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Supplier: R. S. Hughes Company, Inc.
Description: Loctite 3145 potting & encapsulating compound is compatible with polyurethane materials.
- Form / Function: Encapsulant / Potting Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite 3145 potting & encapsulating compound is compatible with polyurethane materials.
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...
Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 6.63
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Supplier: Epoxies Etc...
Description: 20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. 20-2365 has a convenient
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
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Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond R-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 8000 to 14000 cP
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Encapsulants and Potting Compounds - Filter-bond? Elastomeric Casting and Potting Compound -- E-3505Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Epoxies Etc...
Description: The 20-2135 is a two component, low durometer, potting, casting and encapsulating compound. This system is unfilled and low in viscosity allowing for fast self-leveling. The 20-2135 will quickly encapsulate components and electronic devices. The 20-2135 has outstanding thermal cycling
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.5
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Supplier: Epoxies Etc...
Description: internal stress and minimal shrinkage. It is an excellent choice for potting and encapsulating electronic modules, coils, and micro electronic networks that require thermal cycling extremes and low pressure on delicate components.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Henkel Corporation - Industrial
Description: 2-part, yellowish, polyurethane-based casting resin, NSF approved, formulated especially for spiral wound filters (RO) and application to dry substrates. Two component polyurethane adhesive. Macroplast® UK 178A with 178B is a 100% solids, room temperature curing polyurethane
- Compound Type: Leveling / Filling Compound
- Cure Type / Technology: Two Component System
- Industry: Other
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Supplier: MacDermid Alpha Electronics Solutions
Description: High-performance polyurethane potting and encapsulation compound suitable for a wide range of applications. Product Overview UR5604 is a general-purpose two-part polyurethane potting compound designed for potting and encapsulation. This versatile
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Flame Retardant / UL 94V-0 Rated: Yes
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Supplier: MacDermid Alpha Electronics Solutions
Description: This thermally conductive polyurethane encapsulation and potting compound is a two-part system with a black finish. Product Overview UR5097 Thermally Conductive Polyurethane Potting Compound exhibits excellent thermal conductivity, making it ideal for
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: MacDermid Alpha Electronics Solutions
Description: Specialist resin with environmental protection for LEDs and PCBs, preserving optical clarity and color after prolonged UV exposure. Product Overview UR5634 Optically Clear Polyurethane LED Potting Compound is a two-part, semi-rigid polyurethane resin. It is formulated
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 5529, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 5529 is a flexible, flame retardant, mineral filled, polyurethane compound. This potting compound has long pot life, and is low viscosity so it flows well and adheres well to
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 540 psi
- Thermal Conductivity: 0.3400 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 5544, Potting and Encapsulating LOCTITE® STYCAST US 5544 is a fast gelling, flexible, flame retardant, mineral-filled, polyurethane compound. It is a fast-setting potting compound which is low in viscosity, therefore flows well and adheres well
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 63.33 µin/in-F
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 1320 psi
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Supplier: Techsil Limited
Description: Techsil® VT2420LV is a crystal clear two-part, low viscosity room temperature curing polyurethane resin with high shore hardness. VT2420LV offers excellent outdoor weathering properties, due to the incorporation of both UV resistant base materials and the addition of UV stabilizers and
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: CONATHANES® EN-2541 and EN-2543 are filled, flame resistant polyurethane resins, specially formulated for general purpose electrical/electroni c potting, casting and encapsulation. When tested in accordance with UL-94, flame resistance ratings of 94V-O are obtained. EN-2541 and EN-2543
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 2350, Urethane, High Speed Sealing, Potting and Encapsulating LOCTITE® STYCAST US 2350 is a flexible, flame retardant, mineral filled, polyurethane compound. This potting compound has long pot life, and is low viscosity so it flows well
- Thermal Conductivity: 0.5100 W/m-K
- Use Temperature: 149 to 257 F
- Viscosity: 2400 cP
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Supplier: Techsil Limited
Description: Techsil PU23955 is a two part component potting compound which cures to an opaque translucent material that is stable in UV light. Once mixed, the system reacts at room temperature to produce a tough abrasion resistant material with good hydrolysis resistance. There are many
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: TE Connectivity
Description: Quantity : 1 Potting Resin Product Availability : AMERICAS, ASIA, EMEA, ANZPAC, China Product Type Features Material System : Two-Component Polyurethane Potting Resin Product Type : Potting
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Supplier: TE Connectivity
Description: Availability Minimum Order Quantity : 1 Potting Resin Product Availability : China, EMEA, ASIA, ANZPAC, AMERICAS Product Type Features Material System : Two-Component Polyurethane
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Supplier: TE Connectivity
Description: Material System : Two-Part Polyurethane Potting Resin Product Type : Casting Material Usage Conditions Flammability Performance : Non-Flame-Retardant
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Supplier: TE Connectivity
Description: Product Type Features Material System : Two-Part Polyurethane Potting Resin Product Type : Casting Material Usage Conditions Environmental Resistance : Water-Repellent, Hydrolysis Stable Flammability Performance : Non-Flame-Retardant
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Supplier: Protavic America, Inc.
Description: ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electroni c casting and encapsulating applications that require a unique
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Electrically Conductive, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Two Component System
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Supplier: ACCRAbond, Inc.
Description: CONATHANE® UF-3 is a unique polyurethane foam characterized by low vapor pressure. UF-3 is unaffected by grease, oils, and most solvents. Also, it is ozone resistant, has excellent insulation characteristics, is dimensionally stable and will not rot or mildew.
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: DigiKey
Description: BLACK RIGID POLYURETHANE POTTING
- Form / Function: Encapsulant / Potting Compound
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Supplier: Accuris
Description: MOLDING AND POTTING COMPOUND, CHEMICALLY CURED, POLYURETHANE
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-21 Polyurethane Resin System is a two component, non-MBOCA system that is used for casting, embedding, potting, and encapsulation of electrical assemblies and power devices. It is recommended for potting print circuit boards, voltage regulators,
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Dielectric Strength: 0.0165 kV/in
- Elongation: 155 %
- Form / Function: Encapsulant / Potting Compound
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Supplier: RS Components, Ltd.
Description: Optically clear polyurethane 250g - Adhesives & Glues - Potting Compounds
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.2000 W/m-K
- Use Temperature: -40 to 248 F
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST U2535 Polyurethane Encapsulant ) LOCTITE STYCAST U 2535 PTB two component flexible polyurethane encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings.
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: such as strength, chemical resistance, and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. In addition, EP30D10 has been used successfully in a number of different cryogenic applications. Master Bond Polymer System EP30D-10 is
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 50 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-1556 Polyurethane Encapsulant is a two-component polyether-based system used as an encapsulating, molding, and potting compound. It is recommended for harness breakouts, watertight electrical connectors, cables, and cable end seals. It also offers
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 350 kV/in
- Elongation: 400 %
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Supplier: GS Polymers, Inc.
Description: Two part, 1:2 cost-effective general purpose potting system
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: ELANTAS North America LLC
Description: conformal coatings and potting solutions tailored for the smart meter market. Our advanced materials are designed to encapsulate and protect electronic components, defending them from moisture, contaminants, and the rigors of daily operations. This ensures that smart meters, whether
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol US2350 ) LOCTITE STYCAST US 2350 is a flexible, flame retardant, mineral filled, polyurethane compound. This potting compound has long pot life and is low viscosity so it flows well and adheres to many substrates. It has very low odor and does not
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Industry: Electronics
- Thermal Conductivity: 0.5100 W/m-K
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Supplier: Sauereisen, Inc.
Description: Sauereisen Universal Block Filler No. 509 is a moist-cured urethane formulation specifically designed to fill small voids, irregularities, and air pockets in concrete. No. 509 provides a smooth surface prior to application of vinyl ester and urethane protective barriers.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Cure Type / Technology: Two Component System
- Industry Applications: Other
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and premature failure such as vibration, shock, and stress caused by temperature fluctuation during thermal cycling. Material options for electronic protection include silicones, epoxies, polyurethanes, and other various polymers. Silicones are extremely durable and feature important and (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
-component polyurethanes that assure consistent cure and performance even in small “shot-size” potting applications (Bectron® PK materials). Dielectric gels that provide outstanding electronic protection with very low stress on (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
potting materials are based on epoxy, polyurethane, polybutadiene and silicone and are especially designed for areas in demanding electrical and electronic applications. Additional properties such as improved heat dissipation, much greater mechanical stability at high vibrational forces, noise reduction (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
Management With the continued miniaturization and expanding population of components that comprise electronic devices, mitigation of generated heat is an ongoing issue. CHT offers a series of silicone adhesive sealants, encapsulation and potting compounds, silicone gels, gap fillers and non (read more)
Browse Conformal Coatings Datasheets for CHT USA Inc. -
EP30HV Master Bond EP30HV is a lower viscosity, two component epoxy system for high performance bonding, sealing, coating and potting. It is formulated to cure at room temperature or more rapidly at elevated temperatures. The optimum (read more)
Browse Conformal Coatings Datasheets for Master Bond, Inc. -
recommended cure schedule is overnight at room temperature followed by 3-5 hours at 140-175°F. It has exceptionally low exotherm and a long working life of 6 to 8 hours for a 100 gram mass. This compound is 100% reactive, with no solvents or diluents, and has low shrinkage upon curing. EP (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
latter property is particularly useful in potting and encapsulation applications. Also, the compound allows for precise alignment with minimal fixturing and simple curing. Its service temperature range is from 4K to +300°F. The color of Part A is light cream and Part B is similar, but slightly darker (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
NASA low outgassing approved epoxy, Master Bond Supreme 121AO, may be used for bonding, sealing and potting applications.
(read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
. Process and Performance Advantages The one-part formulation simplifies dispensing and eliminates mixing or pot-life concerns. Formulated without solvents or isocyanates, it delivers high ionic purity and consistent coverage across complex geometries (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
Room-Temperature Stable Encapsulant & Wire Bond Adhesive with Secondary Moisture Cure
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Browse Encapsulants and Potting Compounds Datasheets for Dymax
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What Makes Polyurethane Potting Compound For Electronics Thick
Potting compounds are flooding the electronic assembly market, and sometimes this can make it hard for newbies to make the right choice. In case you are not aware, Polyurethane potting compounds are perfect for electronics. They are considered that way due to their incredible features.
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The Importance of Using High-Quality Polyurethane Potting Compound for Electronics
electronics is by using potting compound, a material that encapsulates electronic components to protect them from moisture, heat, and vibration. In this article, we will discuss the benefits of using high-quality polyurethane potting compound for electronics.
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Polyurethane Potting Compound for Electronics from China Polyurethane Potting Compound Manufacturers
Polyurethane encapsulating and potting compounds have many advantages, especially when a quick cure is needed at low temperatures. This solution is better compared to epoxy systems. With polyurethanes, there is better crack resistance and flexibility. There is also better adhesion to some
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How to Achieve Several Efficiencies by Using Polyurethane Potting Compound for Electronics
and vibrations. This is where electronic potting comes in. The enclosure of the miniature electronic component will have to be filled up with suitable materials to protect them from shocks, vibrations, water, high temperature, chemicals, and other external factors.
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How to Apply Polyurethane Potting Compound for Electronics: Tips and Tricks
UV-curing adhesives are a type of adhesive that cures or hardens whenever exposed to ultraviolet light. They have become increasingly popular in various industries due to their fast-curing time, high bond strength, and versatility. In harsh environments where traditional adhesives may fail,
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Polyurethane: "Customized Plastic"
PU Potting Compounds: Vacuum Processing Provides Optimum Results - Polyurethanes have an extremely wide and flexibly modifiable range of properties. This makes them a popular and frequently used group of materials in industrial production. PU potting compounds can be processed easily and feature
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New Urethane Technology for Potting & Encapsulation in Electronics
Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds available to designers are unable to give adequate protection over a wide temperature range
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Dielectric Materials for Use in Radomes
low dielectric constants, useful in radio and microwave frequencies. This makes them ideal for applications such as in conformal antennas, where the material must be applied around a radius. Microelectronics - Non-foamed polyurethanes are often used as "potting compounds" in electronics, where
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SAFETY ANALYSIS OF THE EBR-II HIGH-TEMPERATURE NUCLEAR INSTRUMENT TEST FACILITY (NITF).
A polyurethane potting compound was poured on top of the shot to form a seal for argon g&s.