Jedec Standard

Description: ROHM's switching diodes, including diode arrays, are available in high-reliability packages and stable supply for various applications.

• V_F: 1.3 volts
• I_F: 150,000 mA
• VR: 75 volts
• T_j: -55 to 150 C

Description: JEDEC Memory Controller Standard \x96 for Compute Express Link (CXL)

Description: Notification Standard for Product Discontinuance

Description: JEDEC Memory Device Management Standard \x96 for Compute Express Link (CXL)

Description: Interoperability and Compliance Technical Requirements for JEDEC Standard JESD96A \x96 Recommended Practice for use with IEEE 802.11n

Description: document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation. 14 pages. Released June 2004.

Description: DESCRIPTION Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board

Description: DESCRIPTION This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices

Description: DESCRIPTION Revision D.1 is a maintenance release to correct some editorial concerns identified by the developing committee. Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state surface mount

Description: standard PGA socket

• Operating Temperature: 105 C
• Number of Contacts: 132
• Contact Plating: Nickel Plating
• Features: Other

Description: Features JEDEC standard 1.5V +/- 0.075V Power Supply Frequency:1066Mhz, 1333Mhz SSTL_15 Interface 8 independent internal bank 8-bit pre-fetch Burst Length: 8, 4 Average Refresh Period 7.8us On Die Termination using ODT pin Asynchronous Reset All of Lead-free products are compliant for

• Capacity: 1,000 to 4,000 MB
• Clock Speed: 1,066 to 1,333 MHz
• Pin Count: 240 #
• Operating Temperature: -40 to 185 F

Description: and take advantage on this product for space/ airflow and heat optimization. Features: Compliant with JEDEC standard RoHS compliant Ver low profile (VLP) at the heitht of 18.75mm Highly reliable - for Mission Critical blade server memory solution

• Capacity: 1,000 to 4,000 MB
• Clock Speed: 400 to 800 MHz
• Pin Count: 240 #
• Operating Temperature: 32 to 185 F

Description: 2 uA (Max.) Quiescent Current, Quad 2-input AND Gate Complies with JEDEC standard no. 8-1A The 74HC⁄HCT08 are high-speed Si-gate CMOS devices and are pin compatible with low power schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A. The

Description: and evaluation of test structures for this test method, the reader is referred to the EIA/JEDEC Standard 35-1. 1.4 Failure criteria specified in this test method include both the fixed current limit (soft) and destructive (hard) types. In the past, use of a fixed current limit of 1 µA

Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 The techniques outlined in this standard are for the purpose of standardizing the procedure of measurement, analysis, and reporting of oxide integrity data between interested parties. This test method makes no

Description: 6.0 V (Max.) Supply Voltage, +⁄- 20 mA Clamp Diode Current, Quad 2-Input NAND Gates Complies with JEDEC standard no. 8-1A ESD protection: HBM EIA⁄JESD22-A114-A exceeds 2000 V, MM EIA⁄JES It is high-speed silicone-gate CMOS devices and are pin compatible with low power schottkyy TTL

Description: Complies with JEDEC standard no. 7A ESD protection: HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V Specified from -40 °C to +85 °C and from -40 °C to +125 °C

• Propagation Delay: 11 ns
• Operating Temperature: -40 to 125 C
• Supply Voltage: 5 V
• Gate Type: NAND

Description: 3-State, DIP20 Package, -40 to +125°C Operating Temperature, Octal Bus Tranceivers Octal bidirectional bus interface Complies with JEDEC standard no. 7A ESD protection:

Description: Quad 2-input Exclusive-OR Gate SOIC Package, ICs Output capability is standard ICC category is SSI It is high-speed Si-gate CMOS devices and are pin compatible with low power schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A. It provide the

Description: with JEDEC standard JESD 13-B ESD protection: HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V Specified from -40 °C to +85 °C

• Propagation Delay: 20 ns
• Operating Temperature: -40 to 85 C
• Gate Type: AND
• IC Package Type: Other

Description: (Known as Hysol QMI519 ) LOCTITE ABLESTIK QMI519 is JEDEC L1 260°C for SOIC, industry standard for QFN packages. Industry standard for preplated finishes. Exceptional performance on clean uncoated silver-plated finishes. High adhesion, excellent electrical and thermal

• Thermal Conductivity: 3.8 W/m-K
• Type: Electrically Conductive
• Industry: Electronics (PCB / SMT Assembly)

Description: Complies with JEDEC standard JESD 13-B ESD protection: HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V Specified from -40 °C to +85 °C

• T_J: -40 to 85 C
• Supply Voltage: 3 V, 3.3 V, 3.6V, 5 V
• Features: Other, RoHS Compliant

Description: The 74AHCU04 is high-speed Si-gate CMOS devices and is pin compatible with low power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7A. The 74AHCU04 is a general purpose hex unbuffered inverter. Each of the six inverters is a single stage. Features and

• T_J: -40 to 125 C
• Supply Voltage: 2.5 V, 2.7 V, 3 V, 3.3 V, 3.6V, 5 V
• Device Type: Buffer
• Features: Other

Description: Packages available in JAN, JANTX, JANTXV and JANS levels to MIL-PRF-19500 slash sheets /477. Standard features include: Popular JEDEC registered series, Voidless hermetically sealed glass package, Extremely robust construction, Internal "Category I" Metallurgical bonds.

• V_F: 0.875 to 0.975 volts
• VR: 50 to 150 volts
• I_R: 0.175 to 0.525 mA
• Rectifier Configuration / Technology: Fast / Ultra Fast Recovery Rectifier

Description: 60V Dual N-Channel HEXFET Power MOSFET in a SO-8 package Applications Home appliances Benefits Optimized for broadest availability from distribution partners Product qualification according to JEDEC standard Normal level : Optimized for 10 V gate drive voltage Industry standard

• r_DS(on): 0.0178 ohms
• T_J: 150 C
• V_GS(off): 2 to 4 volts
• Features: MOSFET, Other, Power MOSFET

Description: Soft-switching 1200 V, 60 A Emitter Controlled 7 silicon diode in TO-247-2 2pin package. Summary of Features Low forward voltage (VF) Very soft and fast recovery behavior Low reverse recovery charge HV-H3TRB pass by JEDEC Standard Tvjmax = 175°C Qualified according to JEDEC

• V_F: 2.5 to 3 volts
• I_F: 60,000 to 94,000 mA
• I_R: 0.02 mA
• t_rr: 175 ns

Description: Soft-switching 1200 V, 40 A Emitter Controlled 7 silicon diode in TO-247-2 2pin package. Summary of Features Low forward voltage (VF) Very soft and fast recovery behavior Low reverse recovery charge HV-H3TRB pass by JEDEC Standard Tvjmax = 175°C Qualified according to JEDEC

• V_F: 2.5 to 3 volts
• I_F: 42,000 to 67,000 mA
• I_R: 20,000 to 0.02 mA
• t_rr: 155 ns

Description: Soft-switching 1200 V, 120 A Emitter Controlled 7 silicon diode in TO-247-2 2pin package. Summary of Features Low forward voltage (VF) Very soft and fast recovery behavior Low reverse recovery charge HV-H3TRB pass by JEDEC Standard Tvjmax = 175°C Qualified according to JEDEC

• V_F: 2.5 to 3 volts
• I_F: 120,000 to 177,000 mA
• I_R: 0.02 mA
• t_rr: 215 ns

Description: FIREFLY 0402, red (R), SMT package, standard SMT footprint 0402, colorless diffused resin Product Features Package: SMT package standard SMT footprint 0402 colorless diffused resin Color: red (625 nm) Viewing angle at 50 % IV: 140 (horizontal)165 (vertical) Technology: InGaAlP Thinfilm

• Peak Wavelength: 625 nm
• Viewing Angle: 140 to 165 degrees
• LED Type: Red

Description: The Techni BT2 bright tin process is a low cost bright tin process based on sulfuric acid. It is designed for rack and barrel plating applications. The bright tin deposits have excellent solderability characteristics and are whisker resistant as defined by JEDEC JESD201A standards

• Chemical / Composition: Tin Plating

Description: 14-bit registered buffer designed for 2.3V-2.7V. VDD for PC1600 - PC2700 , and 2.5V-2.7V VDD for PC3200 , and supports low standby operation. All data inputs and outputs are SSTL_2 levelcompatible with JEDEC standard for SSTL_2.

• T_J: 0 to 70 C
• Pin Count: 48 #
• Device Type: Buffer
• Package Type: TSSOP

Description: 13-bit to 26-bit registered buffer designed for 2.3V-2.7V VDD for PC1600 - PC2700 and 2.5V-2.7V VDD for PC3200 , and supports low standby operation. All data inputs and outputs are SSTL_2 level compatible with JEDEC standard for SSTL_2.

• T_J: 0 to 70 C
• Pin Count: 64 #
• Device Type: Buffer
• Package Type: TSSOP

Description: supply bias requirement of 3.3V to 5.0V for driving the N-channel MOSFET. By employing an independent reference voltage input (VDDQ) and a feedback pin (VTTS), this termination regulator provides excellent output voltage accuracy and load regulation as required by JEDEC standards.

• Regulated Output Voltage (V_olt): 0.75 to 1.25 volts
• Output Current (I_OUT): 1 amps
• Operating Temperature: -30 to 100 C
• Input Voltage (V_IN): 2.7 to 5.5 volts