Semiconductor Laminate

Description: , vulcanized rubbers and many plastics is excellent. Parts A and B are both colored silver. Master Bond EP21TDCS adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance, and automotive industries, among others. For convenient handling, EP21TDCS is

• Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
• Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
• Dissimilar Substrates: Yes
• Elongation: 5 %

Description: colored nickel. Master Bond EP21TDCN adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance, and automotive applications. For convenient handling, EP21TDCN is now available in premixed and frozen syringes.

• Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
• Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
• Dissimilar Substrates: Yes
• Elongation: 5 %

Description: -LO adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance and automotive industries, among others. For convenient handling, EP21TDCS-LO is now available in premixed and frozen syringes.

• Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
• Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
• Dissimilar Substrates: Yes
• Features: Anti-static / ESD Control, Electrically Conductive, Electrical Insulation / Dielectric, EMI / RFI Shielding Material, Flexible / Dampening

Description: substrates. Also, the highly flexible EP21TDCNFL is easier to remove than most nickel epoxies, making it well suited for repair type applications. Parts A and B are both colored nickel. Master Bond EP21TDCNFL adhesive is widely used in the electronic, electrical, computer, semiconductor,

• Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
• Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
• Dissimilar Substrates: Yes
• Elongation: 50 %

Description: According to the demands of customers,printing the circuit on the Al2O3/AIN ceramic tapes,after lamination, slicing, high temperature co-firing, brazing, gold plating and other processes, a ceramic and metal integrated package structure with a certain high air tightness is formed

• Material Type: Alumina / Aluminum Oxide

Description: The rotary die cutting module, commonly referred to as a die station, is the cornerstone of our converting systems. Each rotary die station can be used for die cutting, nipping, laminating, punching, embossing, slitting or sheeting by simply changing the tool roll.

• Applications: Labels, Date Stamp
• Cutter: Yes
• Maximum Paper Width: 610 mm
• Media Handling: Paper, Roll, Metals, Plastics, Semiconductors / Electronics

Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV

• Chemical / Polymer System Type: Epoxy
• Coeff. of Thermal Expansion (CTE): 10.56 to 37.78 µin/in-F
• Compound Type: Liquid
• Dielectric Constant: 3.56

Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV

• Chemical / Polymer System Type: Epoxy
• Coeff. of Thermal Expansion (CTE): 28.33 to 103 µin/in-F
• Compound Type: Liquid
• Dielectric Constant: 2.62

Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV

• Chemical / Polymer System Type: Epoxy
• Coeff. of Thermal Expansion (CTE): 31.11 to 117 µin/in-F
• Compound Type: Liquid
• Dielectric Constant: 3.54

Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV

• Chemical / Polymer System Type: Epoxy
• Coeff. of Thermal Expansion (CTE): 30 to 97.22 µin/in-F
• Compound Type: Liquid
• Dielectric Constant: 4.26

Description: We offer a complete line of insulation Tapes for use in producing Flat Flexible Cables (FFC's) and a broad range of adhesive types that allow users to balance final product performance with lamination processes. Applications include clock spring cables, jumpers, and any application requiring

• Adhesive: Specialty / Other
• Backing: Specialty / Other
• Peel Strength / Adhesion: 8 lbs/in
• Performance Features: Dielectric / Insulating

Description: laminated substrates, FR4 and PTFE or woven PCB materials. Prototypes and small production batches can also be produced on short notice if required. The system requires no chemicals and is easy to operate with LPKF CircuitPro software included.

• Automation / Control: Windows / PC Control
• Form Factor: Work Station
• Materials Processed: Semiconductors / Electronics
• Process / Operation: Laser Cutting

Description: h-old 8102 is a 12 micron polyester film coated on both side with a solvent based acrylic adhesive system and protected by white siliconized release paper liner. Can be used for splicing, bonding and laminating foams, papers, plastics, films, foils, for mounting of nameplates, electronic

• Adhesive: Acrylic
• Backing: PET / Polyester
• Temperature Resistance: -30 C
• Thickness: 0.0037 inches

Description: h-old 8100 is a 12 micron polyester film coated on both side with a solvent based acrylic adhesive system and protected by white siliconized release paper liner. Can be used for splicing, bonding and laminating foams, papers, plastics, films, foils, for mounting of nameplates, electronic

• Adhesive: Acrylic
• Backing: PET / Polyester
• Temperature Resistance: -20 C
• Thickness: 0.0022 inches

Description: Dow DOWSIL™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates, and organic substrates. It is flame resistant, self leveling, flowable, thixotropic,

• Compound Type: Thermally Conductive
• Cure Type / Technology: Single Component System
• Dielectric Strength: 400 kV/in
• Electrical / Electronics Applications: Semiconductors / IC Packaging

Description: Dow DOWSIL™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates, and organic substrates. It is flame resistant, self leveling, flowable, thixotropic,

• Compound Type: Thermally Conductive
• Cure Type / Technology: Single Component System
• Dielectric Strength: 400 kV/in
• Electrical / Electronics Applications: Semiconductors / IC Packaging

Description: Designed to Seal Tyvek/Mylar, Nylon, Polyethylene, Polypropylene, Laminates, Kraft/PE and Foil.

• Automation: Semi-Automatic
• Closing Method: Heat Seal
• Features: Portable
• Industry: Industrial / General Use, Agriculture, Automotive, Chemical / Petrochemical, Construction Material, Cosmetics / Perfumery, Electronics / Semiconductor, Food / Beverage, Garment, Household Product / Merchandise, Medical, Military, Mining / Aggregate, Music / Video / Software, Paint / Coating,

Description: Designed to Seal Tyvek/Mylar, Nylon, Polyethylene, Polypropylene, Laminates, Kraft/PE and Foil.

• Automation: Semi-Automatic
• Closing Method: Heat Seal
• Industry: Industrial / General Use, Agriculture, Automotive, Chemical / Petrochemical, Construction Material, Cosmetics / Perfumery, Electronics / Semiconductor, Food / Beverage, Garment, Household Product / Merchandise, Medical, Military, Mining / Aggregate, Music / Video / Software, Paint / Coating,
• Packaging: Bag / Pouch

Description: DD Series Pumps Excellent Performance in Aggressive, High Demand, High Flow Applications DD Series Pumps are application proven on all Semiconductor processes. The DD255 series is well suited for all FPD, 300mm, and 200mm applications by supporting high particulate

• Applications: General Purpose / Industrial, Semiconductor Manufacturing, Other
• Configuration: Individual Vacuum Pump
• Lubrication Style: Dry / Oil-less
• Mechanical Pump Type: Other Mechanical Type

Description: DD Series Pumps Excellent Performance in Aggressive, High Demand, High Flow Applications DD Series Pumps are application proven on all Semiconductor processes. The DD255 series is well suited for all FPD, 300mm, and 200mm applications by supporting high particulate

• Applications: General Purpose / Industrial, Semiconductor Manufacturing, Other
• Configuration: Individual Vacuum Pump
• Lubrication Style: Dry / Oil-less
• Mechanical Pump Type: Other Mechanical Type

Description: coefficient of optical dispersion and good lamination properties. CYTOP amorphous fluoropolymers are available on request in various solvents (110ºC – 180ºC) and at various concentrations.

• Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF)
• Coeff. of Thermal Expansion (CTE): 63.89 to 66.67 µin/in-F
• Industry: Electronics, Semiconductor / IC's, Other
• Material Type / Grade: Thermoplastic

Description: A464 is an unsupported permanent acrylic pressure-sensitive adhesive that has excellent peel, shear, and tack properties. A464 can be used to laminate and bond a wide variety of LSE materials and foams including polyolefins as well as ether and ester type polyurethanes. The product is

• Adhesive: Acrylic, Pressure Sensitive (PSA)
• Peel Strength / Adhesion: 5.62 lbs/in
• Performance Features: Permanent
• Temperature Resistance: -40 to 121 C

Description: A463 is an unsupported permanent acrylic pressure-sensitive adhesive that has excellent peel, shear, and tack properties. A463 can be used to laminate and bond a wide variety of LSE materials and foams including polyolefins as well as ether and ester type polyurethanes. The product is

• Adhesive: Acrylic, Pressure Sensitive (PSA)
• Peel Strength / Adhesion: 5 lbs/in
• Performance Features: Permanent
• Temperature Resistance: -40 to 121 C

Description: A460 is an unsupported permanent acrylic pressure-sensitive adhesive that has excellent peel, shear, and tack properties. A460 can be used to laminate and bond a wide variety of LSE materials and foams including polyolefins as well as ether and ester type polyurethanes. The product is

• Adhesive: Acrylic, Pressure Sensitive (PSA)
• Peel Strength / Adhesion: 4.5 lbs/in
• Performance Features: Permanent
• Temperature Resistance: -40 to 121 C

Description: A465 is an unsupported permanent acrylic pressure-sensitive adhesive that has excellent peel, shear, and tack properties. A465 can be used to laminate and bond a wide variety of LSE materials and foams including polyolefins as well as ether and ester type polyurethanes. The product is

• Adhesive: Acrylic, Pressure Sensitive (PSA)
• Peel Strength / Adhesion: 6.25 lbs/in
• Performance Features: Permanent
• Temperature Resistance: -40 to 121 C

Description: The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH

• Chemical / Polymer System Type: Specialty / Other
• Coeff. of Thermal Expansion (CTE): 54.44 to 70 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
• Features: Electrically Conductive, Flexible / Dampening, Laminating / Composites, Thermal / Heat Conductive

Description: We offer a complete line of insulation Tapes for use in producing Flat Flexible Cables (FFC's) and a broad range of adhesive types that allow users to balance final product performance with lamination processes. Applications include clock spring cables, jumpers, and any application requiring

• Adhesive: Specialty / Other
• Backing: PET / Polyester, Plastic / Polymer
• Peel Strength / Adhesion: 6 lbs/in
• Performance Features: Dielectric / Insulating

Description: camera allows the LPKF ProtoLaser S to visually inspect and properly align the material. Circuit traces as small as 100 µm (4 mil) can be achieved with laminated PCB materials and 50 µm traces can be achieved, along with spacing of 25 µm when working with ceramics. Smaller features may

• Automation / Control: Windows / PC Control
• Form Factor: Work Station
• Laser Type: Other
• Materials Processed: Semiconductors / Electronics

Description: Low Flow Flame Retardant Adhesive on Nomex® Type 410Film Description T4317 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with NOMEX® Type 410 film and are designed for laminated busbar applications requiring a tough

• Adhesive: Specialty / Other
• Backing: Plastic / Polymer, Specialty / Other
• Dielectric Strength: 2.68E7 V/m
• Peel Strength / Adhesion: 4 lbs/in

Description: Low-Flow Flame Retardant Adhesive on Polyimide Film Description T1779 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with polyimide film and are designed for laminated busbar applications requiring a formable, higher temperature

• Adhesive: Specialty / Other
• Backing: Plastic / Polymer, Polyimide (e.g., Kapton®)
• Dielectric Strength: 2.05E8 V/m
• Peel Strength / Adhesion: 8 lbs/in

Description: A thermosetting adhesive with electrical insulation, designed for bonding and sealing semiconductor packages. Product Overview STAYCHIP F614-3A is a thermosetting adhesive with electrical insulating properties. It is designed for attaching or sealing high-reliability semiconductor

• Cure Type / Technology: Thermosetting / Crosslinking
• Features: Electrically Conductive, Electrically Insulating / Dielectric
• Industry: Electronics, Semiconductors / IC Packaging

Description: Molding (Palstic & Metal) Coating & Plating Precise Assembly Line (Gluing, Magnetizing, Assembling, & More) Motor Line (Stamping, Winding, Lamination, & More)

• Industry Served: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Medical / Health Care, Military / Defense, Other
• Location: East Asia / Pacific Only

Description: etched PTFE involve bonding to elastomers to produce laminated diaphragms, as well as the application of pressure sensitive adhesives in the production of PTFE pressure sensitive tapes. In all the above applications, the lamination or adhesive application is usually accomplished with a

• Adhesive: None / Non-adhesive
• Backing: Fluoropolymer, Plastic / Polymer, Specialty / Other
• Dielectric Strength: 9.84E7 V/m
• Features: Dielectric / Insulating

Description: LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.

• Applied Thickness / Gap Fill: 0.0197 to 0.3937 inch
• Compound Type: Thermal Compound / Heat Conductive
• Dielectric Strength: 8 kV/in
• Features: Electrical Insulation / Dielectric Material, Laminating / Composites, UL Approved

Description: LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and

• Applied Thickness / Gap Fill: 0.0098 to 0.0177 inch
• Compound Type: Thermal Compound / Heat Conductive
• Dielectric Strength: 4 to 6 kV/in
• Features: Electrical Insulation / Dielectric Material, Laminating / Composites, UL Approved

Description: LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice

• Applied Thickness / Gap Fill: 0.0197 to 0.3937 inch
• Compound Type: Thermal Compound / Heat Conductive
• Dielectric Strength: 12 kV/in
• Elongation: 81 %

Description: LiPOLY AS02-s is a material with double sided inherent tack, low thermal resistance and high thermal conductivity. It has excellent compressive strength characteristics and good electrical isolation function for high-power electronic components, making it the best choice for thin design

• Applied Thickness / Gap Fill: 0.0059 to 0.0079 inch
• Compound Type: Thermal Compound / Heat Conductive
• Dielectric Strength: 4 to 6 kV/in
• Elongation: 10 %

Description: frequency as model selection guideline: Up to 1,000 bags, hand-operated Bag size (max): Up to 20cm Compatible packaging materials (total thickness of two or more sheets): PE>0.2mm, PP>0.2mm, NY>0.1mm, PVA>0.1mm, other laminated materials>0.1mm Simple operation Use the heating

• Automation: Manual
• Closing Method: Heat Seal
• Features: Portable
• Goods: Consumer Packaging