Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ER2223 Highly Chemical Resistant Epoxy Potting Compound has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive industry. It offers excellent chemical resistance, including to most fluids found in the
- Industry: Automotive, Semiconductors / IC Packaging
- Features: Electronics, Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Type: Thermal Compound / Thermally Conductive
-
Supplier: RS Components, Ltd.
Description: MG high temperature epoxy 832HT 375ml
- Features: Encapsulating / Potting Compound, Specialty / Other
- Chemical System: Epoxy (EP)
-
Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1080 is a two-part high temperature epoxy potting system designed to meet Class H (180°C) operating requirements.
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
-
-
Supplier: Newark, An Avnet Company
Description: High Temperature, Chemically Resistant, Epoxy Potting and Encapsulating Compound / 2.7 qt Kit
-
Supplier: ACCRAbond, Inc.
Description: INSTAbond® 826 A low viscosity, two-component epoxy compound that cures at room temperature. High flexibility, high impact resistance, thermal shock, water/chemical resistance, and good mechanical properties. Wicking and air release capabilities of INSTAbond® 826
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80°F to +500°F is required. lt is 100% reactive and does not contain any solvents
- Viscosity: 7,000 to 100,000 cP
- Use Temperature: -80 to 500 F
- Tensile Strength (Break): 12,400 psi
- Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Semiconductors / IC Packaging
-
Supplier: Allied Electronics, Inc.
Description: Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Maximum operating temperature: 275°C/527°F
-
Supplier: Allied Electronics, Inc.
Description: Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Maximum operating temperature: 275°C/527°F
-
Supplier: Ellsworth Adhesives
Description: ELANTAS PDG Epoxylite® E 5302 HI TEMP Epoxy Potting Compound is a two-component system that consists of a liquid resin and a powder hardener. It has excellent adhesion to metals, ceramics, and most plastics. It is used for bonding and sealing of electrical components requiring
- Tensile Strength (Break): 4,000 psi
- Elongation: 2 %
- Dielectric Strength: 560 kV/in
- Features: Encapsulating / Potting
-
Supplier: Ellsworth Adhesives
Description: ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound is a two-component system used for potting and sealing of electrical and electronic components requiring resistance to high temperatures. It has excellent adhesion to metals, ceramics, and most
- Thermal Conductivity: 0.3 W/m-K
- Dielectric Strength: 600 kV/in
- Features: Encapsulating / Potting Compound
- Chemical System: Epoxy (EP)
-
Supplier: Henkel Corporation - Industrial
Description: To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE® E-40EXP Hysol, a two-component, room-temperature-curing epoxy potting compound designed to pass UL testing and maintain more than 85% of
- Viscosity: 24,000 cP
- Thermal Conductivity: 1.25 W/m-K
- Chemical System: Epoxy (EP)
- Features: Leveling / Filling Compound
-
Supplier: Ellsworth Adhesives
Description: ELANTAS PDG Epoxylite® E 6203 is a two component, epoxy system that is used for potting and sealing electrical and electronic components that require resistance to high temperatures. It is heat curing, low outgassing, and is resistant to acids, alkalis, and solvents. It
- Tensile Strength (Break): 4,000 psi
- Elongation: 2 %
- Dielectric Strength: 560 kV/in
- Features: Electronics, Encapsulating / Potting Compound
-
Supplier: Epoxies Etc...
Description: 20-3066 is a 100% solids epoxy system which exhibits outstanding high temperature resistance. In addition to its' high temperature resistance, 20-3066 also has excellent chemical, solvent, and moisture resistance.
- Use Temperature: -4 to 437 F
- Tensile Strength (Break): 14,000 psi
- Dielectric Strength: 10.000000000000002 kV/in
- Dielectric Constant (Relative Permittivity): 0.4
-
Supplier: Epoxies Etc...
Description: 20-3660 is an electronic grade, 100% solids, epoxy resin system. In addition to it’s high temperature resistance, 20-3660 also provides outstanding physical properties at elevated temperatures.
- Use Temperature: -4 to 446 F
- Thermal Conductivity: 0.54806602 W/m-K
- Tensile Strength (Break): 14,000 psi
- Dielectric Strength: 419.99999999999983 kV/in
-
Supplier: Epoxies Etc...
Description: 20-3290 is a high temperature two part epoxy system. This system has low thermal coefficient of expansion, good thermal shock resistance and high temperature service. 20-3290 is used in a wide variety of electronic potting and encapsulating applications.
- Dielectric Strength: 400.000000000001 kV/in
- Dielectric Constant (Relative Permittivity): 4
- Viscosity: 24,000 cP
- Industry: Electronics (PCB / SMT Assembly)
-
Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969. Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,
- Viscosity: 150 to 300 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 31.666666666666664 to 116.66666666666666 µin/in-F
- Dielectric Constant (Relative Permittivity): 3.36
-
Supplier: Epoxies Etc...
Description: 20-3300 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage, high tensile and compressive strength.
- Viscosity: 12,000 cP
- Use Temperature: -94 to 500 F
- Thermal Conductivity: 0.5769116 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.11111111111111 µin/in-F
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500°F with truly outstanding chemical resistance. High strength bonds serviceable up to 600°F can be obtained with this exceptionally thermally stable and chemically resistant
- Viscosity: 250,000 to 500,000 cP
- Use Temperature: -80 to 600 F
- Tensile Strength (Break): 3,000 to 4,000 psi
- Elongation: 2.1 %
-
Supplier: Master Bond, Inc.
Description: Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems.
- Applied Thickness / Gap Fill: 0.004 to 0.006 inch
- Viscosity: 5,000 to 15,000 cP
- Use Temperature: -80 to 350 F
- Coeff. of Thermal Expansion (CTE): 30,555,555.555555556 to 33,333,333.333333332 µin/in-F
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high
- Use Temperature: 500 F
- Coeff. of Thermal Expansion (CTE): 55.55555555555556 µin/in-F
- Tensile Strength (Break): 4,680 psi
- Elongation: 114.7 %
-
Encapsulants and Potting Compounds - MG Chemicals Black Encapsulating/Potting Epoxy Kit -- MGEP00009Supplier: Techsil Limited
Description: MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
-
Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market
- Viscosity: 150 to 300 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 35 to 99.44444444444444 µin/in-F
- Index of Refraction: 1.5194
-
Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969. Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,
- Viscosity: 4,000 to 7,000 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 11.666666666666666 to 71.11111111111111 µin/in-F
- Dielectric Constant (Relative Permittivity): 3.18
-
Supplier: Hernon Manufacturing, Inc.
Description: Hernon 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond 397 will change from amber-yellow to a reddish brown upon
- Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: Electrical Power / HV, Electronics, Encapsulating / Potting
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System, Thermosetting / Crosslinking
-
Supplier: Henkel Corporation - Industrial
Description: required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing. Room
- Coeff. of Thermal Expansion (CTE): 33.888888888888886 µin/in-F
- Viscosity: 354 cP
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2662 Black, formerly Emerson and Cuming, is a two component, filled, epoxy encapsulant that is used for sealing and potting components that are exposed to high temperatures. It is resistant to chemicals, moisture, and high temperature.
- Viscosity: 40,000 cP
- Thermal Conductivity: 0.53 W/m-K
- Dielectric Strength: 419.1000000000009 kV/in
- Features: Electronics, Encapsulating / Potting Compound
-
Supplier: Techsil Limited
Description: MG Chemicals 832HT is a high temperature epoxy designed for encapsulating and potting electronics in high temperature environments. It is also an ideal encapsulant for very chemically aggressive environments and applications where extreme physical strength
- Industry: Electronics
- Chemical System: Epoxy (EP)
-
Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Viscosity: 1,400 to 2,200 cP
- Use Temperature: 482 F
- Thermal Conductivity: 1 W/m-K
- Coeff. of Thermal Expansion (CTE): 17.22222222222222 to 78.88888888888889 µin/in-F
-
Supplier: Protavic America, Inc.
Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.
- Viscosity: 40,000 cP
- Use Temperature: -55 to 150 F
- Thermal Conductivity: 1.15 W/m-K
- Coeff. of Thermal Expansion (CTE): 12.222222222222221 µin/in-F
-
Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into cavities about 1 mm in width. The glass transition temperature is over 150°C, which helps to improve
- Viscosity: 6,000 cP
- Use Temperature: -67 to 410 F
- Thermal Conductivity: 0.7 W/m-K
- Coeff. of Thermal Expansion (CTE): 9.444444444444445 to 36.11111111111111 µin/in-F
-
Supplier: Protavic America, Inc.
Description: Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at medium
- Use Temperature: -55 to 200 F
- Coeff. of Thermal Expansion (CTE): 36.11111111111111 to 38.888888888888886 µin/in-F
- Tensile Strength (Break): 2,000 psi
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic
Find Suppliers by Category Top
Featured Products Top
-
Featuring a high glass transition temperature of 200-210°C, it resists high temperatures up to 550°F. This system has advantageous flow properties combined with a long woking life. I has an element of toughness, and good physical strength properties. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Master Bond EP30LP-2 is an optically clear epoxy with superb light transmission properties. This low viscosity, electrical insulator also features outstanding dimensional stability. Featuring easy handling, this compound has a convenient two to one mix ratio by weight or (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
MG Chemicals 832FXC is a clear, flexible epoxy potting compound designed to minimize physical stress on delicate components. Ideal for low-temperature, arctic, or temperature-cycling environments, it maintains flexibility and stability through rapid thermal changes. Its transparency allows easy (read more)
Browse Industrial Enclosures Datasheets for New Yorker Electronics Co., Inc. -
LED401 Product Information One component LED curable system for high performance bonding, sealing, coating and encapsulation (read more)
Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Master Bond, Inc. -
controllers, drive systems, and power units. Thermal potting adhesives are typically two-component composite materials based on silicone, epoxy, or polyurethane resins, filled with high thermal conductivity powders. These materials offer excellent (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
latter property is particularly useful in potting and encapsulation applications. Also, the compound allows for precise alignment with minimal fixturing and simple curing. Its service temperature range is from 4K to +300°F. The color of Part A is light cream and Part B is similar, but slightly darker (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
stable operation of the device and prevents performance degradation or damage caused by excessive temperatures. Protection and Encapsulation In addition to excellent thermal performance, thermal potting compounds also provide additional physical protection (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
potting materials are based on epoxy, polyurethane, polybutadiene and silicone and are especially designed for areas in demanding electrical and electronic applications. Additional properties such as improved heat dissipation, much greater mechanical stability at high vibrational forces, noise reduction (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
sensitive components (Bectron®, CONAP®). Epoxy and silicone potting materials that provide protection for high temperature applications (Epoxylite®, (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC
Conduct Research Top
-
Managing Heat Transfer With Potting Compounds
Today's electronic designs are smaller in size and deliver more power, which requires that they run at higher temperatures. In order to maintain long life and high reliability, they must be able to dissipate that heat efficiently. Fans, vents and other cooling devices take up valuable design space
-
New Urethane Technology for Potting & Encapsulation in Electronics
Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds available to designers are unable to give adequate protection over a wide temperature range
-
Optical Transmission Properties of Adhesives
is noteworthy for its low index of refraction and its ability to transmit light very well from 225-2500 nanometers. It is a silicone compound that combines remarkable flexibility, high temperature resistance, superb electrical insulation and outstanding optical clarity. These properties enable it to be used
More Information Top
Indicates content that may require registration and/or purchase.
-
Chemicals | Mouser
High Temperature Epoxy Encapsulating and Potting Compound .
-
Chemicals | Mouser
High Temperature Epoxy Encapsulating and Potting Compound .
-
Chemicals | Mouser
High Temperature Epoxy Encapsulating and Potting Compound .
-
N-Reactor Department monthly report, November 1964
This is believed to have resultad from softening of the epoxy potting compound ° The transducers are being replacel by high tem- perature ceramic units.
-
Professional resources
The completely revised handbook is a source of technical data for the use of high temperature ad- hesives, putties, epoxies , conductive materials, pot- ting compounds , machin- able ceramics, refractory materials, insulation pro- ducts, and protective coatings.
-
Synthesis and properties of a low hygrothermal stress epoxy molding compound for electronic encapsulation
In a microelectronic packaging process, the epoxy molding compounds are transferred from a low- tem- perature transfer pot to high -temperature mold cavi- ties wherein the crosslinking reaction takes place.
-
Evaluation of a 4 mm x 4 mm SiC GTO at Temperatures up to 150°C and Varying Pulse Width
Two of the devices were packaged with a green, silicon-based potting compound for high voltage insulation, two were packaged without insulation, and two were packaged with a hard, high- temperature epoxy .
-
Epoxy–imide resins from 2,2‐bis[4‐(4‐trimellitimidophenoxy)phenyl]propane: Adhesive and thermal properties
… research- ers as they combine the versatility and ease of process- ability of epoxy resins and high temperature proper- ties of imide groups.1–12 Epoxy –imide resins are used … … in composites, organic insulators, pot- ting and encapsulating compounds , and adhesives.2–4 In …
-
Motorsport Sensor Technology
These parts are encapsulated with a ceramic based potting compound , because the thermal expansion coefficient of epoxy based materials is too high and they do not offer sufficient mechanical support at very high temperature .
-
Evaluation of 4 mm x 4 mm Silicon Carbide Thyristors
Two of the devices were packaged with a green, silicon-based potting compound for high voltage insulation, two were packaged bare, without insulation, and two were packaged with a hard, high- temperature epoxy .