Semiconductor Laminate

Description: to metal lid surfaces, epoxy laminate, or solder mask-coated substrates. Thermosetting Cures upon heating, providing a strong and durable bond. Semiconductors Featured Applications Attachment or Sealing Ideal for attaching or sealing high-reliability semiconductor packages and

• Features: Electrical Insulation / Dielectric Material, Electrically Conductive Compound (Adhesive, Grease)
• Industry: Electronics, Semiconductors / IC Packaging
• Cure / Technology: Thermosetting / Crosslinking

Description: According to the demands of customers,printing the circuit on the Al₂O₃/AIN ceramic tapes,after lamination, slicing, high temperature co-firing, brazing, gold plating and other processes, a ceramic and metal integrated package structure with a certain high air tightness is formed.(HTCC)Features1.

• Material Type: Alumina / Aluminum Oxide

Description: Pressure Gauges JG Series Product Features • Pressure gauges are designed for general and laboratory applications involving the measurement of compressed gases compatible with the materials of construction. • Gauges are used to monitor pressure of regulators and system • Tested for use with oxygen

• Dial Size: 2 inch
• Operating Temperature: -40 to 140 F
• Media: Gas
• Type: Gauge

Description: Pressure Gauges JR Series Product Features • Pressure gauges are designed for general and laboratory applications involving the measurement of compressed gases compatible with the materials of construction. • Gauges are used to monitor pressure of regulators and system • Tested for use with oxygen

• Dial Size: 2 inch
• Operating Temperature: -40 to 140 F
• Media: Gas
• Type: Gauge

Description: to accommodate bolt-in fuses Applications Fuse blocks for semiconductor fuses

• Normal Operating Current: 0 to 1,000 amps
• Rated Operating Voltage: 1,000 volts
• Operating Temperature: 176 F
• Approvals / Ratings: CSA Certification, UL Approval

Description: h-old 8100 is a 12 micron polyester film coated on both side with a solvent based acrylic adhesive system and protected by white siliconized release paper liner. Can be used for splicing, bonding and laminating foams, papers, plastics, films, foils, for mounting of nameplates, electronic

• Thickness: 0.0021653543307086614 inches
• Temperature Resistance: -20 C
• Adhesive: Acrylic
• Features: Double-Sided Adhesive, Electronics (PCB, Semiconductor)

Description: Designed to Seal Tyvek/Mylar, Nylon, Polyethylene, Polypropylene, Laminates, Kraft/PE and Foil.

• Industry: Agriculture, Automotive, Chemical / Petrochemical, Construction Material, Cosmetics / Perfumery, Electronics / Semiconductor, Food / Beverage, Garment, Household Product / Merchandise, Industrial / General Use, Medical, Military, Mining / Aggregate, Music / Video / Software, Paint / Coating,
• Packaging: Bag / Pouch
• Goods: Bulk / OEM Packaging, Consumer Packaging, Powder / Granular
• Machine Type: Closing Machines, Sealing Machines

Description: Designed to Seal Tyvek/Mylar, Nylon, Polyethylene, Polypropylene, Laminates, Kraft/PE and Foil.

• Industry: Agriculture, Automotive, Chemical / Petrochemical, Construction Material, Cosmetics / Perfumery, Electronics / Semiconductor, Food / Beverage, Garment, Household Product / Merchandise, Industrial / General Use, Medical, Military, Mining / Aggregate, Music / Video / Software, Paint / Coating,
• Packaging: Bag / Pouch
• Goods: Bulk / OEM Packaging, Consumer Packaging, Powder / Granular
• Machine Type: Closing Machines, Sealing Machines

Description: Dow DOWSIL™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates, and organic substrates. It is flame resistant, self leveling, flowable, thixotropic,

• Viscosity: 81,000 cP
• Thermal Conductivity: 1.8 W/m-K
• Tensile Strength (Break): 545 psi
• Elongation: 15 %

Description: Dow DOWSIL™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates, and organic substrates. It is flame resistant, self leveling, flowable, thixotropic,

• Viscosity: 81,000 cP
• Thermal Conductivity: 1.8 W/m-K
• Tensile Strength (Break): 545 psi
• Elongation: 15 %

Description: We offer a complete line of insulation Tapes for use in producing Flat Flexible Cables (FFC's) and a broad range of adhesive types that allow users to balance final product performance with lamination processes. Applications include clock spring cables, jumpers, and any application requiring long

• Thickness: 0.001 to 0.002 inches
• Peel Strength / Adhesion: 8 lbs/in
• Features: Dielectric / Insulating, Electronics (PCB, Semiconductor), Specialty / Other

Description: A highly effective negative tone photoresist remover used mainly for TSV mask and solder bumping applications. Developed to address laminated photo-resins and liquid resins, the novel stripping formulation of this TMAH/DMSO chemistry exhibits high dissolution performance compared to standard TMAH

• Type: Cleaner / Cleaning Agent, Stripper (Paint, Resins)
• Industry Applications: Semiconductor Wafer / Cleanroom

Description: Product Overview ALPHA Argomax 8021 Film offers a ready-to-laminate solution that removes the need for printing, dispensing, and drying process steps. Optimized for use in Die Transfer Film (DTF) processes, it supports a wide range of surfaces and is customized for fast, easy die and clip

• Thick Film Type: Conductor
• Applications: Die Bonding, Electronics / Microelectronics
• Material: Silver / Silver Alloy

Description: A460 is an unsupported permanent acrylic pressure-sensitive adhesive that has excellent peel, shear, and tack properties. A460 can be used to laminate and bond a wide variety of LSE materials and foams including polyolefins as well as ether and ester type polyurethanes. The product is

• Thickness: 0.002 inches
• Peel Strength / Adhesion: 4.5 lbs/in
• Temperature Resistance: -40 to 121.11111111111111 C
• Adhesive: Acrylic, Pressure Sensitive (PSA), Transfer

Description: A463 is an unsupported permanent acrylic pressure-sensitive adhesive that has excellent peel, shear, and tack properties. A463 can be used to laminate and bond a wide variety of LSE materials and foams including polyolefins as well as ether and ester type polyurethanes. The product is

• Thickness: 0.003 inches
• Peel Strength / Adhesion: 5 lbs/in
• Temperature Resistance: -40 to 121.11111111111111 C
• Adhesive: Acrylic, Pressure Sensitive (PSA), Transfer

Description: A464 is an unsupported permanent acrylic pressure-sensitive adhesive that has excellent peel, shear, and tack properties. A464 can be used to laminate and bond a wide variety of LSE materials and foams including polyolefins as well as ether and ester type polyurethanes. The product is

• Thickness: 0.004 inches
• Peel Strength / Adhesion: 5.625 lbs/in
• Temperature Resistance: -40 to 121.11111111111111 C
• Adhesive: Acrylic, Pressure Sensitive (PSA), Transfer

Description: Low-Flow Flame Retardant Adhesive on Polyimide Film Description T1779 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with polyimide film and are designed for laminated busbar applications requiring a formable, higher temperature dielectric material. The materials

• Width: 12 to 48 inches
• Thickness: 0.001 to 0.005 inches
• Peel Strength / Adhesion: 8 lbs/in
• Dielectric Strength: 204,724,409.448818 V/m

Description: A465 is an unsupported permanent acrylic pressure-sensitive adhesive that has excellent peel, shear, and tack properties. A465 can be used to laminate and bond a wide variety of LSE materials and foams including polyolefins as well as ether and ester type polyurethanes. The product is

• Thickness: 0.005 inches
• Peel Strength / Adhesion: 6.25 lbs/in
• Temperature Resistance: -40 to 121.11111111111111 C
• Adhesive: Acrylic, Pressure Sensitive (PSA), Transfer

Description: DW 212 is a film , skived from virgin PTFE, that has been etched on one side with sodium naphthalene. This surface treatment allows PTFE, which normally exhibits very poor adhesion, to be bonded to other materials. APPLICATION INFORMATION The major applications for sodium etched PTFE involve

• Width: 12 to 38 inches
• Thickness: 0.002 to 0.04 inches
• Temperature Resistance: 260 C
• Dielectric Strength: 98,425,196.8503935 V/m

Description: The rotary die cutting module, commonly referred to as a die station, is the cornerstone of our converting systems. Each rotary die station can be used for die cutting, nipping, laminating, punching, embossing, slitting or sheeting by simply changing the tool roll.

• Printing Rate: 1,523.9999999999993 mm/sec
• Printing Width: 609.5996708161778 mm
• Maximum Paper Width: 609.5996708161778 mm
• Features: Cutter, Date Stamp, Labels

Description: CYTOP™ amorphous fluoropolymers have the same excellent chemical, thermal, electrical and surface properties as conventional fluoropolymers like PTFEs, but also exhibit high optical transparency and good solubility in specific fluorinated solvents. CYTOP fluoropolymers are like transparent PTFEs.

• Coeff. of Thermal Expansion (CTE): 63.888888888888886 to 66.66666666666667 µin/in-F
• Water Absorption: 0.3 %
• Industry: Electronics, Semiconductor / IC's
• Chemical System: Fluoropolymer (PTFE / PVDF)

Description: The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH

• Viscosity: 7,500 to 10,500 cP
• Coeff. of Thermal Expansion (CTE): 54.44444444444444 to 70 µin/in-F
• Water Absorption: 0.15 %
• Features: Die Bonding Adhesive / Compound, Electrically Conductive, Flexible / Dampening, Gel, Laminating / Composites, Other, Specialty / Other, Thermal Compound / Interface (Thermally Conductive), Unfilled

Description: Custom web coating expertise available utilizing our multiple coating method capabilities that optimize your production process Coating services for experimental, prototype and contract manufacturing - available on four multifunction coating and laminating lines

• Industry / Application: Aerospace / Avionics, Agriculture / Forestry, Automotive, Building / Construction, Chemicals / Raw Materials, Consumer / Retail, Electronics / Semiconductors, Energy / Utility, Food / Beverage, Hydraulics / Pneumatics, Industrial / Commercial, Instruments / Sensors, Marine, Material Handling,
• Services: Design / Development, Low Volume Production, Sourcing, Testing / Inspection
• Features: Midwest US Only, North America, United States Only

Description: We have served the optical market since 301 was introduced in 1969.  Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,

• Use Temperature: 482 F
• Coeff. of Thermal Expansion (CTE): 31.11111111111111 to 117.22222222222221 µin/in-F
• Dielectric Constant: 3.54
• Index of Refraction: 1.5102

Description: We have served the optical market since 301 was introduced in 1969.  Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,

• Use Temperature: 572 F
• Coeff. of Thermal Expansion (CTE): 28.333333333333332 to 102.77777777777777 µin/in-F
• Dielectric Constant: 2.62
• Index of Refraction: 1.5704

Description: We have served the optical market since 301 was introduced in 1969.  Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,

• Use Temperature: 572 F
• Coeff. of Thermal Expansion (CTE): 30 to 97.22222222222221 µin/in-F
• Dielectric Constant: 4.26
• Index of Refraction: 1.5168

Description: We have served the optical market since 301 was introduced in 1969.  Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,

• Use Temperature: 635 F
• Coeff. of Thermal Expansion (CTE): 10.555555555555555 to 37.77777777777778 µin/in-F
• Dielectric Constant: 3.56
• Viscosity: 20,000 to 30,000 cP

Description: We offer a complete line of insulation Tapes for use in producing Flat Flexible Cables (FFC's) and a broad range of adhesive types that allow users to balance final product performance with lamination processes. Applications include clock spring cables, jumpers, and any application requiring long

• Peel Strength / Adhesion: 10 lbs/in
• Dielectric Strength: 5,000 V/m
• Features: Dielectric / Insulating, Electronics (PCB, Semiconductor), Single-Sided Adhesive, Specialty / Other
• Backing: Plastic / Polymer

Description: DD Series Pumps Excellent Performance in Aggressive, High Demand, High Flow Applications DD Series Pumps are application proven on all Semiconductor processes. The DD255 series is well suited for all FPD, 300mm, and 200mm applications by supporting high particulate loads, aggressive

• Ultimate Operating Vacuum: 0.0005 to 0.003 torr
• Pumping Speed: 2,148 CFM
• Operating Temperature: 50 to 104 F
• Motor Power: 21.3095041199548 HP

Description: Master Bond Polymer System EP30-3 is a two component, low viscosity, epoxy resin system featuring optical clarity, high physical strength properties, outstanding chemical resistance and superior high temperature properties. Excellent mechanical strength characteristics and remarkably high heat

• Viscosity: 5,000 to 6,000 cP
• Use Temperature: -60 to 250 F
• Coeff. of Thermal Expansion (CTE): 16 µin/in-F
• Tensile Strength (Break): 8,500 psi

Description: DD Series Pumps are application proven on all Semiconductor processes. The DD255 series is well suited for all FPD, 450mm, 300mm, and 200mm applications by supporting high particulate loads, aggressive chemistries, and high process gas flows. All DD series pumps can be combined with VFD

• Ultimate Operating Vacuum: 0.0005 to 0.003 torr
• Pumping Speed: 836 to 1,030 CFM
• Operating Temperature: 50 to 104 F
• Features: AC Three Phase

Description: DD Series Pumps are application proven on all Semiconductor processes. The DD255 series is well suited for all FPD, 450mm, 300mm, and 200mm applications by supporting high particulate loads, aggressive chemistries, and high process gas flows. All DD series pumps can be combined with VFD

• Ultimate Operating Vacuum: 0.005 to 0.03 torr
• Pumping Speed: 53 to 62 CFM
• Operating Temperature: 50 to 104 F
• Features: AC Three Phase

Description: Our PB Constant heat sealer is designed for sealing MIL spec barrier bags, coated paper, film and foil laminates, and other multi-layer materials. It comes with a constantly heated upper jaw that is adjustable to 550 °F. The head can be rotated from horizontal to vertical for ease of product

• Industry: Automotive, Electronics / Semiconductor, Food / Beverage, Garment, Household Product / Merchandise, Industrial / General Use, Music / Video / Software, Stationary
• Packaging: Bag / Pouch
• Goods: Consumer Packaging
• Closing Method: Heat Seal

Description: Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based polymer composition can effectively replace conventional heat and/or solvent

• Viscosity: 300 cP
• Use Temperature: -60 to 250 F
• Thermal Conductivity: 0.029 W/m-K
• Coeff. of Thermal Expansion (CTE): 39 to 44 µin/in-F

Description: Magnet manufacturing requires special processes due to the brittle nature of materials used to create magnet ingots. Manufacturing these materials requires specialized procedures and machining equipment to ensure the magnets and metallic accessories being fabricated meet the tight tolerances of

• Industry / Application: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Medical / Health Care, Military / Defense
• Features: East Asia / Pacific Only, Other