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Supplier: Accuris
Description: LIQUID POLYMER, POLYSULFIDE
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Supplier: Accuris
Description: CALKING COMPOUND (LIQUID POLYMER POLYSULFIDE SYNTHETIC RUBBER, FORMULA NO. 112, FOR METAL ENCLOSURES)
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Supplier: Accuris
Description: POLYSULFIDE, POLYMER, LIQUID (FOR ROCKET MOTOR, 3.0 INCH, MARK 32 MOD 0)
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Electrical and Electronic Resins - Two Component, Room Temperature Curing Polysulfide -- EP21TPLV-NVSupplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21TPLV is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures with a noncritical, user-friendly one-to-one mix ratio, weight or
- Chemical / Polymer System Type: Epoxy (EP), Polysulfide
- Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F
- Composition: Two Component System
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than lOOO
- Chemical / Polymer System Type: Epoxy (EP), Polysulfide
- Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F
- Composition: Two Component System
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000
- Chemical / Polymer System Type: Epoxy (EP), Polysulfide, Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a five (5) to one (1) mix ratio by weight. This adhesive is 100
- Chemical / Polymer System Type: Epoxy (EP), Polysulfide
- Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F
- Composition: Two Component System
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Celanese Corporation
Description: FORTRON should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be =< - 30° C. The time between drying and processing should be as short as possible.
- Chemical / Polymer System Type: Polysulphide
- Compound Type: Molding Resin
- Deflection Temperature (@ 264 psi, 1.8 MPa): 509 F
- Dielectric Constant: 3.8
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Supplier: Celanese Corporation
Description: FORTRON should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be =< - 30° C. The time between drying and processing should be as short as possible.
- Chemical / Polymer System Type: Polysulphide
- Compound Type: Molding Resin
- Deflection Temperature (@ 264 psi, 1.8 MPa): 220 F
- Dielectric Constant: 3
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Supplier: Port Plastics, Inc.
Description: TECATRON® SE natural is a high-performance thermoplastic designed specifically for semiconductor applications. It combines good mechanical properties with excellent thermal and chemical resistance properties. Its low ionic impurities make it an excellent choice for applications where high purity is
- Chemical / Polymer System Type: Polysulphide
- Industry: Semiconductor / IC's, Other
- Material Type / Grade: Thermoplastic
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Supplier: Port Plastics, Inc.
Description: ) applications. Furthermore, this PPS polymer combines excellent mechanical properties with a very high heat and chemical resistance to an optimized Semicon plastic.
- Chemical / Polymer System Type: Polysulphide
- Industry: Other
- Material Type / Grade: Thermoplastic
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Supplier: Polyplastics USA, Inc.
Description: As was mentioned in the history column, commercial production of polyphenylene sulfide (PPS) was commenced in 1973 by U.S. company Phillips Petroleum. Demand has expanded over the years on account of the resin's high heat resistance. However, the material came to be known as a brittle one because of
- Chemical / Polymer System Type: Polysulphide
- Coeff. of Thermal Expansion (CTE): 5.56 to 22.22 µin/in-F
- Compound Type: Molding Resin
- Deflection Temperature (@ 264 psi, 1.8 MPa): 509 F
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Supplier: Port Plastics, Inc.
Description: Techtron® PPS offer the broadest resistance to chemicals of any advanced engineering plastic. They have no known solvents below 392°F (200°C) and offer inertness to steam, strong bases, fuels and acids.
- Chemical / Polymer System Type: Polysulphide
- Material Type / Grade: Thermoplastic
- Use Temperature: 392 F
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Supplier: Port Plastics, Inc.
Description: Techtron® PPS 40% GF (CM) is the most recognized PPS. It is compression molded and offers better dimensional stability and thermal performance than Techtron® PPS and maintains its strength to above 425°F (220°C).
- Chemical / Polymer System Type: Polysulphide
- Material Type / Grade: Thermoplastic
- Use Temperature: 425 F
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Supplier: Real Seal Company
Description: , and high tensile strength. Polyurethanes are also unique in that they have a number of serviceable forms, from low strength liquids to highly cross-linked thermoplastics. Real Seal commonly handles the two most often used in the sealing industry; Thermosetting and Thermoplastic
- Chemical / Polymer System Type: Polyurethane
- Compound Type: Molding Resin
- Elongation: 238 %
- Filler Material: Unfilled
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Supplier: Real Seal Company
Description: , and high tensile strength. Polyurethanes are also unique in that they have a number of serviceable forms, from low strength liquids to highly cross-linked thermoplastics. Real Seal commonly handles the two most often used in the sealing industry; Thermosetting and Thermoplastic
- Chemical / Polymer System Type: Polyurethane
- Compound Type: Molding Resin
- Elongation: 410 %
- Filler Material: Unfilled
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Supplier: Real Seal Company
Description: , and high tensile strength. Polyurethanes are also unique in that they have a number of serviceable forms, from low strength liquids to highly cross-linked thermoplastics. Real Seal commonly handles the two most often used in the sealing industry; Thermosetting and Thermoplastic
- Chemical / Polymer System Type: Polyurethane
- Compound Type: Molding Resin
- Elongation: 612 %
- Filler Material: Unfilled
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Supplier: Real Seal Company
Description: , and high tensile strength. Polyurethanes are also unique in that they have a number of serviceable forms, from low strength liquids to highly cross-linked thermoplastics. Real Seal commonly handles the two most often used in the sealing industry; Thermosetting and Thermoplastic
- Chemical / Polymer System Type: Polyurethane
- Compound Type: Molding Resin
- Elongation: 730 %
- Filler Material: Unfilled
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 28.33 to 99.44 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 3.46
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments,
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 8.89 to 37.78 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 4.9
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 23.89 to 128 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 3.21
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market requires their
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 33.89 to 106 µin/in-F
- Compound Type: Casting Resin
- Features: Biocompatible, Optical Grade
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Supplier: Georgia-Pacific Chemicals LLC
Description: A waterborne resin developed for use in the manufacture of FRP, specifically prepreg. The product is formulated to provide low smoke generation, flame resistance, as well as fire resistance.
- Chemical / Polymer System Type: Phenolics (Melamine, Furan)
- Filler Material: Unfilled
- Industry: Aerospace, Military / Government (MIL-SPEC)
- Material Type / Grade: Thermoset
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Supplier: Georgia-Pacific Chemicals LLC
Description: A line of water-soluble UF resins specifically designed to meet individual customer needs such as good tensile, good tear and low emissions. Two types are available: 1) a patented, single-package resin that will not require latex modification and 2) a conventional resin that accepts latex
- Chemical / Polymer System Type: Phenolics (Melamine, Furan)
- Filler Material: Unfilled
- Industry: Industrial
- Material Type / Grade: Thermoset
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Supplier: Georgia-Pacific Chemicals LLC
Description: A line of water and alcohol soluble thermosetting PF adhesive binder resins specifically designed and customized to meet individual high-pressure laminate customer needs in terms of strength, emissions and post-formability.
- Chemical / Polymer System Type: Phenolics (Melamine, Furan)
- Filler Material: Unfilled
- Industry: Industrial
- Material Type / Grade: Thermoset
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Supplier: Georgia-Pacific Chemicals LLC
Description: A line of water-soluble thermosetting phenol-formaldehyde resins specifically designed to meet individual insulation customer needs such as low emissions, cost-effectiveness, good recovery and strength.
- Chemical / Polymer System Type: Phenolics (Melamine, Furan)
- Filler Material: Unfilled
- Industry: Industrial
- Material Type / Grade: Thermoset
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Supplier: Hapco, Inc.
Description: Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available.
- Compound Type: Casting Resin
- Dielectric Constant: 1.3
- Dielectric Strength: 710 kV/in
- Elongation: 25 %
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Supplier: Hapco, Inc.
Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to
- Compound Type: Casting Resin
- Dielectric Constant: 4.2 to 4.3
- Dielectric Strength: 520 kV/in
- Elongation: 1.5 %
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Supplier: Hapco, Inc.
Description: Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available.
- Compound Type: Casting Resin
- Dielectric Constant: 2.4 to 2.5
- Dielectric Strength: 350 kV/in
- Elongation: 500 %
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Supplier: Hapco, Inc.
Description: Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented.
- Compound Type: Casting Resin
- Dielectric Constant: 2.9 to 3.1
- Dielectric Strength: 350 kV/in
- Elongation: 275 %
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Supplier: MCA - Advanced Materials Division
Description: ultra high strength carbon fiber + PPS injection molding compound” No stock shapes offered, only injection molding pellets.
- Chemical / Polymer System Type: Polysulphide
- Compound Type: Molding Resin
- Elongation: 1.4 %
- Filler Material: Carbon / Graphite
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Supplier: ELANTAS North America LLC
Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 27.78 to 94.44 µin/in-F
- Compound Type: Casting Resin
- Elongation: 5 %
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Supplier: 3M Advanced Materials Division
Description: In 1969, astronauts boarded the Apollo 11 spacecraft wearing boots containing 3M™ Dyneon™ Fluoroelastomers. Today, these synthetic elastomeric materials are used in some of the toughest environments on earth. From hot-running automotive engines to harsh chemicals of semiconductor manufacturing and
- Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF), Polyamide / Nylon, Polypropylene (PP), Specialty / Other
- Compound Type: Film Grade Resin, Extrusion Grade Resin, Molding Resin
- Elongation: 170 to 350 %
- Features: Anti-static, Electrically Conductive Compound, Flame Retardant (e.g. UL 94 Rated), Optical Grade
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Supplier: Rieke Metals, Inc.
Description: poly(3-hexylthiophen e-2,5-diyl ),regiorandom
- Chemical / Polymer System Type: Specialty / Other
- Features: Electrically Conductive Compound
- Filler Material: Unfilled
- Industry: Electronics, Semiconductor / IC's
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Supplier: Performance Polymers Group
Description: The ChronoFlex AR and ChronoFlex AR-LT product lines are polycarbonate urethanes designed for molding, casting and dip coating applications. These unique materials are fully synthesized in liquid providing superior strength & elongation while maintaining the inherent polycarbonate advantage
- Chemical / Polymer System Type: Polycarbonate (PC), Polyurethane
- Compound Type: Casting Resin, Molding Resin
- Elongation: 500 to 1200 %
- Features: Biocompatible
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encapsulation applications. EP21LSCL-2Med is specially formulated to have minimal non-yellowing tendencies. This system features a high glass transition temperature (Tg), good resistance to steam and water, liquid sterilants and EtO sterilization. The service temperature range is from -60°F to (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc.
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Handbook of Adhesives and Sealants, Second Edition > OTHER THERMOSETTING ADHESIVES
The liquid polysulfide polymer can be transformed from a liquid state into a solid elastomer, even at low temperatures.
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Polysulfide sealant compositions. II. Interactions between elemental sulfur and organosulfur compounds
When the procedure was applied to polysulfide liquid polymers , products with substantial levels of tri‐ and tetra‐sulfide links were formed.
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Characterization of cured polysulfide polymers by thermal degradation: Pyrolysis‐GC and thermogravimetric studies
Abstract Polymers prepared by curing thiol‐terminated liquid polysulfide polymer [HS(RS2)nRSH, R = CH2CH2OCH2OCH2CH2] with p‐quinonedioxime, PbO2, and MnO2 were studied by pyrolysis‐GC and thermogravimetry.
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http://repositories.lib.utexas.edu/bitstream/handle/2152/21169/SAMARAS-DISSERTATION-2013.pdf?sequence=1
Polysulfide liquid polymer compound is applied as exterior coating to protect sensors installed in harsh environments.
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Adsorption of polysulphide sealants onto organosilane‐coated aluminium and aluminium substrates
Sealants based on polysulphide liquid polymers are exten- sively employed for many applications such as aircraft use requiring high flexibility, good adhesion and chemical resistance.1 Polysulphide sealants are currently also estab- lished as sealants for aircraft fuel tanks.
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Polysulfide Rubber
ABSTRACT: The chemistry of Thiokol LP® liquid polysulfide polymers and their ambient temperature vulcanization to rubbery products is presented.
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Polysulfide Elastomers
A number of liquid polysulfide polymers have been commercialized and these are supplied in a range of viscosities, molecular weights and functionalities.
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Thiol modification of difunctional castor oil and its utility as room temperature setting elastomeric material
Elastomeric products have been obtained from CODT alone and in combination with liquid polysulfide polymer LP‐33 by oxidative cure with manganese dioxide.
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Effect of curing agents on some properties of a polysulfide sealant
Sealants based on polysulfide liquid polymers are widely used in aircraft industry, construction, shipbuilding, and gas main sealing.