Silver Solder Paste

Description: Silver Bearing Solder Paste

• Joining Process / Product Form: Paste
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Tin-Silver Solder Metal Paste

Description: Silver Bearing Solder Paste - 7.1g Syringe; Flux Type:-; Solder Alloy:-; Melting Temperature:-; Weight - Metric:-; Weight - Imperial:-; Product Range:

Description: NC-SMQ® 80 is a halide-free, no-clean solder paste formulated for use with indium-based alloys. Indium-containing alloys offer the benefits of reduced leaching/scavenging of metallizations of precious metals like gold or silver, and improved ductility to compensate for

• Solder Alloy: Indium (In)
• Features: Other
• Joining Process / Product Form: Paste

Description: Product Overview ALPHA OM-362 is a lead-free, zero-halogen, no-clean solder paste available in T4 powder. It is specifically designed to deliver ultra-low voiding performance across all component types, with a focus on bottom-terminated components. ALPHA OM-362 achieves Institute of

• Solder Alloy: Lead Free
• Joining Process / Product Form: Paste, Powder

Description: SOLDER PASTE (62 TIN/36 LEAD/2 SILVER, RMA FLUX, NO-CLEAN, STENCIL PRINTABLE)

Description: SOLDER PASTE(62 TIN/36 LEAD/2 SILVER, RMA FLUX, NO-CLEAN, STENCIL PRINTABLE

Description: LOCTITE ABLESTIK SSP 2020 is a sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated from power devices. It maintains high adhesion at operating temperatures as high

• Type: Electrically Conductive
• Industry: Electronics (PCB / SMT Assembly)

Description: SOLDER PASTE (62 Tin/36 Lead/2 Silver, RMA Flux, No-Clean, Screen Printable) ***TO BE USED WITH FORD WSS-M99P1111-A***

Description: A silver sinter paste for large packages, designed for high-tack component placement on wet paste for marginal surfaces. Product Overview Argomax 2141® Paste is an integrated solution and an extension to the highly successful Argomax range. This product is a dispensable

Description: AI Technology Prima-Solder ME8456 Epoxy Paste Adhesive is a thermally conductive, electrically, reworkable, pure silver filled epoxy paste adhesive. It is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials

• Viscosity: 130,000 cP
• Thermal Conductivity: 7.9 W/m-K
• Chemical System: Epoxy (EP)
• Cure / Technology: Single Component System

Description: AI Technology EG8050-E is an electrically conductive, silver filled epoxy paste adhesive. It exhibits excellent flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). EG8050-E can be readily reworked at 80 to 100 ºC and is fitting

• Viscosity: 180,000 cP
• Thermal Conductivity: 7.9 W/m-K
• Chemical System: Epoxy (EP)
• Cure / Technology: Single Component System, Two Component System

Description: AI Technology ME8452-A is an accelerated version of ME8452 for snapcuring applications. This innovative silver-filled epoxy paste adhesive is solvent free, reworkable, and electrically and thermally conductive. With outstanding flexibility for bonding materials with highly mismatched

• Viscosity: 255,000 cP
• Thermal Conductivity: 7.9 W/m-K
• Chemical System: Epoxy (EP)
• Cure / Technology: Single Component System

Description: ALLOY SN96.5 AG3 CU0.5 SIRIUS 1 LF-500G

• Features: Other
• Joining Process / Product Form: Paste
• Solder Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)

Description: stress which are essential for the thermal and reliability performances of high end power IC packages, SiC power devices, GaAs and GaN die transistors. The thermal performance of this material is comparable to that of a solder paste product. One component Electrically conductive Good

• Industry: OEM / Industrial
• Cure / Technology: Thermosetting / Crosslinking

Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip,

• Melting Range: 460 F
• Conductivity: 58,580,000,000 µS/cm
• Approvals / Conformance: ASTM / UNS
• Joining Process / Product Form: Paste, Powder, Preform, Solid Wire, Strip / Sheet / Foil

Description: solder. Additionally, some very fine pitch temperature-sensitive applications now use pure indium or indium-silver-plated bumps. Indium Corporation provides fine powder solder paste for both wafer and substrate solder deposition, including low and ultralow alpha

• Solder Alloy: Lead Free

Description: consistently delivers strong, durable solder joints. During soldering, the thin silver finish dissolves completely into the bulk solder, resulting in a reliable and resilient copper/tin solder joint. Sterling’s consistent silver plating in blind microvias meets

• Type: Cleaner / Cleaning Agent, Surface Treatment
• Industry Applications: Electrical / Electronics

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are used as

• Viscosity: 12,000 to 20,000 cP
• Use Temperature: 662 F
• Thermal Conductivity: 0.9 W/m-K
• Coeff. of Thermal Expansion (CTE): 21.666666666666668 to 124.44444444444444 µin/in-F

Description: antimony (Sb) allowed as impurities in section 3.3 Alloy Impurities Transfer all information references on solder powder particle size distribution and solder paste products to IPC J-STD-005, Requirements for Solder Pastes Remove Table 3-1 “Particle Size

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are used as

• Viscosity: 800 to 1,600 cP
• Use Temperature: 482 F
• Thermal Conductivity: 1.4 W/m-K
• Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 83.33333333333333 µin/in-F

Description: This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver,

Description: Henkel Loctite Ablestik 83C Silver, formerly Emerson and Cuming ECCOBOND, is an two component, silver filled, epoxy adhesive paste that is used to replace hot soldering for electrical connections and bonding to plastics, metal, ceramics, and glass. It offers excellent electrical

• Thermal Conductivity: 2.6 W/m-K
• Substrate Compatibility: Ceramic / Glass, Metal, Plastic
• Chemical System: Epoxy (EP)
• Cure / Technology: Two Component System

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are used as

• Viscosity: 1,800 to 2,800 cP
• Use Temperature: 572 F
• Thermal Conductivity: 3.3 W/m-K
• Coeff. of Thermal Expansion (CTE): 17.22222222222222 to 66.66666666666667 µin/in-F

Description: This specification covers solder metal alloys used as solders for the purpose of joining together two or more metals at temperatures below their melting points. The solder alloy shall conform to the required chemical compositions of cadmium, zinc, tin, lead, antimony,

Description: Proven in PV module assembly processes, Indium Corporation's No-Clean Liquid Solar Tabbing Fluxes are non-corrosive, non-conductive, and provide excellent solderability on all types of silver metallizations. Formulated to provide a wide process window, Indium Corporation's Liquid Solar

• Joining Process / Product Form: Paste
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Proven in PV module assembly processes, Indium Corporation's No-Clean Liquid Solar Tabbing Fluxes are non-corrosive, non-conductive, and provide excellent solderability on all types of silver metallizations. Formulated to provide a wide process window, Indium Corporation's Liquid Solar

• Joining Process / Product Form: Paste
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: 1.1 This specification covers solder metal alloys (commonly known as soft solders), including zinc-aluminum, zinc-aluminum-copper, zinc-tin, zinc-tin-copper, zinc-cadmium-tin, zinc-cadmium, tin-zinc, cadmium-zinc, cadmium-zinc-silver, and cadmium-silver, used for the

Description: TechniSol Ag 2460 is a non-cyanide silver electrodeposition process used to enhance a silver paste seed layer or used as a solderable layer in a solar cell metal stack application. Ag 2460 is a high-speed, low-silver metal formulation that provides a very fine grain

• Chemical / Composition: Silver Plating

Description: The 794 Series auger valve makes precise, repeatable deposits without damage to the metal alloy particles in fluids such as solder paste and silver epoxies. Using screw feed principles combined with precision time and pressure controls, the 794 Series system ensures consistent

• Container / Syringe Volume: 440 cc
• Dispensing Application: Bead
• Application: Flux / Solder
• Number of Components: Single Component Dispensing

Description: power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity. Medium to high thermal conductivity High electrical conductivity No channel void issue High die shear strength Dispensable silver paste

• Viscosity: 9,000 cP
• Thermal Conductivity: 10 W/m-K
• Coeff. of Thermal Expansion (CTE): 22.22222222222222 µin/in-F
• Features: Thermal / Heat Conductive