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Description: Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive
- Chemical / Polymer System Type: Epoxy (EP), Silicone
- Compound Type: Electrically Conductive
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Semiconductors / IC Packaging
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Description: Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves
- Chemical / Polymer System Type: Epoxy (EP), Silicone
- Compound Type: Electrically Conductive
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Semiconductors / IC Packaging
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Description: Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving production costs and waste. It is suitable for automatic adhesive dispensing, with excellent
- Chemical / Polymer System Type: Epoxy (EP), Silicone
- Compound Type: Electrically Conductive
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Semiconductors / IC Packaging
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 87.78 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: MacDermid Alpha Electronics Solutions
Description: Screen printable conductive adhesive for secure connection of components to flexible and formable circuit tracks. Product Overview XtraForm E7000 is a silver electrically conductive adhesive (ECA) designed for low-temperature substrates such as polyethylene
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high
- Coeff. of Thermal Expansion (CTE): 22.22 µin/in-F
- Compound Type: Thermally Conductive
- Thermal Conductivity: 10 W/m-K
- Viscosity: 9000 cP
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Supplier: Protavic America, Inc.
Description: A silver filled, fast curing, solvent-free, single component electroconductive adhesive with a high silver content for LED applications. It has a pot life of 2 days and its rheology is well suited to application by microdispenser. It exhibits an excellent thermal stability and a
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 27.78 to 94.44 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Protavic America, Inc.
Description: Two part Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the assembly ofnon heat cure products and can be used for repair work in the field. It also has a convenient 1:1 mix ratio.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 38.89 to 139 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachsuch as RFID isotropic applications and can be dispensed, printed or pin transferred. It offers fast in-line cure at low temperature. One part premixed
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22.22 to 66.67 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22.22 to 55.56 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 23.33 to 125 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 26.11 to 110 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Techsil Limited
Description: Elecolit® 3653 is a 1 component silver filled, solvent-free conductive epoxy adhesive used in applications which are subject to vibrations or quick temperature fluctuations. This unique product can be cured thermally in a very short period of time and cures to a 60 - 75 Shore D
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Techsil Limited
Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrically Conductive, Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Epoxy Technology
Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 87.78 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of two part silver conductive epoxy systems, the EP77M-F has
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Master Bond, Inc.
Description: developed one component formulation features outstanding electrical conductivity, superior mechanical strength plus excellent adhesive properties to both similar and dissimilar substrates. An additional attractive characteristic of this silver conductive film is its ability to
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 3.33E-5 to 1.11E-4 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Techsil Limited
Description: MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrically Conductive, Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Techsil Limited
Description: MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies,
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrically Conductive, Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Industrial Adhesives - 3M CircuitWorks Conductive Adhesive - Silver 7 g Syringe - CW2400 - -- CW2400Supplier: R. S. Hughes Company, Inc.
Description: 3M CircuitWorks silver conductive adhesive. Minimum to maximum operating temperatures are -131 F to +212 F.
- Use Temperature: -131 to 212 F
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 3888 is a room temperature cure epoxy adhesive designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required. 2.5 g Packet.
- Compound Type: Electrically Conductive, Thermally Conductive
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 1.5 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ICP 8282, Acrylate, Electrically Conductive Adhesive. LOCTITE® ABLESTIK ICP 8282 is an electrically conductive adhesive designed for applications that require high adhesive strength, flexibility, low silver and a very fast cure at low
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 64C, Epoxy, Assembly LOCTITE® ABLESTIK 64C non-silver, electrically conductive adhesive is designed for a wide variety of applications. It is special recommended for use where exposure to sea water causes silver based electrically conductive
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Use Temperature: 67 to 266 F
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Ablestik silver conductive adhesive. Provides a 2 hr working time. Delivers great performance with a shear strength of 1000 psi.
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 967-1, Epoxy, Die attach LOCTITE® ABLESTIK 967-1 adhesive is designed for applications which require lower-than-normal cure temperatures. Low temperature cure, electrically conductive paste with reduced risk to delicate components and increase manufacturing through-put
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Viscosity: 14000 cP
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Supplier: SAE International
Description: This specification covers an electrically-conduct ive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
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Supplier: SAE International
Description: This specification covers an electrically-conduct ive adhesive supplied as two components; a paste of silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
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Supplier: Accuris
Description: ADHESIVE, EPOXY, SILVER FILLED, CONDUCTIVE
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Supplier: Accuris
Description: Adhesive, Electrically Conductive Silver-Filled Epoxy Resin
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: SAE International
Description: Technical Standard
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Supplier: ThreeBond International, Inc.
Description: conductive filler. They are used to connect various electrical contacts and for conduction. Silver, nickel, carbon, etc. are used as the electro-conductive fillers, and epoxy resin, urethane resin, silicone resin, and synthetic rubber are used as binders. With different options
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Industry Applications: Automotive
- Viscosity: 75000 cP
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11™ has been developed based on advanced proprietary technology that requires 15% or less
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Graphene Laboratories, Inc.
Description: materials that are likely to be subjected to vibrations, temperature variations, shock from impact, bending, and mechanical stress. We use a proprietary mix of silver and graphene materials to formulate an adhesive with an outstanding combination of flexibility and low electrical
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Materion Corporation
Description: Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength.
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrically Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-HTNS™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS™ is developed
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material
- Filled / Reinforced: Yes
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material
- Filled / Reinforced: Yes
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
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Description: Deepmaterial provide customized adhesive services on your demand, custom electronic adhesives, PUR structural adhesive, UV moisture curing adhesive, epoxy adhesive, conductive silver glue, epoxy underfill adhesive, epoxy encapsulant, functional
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Supplier: Accuris
Description: ADHESIVE, ELECTRICALLY CONDUCTIVE SILVER-FILLED EPOXY RESIN (STABILIZED TYPE)
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Supplier: Ellsworth Adhesives
Description: ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. Static
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Elongation: 20 to 30 %
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Supplier: Ellsworth Adhesives
Description: ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. 4 g
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Elongation: 20 to 30 %
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Supplier: MacDermid Alpha Electronics Solutions
Description: Form A9000 is compatible with XtraForm Electrically Conductive Adhesive (ECA), formable silver, and dielectric inks, enabling the fabrication of complex multilayer structures that can be thermoformed and overmolded.
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Epoxies Etc...
Description: 40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester, ceramic, etc. This thick film ink provides excellent conductivity for many
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
Find Suppliers by Category Top
Conduct Research Top
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Silver Filled, Electrically Conductive Adhesives
In the realm of electrically conductive epoxies and silicone, there is nothing like silver. Not only does silver have very high electrical conductivity, it also retains its low resistance over many years, even decades. This is much more desirable than other metals that are highly conductive
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Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging (.pdf)
This paper discusses silver filled and boron nitride filled epoxies for heat-sinking and thermal transfer. Case studies of thermal resistance calculations have been presented with comparisons made against eutectic die-attach.
More Information Top
Indicates content that may require registration and/or purchase.
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Electrical Conductive Adhesives with Nanotechnologies
For ex- ample, the 66.5wt% filled silver conductive adhesive without CNTs had a resistivity of 10 4 Ω cm, but showed a resistivity of 10 -3 Ω cm after adding 0.27wt% CNTs.
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Nanopackaging
For example, the 66.5 wt% filled silver conductive adhesive without CNT had a resis- tivity of 10 4 Ω cm, but showed a resistivity of 10−3 Ω cm after adding 0.27 wt% CNT.
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Advanced Flip Chip Packaging
For example, the 66.5 wt% filled silver conductive adhesive without CNTs had a resistivity of 104 Ohm cm, but showed a resistivity of 10À3 Ohm cm after adding 0.27 wt% CNTs.
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Implementation and Characterization of a Medical Ultrasound Phased Array Probe With New Pb-Free Soldering Materials
The use of new Pb-free solder- ing materials, such as a silver conductive adhesive , is considered in this paper in order to implement an ultrasound array transducer.
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New soldering technology for transducers: Characterization of a medical ultrasound phase array probe
The use of new soldering materials, such as silver conductive adhesive , is taken into consideration in the design of ultrasound array transducers.
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Attenuation in silver-filled conductive epoxy interconnects
Fig. 2 shows a board mounted in the test fixture containing two silver conductive adhesive microstrip lines.
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Advances on Material Science and Manufacturing Technologies
That would save 30-50% consumption of silver than conventional silver conductive adhesives .
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Development of passive and active microprism arrays to change the radiation pattern of solid-state lighting
The LED chip was then bonded inside the Si carrier using silver conductive adhesive .
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Vibration tests on prototypes of ultrasound array transducer: Evaluation of soldering electrical performances
In particular, silver conductive adhesive as soldering material is used and measurements of the electrical resistance are carried out in order to evaluate the resistance degree of the samples to mechanical stresses.
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High-voltage pulse stress on biomedical ultrasound probe soldered with Ag-ECA
[2] M.Catelani, V.L.Scarano, F.Bertocci, R.Singuaroli, P.Palchetti, A.Grandoni, “Thermal Stress on Silver Conductive Adhesive Solder Joints: Performance Evaluation of Medical Ultrasound Array Transducer”, proceedings of I2MTC 2008 (IEEE - International Instrumentation and Measurement Technology Conference) – Singapore …