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Supplier: Fiber Instrument Sales, Inc./FIS
Description: Excellent for general connector use, room cure in 5-10 minutes
- Cure Type / Technology: Room Temperature Curing
- Industry: Other
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Supplier: Fiber Instrument Sales, Inc./FIS
Description: Excellent for general connector use, heat cure in 30 minutes
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: Other
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol E-04SS amber epoxy adhesive.
- Features: Leveling / Filling Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol 3985 black epoxy adhesive is compatible with ceramic, metal and plastic materials with a 30 min @ 272F cure time. Maximum operating temperature is +300 F.
- Features: Leveling / Filling Compound
- Use Temperature: 300 F
- Viscosity: 50000 cP
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol 3985 black epoxy adhesive is compatible with ceramic, metal and plastic materials with a 30 min @ 272F cure time. Maximum operating temperature is +300 F.
- Features: Leveling / Filling Compound
- Use Temperature: 300 F
- Viscosity: 50000 cP
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol 3335 clear epoxy adhesive is compatible with glass, metal and plastic materials. Delivers great performance with a shear strength of 420 psi and tensile strength of 6755 psi.
- Features: Leveling / Filling Compound
- Viscosity: 5000 to 7000 cP
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Supplier: Henkel Corporation - Electronics
Description: Hysol® GR9851™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages.
- Chemical / Polymer System Type: Epoxy
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: HYSOL ECCOBOND G500 is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. It is used as insulation of copper and other materials and attaching leads to coils.
- Cure Type / Technology: Single Component System
- Industry: Electronics
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
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Supplier: Henkel Corporation - Electronics
Description: HYSOL® ES1301™ is a silica filled epoxy casting system recommended for coils, transformers, and general pupose casting.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System
- Industry: Electronics
- Thermal Conductivity: 0.4200 W/m-K
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Supplier: Henkel Corporation - Electronics
Description: HYSOL ECCOBOND 281 BLK one component epoxy adhesive is formualted for use in applications requiring excellent thermal conductivity. It has high thermal conductivity, good chemical resistance and is electrically insulating. It is designed to not flow or sag even on vertical surfaces.
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE HYSOL EE0182 EB6025 is a two part, white epoxy casting system having low abrasion and rapid gel features.
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite PE 3162 Amber is a two component epoxy adhesive hardener that can be used with a variety of Loctite Hysol resins. High strength with a fast cure speed. 1 qt Can.
- Cure Type / Technology: Two Component System
- Industry: Electronics
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE® 3141 Hysol Epoxy Resin, High Temperature is one part of a two part epoxy system to be used with a variety of LOCTITE Hysol hardeners. The system is formulated for high temperature potting and encapsulating applications.
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Henkel Corporation - Industrial
Description: To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE® E-40EXP Hysol, a two-component, room-temperature-cur ing epoxy potting compound designed to pass UL testing and maintain more than 85% of its
- Cure Type / Technology: Two Component System
- Features: Leveling / Filling Compound
- Thermal Conductivity: 1.25 W/m-K
- Viscosity: 24000 cP
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Supplier: RS Components, Ltd.
Description: Loctite Hysol® 9492â?¢ is a high temperature resistant, two component epoxy adhesive. Loctite Hysol 9492 structural bonding, low viscosity . High-temperature two-components epoxy adhesive. Mix ratio 2:1. Offer superior thermal shock resistance, mechanical, electrical and
- Use Temperature: -67 to 356 F
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Supplier: Henkel Corporation - Industrial
Description: Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE® PE 3164 is a clear epoxy resin hardener which forms a black, fast gelling, low viscosity, room temperature cure potting compound with
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: RS Components, Ltd.
Description: Loctite Hysol 9483 A&B is a general purpose, 2K-Epoxy adhesive, suitable for bonding and potting where optical clarity and high strength are required. Loctite Hysol 9483 structural bonding. Two components epoxy adhesive. Flowable. Ultra clear. Low moisture absorption.
- Chemical / Polymer System Type: Epoxy (EP)
- Use Temperature: -58 to 302 F
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Supplier: RS Components, Ltd.
Description: Loctite® Hysol 3455 A & B is an epoxy resin based two component system with a high concentration of Aluminium fillers. Loctite Hysol 3455 A & B is a five- minute, 2K-Epoxy paste. Non-sag paste. Aluminium filled. High strength. Suitable for repairing and rebuilding worn
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Assessment of Effects of a Radiofrequency Energy Field and Thermistor Location in an Electrode Catheter on the Accuracy of Temperature Measurement
The thermistor was hermetically sealed into the electrode with Hysol epoxy to provide thermal and electrical insula- tion.
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LBNL four-side buttable CCD package development
To determine if the Hysol epoxy is fully compatible with our required epoxy characteristics it was tested for mass loss, outgassing, shear strength, shear modulus, bending modulus, CTE, thermal capacity, thermal conductivity, and radioactivity.
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ES&H development activities for the W89 warhead
Scotchcast 8 Epon 828/U Green HYSOL Epoxy , Sprygap Epoxy/Mica/Z, Red Epoxy glass cloth .
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Return to the shorted and shunted quartz gauge problem: Analysis with the SUBWAY code
The component materials of the gauge and impactor are labeled, with Hysol epoxy beiig used for the potting material in the simulation.
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NanoBiotechnology Protocols
Then seal them at the surface with Hysol Epoxy -Patch and allow to harden for the recommended time (Fig. 3) (see Note 2).
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A disposable flexible skin patch for clinical optical perfusion monitoring at multiple depths
Preheated Loctite 9460 Hysol Epoxy (McMaster-Carr, NJ) was poured into the mold at depths of 3-10 mm and allowed to cure overnight.
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ADVANCED WORKER PROTECTION SYSTEM
Hysol epoxy was selected to glue the hubs in place due to its strength and durability at cryogenic temperatures.
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A multilayer-reflection technique for three-dimensional photoelastic studies of perforated plates in bending
Homalite 100 in several thicknesses was used for the model material in the investigation with lamina- tions cemented with either of two Hysol epoxy resins Nos. 2038 or 2039.
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A bonded polariscope for three-dimensional photoviscoelastic studies
cement formulation consisted of the following: Hysol epoxy resin R9-2039 .
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Finite element analysis on impedance matching layer thickness
Different from Grewe's [3] work, the two part HYSOL epoxy was chosen over SPURR for its simplicity and popularity in the transducer industry.