Semiconductor Molding Compound

Description: Composed of pigments and fillers such as glass, carbon, graphite and metal powders (bronze and molybdenum disulfide), Fluon® Filled PTFE Compounds are molding powders that enhance wear resistance, creep resistance, thermal conductivity and electrical conductivity over virgin PTFE

• Industry: Automotive
• Filler: Carbon / Graphite, Metal, Mineral
• Chemical System: Fluoropolymer (PTFE / PVDF)
• Features: Molding Resin

Description: Custom Rubber Molding At Associated Rubber, Inc., we're molding the future today with custom molded rubber products. By combining advanced research and design with contemporary production methods, we can create finished pieces to meet even the most precise specifications. From design

• Industry / Application: Aerospace / Avionics, Agriculture / Forestry, Automotive, Building / Construction, Chemicals / Raw Materials, Consumer / Retail, Electronics / Semiconductors, Energy / Utility, Food / Beverage, Hydraulics / Pneumatics, Industrial / Commercial, Instruments / Sensors, Marine, Material Handling,
• Services: Design / Development, High Volume Production, Low Volume Production, Testing / Inspection
• Capabilities: Molding
• Features: North America, Northeast US Only, United States Only

Description: Hysol GR725LS is a semiconductor grade molding compound designed for power package applications. This material is designed to achieve high JEDEC MSL requirements, at 260°C reflow temperature.

• Industry: Electronics

Description: A high thermal conductivity molding compound using fully rounded spherical crystalling fillers designed to improve thermal management for semiconductor devices. It exhibits high adhesion to Cu and Cu alloys. This material is specifically recommended for isolated power

• Thermal Conductivity: 2.1 W/m-K
• Coeff. of Thermal Expansion (CTE): 11.11111111111111 µin/in-F
• Industry: Electronics
• Features: Thermally Conductive

Description: Hysol GR750HT-25 is a high thermal conductivity molding compound using fully alumina fillers designed to improve thermal management for semiconductor devices. It exhibits high adhesion to copper and copper alloys. This material is specifically recommended.

• Thermal Conductivity: 2.1 W/m-K
• Coeff. of Thermal Expansion (CTE): 12.777777777777777 µin/in-F
• Industry: Electronics
• Features: Other, Thermally Conductive

Description: (Known as Hysol GR725LV-2 ) LOCTITE HYSOL GR725LV is a green, semiconductor grade, low stress and high adhesion molding compound. Its patented sigma technology enables extremely high performance for power packages (high current), passing 3000 hours at 200°C HTSL reliability

• Coeff. of Thermal Expansion (CTE): 6.111111111111111 µin/in-F
• Industry: Electronics

Description: information technology, semiconductor manufacturing equipment and foodstuffs processing machinery.

• Industry: Medical / Food (FDA), Semiconductor / IC's
• Features: Molding Resin
• Type: Thermoplastic

Description: TECHNOMELT® PA 7852 is a moldable polyamide where excellent adhesion and cold temperature flexibility are important, such as in an automotive exterior. Also used extensively in white goods. Excellent adhesion to plastics.

• Industry: Electronics, Semiconductor / IC's

Description: High performance thermoplastic material, unreinforced Polyether Ketone (PEK), semi crystalline, fine powder for compression molding, easy flow, FDA food contact compliant, color natural.

• Tensile Modulus: 3.5 ksi
• Elongation: 10 %
• Industry: Aerospace, Automotive, Electronics, Industrial, Medical / Food (FDA), Semiconductor / IC's
• Features: Molding Resin

Description: SEMICOSIL® 2M2M is Dimethoxydimethylsilane of high purity. Special features high purity low metal content low chloride content low methanol content Application SEMICOSIL® 2M2M was developed for the semiconductor industry, e.g. as precursor for low dielectric constant interlayer dielectrics.

• Industry: Industrial
• Features: Molding Resin, Specialty / Other

Description: CYTOP™ amorphous fluoropolymers have the same excellent chemical, thermal, electrical and surface properties as conventional fluoropolymers like PTFEs, but also exhibit high optical transparency and good solubility in specific fluorinated solvents. CYTOP fluoropolymers are like transparent PTFEs.

• Coeff. of Thermal Expansion (CTE): 63.888888888888886 to 66.66666666666667 µin/in-F
• Water Absorption: 0.3 %
• Industry: Electronics, Semiconductor / IC's
• Chemical System: Fluoropolymer (PTFE / PVDF)

Description: seals and gaskets) using press molding, injection molding, extrusion and calendaring processes. AFLAS parts are used in many industries including: Oil & Gas Chemical Processing Heavy Duty Diesel Automotive Wire & Cable Industrial Food Handling and Pharmaceutical AFLAS 200P specialty

• Use Temperature: 518 F
• Tensile Strength (Break): 1,595.405232929167 to 3,335.847305215531 psi
• Elongation: 230 to 460 %
• Electrical Resistivity: 10 ohm-cm

Description: Parker Lord CoolTherm® ME-543 Black is a thermally conductive, anhydride-free, semiconductor grade epoxy underfill designed for encapsulating densely populated area array flip chip devices. Able to handle over-molding processes. Fast cure, jettable, self-filleting, and can withstand

• Thermal Conductivity: 1.2 W/m-K
• Viscosity: 21,000 cP
• Features: Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)

Description: experts can help you identify the optimal fluoroelastomer compound so you can manufacture quality, cost-effective sealing components. Excellent thermal and chemical resistance Low permeation Long service life Excellent processability Compatible with a variety of molding and extrusion

• Tensile Strength (Break): 1,522.88681325057 to 2,581.65574055811 psi
• Tensile Modulus: 0.5801473574287881 to 1.2328131345361701 ksi
• Elongation: 170 to 350 %
• Industry: Aerospace, Automotive, Building / Construction, Electric Power, Electronics, Energy Conversion (Battery/Fuel Cell/PV), Industrial, Marine, Medical / Food (FDA), Military / Government (MIL-SPEC), Semiconductor / IC's

Description: installation. Customized Die-Cut and molding are available.

• Applied Thickness / Gap Fill: 0.005905515 to 0.00787402 inch
• Use Temperature: -76 to 356 F
• Thermal Conductivity: 4.5 W/m-K
• Elongation: 10 %

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Use Temperature: 527 F
• Thermal Conductivity: 0.44 W/m-K
• Coeff. of Thermal Expansion (CTE): 31.11111111111111 to 111.11111111111111 µin/in-F
• Viscosity: 500 to 1,000 cP

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Use Temperature: 482 F
• Coeff. of Thermal Expansion (CTE): 31.11111111111111 to 117.22222222222221 µin/in-F
• Dielectric Constant: 3.54
• Index of Refraction: 1.5102

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Use Temperature: 572 F
• Coeff. of Thermal Expansion (CTE): 33.888888888888886 to 100 µin/in-F
• Dielectric Constant: 3.8
• Index of Refraction: 1.5318

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Use Temperature: 572 F
• Coeff. of Thermal Expansion (CTE): 11.666666666666666 to 71.11111111111111 µin/in-F
• Dielectric Constant: 3.18
• Viscosity: 4,000 to 7,000 cP

Description: HEPA filters. PPE operates four clean rooms dedicated to manufacturing elastomer components for the semiconductor, food/dairy and pharmaceutical/medical industries. UK: Three clean rooms totaling 00 sq.m. (00 sq.ft.) which include milling, molding and inspection operations in a Class

• Industry: Biotechnology, Chemicals / Materials, Food and Beverage, General Industrial, Marine, Medical, Petroleum / Oil & Gas, Pharmaceutical
• Features: Canada Only, East Asia / Pacific Only, Europe Only, Midwest US Only, Near East Only, North America, Northeast US Only, Northwest US Only, Other, South / Central America Only, South Asia Only, Southern US Only, Southwest US Only, United States Only

Description: thermoforming and various thermal fusion/welding/joining processes. Unlike thermoset materials, thermoplastic composites do not require a chemical reaction or œcure, and can be processed with much shorter molding cycle times. In addition, thermoplastic materials do not require refrigeration

• Industry: Aerospace, Electric Power, Semiconductor / IC's
• Filler: Aramid Fiber, Carbon / Graphite, Fiber Glass
• Material Type: Composite Material, Thermoplastic
• Chemical System: PEEK

Description: can be substituted anywhere other forms of insulating materials are used; such as, in place of custom diecut pads, potting compounds and even over-moldings. Resiliency and long-term aging properties are excellent; applicable in a very wide temperature range from -45˚C to +250˚C (-49˚F

• Temperature Resistance: -45 to 250 C
• Features: Anti-static / ESD Control, Cable, EMI / RFI Shielding, Electrical, Electrically Conductive, Electronics (PCB, Semiconductor), Permanent, Protective Tape, Specialty / Other, UV / Weather Resistant
• Adhesive: Rubber, Silicone

Description: can be substituted anywhere other forms of insulating materials are used; such as, in place of custom diecut pads, potting compounds and even over-moldings. Resiliency and long-term aging properties are excellent; applicable in a very wide temperature range from -45˚C to +250˚C (-49˚F

• Temperature Resistance: -45 to 250 C
• Electrical Resistivity: 10,000,000,000 to 1,000,000,000,000,000 ohm-cm
• Features: Cable Tape, Dielectric / Insulating, Electrical Tape, Electronics (PCB, Semiconductor) Tape, Industrial Tape, Permanent, Protective Tape, Specialty / Other, Specialty Tape, Thermally Insulating / Insulative, UV / Weather Resistant
• Adhesive: Rubber, Silicone

Description: substrates Microwave window materials Compound semiconductor single crystal growth crucible Innovacera can provide Hot Pressed Aluminum Nitride (HPALN) as customized size and welcome to send your inquiry for us.

• Specialty Ceramic Type: Aluminum Nitride
• Performance Features: Metallized / Silvered (Electrode, Mirror)
• Features: Other, Sintered / Fired, Specialty Ceramic
• Shape / Form: Plate / Board (e.g., Fiberboard)

Description: Where Ideas Take Shape Pexco’s precision machining capabilities transform high-performance plastic materials into complex components with tight tolerances for aerospace, medical, semiconductor, and industrial applications. With over 40 CNC machines including 3-, 4-, and 5-axis mills,

• CNC Machining: 3-axis Machining, 4-axis Machining, 5-axis Machining, Milling, Swiss Machining, Turning
• Additional Services: Assembly Services, CAD / CAM Support, Design Assistance, High Volume Production, Low Volume Production, Prototype Services
• Specialty Machining: Extrusion Machining
• Features: North America, Other, Southern US Only, United States Only