Leadless Chip Carriers

Description: Leadless Chip Carrier Pinouts Standardized for Linear's

Description: RESISTOR NETWORK, 6-PIN, LEADLESS CHIP CARRIER

Description: RESISTOR NETWORK, 10 PIN, LEADLESS CHIP CARRIER

Description: RESISTOR NETWORK, 16 PIN, LEADLESS CHIP CARRIER

Description: LEADLESS CHIP CARRIER 28P PBT RO

Description: LEADLESS CHIP CARRIER 84P PBT RO

Description: LEADLESS CHIP CARRIER 68P PBT RO

Description: LEADLESS CHIP CARRIER 52P PBT RO

Description: NETWORK SURFACE MOUNT LEADLESS CHIP CARRIER RCD has been a key manufacturer of standard and custom Resistors/Capacitors /Coils/Delay Lines for over 40 years. RCD’s USA plant is the home of the SWIFTTM program, and also specializes in military, aerospace and

• Resistance Range: 10 to 1.00E7 ohms
• Standard and Compliances: RoHS Compliant

Description: 3.3Vdc HCMOS/TTL SMD Crystal Clock Oscillator|•Low profile, Leadless Chip Carrier (LCC)|•HCMOS/TTL Compatible, 3.3Vdc, 2.5Vdc, & 1.8Vdc options|•Reflow capable, Seam Sealed Package|Applications :|•Clock signaling for µProcessors, PC Motherboards & Graphic Cards|•High output

• Oscillation Frequency: 24.58 MHz
• Total Frequency Stability: 20 ppm

Description: The HC2700 Series are precision voltage references that use thin film hybrid technology to achieve extremely accurate, low temperature coefficient, 10 volt reference sources. The HC2700LCC Series packages the HC2700, HC2701, and HC2702 in a 28 pin JEDEC compatible leadless chip

Description: , Plastic J-leaded Chip Carrier (PLCC) 32-lead, Plastic Thin Small Outline Package (TSOP) Available in dual marked (5962-382670xxx) CERAMIC Hermetic Packaging 32-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip) 32-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package

• Access Time: 120 to 150 ns
• Data Rate: 120 MHz
• Data Retention: 10 years
• Density: 1000 kbits

Description: ) 28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC) 28-lead, Plastic Thin Small Outline Package (TSOP) Available in Dual marked (5962-886340xxx) CERAMIC Hermetic Packaging 28-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip) 28-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat

• Access Time: 70 to 120 ns
• Data Retention: 10 years
• Density: 256 kbits
• IC Package Type: SOIC, DIP, Other

Description: The HMC908A is a compact, gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), inphase/ quadrature (I/Q) downconverter in a leadless, RoHS compliant ceramic leadless chip carrier. This device provides a small signal conversion gain of 11 dB with a

• Conversion Gain: 11 dB
• Form Factor: Other
• Input Frequency Range: 9000 to 12000 MHz
• Noise Figure: 2 dB

Description: .600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip) 28-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package (Flatpack) 32-Pad, Non-windowed, Ceramic, Leadless Chip Carrier (LCC)

• Access Time: 150 to 250 ns
• Data Retention: 10 years
• Density: 256 kbits
• IC Package Type: SOIC, DIP, Other

Description: Low forward voltage. Designed for mounting on small surface. Extremely thin/ leadless package. Majority carrier conduction Maximum Continuous Forward Current = 500mA Diode Configuration = Single Number of Elements per Chip = 1 Peak Reverse Repetitive Voltage = 30V Mounting

• Diode Applications: Rectifier Diode
• Diode Type: Schottky Barrier Diodes
• I_F: 500 mA
• VR: 30 volts

Description: Bond-on heatsinks for leadless chip carriers and flat-packs. Primarily designed for 68-pin devices. Suitable for high-power LEDs For Use With = BGA Height = 9.14mm Dimensions = 25.4 (Dia.) x 9.14mm Thermal Resistance = 25.9°C/W Diameter = 25.4mm Colour = Black

• Height: 9.14 mm
• Thermal Resistance: 25.9 °C / W
• Width: 25.4 mm

Description: Bond-on heatsinks for leadless chip carriers and flat-packs. Primarily designed for 68-pin devices. Suitable for high-power LEDs For Use With = BGA Height = 9.14mm Dimensions = 28.58 (Dia.) x 9.14mm Thermal Resistance = 23.4°C/W Diameter = 28.58mm Colour = Black

• Height: 9.14 mm
• Thermal Resistance: 23.4 °C / W
• Width: 28.58 mm

Description: Low forward voltage. Designed for mounting on small surface. Extremely thin/ leadless package. Majority carrier conduction Diode Configuration = Single Maximum Continuous Forward Current = 200mA Number of Elements per Chip = 1 Peak Reverse Repetitive Voltage = 35V Mounting

• Diode Applications: Rectifier Diode
• Diode Type: Schottky Barrier Diodes
• I_F: 200 mA
• VR: 35 volts

Description: AD7878 is fabricated in Linear Compatible CMOS (LC2 MOS), an advanced, mixed technology process that combines precision bipolar circuits with low power CMOS logic. The part is available in four package styles, 28-pin plastic and hermetic dual-in-line package (DIP), leadless ceramic

Description: The OLS910 consists of a pair of LEDs that are optically coupled to a dielectrically isolated photovoltaic diode array, packaged in a small hermetic leadless chip carrier (LCC). When the LED is energized, the infrared emission is detected by the photovoltaic array and a DC

• Isolation Voltage: 1500 volts

Description: The OLS303 is suitable for wide bandwidth analog applications. Each OLS303 has an LED and integrated photodiode transistor detector mounted and coupled in a custom hermetic surface mount Leadless Chip Carrier (LCC) ceramic package, that provides 1500 VDC of electrical isolation

Description: The OLI110 consists of an LED and N-P-N silicon phototransistor that is electrically isolated, but optically coupled on a ceramic leadless chip carrier (LCC) surface mount package. The epoxy coating on the OLI110 allows the device to withstand normal solvent cleaning operations.

• Isolation Voltage: 1500 volts
• Optocoupler Output: Phototransistor

Description: -P-N silicon phototransistor that is electrically isolated, but optically coupled inside a hermetic 8-pin leadless chip carrier (LCC) package. The OLS2249 has 100 percent high-reliability screening parts available. Contact us for more details.

• Isolation Voltage: 1500 volts
• Optocoupler Output: Phototransistor

Description: API Technologies' line of non-dispersive and dispersive SAW Delay Lines offer semi-standard or custom designs with various delay and bandwidth options. SAW Delay Lines are available in several packaging options such as ceramic leadless chip carriers, which provide small size and

Description: fabricated in Analog Devices' Linear Compatible CMOWS (LC2MOS) process, a mixed technology process that combines precision bipolar circuits with low-power CMOS logic. The part is available in a 28-pin, 0.6"" wide, plastic or hermetic dual-in-line package (DIP), in a 28-terminal leadless

• IC Package Type: DIP
• Resolution: 12 bits

Description: Avago Technologies' MGA-412P8 is a 802.11 b/g WLAN power amplifier housed in a miniature 2 x 2 x 0.75 mm leadless plastic chip carrier (LPCC) package. The power amplifier is designed for applications in the 1.7GHz to 3GHz frequency range, yet it is optimized for IEEE 802.11 b/g

• Amplifier Type: Power Amplifier
• Applications: Mobile / Wireless Systems
• Frequency Range: 1700 to 3000 MHz
• Maximum Gain: 25.5 dB

Description: The HCPL-6631 is a high reliability Class H two channel hermetically sealed optocoupler in a 20 Pad Leadless Ceramic Chip Carrier package with solder dipped pads. The solder contains lead. The product is capable of operation and storage over the full military temperature range

• Collector Emitter Breakdown Voltage: 5 volts
• Isolation Voltage: 1500 volts
• Mounting Option: Surface Mount
• Operating Temperature: -55 to 125 C

Description: The DSCC SMD 81028032A is a high reliability Class H two channel hermetically sealed optocoupler in a 20 Pad Leadless Ceramic Chip Carrier package with solder dipped pads. The solder contains lead. The product is capable of operation and storage over the full military

• Collector Emitter Breakdown Voltage: 5 volts
• Isolation Voltage: 1500 volts
• Mounting Option: Surface Mount
• Operating Temperature: -55 to 125 C

Description: The HCPL-663K is a two channel hermetically sealed optocoupler in a 20 Pad Leadless Ceramic Chip Carrier package with solder dipped pads and the highest level of reliability, Class K. The solder contains lead. The product is capable of operation and storage over the full

• Collector Emitter Breakdown Voltage: 5 volts
• Isolation Voltage: 1500 volts
• Mounting Option: Surface Mount
• Operating Temperature: -55 to 125 C

Description: The 66183 is a single channel device electrically similar to the 4N49. This product has been designed to be more tolerant to proton radiation. The 66183 optocoupler is packaged in a hermetically sealed 6 pin leadless chip carrier (LCC). This device can be supplied to customer

• Collector Emitter Breakdown Voltage: 40 volts
• Isolation Voltage: 1000 volts
• Mounting Option: Surface Mount
• Operating Temperature: -55 to 125 C