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Supplier: Associated Rubber, Inc.
Description: Custom Rubber Molding At Associated Rubber, Inc., we're molding the future today with custom molded rubber products. By combining advanced research and design with contemporary production methods, we can create finished pieces to meet even the most precise specifications. From
- Capabilities: Molding
- Industry Served: Aerospace / Avionics, Agriculture / Forestry, Automotive, Building / Construction, Chemicals / Raw Materials, Consumer / Retail, Electronics / Semiconductors, Energy / Utility, Food / Beverage, Hydraulics / Pneumatics, Industrial / Commercial, Instruments / Sensors, Marine, Material Handling,
- Location: North America, United States Only, Northeast US Only
- Services: Design / Development, Low Volume Production, High Volume Production, Testing / Inspection
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Supplier: Henkel Corporation - Industrial
Description: TECHNOMELT® AS 7875 is a moldable polyolefin for demanding moisture and solvent resistance. Excellent adhesion to the most difficult substrates.
- Industry: Electronics, Semiconductor / IC's
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Supplier: Henkel Corporation - Industrial
Description: TECHNOMELT® PA 7852 is a moldable polyamide where excellent adhesion and cold temperature flexibility are important, such as in an automotive exterior. Also used extensively in white goods. Excellent adhesion to plastics.
- Industry: Electronics, Semiconductor / IC's
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Supplier: Henkel Corporation - Industrial
Description: High performance thermoplastic polyamide designed to meet low pressure moulding process requirements. TECHNOMELT® PA 638 BLACK high performance thermoplastic polyamide is designed to meet low pressure moulding process requirements. This product can be processed at low processing pressure due to its
- Industry: Electronics, Semiconductor / IC's
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Supplier: Victrex PLC
Description: High performance thermoplastic material, unreinforced Poly Ether Ether Ketone (PEEK), semi crystalline, fine powder for compression molding, easy flow, FDA food contact compliant, color natural.
- Chemical / Polymer System Type: PEEK
- Elongation: 15 %
- Filler Material: Unfilled
- Industry: Aerospace, Automotive, Electronics, Semiconductor / IC's, Medical / Food (FDA), Industrial
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Supplier: Victrex PLC
Description: High performance thermoplastic material, unreinforced Polyether Ketone (PEK), semi crystalline, fine powder for compression molding, easy flow, FDA food contact compliant, color natural.
- Chemical / Polymer System Type: PEEK
- Elongation: 10 %
- Filler Material: Unfilled
- Industry: Aerospace, Automotive, Electronics, Semiconductor / IC's, Medical / Food (FDA), Industrial
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Supplier: Victrex PLC
Description: High performance thermoplastic material, unreinforced Polyether Ketone (PEK), semi crystalline, fine powder for compression molding, low flow, FDA food contact compliant, color natural.
- Chemical / Polymer System Type: PEEK
- Elongation: 15 %
- Filler Material: Unfilled
- Industry: Aerospace, Automotive, Electronics, Semiconductor / IC's, Medical / Food (FDA), Industrial
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Supplier: Victrex PLC
Description: High performance thermoplastic material, unreinforced Poly Ether Ether Ketone (PEEK), semi crystalline, fine powder for compression molding, low flow, FDA food contact compliant, color natural.
- Chemical / Polymer System Type: PEEK
- Elongation: 30 %
- Filler Material: Unfilled
- Industry: Aerospace, Automotive, Electronics, Semiconductor / IC's, Medical / Food (FDA), Industrial
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Supplier: 3M Advanced Materials Division
Description: application, our technical experts can help you identify the optimal fluoroelastomer compound so you can manufacture quality, cost-effective sealing components. Excellent thermal and chemical resistance Low permeation Long service life Excellent processability Compatible with a variety of
- Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF), Polyamide / Nylon, Polypropylene (PP), Specialty / Other
- Elongation: 170 to 350 %
- Features: Electrically Conductive Compound, Flame Retardant (e.g. UL 94 Rated), Optical Grade
- Filler Material: Unfilled
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Supplier: Toray Industries (America), Inc.
Description: Toyo Plastic Seiko Co., Ltd. is manufacturing and marketing materials for cut and shaved processing (rods, boards and sheets) made of super engineering plastics (such as PAI, PEEK and PPS) with excellent resistance to heat, chemicals and wear. The materials are widely used in areas such as
- Industry: Semiconductor / IC's, Medical / Food (FDA)
- Material Type / Grade: Thermoplastic
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Supplier: AGC Chemicals Americas, Inc.
Description: CYTOP™ amorphous fluoropolymers have the same excellent chemical, thermal, electrical and surface properties as conventional fluoropolymers like PTFEs, but also exhibit high optical transparency and good solubility in specific fluorinated solvents. CYTOP fluoropolymers are like transparent PTFEs.
- Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF)
- Coeff. of Thermal Expansion (CTE): 63.89 to 66.67 µin/in-F
- Filler Material: Unfilled
- Industry: Electronics, Semiconductor / IC's, Other
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Supplier: Henkel Corporation - Electronics
Description: A high thermal conductivity molding compound using fully rounded spherical crystalling fillers designed to improve thermal management for semiconductor devices. It exhibits high adhesion to Cu and Cu alloys. This material is specifically recommended for isolated power
- Coeff. of Thermal Expansion (CTE): 11.11 µin/in-F
- Features: Thermally Conductive
- Industry: Electronics
- Thermal Conductivity: 2.1 W/m-K
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Supplier: Henkel Corporation - Electronics
Description: Hysol GR750HT-25 is a high thermal conductivity molding compound using fully alumina fillers designed to improve thermal management for semiconductor devices. It exhibits high adhesion to copper and copper alloys. This material is specifically recommended.
- Coeff. of Thermal Expansion (CTE): 12.78 µin/in-F
- Features: Thermally Conductive
- Filler Material: Other
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: Hysol GR725LS is a semiconductor grade molding compound designed for power package applications. This material is designed to achieve high JEDEC MSL requirements, at 260°C reflow temperature.
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol GR735 ) LOCTITE HYSOL CG0645 GR735 is a high productivity molding compound designed specifically for the encapsulation of discrete semiconductor devices. This material is formulated to have higher thermal conductivity, which makes it applicable for devices
- Features: Thermally Conductive
- Industry: Electronics
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 31.11 to 111 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 2M2M is Dimethoxydimethylsil ane of high purity. Special features high purity low metal content low chloride content low methanol content Application SEMICOSIL® 2M2M was developed for the semiconductor industry, e.g. as precursor for low dielectric constant interlayer dielectrics.
- Chemical / Polymer System Type: Specialty / Other
- Industry: Industrial
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 30 to 97.22 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.26
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 33.89 to 100 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.34
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY AS02-s is a material with double sided inherent tack, low thermal resistance and high thermal conductivity. It has excellent compressive strength characteristics and good electrical isolation function for high-power electronic components, making it the best choice for thin design
- Applied Thickness / Gap Fill: 0.0059 to 0.0079 inch
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Strength: 4 to 6 kV/in
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Supplier: Greene, Tweed & Co.
Description: thermoforming and various thermal fusion/welding/joini ng processes. Unlike thermoset materials, thermoplastic composites do not require a chemical reaction or œcure,� and can be processed with much shorter molding cycle times. In addition, thermoplastic materials do not require
- Chemical / Polymer System Type: PEEK, Specialty / Other
- Industry: Aerospace, Electric Power, Semiconductor / IC's
- Material Type / Grade: Composite Material, Thermoplastic
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® ME-543 Black is a thermally conductive, anhydride-free, semiconductor grade epoxy underfill designed for encapsulating densely populated area array flip chip devices. Able to handle over-molding processes. Fast cure, jettable, self-filleting, and can withstand
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.2 W/m-K
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Supplier: Fujipoly® America Corp.
Description: methods. The insulation type can be substituted anywhere other forms of insulating materials are used; such as, in place of custom diecut pads, potting compounds and even over-moldings. Resiliency and long-term aging properties are excellent; applicable in a very wide temperature range
- Adhesive: Specialty / Other
- Backing: Rubber, Silicone
- Electrical Resistivity: 1.00E10 to 1.00E15 ohm-cm
- Performance Features: UV / Weather Resistant, Dielectric / Insulating, Permanent, Protective Tape, Thermally Insulating / Insulative
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Description: substrates Microwave window materials Compound semiconductor single crystal growth crucible Innovacera can provide Hot Pressed Aluminum Nitride (HPALN) as customized size and welcome to send your inquiry for us.
- Applications: Other
- Material Type: Aluminum Nitride, Specialty Ceramic
- Performance Features: Metallized / Silvered
- Shape / Form: Plate / Board (e.g., Fiberboard)
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Supplier: Precision Polymer Engineering Ltd.
Description: . PPE maintains full control of its products from seal design to mold tool design and manufacture through to material compounding, molding and post cure. This simply means that you are assured of a unique quality product from one of the top suppliers to the semiconductor and
- Industry: Biotechnology, Chemicals / Materials, Food and Beverage, General Industrial, Marine, Medical, Petroleum / Oil & Gas, Pharmaceutical, Other
- Location: North America, United States Only, Northeast US Only, Southern US Only, Southwest US Only, Northwest US Only, Midwest US Only, Canada Only, South / Central America Only, Europe Only, South Asia Only, Near East Only, East Asia / Pacific Only
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materials. This is done by process control which is well proven in other sensitive industries and across all manufacturing types such as compounding, stock shapes and component production through injection molding and machining. Proven Materials in Semiconductors PEEK PTFE PFA (read more)
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Cri-Tech, Inc. announces the introduction of a new line of Cri-plastMPTM PFA Static Dissipative - High Flow Compounds. Specially formulated for injection molding and designed to meet your static dissipative/conductive, ATEX requirements in multiple applications (read more)
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Additional fluoropolymer materials available, including modified PTFE, PTFE compounds, PEEK, PFA, PCTFE, and PVDF Industries Served: Telecommunications Electronics and Semiconductors Automotive Designed (read more)
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Ideal for corrosive media handling Suitable for high-purity and semiconductor systems (read more)
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Microwave window materials Compound semiconductor single-crystal growth crucible Innovacera can provide Hot Pressed Aluminum Nitride (HPALN) in customized sizes and welcome you to send your inquiry to us. (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
. Mold Release Agents: Due to their high chemical inertness, h-BN powders do not react with materials such as metals, glass, and ceramics and are released. They are commonly used as a release agent in processes such as metal casting, glass molding, and composite molding to reduce adhesion (read more)
Browse Ceramic Powders and Precursors Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Film is widely used as a cushioning/release film in semiconductor molding processes. Learn more about our fluoroproducts and industry solutions at https://www.agcchem.com/. (read more)
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High-purity ceramic powders are mixed with binders to form a moldable compound. 2.2 Forming Methods Dry Pressing: Compressed into spherical shapes using high-pressure molds (read more)
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markets including food and beverage and semiconductor wafer fabrication. Selecting the Right Fluoroelastomer When selecting a fluoroelastomer, assess the specific needs of the application including: Thermal stability: Can it perform within the required (read more)
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More Information Top
Indicates content that may require registration and/or purchase.
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Electronic Chemicals: PCB Chemicals and Semiconductor Packaging Materials
Plastic packages are prepared from semiconductor molding compounds using resin transfer molding (RTM).
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Relationship of adhesion, delamination, preconditioning and preplating effects at the plastic to leadframe interface
A Design Of Experiment (DOE - 4 x 5 x 5 full factorial) was set up to study four semiconductor molding compounds x five industry standard preplated finishes x five typical preconditioningstages.
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High solder-reflow crack resistant molding compound
Abstract- A variety of epoxy resins, filler mixtures, and ad- hesion additives were examined in semiconductor molding com- pounds for solder-reflowcrack resistance (popcorn crack resis- tance).
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Development of the environmentally friendly epoxy molding compound
Among them, increase of reflow temperature when Pb free solder is used is the most critical for semiconductor molding compound .
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Hygro-thermo-mechanical Behavior of Adhesive-Based
Flexible Chip-on-Flex Packaging
SEMI G66-96, Test Method for the Measurement of Water absorption Characteristics for Semiconductor Molding Compounds .
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Development of high‐performance epoxy/clay nanocomposites by incorporating novel phosphonium modified montmorillonite
On the other hand, phosphine and phosphonium salt are used as a catalyst in organic synthesis and an epoxy curing accelerator in semiconductor mold- ing compounds .
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Concurrent enthalpy recovery and curing phenomena in epoxy encapsulating materials for semiconductor applications
Generally, the manufacturer of semiconduc- tor molding compound materials recommends a post mold curing cycle at temperatures (closeto the molding temperature for the purpose of op- timizing the materials, properties.
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Interaction of process variables with the fracture behavior of amorphous polystyrene during attrition
owdered polymeric systems find use in a diverse Prange of applications including 100%solids deco- rative and functional coatings, semiconductor mold- ing compounds , electrophotography, and powder printing technologies.
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Infrared Technology: Applications to Electro-Optics Photonic Devices and Sensors
These unique properties along with low-noise CW output make fiber lasers most at- tractive for laser printers and for legible marking on semiconductor molding com- pounds , lead frames, wafers, ceramic substrates, and packages.
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Moisture resistant aluminum nitride filler for high thermal conductivity microelectronic molding compounds
This present study examines the effect of using coated aluminum nitride filler at different levels in a semiconductor molding compound and the potential benefits of using this high thermal conductivity molding compound in a model TO220 package.