Single Wafer Clean

Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF-310 includes Rigaku's patented

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 150 to 300 mm

Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-V310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF-V310 includes Rigaku's patented

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 150 to 300 mm

Description: JST's 300 CLV Cleaner and Stripping Tool is a completely self contained, dry to dry unit designed for cleaning and stripping wafers, optics, disk drives, flat panels and other delicate parts. Just place the product into the dry tank, process through either single or multiple

Description: clean 4. Strong impact resistance 5. Slip Free Different Models of ceramic wafer boat : The semiconductor manufacturing industry typically processes these wafers in either horizontal or vertical carriers. The horizontal carrier, typically called a "boat", has

• Material Type: Carbide Materials, Silicon Carbide
• Shape / Form: Fabricated / Custom Shape

Description: wearable. It is also very easy to clean and wash because of its smooth and density surface . The zirconia ceramic tooth rails adopt special processing technology which greatly reduce the marks on the wafers . It is assembled on the automatic wafer handling system for DOA

• Compressive / Crushing Strength: 290074 psi
• Density: 6 g/cc
• MOR / Flexural Strength: 116029 psi
• Material Type: Zirconia, Specialty Ceramic

Description: Praher K6 thermoplastic wafer check valves are available in sizes 2" though 8" with maximum operating pressure of 150 psi at 72 F, non-shock. The valve does not require a spacer for full disc opening performance in SCH 80 pipes. Valves have a single disc design suitable for horizontal

• Material of Construction: PVC
• Valve Size: 6 inch
• Valve Type: Wafer / Split Disc Check Valves

Description: Fast scribing speeds; high yield rates; high production capacity Produces high-quality results with no residue or melt-back Fully-automatic processing; integrated coating application, wafer cutting, and cleaning functions Laser type: DPSS 355nm ultraviolet laser Laser

• Automation / Control: Windows / PC Control
• Laser Output Power: 0.0 to 5 watts
• Laser Type: Other
• Materials Processed: Metal / Conductive Materials, Semiconductors / Electronics, Soft / Fibrous (Textiles, Foams, Paper)

Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3760 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF 3760 includes Rigaku's patented

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 200 mm

Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3800e can measure elements from S through U with a single-target, dual-beam X-ray system and a new liquid nitrogen-free detector system. The TXRF 3800e includes

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 200 mm

Description: Technic Predip 470 is a single additive pre-treatment process which minimizes silver immersion deposits on copper/copper alloy substrates prior to silver plating.

• Industry Applications: Semiconductor Wafer / Cleanroom
• Type: Pretreatment / Conditioner, Surface Treatment

Description: the front surface of a clean, unpatterned, polished or epitaxial wafer of the same type that is to be inspected by the SSIS. Note 1-This practice was developed primarily for use in calibrating SSISs intended for inspecting monocrystalline wafers, in which case pre-deposited bare

Description: following generation of excess carriers with a light pulse is determined by monitoring the microwave reflectivity of the wafer. Since no contact is made to the specimen, this test method is nondestructive. If wafer cleanness is maintained, wafers may be further processed

Description: increases with surface roughness. 1.4 This test method is especially useful for determining the surface elemental areal densities in the native oxide or in chemically grown oxide of polished silicon wafers after cleaning. 1.5 This test method is useful for elemental areal densities

Description: Low cost wet bench design for R&D and low volume applications. Same basic cell and wafer holder design as used on our highly successful SEMCON 1500 and 2000 series. Tool features a single plating cell and dragout rinse cell. Plating and electroforming of

• Application / Industry: Semiconductor / Wafer
• Equipment / System Type: Laboratory / Pilot System
• Process / Technology: Electroplating

Description: designed with multiple processes, which handle a single cassette of (25) wafers at a time up to 200mm diameter. The tool handles cassettes “dry in” and “dry out”. The wafer cassettes are manually presented and removed to the tool loading / unloading port. Each cassette is

• Application / Industry: Semiconductor / Wafer, Solar / Photovoltaic
• Equipment / System Type: Automated System
• Process / Technology: Electroplating

Description: Characteristics Materials: Clean Room Diameter: 76.2 Type: Round Dopant: Single Wafer Shipper Orientation: lid/base/spring Thickness-actual: Holds 1 Wafer Grade: Clean Room Misc Info. Growth Method: ePak Lot Size: 10

Description: Characteristics Materials: Clean Room Diameter: 100.0 Type: Round Dopant: Single Wafer Shipper Orientation: lid/base/spring Thickness-actual: Holds 1 Wafer Grade: Clean Room Misc Info. Growth Method: ePak Lot Size: 10

Description: Characteristics Materials: Clean Room Diameter: 38.1 Type: Round Dopant: Single Wafer Shipper Orientation: lid/base/spring Thickness-actual: Holds 1 Wafer Grade: Clean Room Misc Info. Growth Method: ePak Lot Size: 10

Description: Characteristics Materials: Clean Room Diameter: 50.8 Type: Round Dopant: Single Wafer Shipper Orientation: lid/base/spring Thickness-actual: Holds 1 Wafer Grade: Clean Room Misc Info. Growth Method: ePak Lot Size: 10

Description: Low Particle Generation-One piece Molded Design Corrosion Resistant 1 to 4 Actuation Levels in a Single Unit Lengths to 24" (610 mm) Applications: Semiconductor Process Equipment Pure Chemical Delivery System Wafer Cleaning and Etching Systems Cabinet Leak Sensing

• Configuration (Normal State): Normally Open (NO), Normally Closed (NC)
• Material Temperature Range: -40 to 250 F
• Maximum Operating Pressure: 50 psi
• Meter Technology: Mechanical / Magnetic Floats

Description: and driving torques. Type-CSD screws are normally used with thicker materials. The wafer head design allows the screw to set flush in wood and softer materials and provides a clean, finished appearance. All self-drilling screws offer economical benefits: reduces labor and tooling

• Drive Type: Philips / Frearson
• Head Type: Other
• Inch: # 10
• Length: 2 inch

Description: friction and driving torques. Type-CSD screws are normally used with thicker materials. The wafer head design allows the screw to set flush in wood and softer materials and provides a clean, finished appearance. All self-drilling screws offer economical benefits: reduces labor and

• Drive Type: Philips / Frearson
• Head Type: Other
• Inch: # 10
• Length: 1.25 inch

Description: friction and driving torques. Type-CSD screws are normally used with thicker materials. The wafer head design allows the screw to set flush in wood and softer materials and provides a clean, finished appearance. All self-drilling screws offer economical benefits: reduces labor and

• Drive Type: Philips / Frearson
• Head Type: Other
• Inch: # 14
• Length: 1.25 inch

Description: friction and driving torques. Type-CSD screws are normally used with thicker materials. The wafer head design allows the screw to set flush in wood and softer materials and provides a clean, finished appearance. All self-drilling screws offer economical benefits: reduces labor and

• Drive Type: Philips / Frearson
• Head Type: Other
• Inch: #  8
• Length: 1.25 inch

Description: MATERIALS Plasma Pure™ UC Alumina Low Loss Tangent Alumina PureSiC® CVD Silicon Carbide Exyria™ Yttria & Yttria Coatings Coatings: CVD SiC, ESD-Safe UltraClean™ Recrystallized SiC StatSafe™ ESD-Safe Ceramics Single Crystal Silicon

• Applications: Chemical / Materials Processing
• Material Type: Aluminum Nitride, Alumina / Aluminum Oxide, Carbide Materials, Silicon Carbide, Yttria, Specialty Ceramic
• Shape / Form: Fabricated / Custom Shape

Description: This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 20 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom wafer calibration standards. Manual loading allows

• Other Predefined: Yes

Description: This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 10 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom wafer calibration standards. Manual loading allows

• Other Predefined: Yes

Description: Rubicon’s sapphire epi-polished wafers are ultra-flat, super clean, stress-free large diameter substrates, offered with precision orientations and offsets and wafer-to-wafer uniformity, with one or both surfaces finished. These sapphire wafers are custom designed to meet

• Applications: Dielectric Ceramics / Materials, Electroceramics (Electrical and Electronic Ceramics), Optics / Optical Grade
• Width / O.D.: Up to 7.87 inch

Description: The ZT box module offers two degrees of freedom – Z and Theta – in a single unit, with both coarse and fine Z-axis adjustments available. Designed for wafer process control applications, it can function independently or be mounted atop an XY platform. This module provides

• Actuation Type: Electrical
• Axis Configuration: Z Axis Only
• Features: Multi-position
• Rated Speed: 0.7874 to 3.94 in/sec

Description: measurement cycle supports concentration control for 300mm processes. A short measurement cycle of approximately three seconds makes it possible to track concentrations close to real time. Fine-tuned concentration control makes it suitable for batch-type baths as well as single-bath

Description: needed in the direction of flow for bubble tight sealing. Applications The SV11, SV12 series are suitable for a broad range of light industrial applications. Typical applications include: Vacuum pumps Water analysis Wafer cleaning for semiconductor

• Actuation: Electric
• Connection: Threaded
• Features: Single Solenoid, Normally Open (Open Center), Normally Closed (Closed Center)
• Media Description: Water (General), Wastewater

Description: component of choice for many applications as low-cost silicon wafer fabrication technologies continue to provide high reliability and long-term performance. Design Features: cleanroom 1Low leakage devices P on N type State of the art class 1000 clean room Computer aided designs Custom

• PN, PIN, or Avalanche: PN Photodiode
• Photodiode Material: Silicon

Description: measurement cycle supports concentration control for 300-mm processes A short measurement cycle of approximately three seconds makes it possible to track concentrations at much closer to real time. Supports fine-tuned concentration control for batch-type-bath as well as single-bath

• Display Type: Digital Display
• Electrical Output: Analog Current Output, Switch / Alarm Relay Output
• Measures Conductivity / Dissolved Solids: Yes
• Mounting / Environment: In-Situ / Field

Description: The HF-960M uses sensors that offer outstanding corrosion resistance for high-precision, high-speed measurement of low concentrations of hydrofluoric acid, hydrochloric acid and ammonia, and is thus perfect for single-bath and wafer cleaning. The HF-960M is also an

• Analog Input Type: DC Voltage
• Depth: 115 mm
• Display Technology: LED
• Display Type: Combination