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Supplier: Integrated Device Technology
Description: The ZSSC1750 is a System Basis Chip ( SBC ) with a dual-channel ADC for battery sensing/management in automotive, industrial, and medical systems. The ZSSC1750 features an SPI interface. One of the two input channels measures the battery current IBAT via the voltage drop
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Supplier: Integrated Device Technology
Description: The ZSSC1751 is a System Basis Chip ( SBC ) with a dual-channel ADC for battery sensing/management in automotive, industrial, and medical systems. The ZSSC1751 features an SPI interface and an integrated LIN 2.1 transceiver. One of the two input channels measures the
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Supplier: Euchner-U.S.A., Inc.
Description: Four safe inputs, two safe semiconductor outputs AS-i monitor, master and connection for 24V power supply unit (AS-interface Power 24V) integrated Chip card and USB for parameter assignment AS-i master The SBM includes an AS-i Master, which can
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Supplier: Microchip Technology, Inc.
Description: The MCP2025 provides a bidirectional, half-duplex communication physical interface to an automotive and industrial Local Interconnect Network (LIN) and SAE J2602 bus. Operation covers LIN Bus Specification Versions 1.3, 2.0, 2.1 and SAE J2602. The device incorporates a voltage regulator with 5V/70mA
- IC Package Type: DIP / CDIP / PDIP, SOIC / SOP, Other
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Supplier: Microchip Technology, Inc.
Description: The MCP2021 provides a bidirectional, half-duplex communication physical interface to an automotive and industrial Local Interconnect (LIN) and SAE J2602 bus. Operation covers LIN Bus Specification Versions 1.3, 2.0, 2.1 and SAE J2602. The device incorporates a voltage regulator with 5V/50mA or
- IC Package Type: DIP / CDIP / PDIP, SOIC / SOP, Other
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Supplier: Microchip Technology, Inc.
Description: The MCP2021A provides a bidirectional, half-duplex communication physical interface to an automotive and industrial Local Interconnect (LIN) and SAE J2602 bus. Operation covers LIN Bus Specification Versions 1.3, 2.0, 2.1 and SAE J2602. The device incorporates a voltage regulator with 5V/70mA or
- IC Package Type: DIP / CDIP / PDIP, SOIC / SOP, Other
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Supplier: Utmel Electronic Limited
Description: Power System Basis Chip with High Speed CAN And LIN Transceivers 48-Pin LQFP EP T/R
- Features: RoHS
- Form Factor / Package: Other
- Operating Temperature: -40 C
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Supplier: Utmel Electronic Limited
Description: Power System Basis Chip with High Speed CAN and LIN Transceiver 48-Pin LQFP EP T/R
- Features: RoHS
- Form Factor / Package: Other
- Operating Temperature: -40 C
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Supplier: Microchip Technology, Inc.
Description: The Microchip ATA663231 system basis chip is a fully integrated LIN transceiver, designed according to the LIN specification 2.0, 2.1, 2.2, 2.2A and SAEJ2602-2, with a low-drop voltage regulator with 3.3V/85mA. The combination of voltage regulator and bus transceiver makes it
- IC Package Type: Other
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Supplier: Lingto Electronic Limited
Description: TLE9267 - SYSTEM BASIS CHIP
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Description: 1.1 ISO 2580-1:2002 establishes a system of designation for acrylonitrile-butadi ene-styrene (ABS) moulding and extrusion materials, which may be used as the basis for specifications. 1.2 The types of ABS plastic are differentiated from each other by a classification
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Supplier: Lingto Electronic Limited
Description: TLE9268-2QX - SYSTEM BASIS CHIP
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Supplier: CSA Group
Description: ISO 19062-1:2015 establishes a system of designation for acrylonitrile-butadi ene-styrene (ABS) moulding and extrusion materials, which may be used as the basis for specifications. The types of ABS plastic are differentiated from each other by a classification system based on
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Description: LIN SYSTEM BASIS CHIP
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Supplier: Lingto Electronic Limited
Description: SYSTEM BASIS CHIP
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Supplier: Lingto Electronic Limited
Description: SYSTEM BASIS CHIP
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Supplier: ODG (Origin Data Global)
Description: LIN SYSTEM BASIS CHIP
- Device Type / Applications: Transceiver, Other
- IC Package Type: Other
- Supply Voltage: Other
- TJ: -40 to 150 C
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Description: SYSTEM BASIS CHIP, POWER MANAGEM
- IC Package Type: SSOP
- Supply Voltage: Other
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Description: SYSTEM BASIS CHIP, POWER MANAGEM
- IC Package Type: SSOP
- Supply Voltage: Other
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Supplier: ODG (Origin Data Global)
Description: SYSTEM BASIS CHIP FS8410
- IC Package Type: Other
- Operating Temperature: -40 to 125 C
- Regulator Category: Linear Regulator
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Supplier: ODG (Origin Data Global)
Description: SYSTEM BASIS CHIP FS8500
- IC Package Type: Other
- Operating Temperature: -40 to 125 C
- Regulator Category: Linear Regulator
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Supplier: Quarktwin Technology Ltd.
Description: System Basis Chip PMIC 32-SOIC-EP
- Operating Temperature: -40 to 125 C
- Package Type: SOP, SSOP, Other
- Quiescent Current (IQ): 2000 µA
- Supply Voltage (Vi): 5.5 to 28 volts
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Supplier: DigiKey
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
- IC Package Type: Other
- Operating Temperature: -40 to 125 C
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Supplier: DigiKey
Description: System Basis Chip Interface 32-SOIC-EP
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Supplier: Quarktwin Technology Ltd.
Description: System Basis Chip Interface 32-SOIC-EP
- IC Package Type: SOP, SSOP, Other
- RoHS Compliant: Yes
- Supply Voltage: Other
- Technology: Other, CAN
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Supplier: Quarktwin Technology Ltd.
Description: IC SYSTEM BASIS CHIP DSO-36
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Supplier: Acme Chip Technology Co., Limited
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
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Supplier: VAST STOCK CO., LIMITED
Description: Interface - Specialized SYSTEM BASIS CHIP W/LIN
- RoHS Compliant: Yes
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Supplier: DigiKey
Description: FS6500 System Basis Chip (SBC) Interface Evaluation Board
- Category: Development Board
- Manufacturer: Other
- Supported System: Microcontroller
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Supplier: Quarktwin Technology Ltd.
Description: System Basis Chip PMIC 32-LQFP (7x7)
- Operating Temperature: -40 to 125 C
- Package Type: QFP, Other
- Supply Voltage: Other
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Supplier: VAST STOCK CO., LIMITED
Description: Interface Development Tools LIN Networking System Basis Chip
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Supplier: Rochester Electronics
Description: MCZ33789 - Airbag System Basis Chip With Power Supply And Psi5 Sensor Power Supply And Psi5 Sensor Interface
- Features: RoHS Compliant
- IC Package Type: QFP, LQFP, Other
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Supplier: Rochester Electronics
Description: System Basis Chip, CAN, 2x 5.0V/200mA LDOs, SOIC 28
- IC Package Type: Other
- Output Current (IOUT): 0.2000 amps
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Supplier: Intelligraphics, Inc.
Description: The Intel® Atom™ Baytrail processor E3800 product family is the first system-on-chip (SoC) designed for intelligent systems, delivering outstanding compute, graphical, and media performance while operating in an extended range of thermal conditions. Targeted at the exploding
- Deployment: Standalone
- Licensing: Perpetual
- Operating System: Windows
- Use: Professional
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Supplier: Win Source Electronics
Description: Manufacturer: NXP Win Source Part Number: 884434-MCZ33903D5EK Features: System Basis Chip Interface 32-SOIC-EP Package: Bulk Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting: Surface Mount Categories: Integrated Circuits (ICs) Case / Package: 32-SOIC-EP Popularity:
- IC Package Type: SOIC, SSOP, Other
Find Suppliers by Category Top
Featured Products Top
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, high reliability and repeatability within a wide temperature range from -200 °C up to 1000 °C. Because of very small dimensions and low thermal mass, the thin-film temperature sensors exhibit a very short response time. IST sensor products from the FlipChip Series (read more)
Browse Temperature Sensor Chips Datasheets for Innovative Sensor Technology IST USA Division -
As an important component of LED, packaging substrates are also changing with the development of LED chip technology. At present, metal and ceramic substrates are mainly used in LED heat dissipation substrates. Metal substrates are made of aluminum or copper. Because of their mature technology (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
error and temperature drift are corrected "OnChip" through computation. Because of the special robust construction, the sensor also withstands peak loading at high temperatures. Therefore, this special model is also ideal for extremely sophisticated industrial applications in drying systems and (read more)
Browse Hygrometers and Humidity Measurement Instruments Datasheets for Innovative Sensor Technology IST USA Division -
interface as digital values. The module is precisely calibrated by the manufacturer and is therefore fully inter-changeable without adjustment. Both the linearity error as well as the temperature drift are corrected "OnChip" through computation resulting in an outstanding accuracy over a wide range (read more)
Browse Hygrometers and Humidity Measurement Instruments Datasheets for Innovative Sensor Technology IST USA Division -
interchangeable without adjustment. Both the linearity error as well as temperature drift are corrected "OnChip" through computation resulting in an outstanding accuracy over a wide range of applications. The high chemical resistance, dew formation resistant design and an excellent long-term stability (read more)
Browse Hygrometers and Humidity Measurement Instruments Datasheets for Innovative Sensor Technology IST USA Division -
-term stability, low self-heating and fast response time. Standard sensors available with nominal resistance*: 100 Ω at 0 °C, 500 Ω at 0 °C and 1000 Ω at 0 °C Chip sizes: 0805; 0603; 1206 Data sheets (read more)
Browse Temperature Sensor Chips Datasheets for Innovative Sensor Technology IST USA Division -
Innovative Sensor Technology features the new UltraSlim Platinum RTD component with a chip size of 3505 (3.5mm x 0.5mm x 0.5mm (L x W x H)). The ultra-small dimensions of the sensor allow it to be mounted in a tube with an ID Ø of 0.8 mm (0.0315") and the temperature range from (read more)
Browse Resistive Temperature Devices (RTD) Elements Datasheets for Innovative Sensor Technology IST USA Division -
IST Humidity Sensors – P14 Thermo P14 Thermo sensor products are designed to measure humidity, temperature and heating on one chip. They have excellent accuracy due to optimized thermal coupling, high chemical resistance and could measure comfortably at dew (read more)
Browse Hygrometers and Humidity Measurement Instruments Datasheets for Innovative Sensor Technology IST USA Division -
Developed as an alternative to the traditional wire-wound sensors, the PW-sensor from IST AG is the only chip in the market that combines high accuracy and precision with the advantages of the thin-film sensors, that offer vibration stability and very low hysteresis, while at the same (read more)
Browse Resistive Temperature Devices (RTD) Elements Datasheets for Innovative Sensor Technology IST USA Division -
functionality of a system. P14-Rapid Within meteorology applications, such as radio sondes and weather balloons, there is a strong need for ultrafast, stable and (read more)
Browse Humidity Controllers Datasheets for Innovative Sensor Technology IST USA Division
Conduct Research Top
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Forum sets course for blue-laser DVD standard The DVD Forum will use the 0.6-mm bonded disk proposed by NEC Corp. and Toshiba Corp. as the basis of its next-generation DVD standard utilizing a blue laser. STMicro shows dual-function DNA analysis chip STMicroelectronics demonstrated a dual-function
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Application: Switching Performance PCB's Used In IC's - Reed Relay
Chip makers use new performance boards for every new chip they develop. Since most integrated. circuit/chip makers generally have large factories devoted to the testing of their chips. Hundreds of testers are typically used on a 24 hour/7 days a week basis. Each tester may be well over $1,000,000
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
C-Cube to unveil DoMiNo DVD chip architecture at CES MILPITAS, Calif. -- C-Cube Microsystems Inc. will take the Consumer Electronics Show (CES) in Las Vegas today to announce a new, low-cost chip architecture for DVD recorders, gateways, set-top boxes, and other consumer items. The new architecture
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Application: IC Testing - Reed Relay
millions of dollars, are designed to test these chips on a 24 hour and 7 day basis.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
at leading chip foundry Taiwan Semiconductor Manufacturing Co. Ltd. were NT$14.20 billion (about $420 million) on a consolidated basis, a decrease of 47.7 percent from March 2008. However, this was ahead of expectations. Europe gets tough over power adapters The European Commission is set to mandate
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
basis is expected to be driven heavily by DSL in Asia-Pacific markets and by cable in North America. Tokyo Electron, IMEC team on immersion lithography Tokyo Electron Ltd., a supplier of chip manufacturing equipment, said it had agreed to work with IMEC vzw, a Belgian microelectronics research center
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
production "--or early production--for its 90-nm process by the third quarter of 2002. The foundry giant's 90-nm technology has been branded "Nexsys " Samsung taking hefty gamble on NAND chips Samsung Electronics Co. Ltd. is staking its future heavily on NAND flash chips to offset an expected slowdown
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
on flash-memory front NETANYA, Israel -- Saifun Semiconductor Ltd. here announced that it has achieved new and record performance levels for its flash-memory chip lines being built on a foundry basis by Tower Semiconductor Ltd. By utilizing Tower's so-called microFLASH process technology in its fab
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
is on the ropes. But renewed activity at both the laser component and transponder level renews hope that survivors will eke out a viable business in individual laser elements and larger packaged transponders. Optimism begins to return to chip industry With the latest statistics showing strong chip sales
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Sony this week issued a recall of batteries for its Vaio notebook computers. The company revealed that the total number of its lithium-ion batteries to be recalled has reached 9.6 million units from a total of eight notebook PC vendors and some other peripheral product vendors. Study links chip
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
NEC tips 55-nm process with high-k, immersion NEC Electronics Inc. has rolled out what the company claims is the industry's first 55-nm standard CMOS process technology for use in next-generation, system-on-a-chip (SoC) designs with ultra-low power consumption. Options probe delays Semtech's
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Permanent Magnet Basics
Computer chip manufacturers and auto. manufacturers delight in the feeding frenzy. that follows the announcement of a new, faster model. This "speed greed" makes premium products the subject of feature review articles in industry specific media. A drop in the cost of magnet material, on a cost per
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Protect the Product, Not the Package
There is no shortage of new technologies designed to protect the drug supply chain. RFID gets most of the publicity, but experts acknowledge that it can, in theory, be hacked, while an RFID chip on a package may not guarantee that the product is not diverted. Holograms and other forms of security
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
by the Japanese company in Mie. Exar CEO Ciffone steps down Exar Corp. (Fremont, Calif.) announced Friday (Sept. 10) that Donald L. Ciffone Jr. has retired as president and chief executive and will be replaced on an interim basis by Roubik Gregorian, currently executive vice president and chief
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Rapid Microbiological Methods for a New Generation
by a conventional microarray, and over 1,500 nanoarray spots would occupy the area required for a single microarray spot. For example, BioForce Nanosciences? (Ames, Iowa) NanoArray prints biological and non-biological materials onto silicon chips (at right) and other surfaces with ultra-micro spot sizes ranging
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Designing Atmospheric-Pressure Plasma Sources for Surface Engineering of Nanomaterials
and isolation. The. potential of DEP as a biological tool for sample isolation and. enrichment for drug screening, disease detection and. treatment, as well as on-chip applications lies in its inherent. advantages over current concentration and detection techniques. These techniques typically maintain