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Supplier: Fiber Instrument Sales, Inc./FIS
Description: Excellent for general connector use, room cure in 5-10 minutes
- Features: Epoxy (EP), Other
- Cure / Technology: Room Temperature Curing
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Supplier: Henkel Corporation - Electronics
Description: HYSOL ECCOBOND 281 BLK one component epoxy adhesive is formualted for use in applications requiring excellent thermal conductivity. It has high thermal conductivity, good chemical resistance and is electrically insulating. It is designed to not flow or sag even on vertical surfaces.
- Industry: Electronics
- Features: Thermally Conductive
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
- Features: Epoxy (EP)
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol 9459 gray epoxy adhesive with a 60 min @ 250F cure time. Delivers great performance with a shear strength of 3000 psi. Maximum operating temperature is +300 F.
- Viscosity: 40,000 cP
- Use Temperature: 300 F
- Features: Epoxy (EP), Leveling / Filling Compound
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Supplier: Henkel Corporation - Electronics
Description: (Known as LOCTITE HYSOL GR 646HV-L1 Epoxy molding compound ) LOCTITE HYSOL GR 646HV-L1 is recommended for automatic molding operations. It is a green product, low stress, fast cure and delivers outstanding performance and ease of use. It meets UL 94 V-0 flammability at 6.35 mm
- Industry: Electronics
- Chemical System: Epoxy
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol 3981 clear epoxy adhesive is compatible with ceramic, glass, metal and plastic materials with a 35 min @ 212F cure time. Delivers great performance with a shear strength of 4930 psi and tensile strength of 8970 psi. Minimum to maximum operating temperatures are -65 F to
- Viscosity: 5,000 cP
- Use Temperature: -65 to 300 F
- Features: Epoxy (EP), Leveling / Filling Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol E-04SS amber epoxy adhesive.
- Features: Epoxy (EP), Leveling / Filling Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol 9432NA gray epoxy adhesive is compatible with steel materials with a 60 min @ 248F cure time. Delivers great performance with a shear strength of 2850 psi and tensile strength of 7350 psi.
- Viscosity: 225,000 cP
- Features: Epoxy (EP), Leveling / Filling Compound
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL ECCOBOND 281 epoxy paste ) LOCTITE ABLESTIK 281 is a thermally conductive and electrically insulating, one component filled thixotropic paste. It is suitable for use on a wide variety of substrates. It does not contain any solvents and eliminates the need for additional
- Industry: Electronics
- Features: Thermally Conductive
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Supplier: Newark, An Avnet Company
Description: E-20HP(TM) Hysol(R) Epoxy Adhesive, High Performance, 200 ml Dual Cartridge RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: E-20HP(TM) Hysol(R) Epoxy Adhesive, High Performance, 400 ml Dual Cartridge RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: E-20HP(TM) Hysol(R) Epoxy Adhesive, High Performance, 50 ml Dual Cartridge RoHS Compliant: Yes
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL EE1117-HD3561 epoxy system ) LOCTITE STYCAST HD 3561 epoxy system is designed for use as a sealant or for potting electronic devices. It is specially formulated for LED display backfill applications.
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE HYSOL EE0182 EB6025 is a two part, white epoxy casting system having low abrasion and rapid gel features.
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite PE 3162 Amber is a two component epoxy adhesive hardener that can be used with a variety of Loctite Hysol resins. High strength with a fast cure speed. 1 qt Can.
- Industry: Electronics
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE® 3141 Hysol Epoxy Resin, High Temperature is one part of a two part epoxy system to be used with a variety of LOCTITE Hysol hardeners. The system is formulated for high temperature potting and encapsulating applications.
- Chemical System: Epoxy (EP)
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Supplier: Henkel Corporation - Industrial
Description: To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE® E-40EXP Hysol, a two-component, room-temperature-curing epoxy potting compound designed to pass UL testing and maintain more than 85% of its compression
- Viscosity: 24,000 cP
- Thermal Conductivity: 1.25 W/m-K
- Features: Epoxy (EP), Leveling / Filling Compound
- Cure / Technology: Two Component System
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Supplier: DigiKey
Description: LOCTITE HYSOL E60NC/260NC 50ML
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Assessment of Effects of a Radiofrequency Energy Field and Thermistor Location in an Electrode Catheter on the Accuracy of Temperature Measurement
The thermistor was hermetically sealed into the electrode with Hysol epoxy to provide thermal and electrical insula- tion.
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LBNL four-side buttable CCD package development
To determine if the Hysol epoxy is fully compatible with our required epoxy characteristics it was tested for mass loss, outgassing, shear strength, shear modulus, bending modulus, CTE, thermal capacity, thermal conductivity, and radioactivity.
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ES&H development activities for the W89 warhead
Scotchcast 8 Epon 828/U Green HYSOL Epoxy , Sprygap Epoxy/Mica/Z, Red Epoxy glass cloth .
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Return to the shorted and shunted quartz gauge problem: Analysis with the SUBWAY code
The component materials of the gauge and impactor are labeled, with Hysol epoxy beiig used for the potting material in the simulation.
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NanoBiotechnology Protocols
Then seal them at the surface with Hysol Epoxy -Patch and allow to harden for the recommended time (Fig. 3) (see Note 2).
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A disposable flexible skin patch for clinical optical perfusion monitoring at multiple depths
Preheated Loctite 9460 Hysol Epoxy (McMaster-Carr, NJ) was poured into the mold at depths of 3-10 mm and allowed to cure overnight.
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ADVANCED WORKER PROTECTION SYSTEM
Hysol epoxy was selected to glue the hubs in place due to its strength and durability at cryogenic temperatures.
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A multilayer-reflection technique for three-dimensional photoelastic studies of perforated plates in bending
Homalite 100 in several thicknesses was used for the model material in the investigation with lamina- tions cemented with either of two Hysol epoxy resins Nos. 2038 or 2039.
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A bonded polariscope for three-dimensional photoviscoelastic studies
cement formulation consisted of the following: Hysol epoxy resin R9-2039 .
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Finite element analysis on impedance matching layer thickness
Different from Grewe's [3] work, the two part HYSOL epoxy was chosen over SPURR for its simplicity and popularity in the transducer industry.