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  • Load Cell Application - Medical Bag
    was being delivered properly, that the bag was properly filled at all times, and that no back bleeding was occurring. Integrating a load cell and monitoring system to the basic infusion-delivery method removed guesswork from the process. The load cell measured the exact weight of the bag and immediately
  • Learn about Plug & Play Smart Load Cells
    interface, and gives technical information such as sensitivity, bridge type, excitation, etc. This information is stored in an EEPROM chip attached to a Load Cell. By having this chip, the Load Cell can identify and describe itself to the network and or Smart Load Cell Meter, thereby easing automatic
  • Application Note: Surgical Stapler
    how this was accomplished using the New Interface Model LBMU Compression Load Button and a Model 9820 Load Cell Indicator.
  • Application Note: Tablet Forming
    , while reducing losses (i.e. cracked tablets or voids) by adding a dimension of feedback that could be used to assign specific press adjustment criterion for given inputs. Learn how this was accomplished using the Interface Model WMC Sealed Stainless Steel Mini Load Cell and a Model 9320 Portable Load
  • F/A-18 Fighter Aircraft Wing Fatigue Testing
    throughout the lifetime of the aircraft. Highly accurate measurements must be recorded in order to make sure that a near-exact replication of in-flight conditions is being achieved. Learn how this is accomplished using the Interface Model 1248 Precision Flange LowProfile TM Load Cell and an indicator.
  • Signature analysis holds key to precise mechanical assembly
    Inc. come in nine different sizes up to 22,000-lb force. Systems include the press ram, servomotor and amplifier, PC-based hardware with PLC control interface, Window-based control and monitoring software, and an integrated load cell and preamplifier. EMAPs (electromechanical assembly presses) from
  • MICRO: Characterizing CMP
    carrier. The wafer carrier supports the wafer during CMP and applies the necessary load or pressure to remove material from the wafer surface. In addition, this carrier can rotate during polishing to achieve uniform system kinematics in order to achieve better polishing uniformity. In an orbital CMP

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