Semiconductor Inspection Tool

Description: hardware on our leading technology machine tools. We also offer contract machining on a single process need basis. Manufacturing Services Offered: Wire and Sinker EDM EDM is one of the most accurate processes for machining complex geometries into

• Capabilities: Electrical and Electromechanical Assembly, Extrusion, Machining, Mechanical Assembly, Plastic Fabrication, Sheet Metal Fabrication, Welding and Fabrication
• Industry Served: Aerospace / Avionics, Automotive, Chemicals / Raw Materials, Electronics / Semiconductors, Energy / Utility, Food / Beverage, Hydraulics / Pneumatics, Industrial / Commercial, Instruments / Sensors, Marine, Material Handling, Medical / Health Care, Military / Defense, Telecommunications
• Location: North America, United States Only, Northeast US Only
• Services: Certification / Qualification, Computer Aided Design (CAD) / Solid Modeling, Computer Aided Machining (CAM), Design / Development, Just-in-Time Delivery, Kitting, Low Volume Production, High Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product

Description: scattered from defects while suppressing background noise from the wafer surface. It is widely adopted to control contamination in the manufacturing of semiconductors on the 10-nm scale, and for delivery and incoming wafer quality control. For device manufacturer: incoming inspection

• Form Factor: Wafer Probing System
• Mounting / Loading: Floor Mounted / Stand-alone

Description: X-Ray Inspection X-Ray Inspection can be an effective, non-destructive inspection tool. This form of interactive analysis provides internal viewing of an assembly’s design, internal components, workmanship and potential latent quality issues. Digital X-ray technology has

• Industry: Automotive, Aviation / Aerospace, Coatings / Platings, Welding / Fabrication
• Regional Preference: North America, United States Only, Northeast US Only, Europe Only
• Technology: Acoustic Emission, Computed Tomography / Digital Imaging, Optical / Visual, Penetrant Testing System (Dye / FPI), Radiographic / X-ray

Description: , sidewall slope, and line width characterization. The completely automated XE-LCD is designed for characterization of flat panel displays as either an in-line or off-line inspection tool. • Automatic Non-Contact AFM measurement • Automatic navigation and focusing

• Application: Semiconductor Inspection
• Scanning Probe Microscope Type: AFM

Description: market today. Providing the highest resolution and the lowest gauge sigma value for repeatability and reproducibility, the XE-WAFER is the perfect solution for the semiconductor and hard disk drive industries which, until now, had very limited choices for industrial grade in-line

• Application: Semiconductor Inspection
• Scanning Probe Microscope Type: AFM

Description: , until now, had very limited choices for industrial grade in-line inspection tools for HDD slider metrology. Artifact Free Metrology by Crosstalk Elimination • Two independent, closed-loop XY and Z flexure scanners for sample and tip • Flat and linear XY scan of up to

• Application: Semiconductor Inspection
• Lateral Resolution: 1.5 nm
• Scanning Probe Microscope Type: AFM

Description: • Out of plane motion of less than 2 nm over entire scan range • Accurate feature measurements with industry leading gauge sigma • Superior tool to tool matching Longer Tip Life by True Non-Contact Mode • 10 times larger Z-scan bandwidth than a piezotube

• Application: Semiconductor Inspection
• Lateral Resolution: 1.5 nm
• Scanning Probe Microscope Type: AFM

Description: The LLC6 is a precise linear lens changer with 6 lens ports providing ultra fast, automatic lens changing without the need of re-qualifying the lens. It is the ideal tool for TFT-LCD and Photomask Inspection/Repair applications or other tasks where multiple optical magnifications are

• Applications: Semiconductor Wafers
• Form Factor: Other
• Non-contact: Yes
• Non-destructive: Yes

Description: Inspection, Burring, Electronic Soldering or Drilling. The unit can also be adapted to special stands for mounting on Machine Tools and for Medical Operating Procedures. It can be incorporated into systems as an electron microscope viewer. The unit has excellent natural light gathering

• Application: Measuring / Toolmaker, Metallurgical, Semiconductor Inspection
• Eyepiece Style: Binocular
• Grade: Benchtop
• Microscope Type: Stereomicroscope

Description: stage rail designs normally seen on high-end machine tools. VMR-Z120X maximum magnification model Offers even greater precision, providing optical magnification to 120x. Ideal for wafer level CSP, wafer bump height and SIP, rerouted masks and masks for MEMS. Other features

• Applications / Capabilities: Electronics or Semiconductor Inspection
• Image Source: Optical Microscope
• System Type: Turnkey / Complete System

Description: Trevista CI Dome Features The Trevista CI Dome is a hardware and software-based image formation and inspection solution. Using the power of VisionPro software, the Trevista CI Dome enhances inspection processes of parts with shiny or matte surfaces. The built-in Trevista vision

• Applications / Capabilities: Assembly Quality, Electronics or Semiconductor Inspection, Flaw Detection, Other
• System Type: Modular / PC-Based

Description: 3D Measurement Tools - Height, Roughness, Radius, and More The VR Series includes a cross-sectional profile measurement menu with tools for measuring height, width, angle, radius, etc. A large variety of 3D analysis functions such as height difference, area, volume, and roughness are

• Application: Semiconductor Inspection
• Computer Interface: Yes
• Digital Display: Yes
• Grade: Benchtop

Description: The NWL200 series is the first lineup of wafer loaders for inspection microscopes capable of loading 100 micron thin wafers. Thanks to a new chuck system, the NWL200 series achieves highly reliable loading suitable for inspection of next-generation semiconductors. Improved wafer

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System, Other
• Maximum Wafer / Part Size: 200 mm
• Measurement Capability: Defects / ADC

Description: The Phenom Pure desktop SEM (scanning electron microscope) is an ideal tool for making the transition from working with a light microscope to operating an electron microscope. The Phenom Pure is equipped with the basic fundamentals for meeting imaging needs. The Phenom Pure provides high

• Applications / Capabilities: Electronics or Semiconductor Inspection, Flaw Detection, Materials Analysis
• Image Source: Electron Microscope
• Imaging & Analysis Software: Yes
• System Type: Modular / PC-Based

Description: semiconductor parameter analyzers. You get the best digital sweep parameter analyzer plus a reliability tester, powerful failure-analysis tool, and automated incoming inspection station, all rolled into a single instrument. This new family was explicitly designed to provide

Description: The 4156B is a Semiconductor Parameter Analyzer from Agilent. Semiconductor parameter analyzers are all-in-one tools used for a wide range of measurement capabilities. Semiconductor parameter analyzers can measure and analyze electrical characterizations of many types of

Description: , and cost effectively solve a wide variety of inspections. The patented speckle-free blue laser optics, an industry first, acquires high quality 3D images and on-board high-performance processing powers a comprehensive set of true 3D vision tools, without the need for external

• Applications / Capabilities: Electronics or Semiconductor Inspection, Flaw Detection, Food & Beverage, Production & Quality Control, Seal Integrity, Other
• Image Source: Other Image Source
• Inspection Rate: 4000 inspections per second
• System Type: Modular / PC-Based

Description: In-Sight 7000 Features The In-Sight 7000 series is a full-featured, powerful vision system that performs fast, accurate inspections of a wide range of parts across all industries. Its compact footprint easily fits into space-constrained production lines and the unique, modular design is

• Applications / Capabilities: Assembly Quality, Biotechnology or Medical, Electronics or Semiconductor Inspection, Food & Beverage, Pharmaceutical Packaging, Security & Biometrics, Other
• Data Storage: 7.2 GB
• Image Source: High Speed / Brightness
• System Type: Modular / PC-Based

Description: This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 10 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom wafer calibration standards. Manual loading allows

• Applications: Semiconductor Wafers, CVD / PVD Films
• Form Factor: Other
• Maximum Wafer / Part Size: 150 to 300 mm
• Mounting / Loading: Manual Loading

Description: This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 20 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom wafer calibration standards. Manual loading allows

• Applications: Semiconductor Wafers, CVD / PVD Films
• Form Factor: Other
• Maximum Wafer / Part Size: 150 to 300 mm
• Mounting / Loading: Manual Loading

Description: acquisition The In-Sight 9902L has a blazing fast 67 kHz line rate, acquiring each line of data in just 15 microseconds. Capturing 2,000 pixels with each line, the camera delivers 32MP images (16,000 lines) that enable vision tools to perform highly detailed inspections.

• Applications / Capabilities: Assembly Quality, Biotechnology or Medical, Electronics or Semiconductor Inspection, Food & Beverage, Pharmaceutical Packaging, Security & Biometrics, Other
• Data Storage: 8 GB
• Image Source: Line Scan Camera
• System Type: Modular / PC-Based

Description: to micro viewing Accurate measurements with a telecentric optical system Four Models to Choose From: Entry Level Tilt Model High-resolution Model High-End Model The Tool of Choice for Failure Analysis Speed combined with guaranteed accuracy and repeatability make the DSX1000 digital

• Application: Measuring / Toolmaker, Metallurgical, Semiconductor Inspection, Other
• Computer Interface: Yes
• Grade: Benchtop
• Image Analysis Processing Software: Yes

Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 10 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic

• Applications: Semiconductor Wafers, CVD / PVD Films
• Form Factor: Other
• Maximum Wafer / Part Size: 200 to 300 mm
• Mounting / Loading: Floor Mounted / Stand-alone

Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 20 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic

• Applications: Semiconductor Wafers, CVD / PVD Films
• Form Factor: Other
• Maximum Wafer / Part Size: 200 to 300 mm
• Mounting / Loading: Floor Mounted / Stand-alone

Description: Top Seiko offers precision fabrication of glass products with our latest machines, custom tools and jigs. Glass Materials we machine include: Fused Quartz / Fused Silica, TEMPAX Float®,Corning Glass ULE®, Macor and many more. Let us help you select the best glass material for your

• Application Expertise: Labware (Dewars / Manifolds), Optical / Semiconductor
• Fabrication Services: Glass Part Fabrication, Material Selection, Inspection / Testing
• Location: East Asia / Pacific Only
• Materials Processed: Quartz

Description: /OCR) Intuitive interface allows users of all levels to easily set up a robust inspection Features Auto-Teach Inspection Tool [Color] An inspection tool that is automatically setup by presenting a batch of non-defective workpieces The newly

• Applications / Capabilities: Alignment / Guidance, Assembly Quality, Bar / Matrix Code, Biotechnology or Medical, Color Mark / Color Recognition, Container or Product Counting, Edge Detection, Electronics or Semiconductor Inspection, Electronics Rework, Flaw Detection, Food & Beverage, Gauging, Scanning &
• Image Source: Area Scan Camera, High Speed / Brightness, Multi-spectral, UV / Fluorescence
• Inspection Rate: 212 inspections per second
• Number of Cameras or Imagers Processed: 4

Description: The high-precision surfaceCONTROL 3D snapshot sensor is ideal for automated inline inspection of geometries, shapes and surfaces on diffuse reflective surfaces such as metal, plastic or ceramic.

• Applications / Capabilities: Assembly Quality, Edge Detection, Electronics or Semiconductor Inspection, Flaw Detection, Food & Beverage, Gauging, Scanning & Dimensioning, Non-contact Profilometry, Pattern Recognition, Pharmaceutical Packaging, Presence / Absence, Production & Quality Control, Tool & Die
• Image Source: Area Scan Camera
• Inspection Rate: 0.3000 inspections per second

Description: The high-precision surfaceCONTROL 3D snapshot sensor is ideal for automated inline inspection of geometries, shapes and surfaces on diffuse reflective surfaces such as metal, plastic or ceramic.

• Applications / Capabilities: Assembly Quality, Edge Detection, Electronics or Semiconductor Inspection, Flaw Detection, Food & Beverage, Gauging, Scanning & Dimensioning, Non-contact Profilometry, Pattern Recognition, Pharmaceutical Packaging, Presence / Absence, Production & Quality Control, Tool & Die
• Image Source: Area Scan Camera
• Inspection Rate: 0.3000 inspections per second

Description: ranging in thickness from .003 to .250. Presses are outfitted with CNC controllers and directly interfaced with our design software to minimize the amount of programming needed once the order hits the production floor. In addition quick change tooling systems utilizing standard tooling

• Capabilities: Die Cutting, Laser Processing, Machining, Sheet Metal Fabrication, Stamping, Tool and Die Manufacturing, Welding and Fabrication
• Industry Served: Aerospace / Avionics, Agriculture / Forestry, Automotive, Electronics / Semiconductors, Energy / Utility, Marine, Medical / Health Care, Military / Defense, Pharmaceutical / Biotech, Telecommunications
• Location: North America, United States Only, Northeast US Only
• Services: Computer Aided Design (CAD) / Solid Modeling, Design / Development, Reverse Engineering, Testing / Inspection

Description: Robust, dynamic and versatile, the Workliner range was specially developed for efficient, dynamic automation in the automotive, electronics, white goods, engineering, and machine-tool sectors. Thanks to the many options and add-ons available, Workliner 400/ 400S and 400T can be employed

• Automation: Automatic
• Industry: Industrial / General Use, Automotive, Electronics / Semiconductor
• Machine Type: Other
• Packaging: Cup / Tray

Description: Carclo Technical Plastics have established our Rapid Technology Systems (RTS) which manages the entire development process taking concept through tool manufacturing, where we can offer a range of rapid processes including: Design Service Stereolithography (SLA) Selective Laser Sintering (SLS)

• Capabilities: Gear Manufacturing, Laser Processing, Molding, Mold Making, Optical Manufacturing, Plastic Fabrication, Tool and Die Manufacturing
• Industry Served: Aerospace / Avionics, Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Instruments / Sensors, Medical / Health Care, Military / Defense, Pharmaceutical / Biotech, Telecommunications
• Location: North America, United States Only, Northeast US Only, Southwest US Only, Europe Only, Near East Only, East Asia / Pacific Only
• Services: Computer Aided Design (CAD) / Solid Modeling, Design / Development, Reverse Engineering, Testing / Inspection

Description: The APM650™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Depth Profiling: Yes
• Form Factor: Monitor / Instrument

Description: Industry Challenges In a world of Industry 4.0, precision measurement technology plays a crucial role to meet the increasing demand for automation of manufacturing, inspection processes, and ensuring reliable quality assurance. To satisfy the industrial challenges for superior quality and

• Applications / Capabilities: Alignment / Guidance, Assembly Quality, Bar / Matrix Code, Biotechnology or Medical, Color Mark / Color Recognition, Container or Product Counting, Edge Detection, Electronics or Semiconductor Inspection, Electronics Rework, Flaw Detection, Food & Beverage, Gauging, Scanning &

Description: Prototyping To help you get the best product to market quickly and cost effectively, we offer many digital converting solutions. Most of these processes accept standard file formats of drawings and produce prototype parts without the costly commitment of hard tooling

• Capabilities: Die Cutting, Other
• Industry Served: Aerospace / Avionics, Automotive, Building / Construction, Consumer / Retail, Electronics / Semiconductors, Energy / Utility, Marine, Medical / Health Care, Other
• Location: North America, United States Only, Southern US Only, Midwest US Only, Other
• Services: Design / Development, Reverse Engineering, Testing / Inspection

Description: Questions Cost Evaluation - Cost Reduction and Payback Analysis Since 1987, Isotech has been designing and engineering advanced automation solutions for a broad range of industries, including automotive, medical, packaging, food processing, semiconductors, electronics and more. Isotech can be

• Additional Capabilities: Powder / Bulk Handling, Cleanroom Application, Custom Equipment Design
• Industries Served: Aerospace / Aeronautics, Agriculture, Automotive, Biotech, Chemical, Computer, Defense / Military, Electrical, Electronics, Environmental, Fiber Optics, Food / Beverage, Furnace / Heat Treatment, Gas and Oil, General Industry / Manufacturing, Government, Marine, Medical, Mining, Paper,
• Location: North America, United States Only, Northeast US Only
• Services: Safety and Operator Protection, CAD / CAM Support, Control System Design / Programming, Equipment Design, Systems Design / Integration, Factory Automation, Manufacturing Cells, On-site Support / Training, Turnkey Systems, Process Development, In-house Prototyping / Testing, In-house Production,

Description: widely used in scenes such as the positioning of the needle of the dispenser, the positioning of the CNC tool positioning and the positioning of the industrial robot. - Ultra-small spot, repeatability up to 0.01mm; - Extremely short response time, the detection frequency can reach 2kHz; -

• Applications / Capabilities: Alignment / Guidance, Assembly Quality, Bar / Matrix Code, Biotechnology or Medical, Color Mark / Color Recognition, Container or Product Counting, Edge Detection, Electronics or Semiconductor Inspection, Electronics Rework, Flaw Detection, Food & Beverage, Gauging, Scanning &

Description: are also able to build zinc molds out of inexpensive steel that will allow actual die cast samples with a lower cost of entry. Prototype production requires experience and insight into innovative and unique machining techniques beyond typical tooling and production machining. Our associates

• Capabilities: Electronic Manufacturing, Machining, Metal Casting, Molding, Mold Making, Tool and Die Manufacturing
• Industry Served: Aerospace / Avionics, Agriculture / Forestry, Automotive, Building / Construction, Chemicals / Raw Materials, Electronics / Semiconductors, Hydraulics / Pneumatics, Industrial / Commercial, Instruments / Sensors, Marine, Medical / Health Care, Military / Defense, Pharmaceutical / Biotech,
• Location: North America, United States Only, Northeast US Only, Southern US Only, Midwest US Only
• Services: Computer Aided Design (CAD) / Solid Modeling, Computer Aided Machining (CAM), Design / Development, Reverse Engineering, Testing / Inspection

Description: output of it has all 3D information required including Z-axis in the level of submicron. With a tool like 3D laser camera, any tiny details can be seen. Benefits ? Support the output of 2D and 3D information simultaneously ? Pre-calibration ? The speed is up to 500-4,000HZ ? High precision:

• Applications / Capabilities: Alignment / Guidance, Assembly Quality, Bar / Matrix Code, Biotechnology or Medical, Color Mark / Color Recognition, Container or Product Counting, Edge Detection, Electronics or Semiconductor Inspection, Electronics Rework, Flaw Detection, Food & Beverage, Gauging, Scanning &
• Image Source: Line Scan Camera

Description: , reducing labor input and tooling customization costs, and improving manufacturing production efficiency. The highly-integrated lightweight body design meets the needs of short-distance positioning for robot arm-mounted installations, and is also friendly to small-load collaborative robots.

• Applications / Capabilities: Alignment / Guidance, Assembly Quality, Bar / Matrix Code, Biotechnology or Medical, Color Mark / Color Recognition, Container or Product Counting, Edge Detection, Electronics or Semiconductor Inspection, Electronics Rework, Flaw Detection, Food & Beverage, Gauging, Scanning &

Description: and defect control: inspection, repair, verification strategies, pellicles, in fab • Simulation and imaging: mask transfer to wafer (LER, SWA, surface roughness) • Nanoimprint lithography tools, mask, transfer, and resists • Deep learning mask technology applications

• Frequency: Annually
• Industry: Electronics and Semiconductor
• Type: Conference, Exhibition

Description: multiple angles. Pinpoint the root cause of production line failures. Operator friendly GUI and tools. Lower down time and increased productivity. Acquire from all cameras in a continuous loop or in pre-post loop with triggering for start stop. 4 or

• Applications / Capabilities: Alignment / Guidance, Assembly Quality, Biotechnology or Medical, Electronics or Semiconductor Inspection, Flaw Detection, Food & Beverage, Pharmaceutical Packaging, Presence / Absence, Production & Quality Control, Security & Biometrics, Tool & Die Monitoring, Web
• Data Storage: 128 GB
• Image Source: Area Scan Camera, Line Scan Camera, High Speed / Brightness
• Inspection Rate: 1800 inspections per second

Description: , innovative team of engineers can provide a comprehensive approach to failure analysis of a wide range of products; from the largest printed circuit board to the smallest transistor, IAL has the tools, techniques, and expertise necessary to cut through the confusion surrounding any

• Capabilities: Failure Analysis / Troubleshooting, Testing
• Forms Tested: Components / Parts, Samples / Materials
• Industry Applications: Electronics, Semiconductors / IC Packages
• Services Offered: Electrical Characteristics Testing, NDT / Inspection, Optical Testing, Performance Testing

Description: processes the hoist returns the cassette to the unloading port located at the same end of the tool as the loading port. The unloading port also has a sliding drawer mechanism to allow easy unloading of the cassette from the tool. The tool may be configured with darkened outside

• Application / Industry: Semiconductor / Wafer, Solar / Photovoltaic
• Equipment / System Type: Automated System
• Process / Technology: Electroplating

Description: housing is available in two model options (B: with worktable, P: with axes X/Y/Z). Vision inspection solutions for mark alignment, mark inspection and code validation can also be integrated. The general purpose B models: programmable Z-axis, worktable, electric lift door; ideal for

• Application Software Included: Yes
• Applications: Other
• Automation: Semi-automatic
• Media Handling: Glass / Ceramics, Metals, Plastics, Semiconductors / Electronics

Description: ATS applies industry-leading technical knowledge and resources to deliver a total automation solution, whether you require single- or multi-station lean automation, or a turnkey manufacturing system integrating third-party equipment, production-ready ATS standard products and technology custom

• Additional Capabilities: Cleanroom Application, Custom Equipment Design
• Industries Served: Aerospace / Aeronautics, Automotive, Computer, Electrical, Electronics, Fiber Optics, General Industry / Manufacturing, Medical, Pharmaceutical, Microelectronics / Semiconductor, Telecommunications, Other
• Location: North America, Southern US Only, Southwest US Only, Northwest US Only, Midwest US Only, Canada Only, Europe Only, East Asia / Pacific Only
• Services: CAD / CAM Support, Control System Design / Programming, Equipment Design, Systems Design / Integration, Factory Automation, Manufacturing Cells, On-site Support / Training, Turnkey Systems, Process Development, In-house Prototyping / Testing, In-house Production, Automated Testing /

Description: The rotary die cutting module, commonly referred to as a die station, is the cornerstone of our converting systems. Each rotary die station can be used for die cutting, nipping, laminating, punching, embossing, slitting or sheeting by simply changing the tool roll.

• Automation: Automatic, Other
• Closing Method: Heat Seal, Tuck / Fold
• Features: Stainless Steel Construction
• Goods: Consumer Packaging

Description: StreamPix and TroublePix operate at their best using state of the art StreamPix Station 625 and 1250 computers. These fine tuned computers are assembled in our labs with carefully selected components that will guarantee ultimate performance as well as image recording for hours with a no frame drop

• Applications / Capabilities: Alignment / Guidance, Assembly Quality, Biotechnology or Medical, Electronics or Semiconductor Inspection, Flaw Detection, Food & Beverage, Pharmaceutical Packaging, Presence / Absence, Production & Quality Control, Security & Biometrics, Tool & Die Monitoring, Web
• Data Storage: 128 GB
• Image Source: Area Scan Camera, Line Scan Camera, High Speed / Brightness
• Inspection Rate: 1800 inspections per second

Description: NorPix can provide custom multi-camera recording systems to fit your needs. StreamPix 5 Description 4 cameras x 60 fps 4 cameras at 60 fps x 640 x 480 on a single laptop. 4 cameras x 80 fps Laptop solution at 4 cameras at 80 fps x 640 x 480. 8 cameras x 90 fps. Desktop solution with 8 cameras at 90

• Applications / Capabilities: Alignment / Guidance, Assembly Quality, Biotechnology or Medical, Electronics or Semiconductor Inspection, Flaw Detection, Food & Beverage, Pharmaceutical Packaging, Presence / Absence, Production & Quality Control, Security & Biometrics, Tool & Die Monitoring, Web
• Data Storage: 128 GB
• Image Source: Area Scan Camera, Line Scan Camera, High Speed / Brightness
• Inspection Rate: 1800 inspections per second

Description: , all custom and commodity cables. · Metal fabrication, casting and extrusion, including all finishes and pad printing. · Plastics tooling and manufacture. Assembly facilities · Entech partners with 4 assembly facilities as well as in-house capabilities to provide

• Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Extrusion, Mechanical Assembly, Molding, Plastic Fabrication, Sheet Metal Fabrication
• Industry Served: Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Instruments / Sensors, Telecommunications
• Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only
• Services: Computer Aided Design (CAD) / Solid Modeling, Computer Aided Machining (CAM), Just-in-Time Delivery, Kitting, Low Volume Production, High Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing / Stocking

Description: GEVA-4000 is the newest addition to Teledyne DALSA's high-performance industrial controllers, offering excellent cost savings for multi-camera vision applications such as final inspection of large assemblies. With over eight times the processing performance of the entry level GEVA 300 and

• Applications / Capabilities: Alignment / Guidance, Assembly Quality, Bar / Matrix Code, Color Mark / Color Recognition, Container or Product Counting, Edge Detection, Electronics or Semiconductor Inspection, Flaw Detection, Food & Beverage, ID Detection / Verification, Optical Character Recognition (OCR), Pattern
• Image Source: Area Scan Camera
• System Type: Embedded / Vision Engine, Modular / PC-Based

Description: . Rapid prototypes using 3D Printing Technology in flexible or rigid materials Prototypes using single or small cavitation tooling LIM (Liquid Injection Molding) Injection/Transfer/C ompression Molding Using High Consistency Rubber Material

• Capabilities: Extrusion, Molding
• Industry Served: Agriculture / Forestry, Automotive, Building / Construction, Chemicals / Raw Materials, Consumer / Retail, Electronics / Semiconductors, Energy / Utility, Food / Beverage, Hydraulics / Pneumatics, Industrial / Commercial, Instruments / Sensors, Marine, Material Handling, Medical / Health
• Location: North America, United States Only, Southern US Only, Europe Only, East Asia / Pacific Only
• Services: Computer Aided Design (CAD) / Solid Modeling, Design / Development, Reverse Engineering, Testing / Inspection