Low Viscosity Thermal Potting Compounds

Description: Flame-retardant, thermally conductive epoxy potting compound designed for easy processing and enhanced thermal conductivity. Product Overview ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part epoxy resin designed to meet the

• Type: Electrically Conductive, Thermal Compound / Thermally Conductive
• Features: Electronics, Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated)
• Chemical System: Epoxy (EP)
• Industry: Semiconductors / IC Packaging

Description: CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow

• Use Temperature: -67 to 464 F
• Thermal Conductivity: 0.68 W/m-K
• Elongation: 240 %
• Tensile Strength (Break): 249.46336369437884 psi

Description: INSTAbond® 803 A low viscosity two-component general purpose electrical encapsulant/molding compound that is designed for applications requiring high-impact strength, thermal shock resistance, good corrosion resistance, and good water resistance. INSTAbond® 803 is

• Use Temperature: -58 to 248 F
• Features: Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)
• Cure / Technology: Two Component System

Description: Scotch-Weld™ epoxy potting compound⁄adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy potting

Description: Scotch-Weld™ epoxy potting compound⁄adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy potting

Description: Highly chemical-resistant epoxy potting compound formulated for harsh conditions in under-hood applications. Product Overview ER2223 Highly Chemical Resistant Epoxy Potting Compound has been specially formulated to meet the harsh operating conditions of under-hood

• Industry: Automotive, Semiconductors / IC Packaging
• Features: Electronics, Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)
• Type: Thermal Compound / Thermally Conductive

Description: 20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties.

• Viscosity: 150 to 6,000 cP
• Use Temperature: -85 to 275 F
• Thermal Conductivity: 0.50479765 W/m-K
• Coeff. of Thermal Expansion (CTE): 90 µin/in-F

Description: 10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and

• Viscosity: 800 to 2,000 cP
• Use Temperature: -58 to 302 F
• Thermal Conductivity: 0.4326837 W/m-K
• Tensile Strength (Break): 10,500 psi

Description: properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as good physical strength properties. EP30AO is low viscosity with excellent flow characteristics making it ideal as a thermally conductive

• Viscosity: 50,000 to 70,000 cP
• Use Temperature: -60 to 250 F
• Thermal Conductivity: 1.441 W/m-K
• Coeff. of Thermal Expansion (CTE): 22 µin/in-F

Description: 20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2125 will cushion and protect

• Use Temperature: -22 to 257 F
• Thermal Conductivity: 0.297109474 W/m-K
• Elongation: 225 to 295 %
• Tensile Strength (Break): 155 to 1,750 psi

Description: Casting resin. When cured with any of the hardeners presented below, these systems possess low viscosity, low shrinkage, low exotherm, excellent resistance to thermal shock, good electrical properties and hardnesses.

• Features: Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)

Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when

• Viscosity: 11,000 to 14,000 cP
• Form / Function: Die Bonding Adhesive / Compound
• Features: Electronics, Gap Filling Sealant / FIP Gasket, Grease / Paste, Metal, Plastic
• Chemical System: Silicone

Description: 20-2145 is an unfilled, high performance, electronic grade urethane system. This material has a 1:1 mix ratio, is very low in viscosity, and offers outstanding physical, thermal, and electrical properties. 20-2145 has very good adhesion to most substrates, low exotherm

• Viscosity: 1,300 cP
• Use Temperature: -58 to 257 F
• Thermal Conductivity: 0.40383812 W/m-K
• Tensile Strength (Break): 820 psi

Description: Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications.

• Viscosity: 5,000 to 15,000 cP
• Use Temperature: -60 to 250 F
• Tensile Strength (Break): 5,000 to 7,000 psi
• Dielectric Strength: 450.00000000000006 kV/in

Description: A very low viscosity epoxy resin with excellent thermal stability, designed for compatibility with reflow applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use within the electronics

• Features: Electronics, Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated)
• Chemical System: Epoxy (EP)
• Industry: Semiconductors / IC Packaging
• Type: Thermal Compound / Thermally Conductive

Description: LOCTITE ECCOBOND UF 3811, Halogen free, Reworkable, Low viscosity, Epoxy, Underfill, Encapsulant LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no

• Coeff. of Thermal Expansion (CTE): 33.888888888888886 µin/in-F
• Viscosity: 354 cP

Description: 3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper,

• Viscosity: 6,000 to 16,000 cP
• Thermal Conductivity: 0.177 W/m-K
• Dielectric Strength: 850.0000000000001 kV/in
• Features: Encapsulating / Potting

Description: 3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Clear is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper,

• Viscosity: 6,000 to 16,000 cP
• Thermal Conductivity: 0.177 W/m-K
• Dielectric Strength: 850.0000000000001 kV/in
• Features: Encapsulating / Potting

Description: UV15X-5 contains an exceptionally active UV curing initiator which makes cures practical even with relatively low intensity UV light sources. Finally, although UV15X-5 has a relatively high viscosity, this feature is adjustable and lower viscosity's with similar properties are

• Viscosity: 240,000 cP
• Use Temperature: -80 to 250 F
• Thermal Conductivity: 0.029 W/m-K
• Coeff. of Thermal Expansion (CTE): 83 µin/in-F

Description: Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix

• Viscosity: 1,600 to 1,800 cP
• Use Temperature: -60 to 250 F
• Coeff. of Thermal Expansion (CTE): 14 µin/in-F
• Tensile Strength (Break): 7,800 psi

Description: Dow SE 4445 CV Thermally Conductive Gel Gray is a two component, heat curing gel that is used for potting electronic modules, base material for thermally conductive gel sheet, and gap fill material between heat sinks and electronic heat sinks. It offers low viscosity, wide

• Thermal Conductivity: 1.26 W/m-K
• Dielectric Strength: 127 kV/in
• Viscosity: 14,000 cP
• Features: Encapsulant / Potting Compound

Description: Flame-retardant two-part epoxy potting and encapsulating compound, offering a cost-effective solution for various applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use in the electronics industry.

• Features: Electronics, Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated)
• Chemical System: Epoxy (EP)
• Industry: Semiconductors / IC Packaging
• Type: Thermal Compound / Thermally Conductive

Description: thermal expansion, low viscosity, good thermal conductivity, impact resistance, and excellent electrical insulative properties. It contains a filler that has a grainy consistency. 1 gal Pail.

• Thermal Conductivity: 1.5 to 1.9 W/m-K
• Dielectric Strength: 370.84000000000077 to 393.70000000000084 kV/in
• Viscosity: 7,700 to 58,000 cP
• Features: Encapsulant / Potting Compound

Description: ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electronic casting and encapsulating applications that

• Viscosity: 625 cP
• Use Temperature: -85 to 347 F
• Dielectric Constant (Relative Permittivity): 4.3
• Water Absorption: 1.5 %

Description: Thermal conductivity: 1.5 W/m-K Ultra-conforming with excellent wet-out for near zero interface stress No cure by-products Low density for weight sensitive application Excellent low and high temperature mechanical and chemical stability Shear thinning viscosity for ease

• Use Temperature: 302 F
• Thermal Conductivity: 1.5 W/m-K
• Dielectric Constant (Relative Permittivity): 0.0064
• Form / Shape: Gap Filling Compound

Description: power converters and complete power supplies. Product Benefits Convenient 1:1 mixing ratio Solvent free Cure can be accelerated by heat Deep section cure possible Low shrinkage Low viscosity Reversion resistant and hydrolytically stable Technical Properties Uncured

• Use Temperature: -60 to 204 F
• Features: Electronics, Encapsulating / Potting
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: power converters and complete power supplies. Product Benefits Convenient 1:1 mixing ratio Solvent free Cure can be accelerated by heat Deep section cure possible Low shrinkage Low viscosity Reversion resistant and hydrolytically stable Technical Properties Uncured

• Use Temperature: -60 to 204 F
• Features: Electronics, Encapsulating / Potting
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: Thermally conductive Electrically insulative Low viscosity Excellent adhesion Excellent thermal shock and impact resistance Excellent low temperature properties

• Use Temperature: 85 to 221 F
• Thermal Conductivity: 2.29 W/m-K
• Viscosity: 22,000 cP
• Chemical System: Epoxy (EP)

Description: (Known as HYSOL US1151 ) LOCTITE STYCAST US 1151 is a low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties. Introduction of this material on a bed of 8-12 mesh sand increases thermal conductivity while

• Viscosity: 1,000 cP
• Thermal Conductivity: 0.18 W/m-K
• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: ELASTOSIL® RT 745 A/B is a pourable, thermally curable, addition-curing, two-part silicone rubber. Special features two-part, 1 : 1 mixing ratio low viscosity low hardness low risk of inhibition rapid heat cure primerless adhesion Application encapsulation of electronic

• Viscosity: 1,000 cP
• Features: Electronics, Encapsulating / Potting, Liquid, RTV / Room Temperature Curing
• Chemical System: Rubber Based / Elastomeric, Silicone
• Cure / Technology: Thermosetting / Crosslinking, Two Component System

Description: (Known as Hysol ES1902 ) LOCTITE STYCAST ES 1902 DQ is a clear, transparent, very fast UV gel with thermal co-cure, excellent dimensional stability and low viscosity; easy to handle.

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: excellent adhesion performance to a variety of substrates, excellent resistance to a variety of environmental stimuli, low viscosity, high dielectric strength and improved flexibility at low temperatures. These naturally occurring raw materials maintain a wide operating

• Use Temperature: -40 to 284 F
• Thermal Conductivity: 0.65 W/m-K
• Elongation: 115 %
• Dielectric Strength: 497.84000000000106 kV/in