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Supplier: ROHM Semiconductor USA, LLC
Description: ROHM's switching diodes, including diode arrays, are available in high-reliability packages and stable supply for various applications.
- IF: 150000 mA
- RoHS Compliant: Yes
- Tj: -55 to 150 C
- VF: 1.3 volts
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Supplier: Accuris
Description: JEDEC CATALOG OF STANDARDS AND PUBLICATIONS
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Supplier: Aries Electronics, Inc.
Description: OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. Will plug into standard PGA socket
- Contact / Pin Type: Wire Wrap Pins
- Contact Plating: Nickel Plating, Other
- Mounting: Through-hole
- Number of Contacts: 132
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Supplier: Accuris
Description: JEDEC MODULE SIDEBAND BUS (SIDEBANDBUS)
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Supplier: Accuris
Description: JEDEC ATTENTION LABELS FOR ELECTROSTATIC SENSITIVE DEVICES
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Supplier: SAE International
Description: This document has been formulated as a suggested guide in assisting EIA Engineering Department Panels and JEDEC Councils in cooperating with the Defense Department and other Federal agencies in the preparation of suggested reliability requirements for various types of electronic products as
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Description: changes with respect to the previous edition: - adoption and modification of STACK Specification S/0001 revision 14 notice 3, update of IEC semiconductor test methods; - update of JEDEC semiconductor test methods; - including addition of JEP148A, based on the Physics of Failure Risk and
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Supplier: Allied Electronics, Inc.
Description: 2 uA (Max.) Quiescent Current, Quad 2-input AND Gate Complies with JEDEC standard no. 8-1A The 74HC/HCT08 are high-speed Si-gate CMOS devices and are pin compatible with low power schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A. The
- Gate Type: AND
- Logic Family: Standard CMOS / CMOS 4000
- Number of Inputs: 2
- Operating Temperature: -40 to 125 C
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Supplier: Allied Electronics, Inc.
Description: input UsefUL as a 3 to 8 active high decoder The 74HC123; 74HCT123 are high-speed Si-gate CMOS devices and are pin compatible with low power schottkyy TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A.
- IC Package Type: DIP
- Logic Family: Standard CMOS / CMOS 4000
- Operating Temperature: Over -40 C
- Pin Count: 16
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Supplier: Allied Electronics, Inc.
Description: compatible with “4060” of the “4000B” series. They are specified in compliance with JEDEC standard no. 7A. It is 14-stage ripple-carry counter/dividers and oscillators with three oscillator Q11 to Q13 == LOW), independent of other input conditions.
- IC Package Type: Other
- Logic Family: Standard CMOS / CMOS (4000)
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Supplier: Advantech
Description: Increased Bandwidth, up to 2600 Mbps Industrial Stand 30u Gold Plating Enhanced Power Efficiency RoHS compliant & Complies with JEDEC standards Up to 32GB
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Supplier: Allied Electronics, Inc.
Description: 3-State, DIP20 Package, -40 to +125°C Operating Temperature, Octal Bus Tranceivers Octal bidirectional bus interface Complies with JEDEC standard no. 7A ESD protection:
- Device Type / Applications: Transceiver, Other
- IC Package Type: DIP
- TJ: Over -40 C
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Supplier: Richardson RFPD
Description: -Q Inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil standards. Finishes are available in RoHS compliant Sn.
- DCR: 0.4800 ohms
- Inductance Range: 0.0047 microH
- Rated DC Current: 195 milliamps
- SRF: 7000 MHz
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Supplier: Nexperia B.V.
Description: Power-down mode operation Inputs accept voltages up to 5.5 V ESD protection: HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2500 V for A port HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 15000 V for B port CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds
- Features: RoHS Compliant, ESD Protection?
- Input Voltage: 1.2 to 3.6 volts
- Logic Family: Standard CMOS
- Operating Temperature: -40 to 125 C
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Supplier: Nexperia B.V.
Description: ; ICC = 0.9 µA (maximum) Latch-up performance exceeds 100 mA per JESD 78 Class II Complies with JEDEC standards: JESD8-12 (0.8 V to 1.3 V) JESD8-11 (0.9 V to 1.65 V) JESD8-7 (1.65 V to 1.95 V) JESD8-5 (2.3 V to 2.7 V) JESD8
- ESD Protection: Yes
- IC Package Type: Other
- Logic Family: Standard CMOS / CMOS 4000, Other
- Operating Temperature: -40 to 125 C
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Supplier: Nexperia B.V.
Description: voltage range from 2.3 V to 3.6 V High noise immunity Complies with JEDEC standard: JESD8-5 (2.3 V to 2.7 V) JESD8-B/JESD36 (2.7 V to 3.6 V) ESD protection: HBM: ANSI/ESDA/Jedec JS-001 Class 2 exceeds 2000 V CDM: ANSI/ESDA/Jedec
- Logic Family: TTL, Standard CMOS / CMOS (4000), Other
- Max Ron: 7 ohms
- On-Chip ESD Protection: Yes
- Operating Ambient Temperature: -40 to 125 C
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Supplier: ASTM International
Description: and evaluation of test structures for this test method, the reader is referred to the EIA/JEDEC Standard 35-1. 1.4 Failure criteria specified in this test method include both the fixed current limit (soft) and destructive (hard) types. In the past, use of a fixed current limit of 1 µA
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Supplier: Nexperia B.V.
Description: exceeds 100 mA per JESD 78 Class II Level B Complies with JEDEC standards: JESD8C (2.7 V to 3.6 V) JESD7A (2.0 V to 6.0)
- Logic Family: Standard CMOS / CMOS (4000), Other
- Operating Ambient Temperature: -40 to 125 C
- Package Type: Other
- Supply Voltage: Other
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Supplier: Infineon Technologies AG
Description: 75V Single N-Channel Power MOSFET in a TO-220AB package Summary of Features Optimized for broadest availability from distribution partners Product qualification according to JEDEC standard Industry standard through-hole power package High
- Package Type: TO-220, Other
- Packing Method: Shipping Tube / Stick Magazine, Other
- Polarity: N-Channel, Other
- TJ: 175 C
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Supplier: OSRAM Opto Semiconductors
Description: FIREFLY 0402, red (R), SMT package, standard SMT footprint 0402, colorless diffused resin Product Features Package: SMT package standard SMT footprint 0402 colorless diffused resin Color: red (625 nm) Viewing angle at 50 % IV: 140 (horizontal)165
- Color: Red
- Peak Wavelength: 625 nm
- Viewing Angle: 140 to 165 degrees
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Supplier: ROHM Semiconductor GmbH
Description: power supply bias requirement of 3.3V to 5.0V for driving the N-channel MOSFET. By employing an independent reference voltage input (VDDQ) and a feedback pin (VTTS), this termination regulator provides excellent output voltage accuracy and load regulation as required by JEDEC
- IC Package Type: Other
- Operating Temperature: -30 to 100 C
- Output Current (IOUT): 1 amps
- Regulated Output Voltage (Volt): 0.7500 to 1.25 volts
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Supplier: ROHM Semiconductor USA, LLC
Description: power supply bias requirement of 3.3V to 5.0V for driving the N-channel MOSFET. By employing an independent reference voltage input (VDDQ) and a feedback pin (VTTS), this termination regulator provides excellent output voltage accuracy and load regulation as required by JEDEC
- IC Package Type: Other
- Operating Temperature: -30 to 100 C
- Output Current (IOUT): 1 amps
- Regulated Output Voltage (Volt): 0.7500 to 1.25 volts
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Supplier: Integrated Device Technology
Description: 13-bit to 26-bit registered buffer designed for 2.3V-2.7V VDD for PC1600 - PC2700 and 2.5V-2.7V VDD for PC3200 , and supports low standby operation. All data inputs and outputs are SSTL_2 level compatible with JEDEC standard for SSTL_2.
- Device Type / Applications: Buffer
- IC Package Type: TSSOP
- Pin Count: 64 #
- TJ: 0.0 to 70 C
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Supplier: Cypress Semiconductor Corp.
Description: requires only a single 3.0V power supply for read and write functions and is entirely command set compatible with the JEDEC Flash standards. The Cypress AL NOR Flash family is a standard mode Flash with extended temperature support. Each device requires only a single 3.0V power
- Density: 8000 to 2.00E6 kbits
- IC Package Type: TSOP, Other
- Pin Count: 48 to 80
- Screening Level: Commercial, Industrial
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Supplier: MagicRAM, Inc.
Description: With its small size and JEDEC MO-297 standard compliant,MagicRAM Slim SATA III SSD is an ideal solution for business-critical embedded,networking and industrial applications. MagicRAM Slim SATA III SSD offers a wide range of features such as S.M.A.R.T.based Life Time Monitoring, TRIM
- Capacity: 1 to 256 GB
- Device Type: Hard Drive, Solid State Disk
- Height: 0.1575 inch
- Interface: Other
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Supplier: Infineon Technologies AG
Description: j(max) of 175°C Qualified according to JEDEC Standard Cooler packages and higher efficiency Excellent EMI behavior Excellent trade- off between cost and performance Low conduction losses Easy paralleling Potential Applications
- Diode Applications: Power Diode
- IF: 30000 to 52300 mA
- IR: 0.0500 mA
- RoHS Compliant: Yes
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Supplier: Greenwich Instruments Ltd.
Description: The range of non-volatile lithium battery backed memory devices have been established over two decades. We offer industry standard JEDEC pinouts for NV RAM in the following configurations: 2k x 8 (16K bit), 8k x 8 (64K bit), 32k x 8 (256K bit), 128k x 8 (1024K bit). All of these
- Bits per Word: 8 bits
- Data Retention: 10 years
- Density: 16 kbits
- IC Package Type: DIP, Other
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Supplier: CSA Group
Description: changes with respect to the previous edition: - adoption and modification of STACK Specification S/0001 revision 14 notice 3, update of IEC semiconductor test methods; - update of JEDEC semiconductor test methods; - including addition of JEP148A, based on the Physics of Failure Risk and
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Supplier: Advantech
Description: SQFlash 830 series mSATA delivers all the advantages of SATA III Disk and compliant with standard mSATA F/F which is generated by JEDEC and could provide a wide range capacity from 64GB to 1TB for MLC and 64GB to 512GB for uMLC which delivers the read /write performance up to 561/534
- Memory Size: 256 GB
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Supplier: Richardson RFPD
Description: printed circuit board. The SMT package can support frequencies up to 6 GHz. MLOTM crossovers have been subjected to JEDEC reliability standards and 100% electrically tested. The RF-DC crossovers are available in NiSn.
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Supplier: Integrated Device Technology
Description: 1.8V Digital temperature sensor with accuracy up to ±0.5°C, designed to target applications demanding highest level of temperature readout. The sensor is fully compliant with JEDEC JC42 .4 Component Specification. The digital temperature sensor comes with several user
- Input (Supply) Voltage: 1.8 volts
- Operating Temperature: 0.0 to 70 C
- Sensor Type: Temperature Sensor
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Supplier: MACOM
Description: Packages available in JAN, JANTX, JANTXV and JANS levels to MIL-PRF-19500 slash sheets /477. Standard features include: Popular JEDEC registered series, Voidless hermetically sealed glass package, Extremely robust construction, Internal "Category I" Metallurgical bonds.
- Diode Applications: Rectifier Diode
- IR: 0.1750 to 0.5250 mA
- VF: 0.8750 to 0.9750 volts
- VR: 50 to 150 volts
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Supplier: Richardson RFPD
Description: Fully qualified to the Industrial JEDEC standard. With the performance advantages of a Silicon Carbide (SiC) Schottky Barrier diode, power electronics systems can expect to meet higher efficiency standards than Si-based solutions, while also reaching higher frequencies and power
- IF: 20000 mA
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Supplier: Renesas Electronics Corporation
Description: The HM-65642 is a CMOS 8192 x 8-bit Static Random Access Memory. The pinout is the JEDEC 28 pin, 8-bit wide standard, which allows easy memory board layouts which accommodate a variety of industry standard ROM, PROM,EPROM, EEPROM and RAMs. The HM-65642 is ideally suited for use
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COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023D AND JEDEC SO-023 The new DDR5 connector with only 287 terminals addresses the resonance from the floating RFU pin 220 which resulted in a margin delta. Both RDIMM and UDIMM versions of the new DDR5 socket are tooled and (read more)
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interconnection to the standard memory modules in communications equipment. Manufactured to JEDEC industry standards for single in-line memory modules (SIMM) and dual in-line memory modules (DIMM), our memory sockets provide end latches for module retention and ejection as well as mechanical voltage (read more)
Browse IC Interconnect Components Datasheets for TE Connectivity -
JEDEC standards and are available in 16GB and 32GB capacities, as 4800MT/s. The Innodisk DDR5 specification details up to four times as much capacity per IC, raising the maximum achievable per die (read more)
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? CDM Electronics can accommodate virtually any testing requirement, including testing performed by our experts at CDM’s manufacturing facilities in Turnersville, NJ. CDM’s credentialed quality technicians are experienced with various IEC, JEDEC, and MIL-STD test standards and ensure accurate and reliable test data. (read more)
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. Product is rapidly transferred between the hot and cold chamber creating a temperature shock of the specimens. These thermal shock chambers meet a variety of test specifications including Mil-Std 810, Mil-Std 883, IEC 60068-2-14, JEDEC and a variety of commercial test standards (read more)
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Flash device. Key Features: ASIL-B compliant and ASIL-D ready: Meets ISO 26262 standard for automotive functional safety IEC-61508 ready Endurance flex architecture: Multiple partitions each configurable to provide up to 25 years of data retention or 1 (read more)
Browse FLASH Memory Chips Datasheets for Infineon Technologies AG -
defined by numerous standards from organizations including the American National Standards Institute (ANSI), JEDEC, and International Electrotechnical Commission (IEC), among others. The human body model (HBM), which approximates a discharge from a charged human fingertip to a grounded device, and (read more)
Browse Modeling and Simulation Software Datasheets for Remcom (USA)
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Rambus targeted by FTC probe The Federal Trade Commission has launched a preliminary investigation of Rambus Inc. for possible antitrust violations stemming from the company's dealings with the JEDEC standards deliberation body. Semiconductor Alert! (Jan. 29-Feb. 2) Commentary & analysis of week's
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
In a rare move, the JEDEC standards body is considering a specification that would result in a modified, or look-alike, DDR-II memory chip aimed at graphics cards. IEDM sees strained, fully depleted future The 48th International Electron Devices Meeting, planned for Dec. 8-11 in San Francisco, may
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
to disclose its SDRAM patent applications to the JEDEC standards body in the 1992-96 time period. NEC to cut 700 jobs, close IC assembly/test unit in California ROSEVILLE, Calif. -- NEC Corp. today (April 6) announced it was eliminating 700 jobs and restructuring its manufacturing operations here. As part
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Heard on the Beat (March 29) Heard on the Beat (March 29) JEDEC forms new IC standards group to make 802.11 WLANs fly ARLINGTON, Va. -- Will the wireless local-area networking (WLAN) market finally take off? JEDEC here is attempting to make the WLAN market fly by confirming the formation of a new
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
devises photonic SOI technology Silicon Genesis Corp.(SiGen), a developer of silicon-on-insulator (SOI) wafer technologies, claims to have integrated a single-chip opto-electronics device into standard silicon chip processing into what its calls "NanoPhotonic SOI. " Appeals court denies rehearing
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S2083: Surface Mounting Instructions for PQFN Packages
. These considerations apply in general for most of M/A-COM's surface mount packaged IC's. This application note provides specific guidelines for mounting the fine pitch quad flat no lead packages (PQFN per JEDEC MO-220), also known as MLP, MLF, or FQFP-N packages. The first consideration in mounting the PQFN