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Description: Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive
- Type: Electrically Conductive
- Chemical System: Epoxy (EP), Silicone
- Industry: Semiconductors / IC Packaging
- Features: Specialty / Other
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver
- Use Temperature: -452 to 250 F
- Thermal Conductivity: 1.585 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 6,000 to 6,500 psi
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Supplier: Master Bond, Inc.
Description: one component formulation features outstanding electrical conductivity, superior mechanical strength plus excellent adhesive properties to both similar and dissimilar substrates. An additional attractive characteristic of this silver conductive film is its ability to cure
- Use Temperature: -100 to 400 F
- Thermal Conductivity: 1.442279 W/m-K
- Coeff. of Thermal Expansion (CTE): 0.00011111111111111112 to 0.000033333333333333335 µin/in-F
- Industry: Aerospace, Automotive, OEM / Industrial, Optical Grade / Material, Semiconductors / IC Packaging
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Supplier: Newark, An Avnet Company
Description: Silver Conductive Epoxy Adhesive / 0.52 oz Syringes
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Supplier: Newark, An Avnet Company
Description: Silver Conductive Epoxy Adhesive / 5.72 oz tub kit
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Supplier: Epoxy Technology
Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper.
- Viscosity: 800 to 1,600 cP
- Use Temperature: 482 F
- Thermal Conductivity: 1.4 W/m-K
- Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 83.33333333333333 µin/in-F
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Supplier: Accuris
Description: ADHESIVE, EPOXY, SILVER FILLED, CONDUCTIVE
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Ablestik silver conductive adhesive. Provides a 2 hr working time. Delivers great performance with a shear strength of 1000 psi.
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 64C, Epoxy, Assembly LOCTITE® ABLESTIK 64C non-silver, electrically conductive adhesive is designed for a wide variety of applications. It is special recommended for use where exposure to sea water causes silver based electrically conductive
- Use Temperature: 67 to 266 F
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Industrial Adhesives - 3M CircuitWorks Conductive Adhesive - Silver 7 g Syringe - CW2400 - -- CW2400Supplier: R. S. Hughes Company, Inc.
Description: 3M CircuitWorks silver conductive adhesive. Minimum to maximum operating temperatures are -131 F to +212 F.
- Use Temperature: -131 to 212 F
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 3888 is a room temperature cure epoxy adhesive designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required. 2.5 g Packet.
- Thermal Conductivity: 1.5 W/m-K
- Type: Electrically Conductive
- Features: Thermal / Heat Conductive
- Cure / Technology: Two Component System
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Supplier: Accuris
Description: Adhesive, Electrically Conductive Silver-Filled Epoxy Resin
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Supplier: MacDermid Alpha Electronics Solutions
Description: Screen printable conductive adhesive for secure connection of components to flexible and formable circuit tracks. Product Overview XtraForm E7000 is a silver electrically conductive adhesive (ECA) designed for low-temperature substrates such as polyethylene
- Type: Electrically Conductive
- Features: Electronics
- Industry: Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: A silver filled, fast curing, solvent-free, single component electroconductive adhesive with a high silver content for LED applications. It has a pot life of 2 days and its rheology is well suited to application by microdispenser. It exhibits an excellent thermal stability and a
- Viscosity: 20,000 cP
- Thermal Conductivity: 7 W/m-K
- Coeff. of Thermal Expansion (CTE): 27.77777777777778 to 94.44444444444444 µin/in-F
- Form / Shape: Die Bonding Adhesive / Compound, Grease / Paste
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of two part silver conductive epoxy systems, the EP77M-F has
- Use Temperature: -452.47 to 257 F
- Thermal Conductivity: 1.442279 W/m-K
- Industry: Aerospace, Automotive, OEM / Industrial, Semiconductors / IC Packaging
- Features: Ceramic / Glass, Composites, Electrical Power / HV, Electronics, Marine, Metal, Other, Plastic, Rubber / Elastomer, Specialty / Other, Thermal / Heat Conductive, Tooling / Mold Material
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Supplier: SAE International
Description: This specification covers an electrically-conductive adhesive supplied as two components; a paste of silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
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Supplier: Accuris
Description: ADHESIVE, ELECTRICALLY CONDUCTIVE SILVER-FILLED EPOXY RESIN (STABILIZED TYPE)
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Supplier: SAE International
Description: This specification covers an electrically-conductive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
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Supplier: Epoxy Technology
Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper.
- Viscosity: 25,000 to 45,000 cP
- Use Temperature: 482 F
- Thermal Conductivity: 2.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 51.99999999999999 to 88.99999999999999 µin/in-F
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ABP 8520E2, Silicone, Die attach LOCTITE® ABLESTIK ABP 8520E2 silver filled, conductive die attach adhesive is specifically designed for use in crystal oscillator manufacturing applications. Low modulus Low temperature cure
- Viscosity: 10,000 cP
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Supplier: Epoxy Technology
Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper.
- Viscosity: 1,800 to 3,600 cP
- Use Temperature: -67 to 572 F
- Thermal Conductivity: 12.6 to 26.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.11111111111111 to 52.22222222222222 µin/in-F
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Supplier: Epoxy Technology
Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper.
- Viscosity: 12,000 to 20,000 cP
- Use Temperature: 662 F
- Thermal Conductivity: 0.9 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.666666666666668 to 124.44444444444444 µin/in-F
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Supplier: Newark, An Avnet Company
Description: Silver Conductive Grease
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Supplier: Henkel Corporation - Electronics
Description: (Known as ABLESTIK ICP-3801 conductive adhesive ) LOCTITE ABLESTIK ICP 3801 is a one component electically conductive epoxy designed to provide lower and more stable costs compared to materials relying solely on silver pigments as part of the formula. This material's
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver
- Use Temperature: -452 to 275 F
- Thermal Conductivity: 1.585 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 6,000 to 6,500 psi
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Supplier: Techsil Limited
Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks
- Type: Electrically Conductive
- Features: Electronics, Thermal / Heat Conductive
- Chemical System: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies,
- Type: Electrically Conductive
- Features: Electronics, Thermal / Heat Conductive
- Chemical System: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Allied Electronics, Inc.
Description: effective heat sink adhesive. This Conductive Silver Epoxy comes in two 7g syringes. Epoxy electrically conductive adhesive with reaction product of epichlorohydrin and bisphenol F, silver chemical component.
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Supplier: Techsil Limited
Description: MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies,
- Type: Electrically Conductive
- Features: Electronics, Thermal / Heat Conductive
- Chemical System: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Allied Electronics, Inc.
Description: Features Conductive Silver Epoxy Provides Excellent Electrical and Thermal Conductivity Fully Cured Material Offers High Strength Bonds Extended Pot Life Provides Sixty Minute Work Time High-Strength Solderless Conductive Bonding Repairs Defective Traces and Creates Jumpers on
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Supplier: Allied Electronics, Inc.
Description: Epoxy; Electrically Conductive; 2 part;silver; 1 lb liquid
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Supplier: Techsil Limited
Description: MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic
- Type: Electrically Conductive
- Features: Electronics, Thermal / Heat Conductive
- Chemical System: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Graphene Laboratories, Inc.
Description: Display Packaging / Bonding · Temperature Sensitive Electronics · Medical Devices / Sensors · Solder Replacement SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth thixotropic silver paste Part B – smooth thixotropic silver paste MIX RATIO: 100 (Part A) to 50 (Part B) by weight. POT
- Viscosity: 110,000 to 120,000 cP
- Use Temperature: 77 to 302 F
- Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrical Power / HV, Electronics, Other, Specialty / Other
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11™ has been developed based on advanced proprietary technology that requires 15% or less
- Viscosity: 80,000 to 85,000 cP
- Use Temperature: 77 to 302 F
- Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrical Power / HV, Electronics, Other, Specialty / Other
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Supplier: Allied Electronics, Inc.
Description: Cyanoacrylate Adhesive, 1.05 @ 75 ºF Specific Gravity Conductive Epoxy, Silver Epoxy Resin, Mild Odor Conductive Silver Epoxy Provides Excellent Electrical and Thermal Conductivity High Strength Conductive Bonding Repairs Defective Traces and Creates
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Conduct Research Top
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Silver Filled, Electrically Conductive Adhesives
In the realm of electrically conductive epoxies and silicone, there is nothing like silver. Not only does silver have very high electrical conductivity, it also retains its low resistance over many years, even decades. This is much more desirable than other metals that are highly conductive
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Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging (.pdf)
This paper discusses silver filled and boron nitride filled epoxies for heat-sinking and thermal transfer. Case studies of thermal resistance calculations have been presented with comparisons made against eutectic die-attach.
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Electrical Conductive Adhesives with Nanotechnologies
For ex- ample, the 66.5wt% filled silver conductive adhesive without CNTs had a resistivity of 10 4 Ω cm, but showed a resistivity of 10 -3 Ω cm after adding 0.27wt% CNTs.
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Nanopackaging
For example, the 66.5 wt% filled silver conductive adhesive without CNT had a resis- tivity of 10 4 Ω cm, but showed a resistivity of 10−3 Ω cm after adding 0.27 wt% CNT.
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Advanced Flip Chip Packaging
For example, the 66.5 wt% filled silver conductive adhesive without CNTs had a resistivity of 104 Ohm cm, but showed a resistivity of 10À3 Ohm cm after adding 0.27 wt% CNTs.
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Implementation and Characterization of a Medical Ultrasound Phased Array Probe With New Pb-Free Soldering Materials
The use of new Pb-free solder- ing materials, such as a silver conductive adhesive , is considered in this paper in order to implement an ultrasound array transducer.
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New soldering technology for transducers: Characterization of a medical ultrasound phase array probe
The use of new soldering materials, such as silver conductive adhesive , is taken into consideration in the design of ultrasound array transducers.
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Attenuation in silver-filled conductive epoxy interconnects
Fig. 2 shows a board mounted in the test fixture containing two silver conductive adhesive microstrip lines.
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Advances on Material Science and Manufacturing Technologies
That would save 30-50% consumption of silver than conventional silver conductive adhesives .
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Development of passive and active microprism arrays to change the radiation pattern of solid-state lighting
The LED chip was then bonded inside the Si carrier using silver conductive adhesive .
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Vibration tests on prototypes of ultrasound array transducer: Evaluation of soldering electrical performances
In particular, silver conductive adhesive as soldering material is used and measurements of the electrical resistance are carried out in order to evaluate the resistance degree of the samples to mechanical stresses.
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High-voltage pulse stress on biomedical ultrasound probe soldered with Ag-ECA
[2] M.Catelani, V.L.Scarano, F.Bertocci, R.Singuaroli, P.Palchetti, A.Grandoni, “Thermal Stress on Silver Conductive Adhesive Solder Joints: Performance Evaluation of Medical Ultrasound Array Transducer”, proceedings of I2MTC 2008 (IEEE - International Instrumentation and Measurement Technology Conference) – Singapore …