Products & Services
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Supplier: Epoxies Etc...
Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end
- Viscosity: 500 to 3,000 cP
- Thermal Conductivity: 0.297109474 W/m-K
- Dielectric Strength: 400.000000000001 to 609.9999999999997 kV/in
- Dielectric Constant (Relative Permittivity): 6.63
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Supplier: Epoxies Etc...
Description: 20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. 20-2365 has a convenient
- Viscosity: 150 to 6,000 cP
- Use Temperature: -85 to 275 F
- Thermal Conductivity: 0.50479765 W/m-K
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
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Encapsulants and Potting Compounds - Thermally conductive polyurethane potting compound -- 50-2368FRSupplier: Epoxies Etc...
Description: 50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system
- Viscosity: 150 to 17,000 cP
- Use Temperature: -85 to 275 F
- Thermal Conductivity: 1.1538232 W/m-K
- Tensile Strength (Break): 2,200 psi
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Supplier: MacDermid Alpha Electronics Solutions
Description: This thermally conductive polyurethane encapsulation and potting compound is a two-part system with a black finish. Product Overview UR5097 Thermally Conductive Polyurethane Potting Compound exhibits excellent thermal conductivity, making it ideal for
- Type: Electrically Conductive
- Features: Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Thermal Compound / Heat Conductive
- Chemical System: Polyurethane (PU, PUR)
- Industry: Semiconductors / IC Packaging
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Supplier: MacDermid Alpha Electronics Solutions
Description: High-performance polyurethane potting and encapsulation compound suitable for a wide range of applications. Product Overview UR5604 is a general-purpose two-part polyurethane potting compound designed for potting and encapsulation. This versatile
- Features: Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated)
- Chemical System: Polyurethane (PU, PUR)
- Industry: Semiconductors / IC Packaging
- Cure / Technology: Two Component System
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Supplier: MacDermid Alpha Electronics Solutions
Description: Specialist resin with environmental protection for LEDs and PCBs, preserving optical clarity and color after prolonged UV exposure. Product Overview UR5634 Optically Clear Polyurethane LED Potting Compound is a two-part, semi-rigid polyurethane resin. It is formulated
- Features: Electronics, Encapsulating / Potting
- Type: Optical Grade / Material
- Chemical System: Polyurethane (PU, PUR)
- Industry: Semiconductors / IC Packaging
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Supplier: RS Components, Ltd.
Description: RS PRO ERUR5640RP250G Potting Compound
- Features: Encapsulating / Potting Compound, Specialty / Other
- Chemical System: Polyurethane (PU, PUR)
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Supplier: Accuris
Description: Molding and Potting Compound, Chemically Cured, Polyurethane
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Supplier: Accuris
Description: MOLDING AND POTTING COMPOUND, CHEMICALLY CURED, POLYURETHANE
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Supplier: Epoxies Etc...
Description: The 20-2135 is a two component, low durometer, potting, casting and encapsulating compound. This system is unfilled and low in viscosity allowing for fast self-leveling. The 20-2135 will quickly encapsulate components and electronic devices. The 20-2135 has outstanding thermal cycling
- Viscosity: 1,200 to 1,950 cP
- Use Temperature: -58 to 248 F
- Tensile Strength (Break): 150 psi
- Elongation: 50 %
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 5529, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 5529 is a flexible, flame retardant, mineral filled, polyurethane compound. This potting compound has long pot life, and is low viscosity so it flows well and adheres well to many
- Viscosity: 2,400 cP
- Thermal Conductivity: 0.34 W/m-K
- Tensile Strength (Break): 540 psi
- Chemical System: Polyurethane (PU, PUR)
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Supplier: Accuris
Description: PLASTIC POLYURETHANE, FLEXIBLE POTTING AND MOLDING COMPOUND
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Encapsulants and Potting Compounds - Filter-bond™ Elastomeric Casting and Potting Compound -- E-3505Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval.
- Viscosity: 43,000 to 57,000 cP
- Features: Encapsulating / Potting Compound, Medical / Food (Sanitary / FDA)
- Chemical System: Polyurethane (PU, PUR), Rubber Based / Elastomeric
- Cure / Technology: Two Component System
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Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond R-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval.
- Viscosity: 8,000 to 14,000 cP
- Features: Encapsulating / Potting Compound, Medical / Food (Sanitary / FDA)
- Chemical System: Polyurethane (PU, PUR)
- Cure / Technology: Two Component System
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite 3145 potting & encapsulating compound is compatible with polyurethane materials.
- Features: Encapsulant / Potting Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite 3145 potting & encapsulating compound is compatible with polyurethane materials.
- Features: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: CONATHANES® EN-2541 and EN-2543 are filled, flame resistant polyurethane resins, specially formulated for general purpose electrical/electronic potting, casting and encapsulation. When tested in accordance with UL-94, flame resistance ratings of 94V-O are obtained. EN-2541 and EN-2543
- Features: Encapsulating / Potting
- Chemical System: Polyurethane (PU, PUR)
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Supplier: Newark, An Avnet Company
Description: High Temperature Rigid Polyurethane Potting and Encapsulating Compound / 3 kg, 2.55 L Kit
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Supplier: ACCRAbond, Inc.
Description: CONATHANE® UF-3 is a unique polyurethane foam characterized by low vapor pressure. UF-3 is unaffected by grease, oils, and most solvents. Also, it is ozone resistant, has excellent insulation characteristics, is dimensionally stable and will not rot or mildew.
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
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Supplier: Newark, An Avnet Company
Description: Black Flexible Polyurethane Potting and Encapsulating Compound / 2.84 kg, 2.55 L Kit
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Supplier: Techsil Limited
Description: Techsil® VT2420LV is a crystal clear two-part, low viscosity room temperature curing polyurethane resin with high shore hardness. VT2420LV offers excellent outdoor weathering properties, due to the incorporation of both UV resistant base materials and the addition of UV stabilizers and
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
- Chemical System: Polyurethane (PU, PUR)
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Supplier: Newark, An Avnet Company
Description: Black Flexible Polyurethane Potting and Encapsulating Compound (MTO = 1) / 12 kg, 10.8 L Kit
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Supplier: Newark, An Avnet Company
Description: RESIN, PUR, PACKET, 250G, CLEAR/AMBER; Potting Compound Type:PUR (Polyurethane); Dispensing Method:Packet; Compound Colour:Amber / Transparent; Weight:250g; Product Range:UR5048 Series; SVHC:No SVHC (07-Jul-2017); Volume:- RoHS Compliant: Yes
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Supplier: TE Connectivity
Description: Availability Minimum Order Quantity : 1 Potting Resin Product Availability : China, EMEA, ASIA, ANZPAC, AMERICAS Product Type Features Material System : Two-Component Polyurethane Potting Resin Product Type : Potting Material Potting Resin Technology : Resin
- Features: Encapsulant / Potting Compound, Specialty / Other
- Chemical System: Polyurethane (PU, PUR)
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Encapsulants and Potting Compounds - Techsil® PU23930 Pearl Polyurethane Twinpack 250gm -- TEEP14087Supplier: Techsil Limited
Description: Techsil® PU23930 is a two-part, flexible, room temperature curing polyurethane resin designed for the potting and encapsulation of LED arrays and lighting equipment. Product Features Excellent long term UV stability Scratch and mark resistant Non-toxic High mechanical strength Easy to
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
- Chemical System: Polyurethane (PU, PUR)
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-1556 Polyurethane Encapsulant is a two-component polyether-based system used as an encapsulating, molding, and potting compound. It is recommended for harness breakouts, watertight electrical connectors, cables, and cable end seals. It also offers
- Viscosity: 10,040 to 18,000 cP
- Tensile Strength (Break): 1,400 to 5,000 psi
- Elongation: 400 %
- Dielectric Strength: 350 kV/in
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-2550 Polyurethane Encapsulant is a two-component polyurethane potting system. It is used for potting and encapsulation of electronic components, circuit boards, and related devices. It has low stress cure for protection of sensitive components and
- Viscosity: 1,200 to 3,000 cP
- Thermal Conductivity: 0.5 W/m-K
- Tensile Strength (Break): 1,850 psi
- Elongation: 32 %
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-1556 Polyurethane Encapsulant is a two-component polyether-based system used as an encapsulating, molding, and potting compound. It is recommended for harness breakouts, watertight electrical connectors, cables, and cable end seals. It also offers
- Viscosity: 3,000 to 10,040 cP
- Tensile Strength (Break): 1,400 to 5,000 psi
- Elongation: 400 %
- Dielectric Strength: 350 kV/in
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Supplier: MacDermid Alpha Electronics Solutions
Description: A durable two-part polyurethane encapsulation resin developed for electrical components exposed to extreme conditions. Product Overview UR5645 High Performance Polyurethane Resin has been specially developed for the encapsulation and potting of electronics, such as the next
- Use Temperature: 320 F
- Industry: Automotive, Semiconductors / IC Packaging
- Features: Electronics, Encapsulating / Potting, Marine
- Chemical System: Polyurethane (PU, PUR)
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-21 Polyurethane Resin System is a two component, non-MBOCA system that is used for casting, embedding, potting, and encapsulation of electrical assemblies and power devices. It is recommended for potting print circuit boards, voltage regulators,
- Viscosity: 800 cP
- Tensile Strength (Break): 2,000 psi
- Elongation: 155 %
- Features: Encapsulating / Potting
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Supplier: Protavic America, Inc.
Description: PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and
- Viscosity: 5,000 cP
- Use Temperature: -55 to 120 F
- Tensile Strength (Break): 2,000 psi
- Dielectric Constant (Relative Permittivity): 4.41 to 4.63
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Supplier: Protavic America, Inc.
Description: ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique
- Viscosity: 625 cP
- Use Temperature: -85 to 347 F
- Dielectric Constant (Relative Permittivity): 4.3
- Water Absorption: 1.5 %
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST U2535 Polyurethane Encapsulant ) LOCTITE STYCAST U 2535 PTB two component flexible polyurethane encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings.
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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and premature failure such as vibration, shock, and stress caused by temperature fluctuation during thermal cycling. Material options for electronic protection include silicones, epoxies, polyurethanes, and other various polymers. Silicones are extremely durable and feature important and (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
-component polyurethanes that assure consistent cure and performance even in small “shot-size” potting applications (Bectron® PK materials). Dielectric gels that provide outstanding electronic protection with very low stress on (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
potting materials are based on epoxy, polyurethane, polybutadiene and silicone and are especially designed for areas in demanding electrical and electronic applications. Additional properties such as improved heat dissipation, much greater mechanical stability at high vibrational forces, noise reduction (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
Management With the continued miniaturization and expanding population of components that comprise electronic devices, mitigation of generated heat is an ongoing issue. CHT offers a series of silicone adhesive sealants, encapsulation and potting compounds, silicone gels, gap fillers and non (read more)
Browse Conformal Coatings Datasheets for CHT USA Inc. -
EP30HV Master Bond EP30HV is a lower viscosity, two component epoxy system for high performance bonding, sealing, coating and potting. It is formulated to cure at room temperature or more rapidly at elevated temperatures. The optimum (read more)
Browse Conformal Coatings Datasheets for Master Bond, Inc. -
recommended cure schedule is overnight at room temperature followed by 3-5 hours at 140-175°F. It has exceptionally low exotherm and a long working life of 6 to 8 hours for a 100 gram mass. This compound is 100% reactive, with no solvents or diluents, and has low shrinkage upon curing. EP (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
latter property is particularly useful in potting and encapsulation applications. Also, the compound allows for precise alignment with minimal fixturing and simple curing. Its service temperature range is from 4K to +300°F. The color of Part A is light cream and Part B is similar, but slightly darker (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
NASA low outgassing approved epoxy, Master Bond Supreme 121AO, may be used for bonding, sealing and potting applications.
(read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Room-Temperature Stable Encapsulant & Wire Bond Adhesive with Secondary Moisture Cure
(read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
conditions – from dust storms to heavy rains – while ensuring uninterrupted performance. The stakes? Our global food supply and the efficiency of farms worldwide. Rooted in a tradition of excellence, ELANTAS crafts stateof-the-art conformal coatings and potting solutions, specifically (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC
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What Makes Polyurethane Potting Compound For Electronics Thick
Potting compounds are flooding the electronic assembly market, and sometimes this can make it hard for newbies to make the right choice. In case you are not aware, Polyurethane potting compounds are perfect for electronics. They are considered that way due to their incredible features.
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The Importance of Using High-Quality Polyurethane Potting Compound for Electronics
electronics is by using potting compound, a material that encapsulates electronic components to protect them from moisture, heat, and vibration. In this article, we will discuss the benefits of using high-quality polyurethane potting compound for electronics.
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Polyurethane Potting Compound for Electronics from China Polyurethane Potting Compound Manufacturers
Polyurethane encapsulating and potting compounds have many advantages, especially when a quick cure is needed at low temperatures. This solution is better compared to epoxy systems. With polyurethanes, there is better crack resistance and flexibility. There is also better adhesion to some
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How to Achieve Several Efficiencies by Using Polyurethane Potting Compound for Electronics
and vibrations. This is where electronic potting comes in. The enclosure of the miniature electronic component will have to be filled up with suitable materials to protect them from shocks, vibrations, water, high temperature, chemicals, and other external factors.
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How to Apply Polyurethane Potting Compound for Electronics: Tips and Tricks
UV-curing adhesives are a type of adhesive that cures or hardens whenever exposed to ultraviolet light. They have become increasingly popular in various industries due to their fast-curing time, high bond strength, and versatility. In harsh environments where traditional adhesives may fail,
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Polyurethane: "Customized Plastic"
PU Potting Compounds: Vacuum Processing Provides Optimum Results - Polyurethanes have an extremely wide and flexibly modifiable range of properties. This makes them a popular and frequently used group of materials in industrial production. PU potting compounds can be processed easily and feature
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New Urethane Technology for Potting & Encapsulation in Electronics
Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds available to designers are unable to give adequate protection over a wide temperature range
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Dielectric Materials for Use in Radomes
low dielectric constants, useful in radio and microwave frequencies. This makes them ideal for applications such as in conformal antennas, where the material must be applied around a radius. Microelectronics - Non-foamed polyurethanes are often used as "potting compounds" in electronics, where
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SAFETY ANALYSIS OF THE EBR-II HIGH-TEMPERATURE NUCLEAR INSTRUMENT TEST FACILITY (NITF).
A polyurethane potting compound was poured on top of the shot to form a seal for argon g&s.