Products & Services
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Supplier: JC Cherry, Inc.
Description: High Current High Speed Interface Manual/Handler/Burn in ●Test socket for CCD and CMOS sensor. ?Customizable for various package such as BGA, LGA, PGA. ?Using our high reliable spring probes, stamping pins and socket pins. ?We manufacture test sockets for
- Contact Resistance: 200 milliohms
- Contacts Pitch: 0.2500 mm
- Current Rating: 0.5000 amps
- Operating Temperature: -40 to 150 C
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Supplier: JC Cherry, Inc.
Description: Actual use PC board Mounting sockets Screw Mount Type/Surface Mount Type Application ?Research and Development. ?Mounting on PCB for mass-production. ?Final test and inspection at real environment. ?Failure analysis.
- Product Type: IC Socket
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Supplier: Aries Electronics, Inc.
Description: FEATURES Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating, Nickel Plating
- Contacts Pitch: 0.4000 to 0.4500 mm
- Features: Solderless, Clamshell Socket
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GQ Frame Series Can also be used as Burn in Socket ?High reliability ?Cost competitive ?Temperature: -40 to +150? For SOP Device, LGA Device
- Contact Resistance: 50 milliohms
- Contacts Pitch: 0.4000 to 1.5 mm
- Dielectric Withstanding Voltage: 0.5000 kilovolts
- Insulation Resistance: 100 Mohms
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Supplier: Aries Electronics, Inc.
Description: .4mm to 5.0mm Easy to use removal and insertion tool shipped with every order Replaceable contact strips available in just 1 week Socket alignment pins provide accurate socket location to test board Frequency response data available up to 19GHz
- Contact Plating: Gold Plating, Nickel Plating
- Contact Resistance: 70 milliohms
- Package Type: Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: JC Cherry, Inc.
Description: Test Head ?Suitable for measuring and verifying test sockets, and mount on the board (Burn-In Board). ?Contact method is adopt probe pin which allow easy to measure. ?We are able to design and manufacture according to your specifications, please feel free to contact us.
- Contact Resistance: 200 milliohms
- Insulation Resistance: 100 Mohms
- Package Type: Test / Prototyping Socket
- Product Type: IC Socket, IC Headers
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Supplier: Aries Electronics, Inc.
Description: FEATURES Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket Accepts SOIC Gull-wing and J-lead devices, up to 44 pins on 0.050 [1.27] lead pitch, body
- Contact Plating: Gold Plating, Nickel Plating
- Current Rating: 1 amps
- Features: ZIF Lock, Clamshell Socket
- Military Standards: Other
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Supplier: Aries Electronics, Inc.
Description: standard 13x13 to 21x21 grid GENERAL SPECIFICATIONS SOCKET BODY: black UL 94V-0 Polyphenylene Sulfide (PPS) CONTACTS: BeCu 174, 1/2-hard or Spinodal BeCu CONTACT PLATING: Options: 30µ [0.76µ] min. Au per MIL-G-45204 on contact area, 200µ
- Contact / Pin Type: Solder Tail Pins
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 2.54 mm
- Current Rating: 1 amps
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Supplier: Advanced Interconnections Corp.
Description: Advanced designs and manufactures hundreds of RoHS Compliant screw-machined terminals for our high quality sockets, adapters, and connectors. Advanced also offers a complete line of EMC insulated and non-insulated terminals and test jacks for RoHS Exempt applications.
- Contact / Pin Type: Solder Tail Pins
- Contact Plating: Other
- Product Type: IC Headers
- RoHS Compliant: Yes
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Supplier: Advanced Interconnections Corp.
Description: Advanced's Test Point Pins are precision machined from Brass Copper Alloy can be individually packaged in tape and reel pockets to facilitate automated insertion. To further reduce processing costs when used on surface mount PC boards, Test Pins with unique solder preforms are
- Contact / Pin Type: Solder Tail Pins
- Contact Plating: Gold Plating, Other
- Mounting: SMT
- Product Type: IC Headers
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Supplier: Molex Signal Tech Industrial Ltd.
Description: Galileo is an advanced “quick-turn universal” test socket that leverages elastomeric technology, delivers industry-leading electrical performance with unprecedented lead time. Suitable for benchtop, characterization, debug, and failure analysis applications where a high
- Package Type: LGA, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Molex Signal Tech Industrial Ltd.
Description: Customized test sockets for any IC packages. Suitable for lab, Engineering, SLT & ATE test application. Wide selection of Smiths Interconnects spring pins with low and stable contact resistance. World class design, Lab and manufacturing facility to ensure consistence
- Package Type: Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: IC & Component Sockets 28P TEST SOCKET T
- Package Type: Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: DigiKey
Description: TEST CLIP DIP 24 (2 x 12)
- Probe Configuration: Pin and Socket
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Supplier: DigiKey
Description: "DIP, .600"" Test Clip 36 (2 x 18)"
- Approvals: Other
- Probe Configuration: Pin and Socket
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Supplier: DigiKey
Description: "DIP, .900"" Test Clip 64 (2 x 32)"
- Probe Configuration: Pin and Socket
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Supplier: DigiKey
Description: "DIP, .300"" Test Clip 28 (2 x 14)"
- Probe Configuration: Pin and Socket
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Supplier: Powell Electronics, Inc.
Description: IC & Component Sockets DIP TEST SCKT
- Package Type: DIP, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: IC & Component Sockets DIP TEST SCKT TIN
- Package Type: DIP, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: IC & Component Sockets DIP TEST SCKT
- Package Type: DIP, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Staubli Electrical Connectors
Description: Made of hard-drawn copper alloy for grasping IC legs, plug pins and bare wire connections. Grasped objects are pressed against the tip of the insulator under spring pressure. The low weight of the clip imposes hardly any load even on critical contacts. Ø 2 mm rigid socket in insulator.
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Supplier: Twilight Technology Inc.
Description: Twilight Technology, Inc. specializes in IC packaging and testing services focused on providing solutions for high reliability applications or obsolete components. Twilight Technology has manufactured and marketed a variety of standard and proprietary semiconductor packaging
- Product Type: IC Socket, IC Headers
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Supplier: VAST STOCK CO., LIMITED
Description: Pin & Socket Connectors 05P PLUG TEST 94VO
- Product Type: IC Socket
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Supplier: RS Components, Ltd.
Description: SO TEST SOCKET - IC Sockets - Test & Burn In Sockets
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 1.27 mm
- Current Rating: 1 amps
- Number of Contacts: 16
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Supplier: Advanced Interconnections Corp.
Description: BGA Socketing Systems from Advanced offer an economical and dependable alternative to direct device attach. Our patented SMT designs are field-proven in production, development, programming and test applications. Compact designs and patented features offer you cost effective solutions
- Features: Machined Pins, Open Top Socket
- Output (Bottom) Side Package: BGA, LGA
- Product Type: Package Adapters / Converters, Programming Adapters
- RoHS Compliant: Yes
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Supplier: Ironwood Electronics, Inc.
Description: GHz BGA sockets provide 6.5 to 10 GHz bandwidth in a small, cost effective ZIF socket for prototype and test applications. The GHz BGA socket is a simple mechanical socket based on elastomer connector technology. The GHz socket is a solder-less socket
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 1 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: E-Z-HOOK, a division of Tektest, Inc.
Description: surface mount devices or where connection point is small in order to test electronic components connections; popular as an oscilloscope probe. Mates with 0.030? diameter socket E-Z-Hook test lead or patch cord in order to quickly pair with electronic test connectors.
- Attenuation Factor: 1X
- Operating Temperature: 93.33 C
- Probe Configuration: Hook, Spring Loaded
- Probe Type: Voltage
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Supplier: RS Components, Ltd.
Description: The ABI ChipMaster Compact Professional is a hand held out-of-circuit IC tester. The ChipMaster is designed for testing digital ICs with up to 40 pins through a ZIF socket. The ChipMaster includes a search facility for unknown ICs, loop modes for intermittent failure detection,
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Supplier: Ironwood Electronics, Inc.
Description: Our PLCC socket probing adapters plug into PLCC sockets and provide access to all signals at gold plated, 0.025" square test points. The device being tested is housed in a production PLCC socket on the adapter.
- Product Type: IC Probing / Analysis Adapters
- RoHS Compliant: Yes
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Supplier: Ironwood Electronics, Inc.
Description: Ironwood's socket probe adapters provide connections for test equipment to in-circuit DIP and socketed PLCC packages.
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Supplier: Sensata Technologies
Description: Accepts wide range of PGA packages from 8 X 8 through 15 X 15 Carrier can be molded from Electro-Static-Dissi pative (ESD) materials Designed to be used with automatic test handlers For other PGA requirements consult factory Molded for high temperature materials for applications up to 150°C
- Product Type: IC Socket
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Supplier: RS Components, Ltd.
Description: Rigid probes with finger guard and a rear socket receptacle that can accept 4mm shrouded plugs and leads.,The probes have anti-roll bodies and safety caps (removable) to give non-slip contact with IC legs.,Rated 1000V CAT III Voltage Rating = 1kV Current Rating = 1A Colour = Black
- Operating Temperature: -10 to 80 C
- Probe Configuration: Spring Loaded
- Voltage Rating: 1000 volts
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Supplier: ValueTronics International, Inc.
Description: Attenuation Accuracy: ±1% Output Zero: < 4 mV, referred to input Offset Accuracy: ±1%, ±4 mV, referred to input 5 Interchangeable Tips for Probing a Variety of Test Points Replaceable Probe Tip Socket Hands-Free Probing with FreeHand Probe
- Bandwidth: 2500 MHz
- Probe Type: Voltage, Current
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Supplier: Sensata Technologies
Description: Over 100 standard carriers in addition to thousands of custom versions More designs and tooling than any other manufacturer Can be molded of Electro-Static-Dissi pative (ESD) materials Used to fully automate handling, testing and processing Notches on the carrier body assure proper
- Product Type: IC Socket
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Supplier: RS Components, Ltd.
Description: 14w test socket machined contacts - IC Sockets - IC Socket Adapters
- Product Type: Package Adapters / Converters
Find Suppliers by Category Top
Featured Products Top
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The Levan Elastomeric socket family is engineered specifically with precision. The elastomeric grid of Levan features conductive columns that guarantee accurate and consistent test results across a spectrum of devices. The conductive columns in the elastomeric grid ensure accurate and (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
, Kepler is the only solution that provides two-axis of motion during a single actuation of the socket, an innovation set to pioneer the semiconductor test industry. As a result, Kepler provides a boosted first pass yield (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
At Smiths Interconnect, we are constantly striving to exceed the evolving demands of the semiconductor industry. The Davinci 112 test socket, and expansion of the DaVinci Series, is designed to tackle some of the most complex challenges in testing Application Specific Integrated Circuits (ASICs (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
Smiths Interconnect, a division of Smiths Group plc, announces that it has completed the acquisition of Plastronics Sockets & Connectors (“Plastronics”), a leading supplier of burn-in test sockets and patented spring probe contacts for the semiconductor test market segment (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
Smiths Interconnect today announced the launch of DaVinci Gen V, the latest flagship product in its DaVinci series portfolio. The product rigorously tests semiconductor chips during the manufacturing process to ensure they provide ultra-reliable and repeatable performance. This is important (read more)
Browse IC Interconnect Components Datasheets for Molex Signal Tech Industrial Ltd. -
The Future of Clocks is in Small Silicon Machines For the past 15 years, I've focused a lot on the final result of the semiconductor process: the end products. Initially my career started with testing motherboards, before looking into processors, architecture, manufacturing, and (read more)
Browse IC Clocks Datasheets for SiTime Corporation -
operational efficiency. Behind this capability is a sophisticated manufacturing process involving circuit design, wafer fabrication, etching, doping, material deposition, testing, packaging, assembly, and quality control, ensuring consistent performance and long-term dependability. The (read more)
Browse IC Interfaces Datasheets for Win Source Electronics -
bump-on-polymer processes Single and multiple layer Cu redistribution with several polymer repassivation material choices Eutectic Sn/Pb, Pb-free and high-Pb solder alloys Design services and custom test vehicle fabrication Downloads (read more)
Browse IC Interfaces Datasheets for Micross Components, Inc. -
. This solution empowers engineers and professional buyers with a highly configurable, reliable autonomous driving system that supports development, testing, and deployment of advanced self-driving vehicles. With its flexible sensor layout and integration, engineers can optimize the system to meet specific project requirements, improving overall operational efficiency and enhancing user experiences. (read more)
Browse IC Interfaces Datasheets for Nova Technology(HK) Co.,Ltd -
. Applications: Designed for use with surface mount devices or where connection point is small in order to test electronic components connections; popular as an oscilloscope probe. Mates with 0.030″ diameter socket E-Z-Hook test lead or patch (read more)
Browse Electrical Connectors Datasheets for E-Z-HOOK, a division of Tektest, Inc.
Conduct Research Top
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IC Test Sockets Perform Beyond 10GHz
Semiconductor design engineers have been under constant competitive pressure to provide more features and functions, all with lighter weights, smaller sizes, and lower costs.
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Methodical Socket Selection Speeds up Time-to-Market for IC Development Projects
Many products are designed with todays high-performance integrated circuits. Without sockets, the design, testing, and/or production phases of a new product development process will be chaotic. In response to these demanding needs, sockets featuring a wide variety of contacting methods, form
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Spring Pin Socket User Manual
SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted on to a PCB using supplied hardware
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RF Test Sockets: The Key to the Effective Testing of High-Frequency Devices
With rapid and constant advances in silicon technology, today's IC packages are continually changing both inside and out. The inside of the package is holding more transistors per square millimeter. The outside of the package is constantly being trimmed and reconfigured to approach the size
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
on marketing. IC-packaging and test subcontractors appear to be in the best financial shape in recent memory and are chanting the famous line in the movie classic Network: "I'm mad as hell, and I'm not going to take it anymore! " Hot products: 10-GHz BGA socket, automotive MCU Among the hottest
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
MPU analyst returns to research with ARC Cores A-Tech chairman from Korea becomes SEMI chairman BTU's thermal system sales heat up 46% in Q2 TelCom disputes report, says business with Motorola cell phones remains strong IC vendors vie for 3G cell phone sockets in Japan Anadigics, TriQuint prepare
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
VSIA says more designers adopt its methods The IC design community is starting to adopt the work of the Virtual Socket Interface Alliance (VSIA), which is trying to simplify the mixing and matching of virtual components for designers struggling with increased complexity and greater time-to-market
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