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Supplier: Princess Auto Limited
Description: Silver Bearing Solder Paste
- Fluxes & Cleaners: Soldering Flux / Rosin
- Form / Shape: Paste
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Supplier: Indium Corporation
Description: NC-SMQ® 80 is a halide-free, no-clean solder paste formulated for use with indium-based alloys. Indium-containing alloys offer the benefits of reduced leaching/scavenging of metallizations of precious metals like gold or silver, and improved ductility to compensate for
- Alloy: Indium (In)
- Approvals / Conformance: Other
- Form / Shape: Paste
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Supplier: Accuris
Description: Tin-Silver Solder Metal Paste
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Supplier: MacDermid Alpha Electronics Solutions
Description: Broad latitude for high-reliability applications requiring process flexibility and residue containment, lead-free and zero-halogen. Product Overview ALPHA OM-353 is a zero-halogen solder paste engineered to provide superior electrochemical performance and minimize residue spread
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Supplier: MacDermid Alpha Electronics Solutions
Description: Dispensable paste for pressure sintering large components on gold/silver substrates, including DBC, aluminum, copper. Product Overview ALPHA Argomax 2048 Paste is a dispensable silver sintering paste developed for pressure sintering of large packages or components
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Supplier: MacDermid Alpha Electronics Solutions
Description: Sinter silver paste for die attachment on copper, designed for wet paste placement and low-pressure sintering. Product Overview ALPHA Argomax 5040 Paste is a silver sintering paste developed for die placement on wet paste prior to drying, followed by
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Supplier: MacDermid Alpha Electronics Solutions
Description: A silver sinter paste for large packages, designed for high-tack component placement on wet paste for marginal surfaces. Product Overview Argomax 2141® Paste is an integrated solution and an extension to the highly successful Argomax range. This product is a dispensable
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip,
- Alloy: Other
- Conductivity: 4.81E10 µS/cm
- Form / Shape: Paste, Powder, Preform, Wire
- Melting Range: 536 F
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Supplier: Indium Corporation
Description: plated solder. Additionally, some very fine pitch temperature-sensitiv e applications now use pure indium or indium-silver-plated bumps. Indium Corporation provides fine powder solder paste for both wafer and substrate solder deposition, including low and ultralow
- Lead Free: Yes
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE ABLESTIK SSP 2020 is a sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated from power devices. It maintains high adhesion at operating temperatures as high
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
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Supplier: RS Components, Ltd.
Description: No-Clean solder paste suitable for stencil printing for reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Product Form = Paste Melting Point = +217 - +219°C Percent Silver = 3% Percent Tin = 96.5% Flux
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Paste
- Melting Range: 423 to 426 F
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Supplier: RS Components, Ltd.
Description: No-Clean solder paste suitable for stencil printing for reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Product Form = Paste Melting Point = +217 - +219°C Percent Silver = 3% Percent Tin = 96.5% Flux
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Paste
- Melting Range: 423 to 426 F
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Supplier: RS Components, Ltd.
Description: No-Clean solder paste suitable for stencil printing for reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Product Form = Paste Melting Point = +217 - +219°C Percent Silver = 3% Percent Tin = 96.5% Flux
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Paste
- Melting Range: 423 to 426 F
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Supplier: RS Components, Ltd.
Description: Typical uses are screen printing of PCBs (for surface mounting of chip and leadless components), fired-on ceramics, and gold/silver-plated surfaces. Methods of heating are hot air, vapour phase, infrared, hot plates and even conventional electric irons. Standard particle size available.
- Form / Shape: Paste
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Supplier: Accuris
Description: SOLDER PASTE (62 TIN/36 LEAD/2 SILVER, RMA FLUX, NO-CLEAN, STENCIL PRINTABLE)
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Supplier: Accuris
Description: SOLDER PASTE(62 TIN/36 LEAD/2 SILVER, RMA FLUX, NO-CLEAN, STENCIL PRINTABLE
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Supplier: Accuris
Description: SOLDER PASTE (62 Tin/36 Lead/2 Silver, RMA Flux, No-Clean, Stencil Printable), HIGH VISCOSITY ***TO BE USED WITH FORD WSS-M99P1111-A***
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Supplier: Ellsworth Adhesives
Description: AI Technology Prima-Solder ME8456 Epoxy Paste Adhesive is a thermally conductive, electrically, reworkable, pure silver filled epoxy paste adhesive. It is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 7.9 W/m-K
- Viscosity: 130000 cP
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Description: low stress which are essential for the thermal and reliability performances of high end power IC packages, SiC power devices, GaAs and GaN die transistors. The thermal performance of this material is comparable to that of a solder paste product. One component Electrically conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
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Supplier: Ellsworth Adhesives
Description: AI Technology EG8050-E is an electrically conductive, silver filled epoxy paste adhesive. It exhibits excellent flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). EG8050-E can be readily reworked at 80 to 100 ºC and is fitting
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System, Two Component System
- Thermal Conductivity: 7.9 W/m-K
- Viscosity: 180000 cP
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Supplier: Ellsworth Adhesives
Description: AI Technology ME8452-A is an accelerated version of ME8452 for snapcuring applications. This innovative silver-filled epoxy paste adhesive is solvent free, reworkable, and electrically and thermally conductive. With outstanding flexibility for bonding materials with highly mismatched
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 7.9 W/m-K
- Viscosity: 255000 cP
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 21.67 to 124 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 26.67 to 83.33 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Graphene Laboratories, Inc.
Description: · Flexible Electronics, Wiring & Harnesses · Solder Replacement SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth dark grey paste Part B – smooth thixotropic silver paste MIX RATIO: 100 (Part A) to 100 (Part B) by weight
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material, Specialty / Other
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Supplier: Graphene Laboratories, Inc.
Description: · Medical Devices / Sensors · Solder Replacement SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth thixotropic silver paste Part B – smooth thixotropic silver paste MIX RATIO: 100 (Part A) to 50 (Part B) by weight
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material, Specialty / Other
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Supplier: Graphene Laboratories, Inc.
Description: · Display Packaging / Bonding · Electronics Manufacture / Repair · Solder Replacement SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth thixotropic dark grey paste Part B – smooth thixotropic silver paste MIX RATIO: 100
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material, Specialty / Other
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Supplier: Graphene Laboratories, Inc.
Description: dark grey paste Part B – smooth thixotropic silver paste MIX RATIO: 100 (Part A) to 100 (Part B) by weight. POT LIFE: 4 hours CURING SCHEDULE: Best results are obtained when product is cured at 4 hours @ 150°C / 302°F. Post cure for 1-2 hours @ 180°C
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material, Specialty / Other
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 66.67 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: ASTM International
Description: This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper- silver, tin-antimony-copper- silver-nickel, tin-silver,
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Supplier: ASTM International
Description: 1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper- silver, tin-antimony-copper- silver-nickel, tin-silver,
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Supplier: ASTM International
Description: 1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper- silver, tin-antimony-coppers ilver-nickel, tin-silver,
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Supplier: ASTM International
Description: 1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper- silver, tin-antimony-coppers ilver-nickel, tin-silver,
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Supplier: Indium Corporation
Description: Proven in PV module assembly processes, Indium Corporation's No-Clean Liquid Solar Tabbing Fluxes are non-corrosive, non-conductive, and provide excellent solderability on all types of silver metallizations. Formulated to provide a wide process window, Indium Corporation's Liquid Solar
- Fluxes & Cleaners: Soldering Flux / Rosin
- Form / Shape: Paste
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Supplier: Indium Corporation
Description: Proven in PV module assembly processes, Indium Corporation's No-Clean Liquid Solar Tabbing Fluxes are non-corrosive, non-conductive, and provide excellent solderability on all types of silver metallizations. Formulated to provide a wide process window, Indium Corporation's Liquid Solar
- Fluxes & Cleaners: Soldering Flux / Rosin
- Form / Shape: Paste
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Supplier: Technic, Inc.
Description: TechniSol Ag 2460 is a non-cyanide silver electrodeposition process used to enhance a silver paste seed layer or used as a solderable layer in a solar cell metal stack application. Ag 2460 is a high-speed, low-silver metal formulation that provides a very fine
- Chemical / Process: Silver Plating
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 83C Silver, formerly Emerson and Cuming ECCOBOND, is an two component, silver filled, epoxy adhesive paste that is used to replace hot soldering for electrical connections and bonding to plastics, metal, ceramics, and glass. It offers excellent
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
- Thermal Conductivity: 2.6 W/m-K
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Supplier: Nordson EFD
Description: The 794 Series auger valve makes precise, repeatable deposits without damage to the metal alloy particles in fluids such as solder paste and silver epoxies. Using screw feed principles combined with precision time and pressure controls, the 794 Series system ensures consistent
- Applications: Flux / Solder
- Container / Syringe Volume: 440 cc
- Dispensing Application Type: Bead
- Number of Components: Single Component Dispensing
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Supplier: Protavic America, Inc.
Description: A silver filled, fast curing, solvent-free, single component electroconductive adhesive with a high silver content for LED applications. It has a pot life of 2 days and its rheology is well suited to application by microdispenser. It exhibits an excellent thermal stability and a
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 27.78 to 94.44 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 26.11 to 110 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Henkel Corporation - Industrial
Description: generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity. Medium to high thermal conductivity High electrical conductivity No channel void issue High die shear strength Dispensable silver
- Coeff. of Thermal Expansion (CTE): 22.22 µin/in-F
- Features: Thermal / Heat Conductive
- Thermal Conductivity: 10 W/m-K
- Viscosity: 9000 cP
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Supplier: Henkel Corporation - Industrial
Description: while simultaneously enhancing rheological properties of the paste. It is a No-Dry paste that possesses rheological properties which optimize dispensability during die attach. LOCTITE ABLESTIK QMI3555 incorporates a patented silver/vanadium glass at a metal to glass ratio of
- Thermal Conductivity: 80 W/m-K
- Viscosity: 35000 cP
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Supplier: Henkel Corporation - Industrial
Description: comparable to that of a solder paste product. No resin bleed-out One component Good workability Good sintering properties when used on Ag, PPF, Au and Cu substrates High thermal stability Good electrical stability High reliability Solder replacement
- Coeff. of Thermal Expansion (CTE): 13.89 µin/in-F
- Viscosity: 11500 cP
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MacDermid Alpha Electronics Solutions Expands Singapore Production Facility to Meet Growing Global Demand for Argomax® Silver Sintering Paste This strategic initiative marks a significant milestone in the company’s growth. At the heart of the (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
award celebrates a collaboration of more than two decades, during which MacDermid Alpha has supplied advanced solder alloys, pastes, adhesives, and cleaners to support Syrma SGS’s expansion into one of India’s most technologically advanced manufacturers. In 2025, MacDermid Alpha (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
-quality lead-free alloy that is capable of soldering at a temperature lower than standard tin silver copper alloys. ALPHA HRL3 solder alloy is able to demonstrate reliability performance comparable to standard tin silver copper alloys (SAC305). To ensure consistent sphere size, uniformity, and alloy content, ALPHA Solder Spheres are manufactured to the highest quality control standards. (read more)
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reliability. ALPHA® OM-100 is a silver-free, high-performance solder paste designed to deliver the required thermomechanical reliability (read more)
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only offers enhanced performance for EVs, but also contributes to the creation of more sustainable and eco-friendly automotive systems. Examples of this are low-temperature solder and silver sintering that can play a role in carbon emission reduction. Clark Dai, one of Mac (read more)
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iron powder or hydride powder, with binder, is applied to the welded parts of ceramics and metals. The solder (pure silver, silver-copper solder or low-temperature solder such as lead, tin and indium) is directly added to the metal parts without sintering, and then it is fired in vacuum at one time (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
customized services. LTCC ceramic package shell LTCC (Low Temperature Co-fired Ceramic) is a multilayer ceramic substrate, the main components of which are alumina and glass, and high conductivity metals such as gold, silver, and copper are used as conductor pastes (read more)
Browse Glass Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd.
More Information Top
Indicates content that may require registration and/or purchase.
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Solder Powder: IPC
Tin/ Silver Solder Paste in Die Attach (Sn/Ag .
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Soldering Recommendations for Surface Mount and Multilayer Metal Oxide Varistors (.pdf)
While this configuration is best, other silver solder pastes can also be used.
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Suppression of Transients in an Automotive Environment (.pdf)
While this configuration is best, other silver solder pastes can also be used.
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Induction Brazing of Type-I Fiber Bragg Gratings Into Kovar Ferrules Exploiting Curie Transition
Commercial type-I gratings, labelled GM , were brazed for 25 s at 200 A, one end at a time, into kovar ferrules using susceptors and silver solder paste (liquidus temperature 600 °C).
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Development of a high reliability and large volume manufacturing assembly process for a stacked memory package
The Tin / Silver solder paste alloy was investigated using both Organic Acid (OA) flux and No-Clean flux.
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Pb-free external lead finishes for electronic components: Tin-bismuth and tin-silver
External lead finishes which are compatible with tin-bismuth and tin- silver solder pastes are therefore required.
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In‐Situ Growth and Characterization of Highly Textured La 0.9 Sr 0.1 MnO 3 Films on LaAlO 3 (100) Substrates
Electrical contacts to the samples were provided by direct silver paste soldering on the manganite film.
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Characterization of High Energy Electron Irradiation Damage in UPt3 Samples
Electrical contacts on the samples were made with silver paste ( solder might have reannealed part of the defects), removed before, and made again after the irradiation.
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Dielectric and electromechanical properties of (1−x )PMN-x PZT ferroelectric ceramics
Electrodes were applied by burning-in sil- ver solder paste .
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Characterisation of high energy electron irradiation damage in UPt3
samples
Electrical con- tacts on the samples were done with silver paste ( sol- der might have reannealed part of the defects), removed before, and made again after the irradiation.