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Supplier: Chemence Inc.
Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound, Die Bonding Adhesive / Compound
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Supplier: MacDermid Alpha Electronics Solutions
Description: for efficient thermal dissipation. This compound combines ease of processing with enhanced thermal conductivity compared to traditional epoxy encapsulants. With its UL94 V-0 flame retardance, it is suitable for a variety of applications. The product provides the ultimate
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 803 A low viscosity two-component general purpose electrical encapsulant/molding compound that is designed for applications requiring high-impact strength, thermal shock resistance, good corrosion resistance, and good water resistance. INSTAbond® 803 is
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Use Temperature: -58 to 248 F
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 826 A low viscosity, two-component epoxy compound that cures at room temperature. High flexibility, high impact resistance, thermal shock, water/chemical resistance, and good mechanical properties. Wicking and air release capabilities of INSTAbond® 826 make it
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: capability Low viscosity material flows at room temperature with no additional preheating required High Tg while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing Cures quickly at moderate temperatures to minimize stress to
- Coeff. of Thermal Expansion (CTE): 33.89 µin/in-F
- Viscosity: 354 cP
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Supplier: Epoxies Etc...
Description: 20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
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Supplier: Epoxies Etc...
Description: 20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2125 will cushion and protect
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 5.5 to 5.8
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Supplier: Epoxies Etc...
Description: 20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2121 will cushion and protect
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.4
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Supplier: Epoxies Etc...
Description: 20-2145 is an unfilled, high performance, electronic grade urethane system. This material has a 1:1 mix ratio, is very low in viscosity, and offers outstanding physical, thermal, and electrical properties. 20-2145 has very good adhesion to most substrates, low exotherm
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Master Bond, Inc.
Description: performance properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as good physical strength properties. EP30AO is low viscosity with excellent flow characteristics making it ideal as a
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: CHT USA Inc.
Description: CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 600 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Protavic America, Inc.
Description: ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electroni c casting and encapsulating applications that
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Electrically Conductive, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Two Component System
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1046 is a low cost, epoxy potting and casting system. Major characteristics include: low viscosity, low shrinkage, low exotherm, excellent resistance to thermal shock, and very good electrical insulation properties. When cured with any of
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Fujipoly® America Corp.
Description: Sarcon® SPG-20B is highly conformable/thermall y conductive, low viscosity and easier dispensable type silicone compound. It provides a thermal solution for the recent trends of higher frequencies and integration in the development of electronic devices. Sarcon® SPG-20B
- Chemical / Polymer System Type: Silicone
- Industry: Electronics, Semiconductors / IC Packaging
- Material Type: Gap Filling Compound
- Thermal Conductivity: 2.1 W/m-K
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Supplier: Fujipoly® America Corp.
Description: Sarcon® SPG-50A is highly conformable/thermall y conductive, low viscosity and easier dispensable type silicone compound. It provides a thermal solution for the recent trends of higher frequencies and integration in the development of electronic devices. Sarcon® SPG-50A
- Chemical / Polymer System Type: Silicone
- Industry: Electronics, Semiconductors / IC Packaging
- Material Type: Gap Filling Compound
- Thermal Conductivity: 5 W/m-K
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Supplier: Fujipoly® America Corp.
Description: Sarcon® SPG-20A is highly conformable/thermall y conductive, low viscosity and easier dispensable type silicone compound. It provides a thermal solution for the recent trends of higher frequencies and integration in the development of electronic devices. Sarcon® SPG-20A
- Chemical / Polymer System Type: Silicone
- Industry: Electronics, Semiconductors / IC Packaging
- Material Type: Gap Filling Compound
- Thermal Conductivity: 2 W/m-K
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Supplier: ACCRAbond, Inc.
Description: Casting resin. When cured with any of the hardeners presented below, these systems possess low viscosity, low shrinkage, low exotherm, excellent resistance to thermal shock, good electrical properties and hardnesses.
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: MacDermid Alpha Electronics Solutions
Description: +180°C, this compound is also suited for a variety of other electronics applications. While its primary feature is chemical resistance, ER2223 also exhibits good resistance to thermal cycling, making it ideal for use in environments such as engine compartments. Its low
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications.
- Chemical / Polymer System Type: Epoxy (EP), Specialty / Other
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Encapsulants and Potting Compounds - Momentive RTV627 Grey Potting Silicone 2lb / 908gm -- MOSI17149Supplier: Techsil Limited
Description: RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight or volume
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Encapsulants and Potting Compounds - Momentive RTV627 Grey Potting Silicone 20lb/9.08kg -- MOSI17150Supplier: Techsil Limited
Description: RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight or volume
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrical isolation is required.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: MacDermid Alpha Electronics Solutions
Description: A very low viscosity epoxy resin with excellent thermal stability, designed for compatibility with reflow applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use within the electronics
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Hernon Manufacturing, Inc.
Description: Dissipator® 319 is a room temperature curing, two component thermal conductive epoxy adhesive for potting applications. Dissipator® 319 offers low viscosity for potting applications, is recommended for encapsulation of components that require heat dissipation and
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 14 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Ellsworth Adhesives
Description: 3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper,
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 850 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: 3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Clear is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper,
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 850 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: MacDermid Alpha Electronics Solutions
Description: Flame-retardant two-part epoxy potting and encapsulating compound, offering a cost-effective solution for various applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use in the electronics industry.
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Encapsulants and Potting Compounds - Techsil RTV27905 Clr Silicone Gel Encapsulant 10kg -- TESI19154Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Encapsulants and Potting Compounds - Techsil® RTV27905 Clr Silicone Gel Encapsulant 2kg -- TESI19128Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Ellsworth Adhesives
Description: Dow SE 4445 CV Thermally Conductive Gel Gray is a two component, heat curing gel that is used for potting electronic modules, base material for thermally conductive gel sheet, and gap fill material between heat sinks and electronic heat sinks. It offers low
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 127 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: configurations available upon request Benefits Thermal conductivity: 1.5 W/m-K Ultra-conforming with excellent wet-out for near zero interface stress No cure by-products Low density for weight sensitive application Excellent low and high temperature mechanical and chemical
- Dielectric Constant (Relative Permittivity): 0.0064
- Material Type: Gap Filling Compound
- Thermal Conductivity: 1.5 W/m-K
- Use Temperature: 302 F
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Supplier: Ellsworth Adhesives
Description: of thermal expansion, low viscosity, good thermal conductivity, impact resistance, and excellent electrical insulative properties. It contains a filler that has a grainy consistency. 1 gal Pail.
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 371 to 394 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE® PE 3164 is a clear epoxy resin hardener which forms a black, fast gelling, low viscosity, room temperature cure potting compound with
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
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Supplier: Wacker Chemical Corp.
Description: ELASTOSIL® RT 745 A/B is a pourable, thermally curable, addition-curing, two-part silicone rubber. Special features two-part, 1 : 1 mixing ratio low viscosity low hardness low risk of inhibition rapid heat cure primerless
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. It has a thermally conductive, electrically insulative filler material with ultra small particle sizes. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Flowable – low viscosity for easy dispensing Fast curing – enhances process efficiency Primerless adhesion Medium density, closed cell Flame retardant Thermally insulative Wide operating temperature range (-50 °C to 200+ °C) Noise dampening and cushioning properties (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
cures upon exposure to LED light at 405 nm. It will cure rapidly and fully without any oxygen inhibition. It is a low viscosity system that may be used for small potting and encapsulation applications assuming that there are no shadows or concealed areas. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
can be added to produce tougher, more rigid gels. CHT’s silicone gels are available in a variety of hardnesses, penetrations and viscosities. Low viscosity gels will easily flow around complex components and thixo-gels can be applied where non-slumping or sagging is required. Silicone (read more)
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Well suited for large potting and encapsulation applications, Master Bond EP29LPAO is a cost effective, two part system with a low viscosity, excellent flow properties and heat dissipation properties. Featuring convenient processing, this epoxy has a forgiving 100 to 50 mix ratio by weight and a (read more)
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Master Bond EP30LP-2 is an optically clear epoxy with superb light transmission properties. This low viscosity, electrical insulator also features outstanding dimensional stability. Featuring easy handling, this compound has a convenient two to one mix ratio by weight or (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
-component polyurethanes that assure consistent cure and performance even in small “shot-size” potting applications (Bectron® PK materials). Dielectric gels that provide outstanding electronic protection with very low stress on (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
MG Chemicals 832FXC is a clear, flexible epoxy potting compound designed to minimize physical stress on delicate components. Ideal for low-temperature, arctic, or temperature-cycling environments, it maintains flexibility and stability through rapid thermal changes. Its transparency allows easy (read more)
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QSil-553 2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to (read more)
Browse Conductive Compounds Datasheets for CHT USA Inc. -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
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Non-uniform thermal properties of an alumina granule/epoxy potting compound
A nominally isotropic and uniform potting compound consisting of about 70 to 80% by volume 14-28 mesh (0.6 to 1.2 mm across) alumina granules in low viscosity epoxy was tested to determine its thermal properties.
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Kent and Riegel’s Handbook of Industrial Chemistry and Biotechnology
… 1133-4 Phosphatides, 1580 Phosphoric acid, annual production, 1096 dihydrate process, 1097-1 101 environmental aspects of production, 1109 fertilizer grade, processing, 1125 hemihydrate process, 1102-11 04 thermal process, 1094 unit operations … … film, 671 bulk molding compound , 684 calendaring, 681 centrifugal … … 686 hand-layup molding, 685 impregnation, 683 injection molding, 672 injection molding, molding cycle, 672 liquid casting processes, 682 low -density foams, 676 low … … die molding, 684 melt viscosity , 668 perform molding, 685 … … polyvinyl chloride foam, 677 potting , 683 powder coating, 680 …
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One Component Snap Cure Adhesive
• Low Viscosity Epoxy Potting /Encapsulation Compound Offers Low Exotherm, Long Pot Life • One Component No-Mix Epoxy High Thermal and Strength Adhesive .
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Potted fiber optic sensor coil by novel adhesives for high-stability FOG
The adhesive is a low viscosity system which exhibits a prolonged work life, an adjustable hardness. Specially, the potting compound with a low glass transition temperature (Tg), down to the lower temperature -60℃, remain stable modulus during thermal cycling between -40℃ and 60℃.
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3M - DP270 - Chemicals - Potting Compounds - Allied Electronics
3M™ Scotch-Weld™ epoxy potting compound ⁄adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting , sealing, and encapsulation of many electronic components and is available in clear or black. … Weld epoxy potting compound⁄adhesive DP270 is noncorrosive to copper and offers good thermal shock resistance and …
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3M - DP-270-BLACK - Chemicals - Potting Compounds - Allied Electronics
3M™ Scotch-Weld™ epoxy potting compound ⁄adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting , sealing, and encapsulation of many electronic components and is available in clear or black. … Weld epoxy potting compound⁄adhesive DP270 is noncorrosive to copper and offers good thermal shock resistance and …
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3M - DP-270-CLEAR - Chemicals - Potting Compounds - Allied Electronics
3M™ Scotch-Weld™ epoxy potting compound ⁄adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting , sealing, and encapsulation of many electronic components and is available in clear or black. … Weld epoxy potting compound⁄adhesive DP270 is noncorrosive to copper and offers good thermal shock resistance and …
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Epoxy Resin For Potting At Cryogenic Temperatures
Master Bond EP30FLAO is a two-component epoxy resin system for high-performance potting , bonding, sealing and coating in demanding thermal management applications at cryogenic temperatures. The low - viscosity epoxy is said to have excellent flow characteristics, making it ideal as a thermally conductive potting compound .
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Handbook of Industrial Chemistry and Biotechnology
… of production, 957 fertilizer grade, processing, 970 hemihydrate process, 947, 948, 950–952, 955 thermal process, 945–946 unit … … processing autoclave molding, 617 blow molding, 587, 589, 600, 605, 611, 612 blown film, 585, 586, 606 bulk molding compound , 598, 616 calendaring, 613 … … liquid casting processes, 614–615 low -density foams, 610–611 low … … die molding, 616 melt viscosity , 600, 604, 605 perform … … polyurethane flexible foam, 608 polyurethane rigid foam, 610, 931 polyvinyl chloride foam, 611 potting , 614 powder coating …
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Experimental and mathematical treatment of transfer pot temperature for thermosets
The thermal history of a fluid element in a transfer molding operation is critical to the suit- ability of the particular mold and molding com- pound in that application. The initial phase of the process is characterized by relatively low temperatures in the vicinity of the preheat tem- perature of 90°C with their correspondingly high viscosities . Molding compound flows from the transfer pot for the entire transfer time which may be as long …