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Encapsulants and Potting Compounds - MG Chemicals Black Encapsulating/Potting Epoxy Kit -- MGEP00009Supplier: Techsil Limited
Description: MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1080 is a two-part high temperature epoxy potting system designed to meet Class H (180°C) operating requirements.
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1612-1 with CONACURE® EA-039 is a high performance flexible epoxy potting and encapsulating system. Flexibility has been built into the cured compound without degradation of electrical properties at elevated temperatures. It cures with minimum strain
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: MacDermid Alpha Electronics Solutions
Description: Highly chemical-resistant epoxy potting compound formulated for harsh conditions in under-hood applications. Product Overview ER2223 Highly Chemical Resistant Epoxy Potting Compound has been specially formulated to meet the harsh operating conditions of
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1610 with CONACURE® EA-039 is a high performance flexible epoxy potting and encapsulating system. Flexibility has been built into the cured compound without degradation of electrical properties at elevated temperatures. It cures with minimum strain on
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Flame Retardant / UL 94V-0 Rated: Yes
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 31.67 to 117 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 3.36
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 826 A low viscosity, two-component epoxy compound that cures at room temperature. High flexibility, high impact resistance, thermal shock, water/chemical resistance, and good mechanical properties. Wicking and air release capabilities of INSTAbond® 826
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxy Technology
Description: requires their optical properties. Additionally, our products are found in dental and surgical tools, catheters and diagnostic probes.? EPO-TEK® epoxies also fabricate the circuitry for bench-top instruments, as well as ensure high performance in radiation detection heavy machinery
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 35 to 99.44 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Optoelectronics / Photonics
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Supplier: Epoxies Etc...
Description: 20-3290 is a high temperature two part epoxy system. This system has low thermal coefficient of expansion, good thermal shock resistance and high temperature service. 20-3290 is used in a wide variety of electronic potting and encapsulating applications.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4
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Supplier: Henkel Corporation - Industrial
Description: To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE® E-40EXP Hysol, a two-component, room-temperature-cur ing epoxy potting compound designed to pass UL testing and maintain more than 85% of
- Cure Type / Technology: Two Component System
- Features: Leveling / Filling Compound
- Thermal Conductivity: 1.25 W/m-K
- Viscosity: 24000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND UF 3811, Halogen free, Reworkable, Low viscosity, Epoxy, Underfill, Encapsulant LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no
- Coeff. of Thermal Expansion (CTE): 33.89 µin/in-F
- Viscosity: 354 cP
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG Epoxylite® E 5302 HI TEMP Epoxy Potting Compound is a two-component system that consists of a liquid resin and a powder hardener. It has excellent adhesion to metals, ceramics, and most plastics. It is used for bonding and sealing of electrical components requiring
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 560 kV/in
- Elongation: 2 %
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Supplier: Protavic America, Inc.
Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 12.22 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 11.67 to 71.11 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 3.18
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Supplier: Epoxies Etc...
Description: 20-3066 is a 100% solids epoxy system which exhibits outstanding high temperature resistance. In addition to its' high temperature resistance, 20-3066 also has excellent chemical, solvent, and moisture resistance.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80°F to +500°F is required. lt is 100% reactive and does not contain any solvents
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Optoelectronics / Photonics, Semiconductors / IC Packaging
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 78.89 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound is a two-component system used for potting and sealing of electrical and electronic components requiring resistance to high temperatures. It has excellent adhesion to metals, ceramics, and most
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 600 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG Epoxylite® E 6203 is a two component, epoxy system that is used for potting and sealing electrical and electronic components that require resistance to high temperatures. It is heat curing, low outgassing, and is resistant to acids, alkalis, and solvents. It
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 560 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Master Bond, Inc.
Description: Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation with a free flowing viscosity.
- Applied Thickness / Gap Fill: 0.0030 to 0.0050 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting.
- Applied Thickness / Gap Fill: 0.0030 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 3.89E7 to 4.44E7 µin/in-F
- Composition: Unfilled
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Supplier: Hernon Manufacturing, Inc.
Description: Hernon? 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond? 397 will change from amber-yellow to a reddish brown upon
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...
Description: 20-3300 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage, high tensile and compressive strength.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 21.11 µin/in-F
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into cavities about 1 mm in width. The glass transition temperature is over 150°C, which helps to improve
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Epoxies Etc...
Description: 20-3660 is an electronic grade, 100% solids, epoxy resin system. In addition to it’s high temperature resistance, 20-3660 also provides outstanding physical properties at elevated temperatures.
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Dielectric Constant (Relative Permittivity): 3.5
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Supplier: Master Bond, Inc.
Description: compound. These bonds retain their pertinent physical strength and chemical resistance properties after prolonged exposure to high temperatures. Typical lap shear strength are in the order of 2400-2500psi at ambient temperatures. After heat aging for 1000 hours at 500°F
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: DigiKey
Description: HIGH TEMPERATURE EPOXY
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Protavic America, Inc.
Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a
- Chemical / Polymer System Type: Specialty / Other
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Techsil Limited
Description: MG 832WC is a general purpose, water clear potting and encapsulation compound which offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where high clarity is required; it
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Techsil Limited
Description: MG Chemicals 832HT is a high temperature epoxy designed for encapsulating and potting electronics in high temperature environments. It is also an ideal encapsulant for very chemically aggressive environments and applications where extreme physical strength
- Industry: Electronics
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2662 Black, formerly Emerson and Cuming, is a two component, filled, epoxy encapsulant that is used for sealing and potting components that are exposed to high temperatures. It is resistant to chemicals, moisture, and high temperature.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 419 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Protavic America, Inc.
Description: Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at medium
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 36.11 to 38.89 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-HTNS™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS™ is developed
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: OMEGA Engineering, Inc.
Description: products. OMEGABOND and OMEGATHERM products are compounded and packaged for convenient, easy mixing and application. Each formulation exhibits important characteristics necessary for accurate, fast, reliable temperature measurement. These are: good adhesion and strength, high
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Featuring a high glass transition temperature of 200-210°C, it resists high temperatures up to 550°F. This system has advantageous flow properties combined with a long woking life. I has an element of toughness, and good physical strength properties. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Master Bond EP30LP-2 is an optically clear epoxy with superb light transmission properties. This low viscosity, electrical insulator also features outstanding dimensional stability. Featuring easy handling, this compound has a convenient two to one mix ratio by weight or (read more)
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MG Chemicals 832FXC is a clear, flexible epoxy potting compound designed to minimize physical stress on delicate components. Ideal for low-temperature, arctic, or temperature-cycling environments, it maintains flexibility and stability through rapid thermal changes. Its transparency allows easy (read more)
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Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
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LED401 Product Information One component LED curable system for high performance bonding, sealing, coating and encapsulation (read more)
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latter property is particularly useful in potting and encapsulation applications. Also, the compound allows for precise alignment with minimal fixturing and simple curing. Its service temperature range is from 4K to +300°F. The color of Part A is light cream and Part B is similar, but slightly darker (read more)
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stable operation of the device and prevents performance degradation or damage caused by excessive temperatures. Protection and Encapsulation In addition to excellent thermal performance, thermal potting compounds also provide additional physical protection (read more)
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Conduct Research Top
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Managing Heat Transfer With Potting Compounds
Today's electronic designs are smaller in size and deliver more power, which requires that they run at higher temperatures. In order to maintain long life and high reliability, they must be able to dissipate that heat efficiently. Fans, vents and other cooling devices take up valuable design space
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New Urethane Technology for Potting & Encapsulation in Electronics
Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds available to designers are unable to give adequate protection over a wide temperature range
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Optical Transmission Properties of Adhesives
is noteworthy for its low index of refraction and its ability to transmit light very well from 225-2500 nanometers. It is a silicone compound that combines remarkable flexibility, high temperature resistance, superb electrical insulation and outstanding optical clarity. These properties enable it to be used
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Chemicals | Mouser
High Temperature Epoxy Encapsulating and Potting Compound .
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Chemicals | Mouser
High Temperature Epoxy Encapsulating and Potting Compound .
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Chemicals | Mouser
High Temperature Epoxy Encapsulating and Potting Compound .
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N-Reactor Department monthly report, November 1964
This is believed to have resultad from softening of the epoxy potting compound ° The transducers are being replacel by high tem- perature ceramic units.
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Professional resources
The completely revised handbook is a source of technical data for the use of high temperature ad- hesives, putties, epoxies , conductive materials, pot- ting compounds , machin- able ceramics, refractory materials, insulation pro- ducts, and protective coatings.
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Synthesis and properties of a low hygrothermal stress epoxy molding compound for electronic encapsulation
In a microelectronic packaging process, the epoxy molding compounds are transferred from a low- tem- perature transfer pot to high -temperature mold cavi- ties wherein the crosslinking reaction takes place.
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Evaluation of a 4 mm x 4 mm SiC GTO at Temperatures up to 150°C and Varying Pulse Width
Two of the devices were packaged with a green, silicon-based potting compound for high voltage insulation, two were packaged without insulation, and two were packaged with a hard, high- temperature epoxy .
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Epoxy–imide resins from 2,2‐bis[4‐(4‐trimellitimidophenoxy)phenyl]propane: Adhesive and thermal properties
… research- ers as they combine the versatility and ease of process- ability of epoxy resins and high temperature proper- ties of imide groups.1–12 Epoxy –imide resins are used … … in composites, organic insulators, pot- ting and encapsulating compounds , and adhesives.2–4 In …
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Motorsport Sensor Technology
These parts are encapsulated with a ceramic based potting compound , because the thermal expansion coefficient of epoxy based materials is too high and they do not offer sufficient mechanical support at very high temperature .
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Evaluation of 4 mm x 4 mm Silicon Carbide Thyristors
Two of the devices were packaged with a green, silicon-based potting compound for high voltage insulation, two were packaged bare, without insulation, and two were packaged with a hard, high- temperature epoxy .