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Supplier: AAEON Electronics, Inc.
Description: DiskOnChip® 2000 Flash Disk Module Main
- Density: 32000 to 8.00E6 kbits
- IC Package Type: DIP
- Memory Category: SRAM, Flash, EPROM
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Supplier: Utmel Electronic Limited
Description: PCM W/CRYSTAL NV SRAM SNAP-ON
- IC Package Type: Other
- Memory Category: SRAM
- Operating Temperature: 0.0 to 70 C
- Supply Voltage: 5 V, Other
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Supplier: QUALCOMM, Incorporated
Description: Embedded Flash Solution for Bluetooth Audio Applications The CSR8670 SoC is an audio system-on-chip (SoC) solution with wireless connectivity, embedded flash memory and integrated capacitive touch sensors, enabling the creation of feature rich home entertainment and wearable audio
- Bluetooth Compliance: Other
- Bluetooth Component: Bluetooth® Single Chip Solutions
- Interface: I2C, PCM, UART, USB
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Supplier: QUALCOMM, Incorporated
Description: Kalimba™ DSP DSP Bit Architecture 24-bit DSP Clock Speed 80 MHz Charging Maximum Current 200 mA on chip 500 mA with external transistor Memory Flash 16 Mb internal flash
- Bluetooth Compliance: Other
- Bluetooth Component: Bluetooth® Single Chip Solutions
- Interface: I2C, PCM, UART, USB
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Supplier: Advantech
Description: The PCD-3835 is an IDE compatible Solid State Disk (SSD). The SSD uses a Flash memory chip to store data. You can read and write to the solid state disk just as you read and write to a hard disk drive. However, solid state disks are designed to be much more reliable in harsh industrial
- Memory Type: CompactFlash®
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Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 084589-TMS320C32PCM4 0 Packaging: Tube/Rail Type: Floating Point Voltage - I/O: 5.00V Mounting: SMD (SMT) Clock Rate: 40MHz Non-Volatile Memory: External On-Chip RAM: 2.25kB Voltage - Core: 5.00V
- Clock Speed: 40 MHz
- Operating Temperature: 0.0 to 85 C
- Package Type: QFP, Other
- Supply Voltage: Other
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Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 063092-S320C32PCM4 Packaging: Tube/Rail Type: Floating Point Voltage - I/O: 5.00V Mounting: SMD (SMT) Clock Rate: 40MHz Non-Volatile Memory: External On-Chip RAM: 2.25kB Voltage - Core: 5.00V
- Clock Speed: 40 MHz
- Operating Temperature: 0.0 to 85 C
- Package Type: QFP, Other
- Supply Voltage: Other
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Supplier: QUALCOMM, Incorporated
Description: Wave-2 802.11ac SoC for Routers, Gateways and Access Points The IPQ4019 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-integrated, single-chip design combines
- Data Rate: 1.73E6 kbps
- IC Package Type: BGA
- Interface: I2C, PCI Express, PCM, SPI, UART, USB
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Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 055249-TMS320C32PCM5 0 Packaging: Tray Type: Floating Point Voltage - I/O: 5.00V Mounting: SMD (SMT) Clock Rate: 50MHz Non-Volatile Memory: External On-Chip RAM: 2.25kB Voltage - Core: 5.00V
- Clock Speed: 50 MHz
- Operating Temperature: 0.0 to 85 C
- Package Type: QFP, Other
- Supply Voltage: Other
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Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 213149-TMS320C32PCM6 0 Packaging: Tray Type: Floating Point Voltage - I/O: 5.00V Mounting: SMD (SMT) Clock Rate: 60MHz Non-Volatile Memory: External On-Chip RAM: 2.25kB Voltage - Core: 5.00V
- Clock Speed: 60 MHz
- Operating Temperature: 0.0 to 85 C
- Package Type: QFP, Other
- Supply Voltage: Other
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Supplier: QUALCOMM, Incorporated
Description: Wave-2 802.11ac SoC for Routers, Gateways and Access Points The IPQ4029 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-integrated, single-chip design combines
- Data Rate: 1.73E6 kbps
- IC Package Type: BGA
- Interface: I2C, PCI Express, PCM, SPI, UART, USB
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Supplier: Advantech
Description: PCM-3343 is a cost-effective System On Chip (SoC) PC/104 CPU module driven by the ultra low power DM&P Vortex86DX 800 MHz processor with 256 MB of DDR2 SDRAM memory on board. PCM-3343 has the standard dimensions of 96 x 90 mm in a fanless PC/104 architecture, supporting
- CPU Speed: 800 MHz
- Cache Memory (L1 & L2): 256 KB
- Features: Watchdog Timer?
- Operating Temperature: 32 to 140 F
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Description: IC NVSRAM 1MBIT PCM MODULE
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Supplier: Lingto Electronic Limited
Description: PCM W/CRYSTAL NV SRAM SNAP-ON
- IC Package Type: Other
- Operating Temperature: 0.0 to 70 C
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Supplier: Lingto Electronic Limited
Description: IC NVSRAM 1MBIT PCM MODULE
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Supplier: DigiKey
Description: PCM (PRAM) Memory IC 128Mb (16M x 8) SPI 66MHz 360µs 16-SO W
- Density: 128000 kbits
- IC Package Type: SOIC, Other
- Memory Category: Other
- Operating Temperature: 0.0 to 70 C
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Supplier: Lingto Electronic Limited
Description: PCM W/O CRYSTAL NV SRAM SNAP-ON
- IC Package Type: Other
- Operating Temperature: 0.0 to 70 C
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Description: IC PCM 128MBIT PAR 64EASYBGA
- Cycle Time: 115 ns
- Density: 128000 kbits
- IC Package Type: BGA
- Memory Category: Other
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Description: IC PCM 128MBIT PARALLEL 56TSOP
- Cycle Time: 115 ns
- Density: 128000 kbits
- Memory Category: Other
- Supply Voltage: Other
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Description: IC PCM 128MBIT PARALLEL 56TSOP
- Cycle Time: 135 ns
- Density: 128000 kbits
- Memory Category: Other
- Supply Voltage: Other
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Supplier: ODG (Origin Data Global)
Description: IC PCM 128MBIT PAR 64EASYBGA
- Access Time: 115 ns
- Density: 128000 kbits
- IC Package Type: Other
- Memory Category: Other
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Supplier: Lingto Electronic Limited
Description: IC PCM 128MBIT PARALLEL 56TSOP
- Access Time: 135 ns
- Density: 128000 kbits
- Memory Category: Other
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Supplier: Quarktwin Technology Ltd.
Description: PCM (PRAM) Memory IC 128Mbit Parallel, SPI 135 ns 64-EasyBGA (8x10)
- Access Time: 135 ns
- Density: 128000 kbits
- IC Package Type: BGA, Other
- Memory Category: Other
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Supplier: Quarktwin Technology Ltd.
Description: PCM (PRAM) Memory IC 128Mbit Parallel, SPI 115 ns 64-EasyBGA (8x10)
- Access Time: 115 ns
- Density: 128000 kbits
- IC Package Type: BGA, Other
- Memory Category: Other
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Supplier: Quarktwin Technology Ltd.
Description: PCM (PRAM) Memory IC 128Mbit Parallel, SPI 135 ns 56-TSOP
- Access Time: 135 ns
- Density: 128000 kbits
- IC Package Type: Other
- Memory Category: Other
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Supplier: Quarktwin Technology Ltd.
Description: PCM (PRAM) Memory IC 128Mbit SPI 33 MHz 360 µs 16-SO
- Access Time: 360000 ns
- Density: 128000 kbits
- IC Package Type: SOIC, Other
- Memory Category: Other
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Description: -Free, and REACH environmental and safety standards. ?Applications? ? CPU/GPU Chips ? Capacitors ? Memory/VRAM particles ? Control boards ? Splitters ? Relays
- Dielectric Constant (Relative Permittivity): 4.5
- Elongation: 40 %
- Features: Thermal / Heat Conductive
- Industry: Electronics
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Supplier: DigiKey
Description: PCM (PRAM) Memory IC 128Mb (16M x 8) Parallel, SPI 115ns 56-TSOP
- Density: 128000 kbits
- IC Package Type: Other
- Memory Category: Other
- Operating Temperature: 0.0 to 70 C
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Supplier: DigiKey
Description: PCM (PRAM) Memory IC 128Mb (16M x 8) Parallel, SPI 115ns 64-EasyBGA (8x10)
- Density: 128000 kbits
- IC Package Type: Other
- Memory Category: Other
- Operating Temperature: 0.0 to 70 C
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Supplier: DigiKey
Description: PCM (PRAM) Memory IC 128Mb (16M x 8) Parallel, SPI 135ns 56-TSOP (18.4x14)
- Density: 128000 kbits
- IC Package Type: Other
- Memory Category: Other
- Operating Temperature: -30 to 85 C
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Supplier: ODG (Origin Data Global)
Description: PCM W/CRYSTAL NV SRAM SNAP-ON
- IC Package Type: Other
- Memory Category: SRAM
- Operating Temperature: 0.0 to 70 C
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Supplier: ODG (Origin Data Global)
Description: PCM W/O CRYSTAL NV SRAM SNAP-ON
- IC Package Type: Other
- Memory Category: SRAM
- Operating Temperature: 0.0 to 70 C
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Supplier: Microchip Technology, Inc.
Description: The IS2020 Stereo Audio Chip is a compact, highly integrated, CMOS single-chip RF and baseband IC for Bluetooth 5.0 applications. This chip is fully compliant with Bluetooth specification and completely backward-compatible with Bluetooth 3.0, 2.0 or 1.2 systems. It incorporates
- Interface: I2C
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Supplier: Infineon Technologies AG
Description: & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20819 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™ CYBT-213043-02, CYBT-223058-02,
- Bluetooth Component: Bluetooth® EDR Chip
- Features: RoHS Compliant
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Supplier: Infineon Technologies AG
Description: & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20706 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™ CYBT-343151-02, CYBT-333032-02,
- Features: RoHS Compliant
- IC Package Type: Other
- TJ: -30 to 85 C
- Technology: Bluetooth
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Phase change memory-based 'moneta'system points to the future of computer storage | EurekAlert! Science News
PCM Memory Chips .
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Memory module-level testing and error behaviors for phase change memory
These results can be used for estimating PCM lifetime and for measuring the fabrication quality of individual PCM memory chips .
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Energy efficient Phase Change Memory based main memory for future high performance systems
We propose a PCM based main memory system design using a small, embedded DRAM (eDRAM) cache to replace the row buffers in the PCM memory chip .
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On‐Chip Photonic Memory Elements Employing Phase‐Change Materials
On- chip PCM memory elements. a) Optical microscopy image of an array with 25 different memory elements.
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FPB: Fine-grained Power Budgeting to Improve Write Throughput of Multi-level Cell Phase Change Memory
Similar to a traditional DRAM organization, a DIMM has eight memory chips ( PCM ) that are organized into eight logical banks.
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A Survey of Phase Change Memory Systems
Li et al.[39] proposed OptiPCM to overcome the bus issue by utilizing the photonics to link the memory controller and PCM chips .
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A new approach to the design, fabrication, and testing of chalcogenide-based multi-state phase-change nonvolatile memory
Keywords- Phase change memory (PCM), nonvolatile memory , PCM test chip , memory reliability, fabrication, post-processing.
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Exploiting write power asymmetry to improve phase change memory system performance
To overcome this issue, Li et al. [27] propose to utilize the pho- tonics to link the memory controller and PCM chips .
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Write speeds for phase-change memory shortened by pre-seeding
Phase-change memory ( PCM ) chips use a glass-like material called chalcogenide as a storage medium based on the organization of atoms in a material.
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A 256-Mcell Phase-Change Memory Chip Operating at 2+ Bit/Cell
A fully integrated 256-Mcell multi-level cell (MLC) phase-change memory ( PCM ) chip in 90-nm CMOS technology is presented.