Single Wafer Clean

Description: system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Optional Sweeping TXRF software enables mapping of the contaminant distribution over the

• Maximum Wafer / Part Size: 150.00000000000003 to 300.00000000000006 mm
• Measurements: Area Mapping, Particle Contamination
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: JST's 300 CLV Cleaner and Stripping Tool is a completely self contained, dry to dry unit designed for cleaning and stripping wafers, optics, disk drives, flat panels and other delicate parts. Just place the product into the dry tank, process through either single or multiple chemical

Description: system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Integrated VPD capability enables automatic VPD preparation of one wafer while a TXRF

• Maximum Wafer / Part Size: 150.00000000000003 to 300.00000000000006 mm
• Measurements: Area Mapping, Particle Contamination
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: Praher K6 thermoplastic wafer check valves are available in sizes 2" though 8" with maximum operating pressure of 150 psi at 72 F, non-shock. The valve does not require a spacer for full disc opening performance in SCH 80 pipes. Valves have a single disc design suitable for horizontal

• Valve Size: 8 inch
• Valve Type: Check Valves
• Primary Material: PVC
• Features: Wafer / Split Disc Check Valves

Description: system DOA equipment integrated wafer loading & unloading, unloading the wafers from the Ceramic boat to the cassette or loading the wafers from the cassette to the ceramic boat. Available for double back-to-back wafers in one slot which realize single side

• Density: 5.99999621323765 g/cc
• Thermal Conductivity: 2.5 W/m-K
• MOR / Flexural Strength: 116,029.4714857576 psi
• Compressive / Crushing Strength: 290,073.678714394 psi

Description: φ150mm ) silicone wafer , thickness 675 um . They want this part in 99% alumina ceramic . We don’t have the standard wafer boats for customer wafer size , but we custom made it . Before this projects , we have made a 99% alumina horizontal wafer boat , it is for

• Material Type: Carbide Materials, Silicon Carbide
• Shape / Form: Fabricated / Custom Shape

Description: Closed-loop water cooling X-axis cutting speed: ≤600mm/s Applicable wafer sizes: 2, 4, or 6 inches Cutting line width: <15μm@ 40μm grooving depth Dicing street width: ≥30μm Processing method: Automatic single-axis processing via front-side or backside cutting Imaging system: Coaxial

• Laser Output Power: 0 to 5 watts
• Type: Complete / Turnkey System
• Laser Operation: Laser Cutting
• Options / Components: Laser Head / Focusing Unit, Laser Optics / Beam Delivery, Laser System Enclosure, Monitoring Sensors / System

Description: wafers must be used as calibration wafers. The practice may also be extended to the calibration of SSISs intended to inspect other materials, such as gallium arsenide or other compound semiconducting compounds, in which case, clean, unpatterned, polished wafers of the

Description: Characteristics Materials: Clean Room Diameter: 150.0 Type: Round Dopant: Single Wafer Shipper Orientation: lid/base/spring Thickness-actual: Holds 1 Wafer Grade: Clean Room Misc Info. Growth Method: ePak Lot Size: 10

Description: generation of excess carriers with a light pulse is determined by monitoring the microwave reflectivity of the wafer. Since no contact is made to the specimen, this test method is nondestructive. If wafer cleanness is maintained, wafers may be further processed following testing

Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This test method covers the quantitative determination of elemental areal density on the surface of polished single crystal silicon substrates using total reflection X-ray fluorescence spectroscopy (TXRF) with a monochromatic

Description: Low cost wet bench design for R&D and low volume applications. Same basic cell and wafer holder design as used on our highly successful SEMCON 1500 and 2000 series. Tool features a single plating cell and dragout rinse cell. Plating and electroforming of wafers or discrete

• Process / Technology: Electroplating
• Machinery Type: Laboratory / Pilot System
• Application / Industry: Semiconductor / Wafer

Description: system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Optional Sweeping TXRF software enables mapping of the contaminant distribution over the

• Maximum Wafer / Part Size: 200 mm
• Measurements: Area Mapping, Particle Contamination
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: The Rigaku MFM65 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to

• Maximum Wafer / Part Size: 200 to 300.00000000000006 mm
• Measurements: Composition, Particle Contamination, Roughness / Waviness, Thickness - Film / Layer
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: Low Particle Generation-One piece Molded Design Corrosion Resistant 1 to 4 Actuation Levels in a Single Unit Lengths to 24" (610 mm) Applications: Semiconductor Process Equipment Pure Chemical Delivery System Wafer Cleaning and Etching Systems Cabinet Leak Sensing

• Number of Switch Points: 1 to 4 (#)
• Maximum Operating Pressure: 50 psi
• Material Temperature Range: -40 to 250 F
• Features: Electromechanical Switch, Normally Closed (NC), Normally Open (NO), Single Pole, Single Throw (SPST)

Description: Technic Predip 470 is a single additive pre-treatment process which minimizes silver immersion deposits on copper/copper alloy substrates prior to silver plating.

• Type: Pretreatment / Conditioner, Surface Treatment
• Industry Applications: Semiconductor Wafer / Cleanroom

Description: processes, which handle a single cassette of (25) wafers at a time up to 200mm diameter. The tool handles cassettes “dry in” and “dry out”. The wafer cassettes are manually presented and removed to the tool loading / unloading port. Each cassette is loaded into a sliding drawer

• Machinery Type: Automated System
• Process / Technology: Electroplating
• Application / Industry: Semiconductor / Wafer, Solar / Photovoltaic

Description: Focus/edge rings are designed to improve etch uniformity around the wafer edge or perimeter. When used with an electrostatic chuck (e-chuck), the wafer rests on the edge focus ring - held in place by the electrostatic charge. ADVANCED CERAMIC COMPONENTS CoorsTek advanced, high-purity

• Features: Alumina / Aluminum Oxide, Carbide Materials, Specialty Ceramic
• Specialty Ceramic Type: Aluminum Nitride, Silicon Carbide, Yttria
• Applications: Chemical / Materials Processing
• Shape / Form: Fabricated / Custom Shape

Description: 12 X 1 Self-Drilling Screws / Phillips / Wafer Head / #3 Point / Steel / Zinc Type BSD: A tapping screw with spaced threads and a drill point which drills its own hole. Type CSD: A wafer head thread forming screw with machine screw thread pitch and a drill point which drills its own

• Length: 1 inch
• Inch: # 12
• Features: Other
• Standard Drives: Philips / Frearson

Description: of substrates to be deposited including 150 mm, 200 mm, and 300 mm wafers, supporting of all of your wafer metrology applications and improving product yield. The Model 2300G3M Particle Deposition System offers best-in-class performance for deposition of particle size standards

• Waveform: Other Predefined

Description: of substrates to be deposited including 150 mm, 200 mm, and 300 mm wafers, supporting of all of your wafer metrology applications and improving product yield. The Model 2300G3M Particle Deposition System offers best-in-class performance for deposition of particle size standards

• Waveform: Other Predefined

Description: The CS-137 is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use BHF solution to etch silicon oxide and remove particles from the wafer surface. The CS-137 continually monitors each

Description: Rubicon’s sapphire epi-polished wafers are ultra-flat, super clean, stress-free large diameter substrates, offered with precision orientations and offsets and wafer-to-wafer uniformity, with one or both surfaces finished. These sapphire wafers are custom designed

• Width / O.D.: 7.87402 inch
• Features: Dielectric Ceramic, Electroceramics (Electrical and Electronic Ceramics), Optics / Optical Grade
• Material Type: Sapphire

Description: The CS-153 is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use FPM solution to etch silicon oxide and remove particles from the wafer surface. The CS-153 continually monitors each

• Process Media Temperature: 68 to 176 F
• Operating Temperature: 68 to 77 F
• Electrical Output: Analog Current Output, Switch / Alarm Relay Output
• Display Type: Digital Display

Description: The HF-960M uses sensors that offer outstanding corrosion resistance for high-precision, high-speed measurement of low concentrations of hydrofluoric acid, hydrochloric acid and ammonia, and is thus perfect for single-bath and wafer cleaning. The HF-960M is also an

• Number of Digits: 4
• Width: 96 mm
• Height: 96 mm
• Depth: 115 mm

Description: The CS-153N is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use HF/HNO3 solution to etch silicon oxide and remove particles from the wafer surface. The CS-153N continually monitors each

• Process Media Temperature: 68 to 176 F
• Operating Temperature: 68 to 77 F
• Electrical Output: Analog Current Output, Switch / Alarm Relay Output
• Display Type: Digital Display

Description: Quantum Devices offers the ability to customize a planar silicon photodiode with either single or multiple diode structures on a single chip. This configuration is a p-on-n structure and can be used to detect the presence and absence of minute quantities of light. The linearity of this

• Photodiode Type: PN Photodiode
• Photodiode Material: Silicon

Description: direction of flow for bubble tight sealing. Applications The SV11, SV12 series are suitable for a broad range of light industrial applications. Typical applications include: Vacuum pumps Water analysis Wafer cleaning for semiconductor industries Waste/drain valve Features Direct acting,

• Valve Size: 0.25 inch
• Pressure Rating: 1,000 psi
• Number of Ports/Ways: 2
• Power: 10 to 15 volts

Description: 1.1 This test method covers the determination of total sodium, aluminum, and potassium on the surface of mirror-polished single crystal silicon and silicon epi substrates using secondary ion mass spectrometry (SIMS). This test method measures the total amount of each metal, because this test

Description: environment. This integration ensures that chemicals remain in a controlled, ultra-clean state from the moment they enter the facility until they reach the wafer. The result is a highly reliable manufacturing process that prioritizes purity, repeatability, and environmental safety.

• Body Material: Stainless Steel

Description: Precision Stainless Steel Valve Manifold Panel for Inert Gas Distribution in Cleanroom Manufacturing Environments The Precision Stainless Steel Valve Manifold Panel (VMP) is a specialized solution designed for the efficient and clean distribution of inert gases within high-tech manufacturing

• Application: Gas
• Body Material: Stainless Steel

Description: changeovers between supply barrels to ensure the manufacturing process never runs dry. Chemical Delivery/Dilution (CDM) Before reaching the wafer, many organic chemicals require precise mixing. The CDM automates this by blending concentrated solvents with DI water or other additives. By using

• Body Material: Stainless Steel

Description: Manifold Boxes (VMB), Chemical Dispensing Units (CDU), and specialized Filling Equipment, all working together to ensure a safe, contamination-free environment. Valve Manifold Boxes (VMB) The VMB acts as the central traffic controller for chemical distribution. It takes a single supply line

• Body Material: Stainless Steel