Paste
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: NC-SMQ92J is a halide free, air reflow, no-clean solder paste formulated to leave a benign, probe testable residue. The residue is easily penetrated and will not clog multi-point probes. In addition, NC-SMQ92J offers excellent wetting, unsurpassed stencil life, and consistent

• Product Form: Paste
• Solder Alloy: Tin-Lead (Sn-Pb)

Description: Features Excellent cleanability, residue can be removed with room temperature DI water Stencil-printable, high tack Offers high yields in BGA bumping process Halide-free with excellent solderability Wide process window Introduction WS-363 Interconnect Flux is a high viscosity

• Fluxes & Cleaners: Halogen / Halide Free, Soldering Flux / Rosin

Description: No-Clean Cored Solder Wire, Sn63Pb37 Alloy, 1 lbs. Weight Leaves a low amount of residue, which is both visually negligible and electrically safe. Does not require cleaning, is environmentally safe and needs no CFC solvents. Kester in.245in. low residue flux for cored solder wire was

Description: No-Clean Cored Solder Wire, Sn63Pb37 Alloy, 1 lbs. Weight Leaves a low amount of residue, which is both visually negligible and electrically safe. Does not require cleaning, is environmentally safe and needs no CFC solvents. Kester in.245in. low residue flux for cored solder wire was

Description: No-Clean Cored Solder Wire, Sn63Pb37 Alloy, 1 lbs. Weight Leaves a low amount of residue, which is both visually negligible and electrically safe. Does not require cleaning, is environmentally safe and needs no CFC solvents. Kester in.245in. low residue flux for cored solder wire was

Description: No-Clean Cored Solder Wire, Sn63Pb37 Alloy, 1 lbs. Weight Leaves a low amount of residue, which is both visually negligible and electrically safe. Does not require cleaning, is environmentally safe and needs no CFC solvents. Kester in.245in. low residue flux for cored solder wire was

Description: FLUX, SYRINGE, HALIDE FREE/NO CLEAN ROHS COMPLIANT: YES

Description: Multicore LF318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste which has excellent humidity resistance and a broad process window both for reflow and printing. View or Download the High Reliability PB-Free Solder Alloy

Description: MulticoreLF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high tack to resist component movement during high-speed placement, long printer abandon times and

Description: MULTICORE LF600 is a halide-free, no-clean, solder paste that exhibits excellent thermal stability; it is capable of being print cycled on 0.5 mm pitch CSP apertures for 24 hours in conditions of 33C/75%RH. LF600 also shows almost zero hot slump, reducing the likelihood of

Description: MulticoreLF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high tack to resist component movement during high-speed placement, long printer abandon times and

Description: High-performing ORL0, halide-free, VOC-free no-clean flux for hole-fill and low-defect soldering in lead-free assemblies. Product Overview ALPHA EF-2100 is a non-toxic, VOC-free, halide-free, rosin/resin-free, low-solids, no-clean liquid flux

• Solder Alloy: Lead Free
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Modest residue level, halide-free solder paste recommended for Pb-free soldering and Sn/Pb soldering for printing and reflow in air. LOCTITE® CR 32 is formulated as a modest residue level, halide-free solder paste recommended for Pb-free

• Product Form: Paste

Description: cycle times (> 6 min.) Fine pitch Gap filling and/or vertical surfaces General purpose Halide-free Lead-free shiny fillet Low residue Pin transfer or dipping (low viscosity) Rapid reflow cycle time (< 5 sec.) Reduced slump Restricted residue UV-traceable

• Features: Other
• Product Form: Paste

Description: ROL0 flux under J-STD-004B specifications. Kester 268 is zero-halogen and halide-free with no intentional addition of bromine and chlorine, conforming to the strictest requirements of IEC 61249-2-21, JPCA-ES-01 and IPC-410B specifications. Low Occurrence of Solder Ball Spatter,

• Joining Process / Product Form: Flux Cored Wire
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: MG Chemicals 4900 Sn96 (SAC305) is an electronic grade, lead-free solder wire. It uses the predominant lead-free alloy composition and is complemented with a no clean, synthetically refined, splatter-proof resin flux core. The 4900 solder wire meets J-STD-004 and exceeds

• Features: Flux Cored Wire, Solid Wire
• Solder Alloy: Lead Free

Description: Rosin-based, no-clean flux, halide-free, ROL0, for BGA/PGA and rework. Product Overview Kester TSF-6522RH is a rosin-based, no-clean tacky soldering flux formulated to meet the IEC 61249-2-21 definition for halide-free materials. It can be applied using a doctor blade,

Description: of Fumes Clear Non-Tacky Residue Clear non-tacky residue provides good joint appearance and makes inspection easy. Halogen and Halide Free Halogen and halide free for environmental compliance and high electrical reliability.

• Features: Flux Cored Wire

Description: DESOLDERING BRAID; Braid Material:Copper; Width:2.5mm; Length:5ft; Product Range:Techspray 181; Braid Colour:Blue; Braid Size:#4; Features:No-clean flux, halide-free and non-conductive residue; Flux Type:No Clean; Roll Length:5ft RoHS Compliant: Yes

Description: Clear residue Difficult-to-solder surfaces Enhanced wetting Extended reflow cycle times (> 6 min.) Fine pitch General purpose Halide-free Lead-free shiny fillet Reduced slump Restricted residue

• Product Form: Paste

Description: Non-corrosive, non-hygroscopic, halide free and RoHS compliant. Product Benefits Superior fluxing ability Instant wetting After soldering, the rosin residue is non corrosive, non conducting, moisture resistant, and fungus resistant For precision application of rosin flux, in a

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: LOCTITE NC-OO, Halogen-free, No-clean desoldering wick LOCTITE® NC-OO WICK is designed for static-free desoldering applications and repair of PC boards, without the need for subsequent clean-up. It is formulated using a special halide free, vacuumised, no-clean,

Description: LOCTITE® ECCOBOND FP4802 is a high purity, liquid encapsulant designed for use in applications utilizing lead-free solder. This product can withstand solder reflow temperatures up to 260°C after being exposed to JEDEC level 2 (85°C/60% RH, 168hours) preconditioning. It was

• Coeff. of Thermal Expansion (CTE): 11.11111111111111 µin/in-F
• Viscosity: 80,000 cP