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Supplier: ERSAELECTRONICS PTE. LTD.
Description: replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include Dual, SOIC. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Dual, SOIC, Memory IC and Storage Component, Memory
- Operating Temperature: 0 to 70 C
- Supply Voltage: -4.5 V
- Features: Other
- Package Type: SOIC
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Supplier: AAEON Electronics, Inc.
Description: DiskOnChip® 2000 Flash Disk Module Main
- Density: 32,000 to 8,000,000 kbits
- Package Type: DIP
- Memory Category: EPROM, Flash, SRAM
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Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 084589-TMS320C32PCM40 Packaging: Tube/Rail Type: Floating Point Voltage - I/O: 5.00V Mounting: SMD (SMT) Clock Rate: 40MHz Non-Volatile Memory: External On-Chip RAM: 2.25kB Voltage - Core: 5.00V Categories: Integrated Circuits
- Clock Speed: 40 MHz
- Operating Temperature: 0 to 85 C
- Features: Other
- Package Type: QFP
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Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 063092-S320C32PCM4 Packaging: Tube/Rail Type: Floating Point Voltage - I/O: 5.00V Mounting: SMD (SMT) Clock Rate: 40MHz Non-Volatile Memory: External On-Chip RAM: 2.25kB Voltage - Core: 5.00V Categories: Integrated Circuits
- Clock Speed: 40 MHz
- Operating Temperature: 0 to 85 C
- Features: Other
- Package Type: QFP
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Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 055249-TMS320C32PCM50 Packaging: Tray Type: Floating Point Voltage - I/O: 5.00V Mounting: SMD (SMT) Clock Rate: 50MHz Non-Volatile Memory: External On-Chip RAM: 2.25kB Voltage - Core: 5.00V Family Name: TMS320C32 Categories:
- Clock Speed: 50 MHz
- Operating Temperature: 0 to 85 C
- Features: Other
- Package Type: QFP
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Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 213149-TMS320C32PCM60 Packaging: Tray Type: Floating Point Voltage - I/O: 5.00V Mounting: SMD (SMT) Clock Rate: 60MHz Non-Volatile Memory: External On-Chip RAM: 2.25kB Voltage - Core: 5.00V Family Name: TMS320C32 Categories:
- Clock Speed: 60 MHz
- Operating Temperature: 0 to 85 C
- Features: Other
- Package Type: QFP
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Supplier: DigiKey
Description: PCM (PRAM) Memory IC 128Mb (16M x 8) SPI 66MHz 360µs 16-SO W
- Density: 128,000 kbits
- Operating Temperature: 0 to 70 C
- Features: Other
- Package Type: SOIC
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Supplier: Quarktwin Technology Ltd.
Description: PCM - LPDDR2, MCP - LPDDR2 Memory IC 1Gbit (PCM), 512Mbit (MCP) Parallel 166 MHz 121-VFBGA (8x8)
- Density: 1,000,000 kbits
- Operating Temperature: -25 to 85 C
- Package Type: BGA
- Features: Other
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Description: IC PCM 128MBIT PAR 64EASYBGA
- Density: 128,000 kbits
- Cycle Time: 135 ns
- Features: Other
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Description: 【Applications】 ◆ CPU/GPU Chips ◆ Capacitors ◆ Memory/VRAM particles ◆ Control boards ◆ Splitters ◆ Relays
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 1.8 W/m-K
- Tensile Strength (Break): 14.5036839357197 psi
- Elongation: 40 %
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Supplier: Lingto Electronic Limited
Description: IC PCM 128MBIT PARALLEL 56TSOP
- Density: 128,000 kbits
- Access Time: 115 ns
- Features: Other
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Supplier: ODG (Origin Data Global)
Description: IC PCM 128MBIT PAR 64EASYBGA
- Density: 128,000 kbits
- Access Time: 115 ns
- Operating Temperature: 0 to 70 C
- Features: Other
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: 3.3V, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-DS1330WP-100+ can be used for catalog matching and distributor
- Access Time: 100 ns
- Cycle Time: 100 ns
- Operating Temperature: 0 to 70 C
- Memory Category: NVRAM, NVSRAM, SRAM
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: IC PCM 128MBIT PAR 64EASYBGA Product overview: NP8P128A13B1760E from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers
- Access Time: 115 ns
- Cycle Time: 115 ns
- Operating Temperature: 0 to 70 C
- Supply Voltage: 3.6 V
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Supplier: QUALCOMM, Incorporated
Description: 3.3V Charging Maximum Current 200 mA on chip 500 mA with external transistor Memory RAM 56KB RAM Flash 16MB Up to 64 MB external flash Interface Supported Interfaces UART Master I²C 1x PCM/I²S 1x SPDIF Input/Output ADC 2 ADCs DAC 2 DACs Maximum PIOs 29 PWM (LED) 3 Input Touch
- Operating Frequency: 80 MHz
- Technology: Bluetooth
- Features: Bluetooth® Single Chip Solutions, Other, PCM, UART
- Interface: I2C, USB
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 66MHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 66MHZ, Memory IC and Storage Component, Memory ICs
- Access Time: 360,000 ns
- Cycle Time: 350,000 ns
- Operating Temperature: 0 to 70 C
- Supply Voltage: 3.6 V
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Supplier: QUALCOMM, Incorporated
Description: Wave-2 802.11ac SoC for Routers, Gateways and Access Points The IPQ4019 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-integrated, single-chip design combines
- Data Rate: 1,733,000 kbps
- Package Type: BGA
- Interface: I2C, PCI Express, USB
- Features: PCM, SPI, UART
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Supplier: QUALCOMM, Incorporated
Description: 150 mA Memory RAM 48KB RAM Flash 16MB Interface Supported Interfaces UART USB 2.0 PCM I²S SPDIF Input/Output ADC 2 ADCs DAC 2 DACs General Purpose IOs 16 PWM (LED) 2 Package Package Type 8 x 8 x 0.9 mm 0.4 mm pitch QFN
- Operating Frequency: 32 MHz
- Technology: Bluetooth
- Features: Bluetooth® Single Chip Solutions, Other, PCM, UART
- Package Type: QFN
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Supplier: QUALCOMM, Incorporated
Description: Architecture 24-bit MCU MCU Clock Speed 80MHz Power Management Maximum Input Voltage 3.3V Charging Maximum Current 200 mA on chip 500 mA with external transistor Memory RAM 56KB RAM Interface Supported Interfaces UART USB 2.0 PCM I²S SPI Input/Output ADC 1 ADC DAC 1 DAC Maximum
- Operating Frequency: 80 MHz
- Technology: Bluetooth
- Features: Bluetooth® Single Chip Solutions, Other, PCM, SPI, UART
- Interface: I2C, USB
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Supplier: Infineon Technologies AG
Description: components, flash memory, and the CYW20820 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE modules CYBT-243053-02 and CYBT-253059-02 are supported by the AIROC™ Bluetooth® SDK in
- TJ: -30 to 85 C
- Technology: Bluetooth
- Features: Bluetooth® EDR Chip, Other, RoHS Compliant
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Supplier: Infineon Technologies AG
Description: industrial), lighting, Bluetooth® Mesh, or any Bluetooth® connected IoT application. AIROC™ CYW20819 Modules Infineon's AIROC™ CYW20819 Bluetooth® & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20819 system on
- TJ: -30 to 85 C
- Technology: Bluetooth
- Features: Bluetooth® EDR Chip, Other, RoHS Compliant
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Supplier: Cirrus Logic, Inc.
Description: differentiate products through the Cirrus Logic Framework programming structure and Framework module library. Dolby Pro Logic II, DTS Digital Surround, MPEG Multi-channel and Cirrus Logic Original Surround 6.1 PCM (pulse code modulation) Effects Processor — the last capable of generating
- Pin Count: 144
- Data Bus: 32-Bit
- Features: Other
- Interface Type: SPI
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Supplier: Infineon Technologies AG
Description: industrial), lighting, Bluetooth® Mesh, or any Bluetooth® connected IoT application. AIROC™ CYW20706 Modules Infineon's AIROC™ CYW20706 Bluetooth® & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20706 system on
- TJ: -30 to 85 C
- Technology: Bluetooth
- Features: Other, RoHS Compliant
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Supplier: Microchip Technology, Inc.
Description: The IS2020 Stereo Audio Chip is a compact, highly integrated, CMOS single-chip RF and baseband IC for Bluetooth 5.0 applications. This chip is fully compliant with Bluetooth specification and completely backward-compatible with Bluetooth 3.0, 2.0 or 1.2 systems. It incorporates
- Pin Count: 48 #
- Supply Voltage: 3 V, 3.3 V, 3.6V
- Technology: Bluetooth
- Interface: I2C
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Supplier: Cirrus Logic, Inc.
Description: your local FAE for more information on available applications. Up to 12 Channels of 32-bit serial audio input 16 Ch x 32-bit PCM out with dual 192 kHz SPDIF Tx Two SPI™/I²C® ports SDRAM and serial flash memory Support
- Pin Count: 128
- Clock Speed: 150 MHz
- Operating Current: 350 mA
- Operating Temperature: 0 to 70 C
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Supplier: Infineon Technologies AG
Description: capacitive-sensing with CAPSENSE™ PDM-PCM digital microphone interface Murata type 1DX module (CYW4343W Wi-Fi + BT combo chip) This kit features the Murata Type 1DX module that provides IEEE 802.11b/g/n-compliant Wi-Fi with integrated Bluetooth 5.1, best-in-class power consumption, and
- Category: Development Board
- Features: Other
- Ports: USB
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Supplier: Microchip Technology, Inc.
Description: OS81119, OS81110 Additional Features 150 Mbits/s network bandwidth Intelligent Network Interface Controller architecture that provides a complete network interface on a single chip Supports low-cost LED/POF-based optical physical layer and coax physical layer LVDS interfaces for FOTs
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Phase change memory-based 'moneta'system points to the future of computer storage | EurekAlert! Science News
PCM Memory Chips .
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Memory module-level testing and error behaviors for phase change memory
These results can be used for estimating PCM lifetime and for measuring the fabrication quality of individual PCM memory chips .
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Energy efficient Phase Change Memory based main memory for future high performance systems
We propose a PCM based main memory system design using a small, embedded DRAM (eDRAM) cache to replace the row buffers in the PCM memory chip .
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On‐Chip Photonic Memory Elements Employing Phase‐Change Materials
On- chip PCM memory elements. a) Optical microscopy image of an array with 25 different memory elements.
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FPB: Fine-grained Power Budgeting to Improve Write Throughput of Multi-level Cell Phase Change Memory
Similar to a traditional DRAM organization, a DIMM has eight memory chips ( PCM ) that are organized into eight logical banks.
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A Survey of Phase Change Memory Systems
Li et al.[39] proposed OptiPCM to overcome the bus issue by utilizing the photonics to link the memory controller and PCM chips .
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A new approach to the design, fabrication, and testing of chalcogenide-based multi-state phase-change nonvolatile memory
Keywords- Phase change memory (PCM), nonvolatile memory , PCM test chip , memory reliability, fabrication, post-processing.
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Exploiting write power asymmetry to improve phase change memory system performance
To overcome this issue, Li et al. [27] propose to utilize the pho- tonics to link the memory controller and PCM chips .
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Write speeds for phase-change memory shortened by pre-seeding
Phase-change memory ( PCM ) chips use a glass-like material called chalcogenide as a storage medium based on the organization of atoms in a material.
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A 256-Mcell Phase-Change Memory Chip Operating at 2+ Bit/Cell
A fully integrated 256-Mcell multi-level cell (MLC) phase-change memory ( PCM ) chip in 90-nm CMOS technology is presented.
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