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Supplier: ROHM Semiconductor USA, LLC
Description: ROHM's switching diodes, including diode arrays, are available in high-reliability packages and stable supply for various applications.
- IF: 150000 mA
- RoHS Compliant: Yes
- Tj: -55 to 150 C
- VF: 1.3 volts
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Supplier: Accuris
Description: JEDEC Module Sideband Bus (SidebandBus)
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Supplier: Aries Electronics, Inc.
Description: OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. Will plug into standard PGA socket
- Contact / Pin Type: Wire Wrap Pins
- Contact Plating: Nickel Plating, Other
- Mounting: Through-hole
- Number of Contacts: 132
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Supplier: Accuris
Description: JEDEC Memory Device Management Standard \x96 for Compute Express Link (CXL)
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Supplier: Accuris
Description: JEDEC Memory Controller Standard \x96 for Compute Express Link (CXL)
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Supplier: Accuris
Description: Monotonic Bend Characterization of Board-Level Interconnects
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Description: changes with respect to the previous edition: - adoption and modification of STACK Specification S/0001 revision 14 notice 3, update of IEC semiconductor test methods; - update of JEDEC semiconductor test methods; - including addition of JEP148A, based on the Physics of Failure Risk and
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Supplier: SAE International
Description: This document has been formulated as a suggested guide in assisting EIA Engineering Department Panels and JEDEC Councils in cooperating with the Defense Department and other Federal agencies in the preparation of suggested reliability requirements for various types of electronic products as
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Description: . This edition constitutes a technical revision. This standard is based upon ANSI/ESDA/JEDEC JS-001-2014. It is used with permission of the copyright holders, ESD Association and JEDEC Solid state Technology Association. This edition includes the following significant technical
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Description: revision. The main changes are as follows: - to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C; - reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1; - update for lead-free solder; - correct certain errors in the original Edition 1.
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Description: IEC 60749-20-1:2019 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC
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Supplier: ASTM International
Description: and evaluation of test structures for this test method, the reader is referred to the EIA/JEDEC Standard 35-1. 1.4 Failure criteria specified in this test method include both the fixed current limit (soft) and destructive (hard) types. In the past, use of a fixed current limit of 1 µA
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Supplier: Advantech
Description: Increased Bandwidth, up to 2600 Mbps Industrial Stand 30u Gold Plating Enhanced Power Efficiency RoHS compliant & Complies with JEDEC standards Up to 32GB
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Supplier: Advantech
Description: Increased Bandwidth, up to 2600 Mbps Industrial Stand 30u Gold Plating Enhanced Power Efficiency RoHS compliant & Complies with JEDEC standards Up to 32GB
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Supplier: Advantech
Description: Increased Bandwidth, up to 2600 Mbps Industrial Stand 30u Gold Plating Enhanced Power Efficiency RoHS compliant & Complies with JEDEC standards Up to 32GB
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Supplier: Advantech
Description: Increased Bandwidth, up to 2600 Mbps Industrial Stand 30u Gold Plating Enhanced Power Efficiency RoHS compliant & Complies with JEDEC standards Up to 32GB
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Supplier: ASTM International
Description: each wafer in each case. For a more detailed discussion of the design and evaluation of test structures for this test method, the reader is referred to the EIA/JEDEC Standard 35-1. 1.4 Failure criteria specified in this test method include both the fixed current limit (soft) and
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Supplier: Nexperia B.V.
Description: .35 mm 16-terminal XQFN16 package; pitch 0.4 mm Latch-up performance exceeds 100 mA per JESD78 Class II.A ESD protection: HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V IEC61000
- Features: ESD Protection?
- Input Voltage: 1.1 to 1.95 volts
- Logic Family: Standard CMOS
- Operating Temperature: -40 to 85 C
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Supplier: Nexperia B.V.
Description: symmetrical output characteristics Complies with JEDEC standard JESD 13-B ESD protection: HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V Specified from -40 °C to +85 °C
- Features: RoHS Compliant, ESD Protection?
- Logic Family: Standard CMOS
- Operating Temperature: -40 to 85 C
- Output Type: 3-State
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Supplier: Nexperia B.V.
Description: Power-down mode operation Inputs accept voltages up to 5.5 V ESD protection: HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2500 V for A port HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 15000 V for B port CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds
- Features: RoHS Compliant, ESD Protection?
- Input Voltage: 1.2 to 3.6 volts
- Logic Family: Standard CMOS
- Operating Temperature: -40 to 125 C
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Supplier: Nexperia B.V.
Description: Power-down mode operation Inputs accept voltages up to 5.5 V ESD protection: HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2500 V for A port HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 15000 V for B port CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds
- Features: RoHS Compliant, ESD Protection?
- Input Voltage: 1.2 to 3.6 volts
- Logic Family: Standard CMOS
- Operating Temperature: -40 to 125 C
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Supplier: Richardson RFPD
Description: -Q Inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil standards. Finishes are available in RoHS compliant Sn.
- DCR: 0.4800 ohms
- Inductance Range: 0.0047 microH
- Rated DC Current: 195 milliamps
- SRF: 7000 MHz
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Supplier: Richardson RFPD
Description: technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil standards. Finishes are available in RoHS compliant Sn.
- DCR: 0.1000 ohms
- Inductance Range: 9.00E-4 microH
- Rated DC Current: 835 milliamps
- SRF: 20000 MHz
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Supplier: Richardson RFPD
Description: . MLO Tight Tolerance Inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil standards. Finishes are available in RoHS compliant Sn.
- DCR: 0.1500 ohms
- Inductance Range: 0.0015 microH
- Rated DC Current: 295 milliamps
- SRF: 7000 MHz
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Supplier: Infineon Technologies AG
Description: Soft-switching 1200 V, 40 A Emitter Controlled 7 silicon diode in TO-247-2 2pin package. Summary of Features Low forward voltage (VF) Very soft and fast recovery behavior Low reverse recovery charge HV-H3TRB pass by JEDEC Standard
- Diode Applications: Power Diode
- IF: 42000 to 67000 mA
- IR: 0.0200 to 20000 mA
- RoHS Compliant: Yes
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Supplier: Infineon Technologies AG
Description: Soft-switching 1200 V, 120 A Emitter Controlled 7 silicon diode in TO-247-2 2pin package. Summary of Features Low forward voltage (VF) Very soft and fast recovery behavior Low reverse recovery charge HV-H3TRB pass by JEDEC Standard
- Configuration: Single
- IF: 120000 to 177000 mA
- IFSM: 420 amps
- IR: 0.0200 mA
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Supplier: Infineon Technologies AG
Description: 150V Single N-Channel HEXFET Power MOSFET in a D2-Pak package Benefits Optimized for broadest availability from distribution partners Product qualification according to JEDEC standard Optimized for 10 V gate-drive voltage (called normal level
- Package Type: TO-263, Other
- Polarity: N-Channel, Other
- Transistor Type: MOSFET, Power MOSFET
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Supplier: Infineon Technologies AG
Description: 60V Single N-Channel HEXFET Power MOSFET in a D2-Pak package Benefits Optimized for broadest availability from distribution partners Product qualification according to JEDEC standard Optimized for 10 V gate-drive voltage (called normal level
- Package Type: TO-263, Other
- Packing Method: Tape Reel, Shipping Tube / Stick Magazine, Other
- Polarity: N-Channel, Other
- TJ: 175 C
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Supplier: OSRAM Opto Semiconductors
Description: FIREFLY 0402, red (R), SMT package, standard SMT footprint 0402, colorless diffused resin Product Features Package: SMT package standard SMT footprint 0402 colorless diffused resin Color: red (625 nm) Viewing angle at 50 % IV: 140 (horizontal)165
- Color: Red
- Peak Wavelength: 625 nm
- Viewing Angle: 140 to 165 degrees
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Supplier: ROHM Semiconductor GmbH
Description: power supply bias requirement of 3.3V to 5.0V for driving the N-channel MOSFET. By employing an independent reference voltage input (VDDQ) and a feedback pin (VTTS), this termination regulator provides excellent output voltage accuracy and load regulation as required by JEDEC
- IC Package Type: Other
- Operating Temperature: -30 to 100 C
- Output Current (IOUT): 1 amps
- Regulated Output Voltage (Volt): 0.7500 to 1.25 volts
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Supplier: ROHM Semiconductor USA, LLC
Description: power supply bias requirement of 3.3V to 5.0V for driving the N-channel MOSFET. By employing an independent reference voltage input (VDDQ) and a feedback pin (VTTS), this termination regulator provides excellent output voltage accuracy and load regulation as required by JEDEC
- IC Package Type: Other
- Operating Temperature: -30 to 100 C
- Output Current (IOUT): 1 amps
- Regulated Output Voltage (Volt): 0.7500 to 1.25 volts
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Supplier: Integrated Device Technology
Description: 14-bit registered buffer designed for 2.3V-2.7V. VDD for PC1600 - PC2700 , and 2.5V-2.7V VDD for PC3200 , and supports low standby operation. All data inputs and outputs are SSTL_2 levelcompatible with JEDEC standard for SSTL_2.
- Device Type / Applications: Buffer
- IC Package Type: TSSOP
- Pin Count: 48 #
- TJ: 0.0 to 70 C
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Supplier: Richardson RFPD
Description: Low gate charge, low output charge Qualified for industrial applications according to JEDEC Standards ESD safeguard RoHS, Pb-free, REACH-compliant Applications DCM/BCM PFC AHB/LLC/QR Flyback/ACF DC DC Converter LED Driver Fast battery charger Standard adaptor
- Package Type: Other
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Supplier: Cypress Semiconductor Corp.
Description: requires only a single 3.0V power supply for read and write functions and is entirely command set compatible with the JEDEC Flash standards. The Cypress AL NOR Flash family is a standard mode Flash with extended temperature support. Each device requires only a single 3.0V power
- Density: 8000 to 2.00E6 kbits
- IC Package Type: TSOP, Other
- Memory Category: Flash
- Supply Voltage: 1.8 V, 3 V
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Supplier: CSA Group
Description: changes with respect to the previous edition: - adoption and modification of STACK Specification S/0001 revision 14 notice 3, update of IEC semiconductor test methods; - update of JEDEC semiconductor test methods; - including addition of JEP148A, based on the Physics of Failure Risk and
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Rambus targeted by FTC probe The Federal Trade Commission has launched a preliminary investigation of Rambus Inc. for possible antitrust violations stemming from the company's dealings with the JEDEC standards deliberation body. Semiconductor Alert! (Jan. 29-Feb. 2) Commentary & analysis of week's
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
In a rare move, the JEDEC standards body is considering a specification that would result in a modified, or look-alike, DDR-II memory chip aimed at graphics cards. IEDM sees strained, fully depleted future The 48th International Electron Devices Meeting, planned for Dec. 8-11 in San Francisco, may
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
to disclose its SDRAM patent applications to the JEDEC standards body in the 1992-96 time period. NEC to cut 700 jobs, close IC assembly/test unit in California ROSEVILLE, Calif. -- NEC Corp. today (April 6) announced it was eliminating 700 jobs and restructuring its manufacturing operations here. As part
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Heard on the Beat (March 29) Heard on the Beat (March 29) JEDEC forms new IC standards group to make 802.11 WLANs fly ARLINGTON, Va. -- Will the wireless local-area networking (WLAN) market finally take off? JEDEC here is attempting to make the WLAN market fly by confirming the formation of a new
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
devises photonic SOI technology Silicon Genesis Corp.(SiGen), a developer of silicon-on-insulator (SOI) wafer technologies, claims to have integrated a single-chip opto-electronics device into standard silicon chip processing into what its calls "NanoPhotonic SOI. " Appeals court denies rehearing
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S2083: Surface Mounting Instructions for PQFN Packages
. These considerations apply in general for most of M/A-COM's surface mount packaged IC's. This application note provides specific guidelines for mounting the fine pitch quad flat no lead packages (PQFN per JEDEC MO-220), also known as MLP, MLF, or FQFP-N packages. The first consideration in mounting the PQFN