Leadless Chip Carriers

Description: Leadless Chip Carrier Pinouts Standardized for Linear's

Description: RESISTOR NETWORK, 10 PIN, LEADLESS CHIP CARRIER

Description: RESISTOR NETWORK, 16 PIN, LEADLESS CHIP CARRIER

Description: RESISTOR NETWORK, 6-PIN, LEADLESS CHIP CARRIER

Description: LEADLESS CHIP CARRIER 32P PBT RO

Description: 3.3Vdc HCMOS/TTL SMD Crystal Clock Oscillator|•Low profile, Leadless Chip Carrier (LCC)|•HCMOS/TTL Compatible, 3.3Vdc, 2.5Vdc, & 1.8Vdc options|•Reflow capable, Seam Sealed Package|Applications:|•Clock signaling for μProcessors, PC Motherboards & Graphic Cards|•High output drive

• Oscillation Frequency: 24.576 MHz
• Total Frequency Stability: 20 ppm

Description: NETWORK SURFACE MOUNT LEADLESS CHIP CARRIER RCD has been a key manufacturer of standard and custom Resistors/Capacitors/Coils/Delay Lines for over 40 years. RCD’s USA plant is the home of the SWIFTTM program, and also specializes in military, aerospace and custom/specialty

• Resistance Range: 10 to 10,000,000 ohms
• Standards and Certifications: RoHS Compliant
• Mounting / Packaging: Surface Mount (SMT / SMD)

Description: The OLI110 consists of an LED and N-P-N silicon phototransistor that is electrically isolated, but optically coupled on a ceramic leadless chip carrier (LCC) surface mount package. The epoxy coating on the OLI110 allows the device to withstand normal solvent cleaning operations.

• Isolation Voltage: 1,500 volts
• Output: Phototransistor

Description: The OLS910 consists of a pair of LEDs that are optically coupled to a dielectrically isolated photovoltaic diode array, packaged in a small hermetic leadless chip carrier (LCC). When the LED is energized, the infrared emission is detected by the photovoltaic array and a DC

• Isolation Voltage: 1,500 volts

Description: The OLS303 is suitable for wide bandwidth analog applications. Each OLS303 has an LED and integrated photodiode transistor detector mounted and coupled in a custom hermetic surface mount Leadless Chip Carrier (LCC) ceramic package, that provides 1500 VDC of electrical isolation

Description: API Technologies' line of non-dispersive and dispersive SAW Delay Lines offer semi-standard or custom designs with various delay and bandwidth options. SAW Delay Lines are available in several packaging options such as ceramic leadless chip carriers, which provide small size and

Description: The 66224 is a single channel device electrically similar to the 4N49. This product has been designed to be more tolerant to proton radiation. The 66224 optocoupler is packaged in a hermetically sealed 6 pin leadless chip carrier (LCC). This device available as commercial or

• Isolation Voltage: 1,000 volts
• Rise Time: 20 µs
• Collector Emitter Breakdown Voltage: 40 volts
• Operating Temperature: -55 to 125 C

Description: systems requiring large programs and is organized as 131,072 words of 8 bits. The FDIP32W (window ceramic frit-seal package) and the LCCC32W (leadless chip carrier package) have a transparent lids which allow the user to expose the chip to ultraviolet light to erase the

Description: systems requiring large programs and is organized as 131,072 words of 8 bits. The FDIP32W (window ceramic frit-seal package) and the LCCC32W (leadless chip carrier package) have a transparent lids which allow the user to expose the chip to ultraviolet light to erase the

Description: The HC2700 Series are precision voltage references that use thin film hybrid technology to achieve extremely accurate, low temperature coefficient, 10 volt reference sources. The HC2700LCC Series packages the HC2700, HC2701, and HC2702 in a 28 pin JEDEC compatible leadless chip

Description: phototransistor that is electrically isolated, but optically coupled inside a non-hermetic, four-pin Leadless Chip Carrier (LCC) package. The hermetic surface-mount variant of the OLC049 optocoupler is available as the OLS049, both in a non-screened catalog version as well as a

• Isolation Voltage: 1,000 volts
• Output: Phototransistor

Description: The HMC908A is a compact, gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), inphase/ quadrature (I/Q) downconverter in a leadless, RoHS compliant ceramic leadless chip carrier. This device provides a small signal conversion gain of 11 dB with a

• Input Frequency Range: 9,000 to 12,000 MHz
• Output Frequency Range: 0 to 3,500 MHz
• Conversion Gain: 11 dB
• Noise Figure: 2 dB

Description: The HMC557A is a general purpose, double balanced mixer in a 24-terminal, ceramic leadless chip carrier, RoHS-compliant package. The device can be used as an upconverter or down-converter from 2.5 GHz to 7.0 GHz. This mixer is fabricated in a gallium arsenide (GaAs) metal

• RF Frequency Range: 2,500 to 7,000 MHz
• LO Frequency Range: 2,500 to 7,000 MHz
• IF Frequency Range: 0 to 3,000 MHz
• Conversion Loss: 8 dB

Description: AD7878 is fabricated in Linear Compatible CMOS (LC2 MOS), an advanced, mixed technology process that combines precision bipolar circuits with low power CMOS logic. The part is available in four package styles, 28-pin plastic and hermetic dual-in-line package (DIP), leadless ceramic

Description: Avago Technologies' MGA-412P8 is a 802.11 b/g WLAN power amplifier housed in a miniature 2 x 2 x 0.75 mm leadless plastic chip carrier (LPCC) package. The power amplifier is designed for applications in the 1.7GHz to 3GHz frequency range, yet it is optimized for IEEE 802.11 b/g

• Frequency Range: 1,700 to 3,000 MHz
• Minimum Gain: 25.5 dB
• Maximum Gain: 25.5 dB
• Output Power( P_1dB): 25.300000000000004 dBm

Description: Non-windowed, Ceramic, Leadless Chip Carrier (LCC)

• Density: 1,000 kbits
• Data Rate: 120 MHz
• Access Time: 120 to 150 ns
• Data Retention: 10 years

Description: The DSCC SMD 81028032A is a high reliability Class H two channel hermetically sealed optocoupler in a 20 Pad Leadless Ceramic Chip Carrier package with solder dipped pads. The solder contains lead. The product is capable of operation and storage over the full military

• Isolation Voltage: 1,500 volts
• Rise Time: 0.035 µs
• Collector Emitter Breakdown Voltage: 5 volts
• Operating Temperature: -55 to 125 C

Description: 20 pin Leadless Chip Carrier (LCC). The plastic SOIC (DW) is designed to operate over the commercial temperature range of 0°C to 70°C Additional Features Seven NPN Darlington Pairs -55°C to 125°C Ambient Operating Temperature Range Collector Currents to 600mA Output Voltages

• Output Voltage: 30 volts
• Peak Output Current: 0.5 amps
• Features: Other
• Package Type: SOIC

Description: package and 20-pin leadless chip carrier (LCC). In addition a plastic version is available in 18 lead SOWB (DW) package with a reduced temperature range of 0°C to 70°C Additional Features Eight NPN Darlington Pairs Collector Currents to 600mA Output Voltages from 50V to 95V

• Output Voltage: 30 volts
• Peak Output Current: 0.6 amps
• Features: Other

Description: package and 20-pin leadless chip carrier (LCC). In addition a plastic version is available in 18 lead SOWB (DW) package with a reduced temperature range of 0°C to 70°C Additional Features Eight NPN Darlington Pairs Collector Currents to 600mA Output Voltages from 50V to 95V

• Output Voltage: 30 volts
• Peak Output Current: 0.6 amps
• Features: Other

Description: The BU-67401L is a dual MIL-STD-1553 dual transceiver that operates from a +3.3V power supply voltage. It operates in conjunction with "Harris" type encoder/decoders and comes in an ultra low profile and small footprint in a 48-pad Leadless Plastic Chip Carrier package (LPCC).

• Supply Voltage: 3.3 V
• Device Type: CardBus Controller, Transceiver
• Features: Other, RoHS Compliant

Description: The HCPL-643K is a two channel hermetically sealed optocoupler in a 20 pad Leadless Ceramic Chip Carrier with solder dipped pads and the highest level of reliability (Class K). The solder contains lead. The product is capable of operation and storage over the full military

• Isolation Voltage: 1,500 volts
• Rise Time: 0.015 µs
• Operating Temperature: -55 to 125 C
• Input: DC

Description: Passives Down to 01005 Ball Grid Array (BGAs) and VFBGA Box Build Leadless Chip Carriers / CSP Double-Sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and Replacement Printed Circuit Boards: smallest 0.25″ x 0.25″ Printed Circuit Boards: largest 20″ x

• Testing Services: Agency Compliance Testing, Analytical Laboratory Testing, Functional Testing
• Manufacturing: Flexible Printed Circuit Board Assembly, Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Surface Mount Assembly, Through Hole Assembly
• Production Capabilities: High Volume, Mid Volume, Prototype / Low Volume, Quick Turn
• Features: North America, Other, United States Only

Description: Include: Low to Mid-Volume Board Assembly Larger Quantity Board Assembly SMT and Thru-Hole Press Fits Parts in Any Format ISO 9001:2015 Passives Down to 01005 Ball Grid Array (BGAs) and VFBGA Box Build Leadless Chip Carriers / CSP Double-Sided SMT Assembly Fine Pitch to 08 Mils

• PCB Type: Double-Sided Boards, Flexible Boards, Multi-Layer Boards, Rigid-Flexible Boards, SMT Components, Single-Sided Boards, THT Components
• Features: North America, United States Only
• Supplier Capability: PCB Assembly, Production Quantities, Prototype Quantities, Testing and Evaluation