Liquid Polysulfide Polymers

Description: LIQUID POLYMER, POLYSULFIDE

Description: POLYSULFIDE, POLYMER, LIQUID (FOR ROCKET MOTOR, 3.0 INCH, MARK 32 MOD 0)

Description: CALKING COMPOUND (LIQUID POLYMER POLYSULFIDE SYNTHETIC RUBBER, FORMULA NO. 112, FOR METAL ENCLOSURES)

Description: Master Bond Polymer Adhesive EP21TPLV is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures with a noncritical, user-friendly one-to-one mix ratio, weight or

• Viscosity: 5,000 to 6,000 cP
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F
• Tensile Strength (Break): 3,000 psi

Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000

• Use Temperature: -60 to 250 F
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F
• Tensile Strength (Break): 3,200 psi

Description: Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than lOOO

• Viscosity: 5,000 to 6,000 cP
• Use Temperature: -100 to 300 F
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F

Description: Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient one to three mix

• Use Temperature: -300 to 250 F
• Thermal Conductivity: 1.297 W/m-K
• Coeff. of Thermal Expansion (CTE): 50 to 56 µin/in-F
• Tensile Strength (Break): 1,070 psi

Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of

• Use Temperature: 356 F
• Thermal Conductivity: 0.7 to 0.8 W/m-K
• Coeff. of Thermal Expansion (CTE): 75 to 97.22222222222221 µin/in-F
• Dielectric Strength: 440 kV/in

Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of

• Use Temperature: 311 F
• Thermal Conductivity: 0.3 to 0.35 W/m-K
• Coeff. of Thermal Expansion (CTE): 41.666666666666664 to 138.88888888888889 µin/in-F
• Tensile Strength (Break): 2,900 psi

Description: FORTRON should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be =< - 30° C. The time between drying and processing should be as short as possible.

• Use Temperature: 230 to 248 F
• Deflection Temperature (@ 264 psi, 1.8 MPa): 220 F
• Tensile Strength (Break): 12,500 psi
• Dielectric Constant: 3

Description: FORTRON should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be =< - 30° C. The time between drying and processing should be as short as possible.

• Use Temperature: 266 to 284 F
• Deflection Temperature (@ 264 psi, 1.8 MPa): 509 F
• Tensile Strength (Break): 24,000 psi
• Elongation: 1.5 %

Description: In 1969, astronauts boarded the Apollo 11 spacecraft wearing boots containing 3M™ Dyneon™ Fluoroelastomers. Today, these synthetic elastomeric materials are used in some of the toughest environments on earth. From hot-running automotive engines to harsh chemicals of semiconductor manufacturing and

• Tensile Strength (Break): 1,522.88681325057 to 2,581.65574055811 psi
• Tensile Modulus: 0.5801473574287881 to 1.2328131345361701 ksi
• Elongation: 170 to 350 %
• Industry: Aerospace, Automotive, Building / Construction, Electric Power, Electronics, Energy Conversion (Battery/Fuel Cell/PV), Industrial, Marine, Medical / Food (FDA), Military / Government (MIL-SPEC), Semiconductor / IC's

Description: poly(3-butylthiophene-2,5-diyl ),regiorandom

• Features: Electrically Conductive Compound, Specialty / Other
• Industry: Electronics, Semiconductor / IC's
• Form / Shape: Liquid
• Type: Thermoplastic

Description: As was mentioned in the history column, commercial production of polyphenylene sulfide (PPS) was commenced in 1973 by U.S. company Phillips Petroleum. Demand has expanded over the years on account of the resin's high heat resistance. However, the material came to be known as a brittle one because

• Deflection Temperature (@ 264 psi, 1.8 MPa): 518 F
• Coeff. of Thermal Expansion (CTE): 5.555555555555555 to 16.666666666666668 µin/in-F
• Tensile Strength (Break): 18,854.7891164356 psi
• Elongation: 1.1 %

Description: ChronoSil is a family of polycarbonate based silicone elastomers. These biocompatible materials maintain the inherent benefits of polycarbonate-based urethanes, including high pressure resistance, tensile-strength and superior chemical resistance combined with silicone’s industry recognized

• Tensile Strength (Break): 3,300 to 10,000 psi
• Elongation: 350 to 650 %
• Melt Flow Index (MFI): 2 to 26 g / 10 minutes
• Water Absorption: 0.59 to 0.62 %

Description: Furthermore, this PPS polymer combines excellent mechanical properties with a very high heat and chemical resistance to an optimized Semicon plastic.

• Features: Other, Polysulphide (PPS)
• Type: Thermoplastic

Description: A semi crystalline, high temperature thermoplastic. In addition to the low water absorption, PPS also shows good dimensional stability, low tendency to creep and excellent electrical properties, and is thus well suited for parts with tightest tolerances.

• Features: Polysulphide (PPS)
• Type: Thermoplastic

Description: Techtron® PPS 40% GF (CM) is the most recognized PPS. It is compression molded and offers better dimensional stability and thermal performance than Techtron® PPS and maintains its strength to above 425°F (220°C).

• Use Temperature: 425 F
• Features: Polysulphide (PPS)
• Type: Thermoplastic

Description: The ChronoFlex AR and ChronoFlex AR-LT product lines are polycarbonate urethanes designed for molding, casting and dip coating applications. These unique materials are fully synthesized in liquid providing superior strength & elongation while maintaining the inherent polycarbonate advantage

• Tensile Strength (Break): 3,000 to 10,000 psi
• Elongation: 500 to 1,200 %
• Viscosity: 100 to 50,000 cP
• Features: Biocompatible

Description: ultra high strength carbon fiber + PPS injection molding compound” No stock shapes offered, only injection molding pellets.

• Tensile Strength (Break): 39,000 psi
• Tensile Modulus: 4,300 ksi
• Elongation: 1.4 %
• Filler: Carbon / Graphite

Description: Techtron® PPS offer the broadest resistance to chemicals of any advanced engineering plastic. They have no known solvents below 392°F (200°C) and offer inertness to steam, strong bases, fuels and acids.

• Use Temperature: 392 F
• Features: Polysulphide (PPS)
• Type: Thermoplastic

Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame

• Use Temperature: 284 F
• Thermal Conductivity: 0.40383812 W/m-K
• Tensile Strength (Break): 2,100 psi
• Elongation: 100 %

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Use Temperature: 572 F
• Coeff. of Thermal Expansion (CTE): 33.888888888888886 to 100 µin/in-F
• Dielectric Constant: 3.8
• Index of Refraction: 1.5318

Description: A high temperature phenolic resin developed for use in the manufacture of fiber-reinforced polymer (FRP) that meets the requirements of Military Specification MIL-R-9299C, Type II, Class 2. The product is formulated to provide low smoke generation, flame resistance and strength as well as

• Viscosity: 400 to 800 cP
• Industry: Aerospace, Military / Government (MIL-SPEC)
• Form / Shape: Liquid
• Chemical System: Phenolics (Melamine, Furan)

Description: strength. Polyurethanes are also unique in that they have a number of serviceable forms, from low strength liquids to highly cross-linked thermoplastics. Real Seal commonly handles the two most often used in the sealing industry; Thermosetting and Thermoplastic. Although Real Seal is known

• Tensile Strength (Break): 8,622 psi
• Tensile Modulus: 1.041 ksi
• Elongation: 532 %
• Industry: Automotive, Building / Construction, Industrial, Tooling / Molds

Description: 70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat resistance than most

• Use Temperature: -103 to 572 F
• Thermal Conductivity: 1.80284875 W/m-K
• Coeff. of Thermal Expansion (CTE): 2.5 µin/in-F
• Tensile Strength (Break): 14,500 psi

Description: A waterborne resin developed for use in the manufacture of FRP, specifically for honeycomb and prepreg that meets the requirements of Military Specification MIL-R-9299C. The product is formulated to provide low smoke generation, flame resistance and strength as well as fire resistance.

• Viscosity: 100 to 200 cP
• Industry: Industrial
• Form / Shape: Liquid
• Chemical System: Phenolics (Melamine, Furan)

Description: strength. Polyurethanes are also unique in that they have a number of serviceable forms, from low strength liquids to highly cross-linked thermoplastics. Real Seal commonly handles the two most often used in the sealing industry; Thermosetting and Thermoplastic. Although Real Seal is known

• Tensile Strength (Break): 6,121 psi
• Tensile Modulus: 3.63 ksi
• Elongation: 422 %
• Industry: Automotive, Building / Construction, Industrial, Tooling / Molds

Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market requires

• Use Temperature: 545 F
• Coeff. of Thermal Expansion (CTE): 32.77777777777778 to 74.44444444444444 µin/in-F
• Index of Refraction: 1.5193
• Light Transmission: 95 to 98 %

Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to

• Use Temperature: 325.4 F
• Thermal Conductivity: 0.41826091 W/m-K
• Tensile Strength (Break): 7,000 psi
• Elongation: 0.6 %

Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments,

• Use Temperature: 617 F
• Thermal Conductivity: 1.7 W/m-K
• Coeff. of Thermal Expansion (CTE): 15 to 75.55555555555556 µin/in-F
• Dielectric Constant: 3.73

Description: GP® 486G34 phenolic resin is used in conjunction with GP® 4826 catalyst for the manufacture of FRP. Specifically developed for hand layup and RTM, the system is also suitable for other FRP processes including filament winding. By varying the amount of the catalyst mixture in the GP 486G34 resin,

• Viscosity: 350 to 750 cP
• Industry: Industrial
• Form / Shape: Liquid
• Chemical System: Phenolics (Melamine, Furan)

Description: Resin - Polyaddition heat curing - Translucent Solventless, Quick curing, Good release properties, Good bath stability Outstanding thermal stability, High adhesion to many substrates, Engine fluids resistance (Lubricant, Cooling liquid, …) Properties Viscosity 8500 Description Varnishing of

• Industry: Automotive
• Form / Shape: Liquid
• Chemical System: Silicone
• Type: Thermoset

Description: strength. Polyurethanes are also unique in that they have a number of serviceable forms, from low strength liquids to highly cross-linked thermoplastics. Real Seal commonly handles the two most often used in the sealing industry; Thermosetting and Thermoplastic. Although Real Seal is known

• Tensile Strength (Break): 5,130 psi
• Tensile Modulus: 0.88 ksi
• Elongation: 632 %
• Industry: Automotive, Building / Construction, Industrial, Tooling / Molds

Description: GP Chemicals offers ready-to-use adhesive formulations which can be adjusted to accommodate the differences in customers’ processes. Our plywood ready-to-use and laminated veneer lumber (LVL) ready-to-use mix adhesives are supplied in liquid form. They can be used with most hardwood and

• Industry: Industrial
• Form / Shape: Liquid
• Chemical System: Phenolics (Melamine, Furan)
• Type: Thermoset