Products & Services
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Supplier: Richardson RFPD
Description: ADHESIVE, ACRYLIC, SYRINGE, 25ML
- Features: Thermal / Heat Conductive
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Supplier: Richardson RFPD
Description: DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which require
- Features: Thermal / Heat Conductive
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Supplier: Richardson RFPD
Description: DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which require
- Features: Thermal / Heat Conductive
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Supplier: Richardson RFPD
Description: DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which require
- Features: Thermal / Heat Conductive
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST TGR 4000, High Performance Thermal Interface Compound for Copper-Based Heat Sinks BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat sink. Other high watt
- Features: Thermal / Heat Conductive
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST TGR 1500A, High Performance, Value Compound for High-End Computer Processors BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a thermal interface material between a high end computer processor and a heat sink. Other high watt
- Chemical / Polymer System Type: Silicone
- Features: Thermal / Heat Conductive
- Thermal Conductivity: 1.5 W/m-K
- Use Temperature: 302 F
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Description: The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K. ? Available in various thicknesses from 0.3 to 10.0 mm. ? Highly
- Dielectric Constant (Relative Permittivity): 9
- Dielectric Strength: 2.03E-4 kV/in
- Elongation: 30 %
- Features: Thermal / Heat Conductive
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Supplier: Budnick Converting, Inc.
Description: 3M 8805 is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices such as fans, heat spreaders, or heat pipes.
- Thickness: 0.0050 inches
- Type: Transfer
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Supplier: Budnick Converting, Inc.
Description: 3M 8810 is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices such as fans, heat spreaders, or heat pipes.
- Peel Strength / Adhesion: 4.69 lbs/in
- Thickness: 0.0100 inches
- Type: Transfer
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Supplier: Budnick Converting, Inc.
Description: Nitto Denko thermal conductive adhesive tape TR-5925F offers superior thermal conductive property by using the thermal conductive adhesive layer. TR-5925F acquires flammability UL94 V-0 certification. It can be used various industries, including electronics.
- Thickness: 0.0098 inches
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Supplier: Budnick Converting, Inc.
Description: Nitto Denko thermal conductive adhesive tape TR-5325F offers superior thermal conductive property by using the thermal conductive adhesive layer. TR-5325F acquires flammability UL94 V-0 certification. TR-5325F offers excellent workability and processability by
- Adhesive: Specialty / Other
- Backing: Plastic / Polymer, PET / Polyester
- Thickness: 0.0098 inches
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST LIQUI BOND TLB SA3500, Thermally Conductive, Two-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND TLB SA3500 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a two-part material and requires no refrigeration. The
- Features: Thermal / Heat Conductive
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST LIQUI BOND TLB SA1800, Thermally Conductive, One-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND® TLB SA1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer. The adhesive is supplied as a one-part liquid component,
- Dielectric Constant (Relative Permittivity): 0.0060
- Features: Thermal / Heat Conductive
- Thermal Conductivity: 1.8 W/m-K
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Description: The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m·K. ? High bonding performance. ? Good stability, long
- Chemical / Polymer System Type: Silicone
- Features: Thermal / Heat Conductive
- Industry: Electronics
- Thermal Conductivity: 1.5 W/m-K
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Single Component System, Specialty / Other
- Dielectric Strength: 635 kV/in
- Elongation: 170 %
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Description: The no-flow package is designed for local circuit board protection. This adhesive can be cured in a few seconds under UV light of appropriate intensity. In addition to light curing, the adhesive also contains a secondary thermal curing initiator.
- Cure Type / Technology: Thermoplastic / Hot Melt, UV / Radiation Cured (EB, Light)
- Industry: Electronics
- Viscosity: 3480 cP
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Supplier: Hi-Tech Seals, Inc.
Description: preparation and bond well to dirty and oily surfaces. Other acrylic features include the ability to bond a wide range of materials, excellent gap fills and fast fixturing times. HERNON® offers two families of acrylic adhesives: the ReAct® bonding systems, and the Dissipator® thermally
- Coeff. of Thermal Expansion (CTE): 3.94E-4 µin/in-F
- Cure Type / Technology: Reactive / Moisture Cured, Two Component System
- Dielectric Constant (Relative Permittivity): 12.34 to 14.92
- Dielectric Strength: 38.1 kV/in
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into cavities about 1 mm in width. The glass transition temperature is over 150°C, which helps to improve the
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 9.44 to 36.11 µin/in-F
- Dielectric Constant (Relative Permittivity): 4.5 to 5.5
- Dielectric Strength: Over 381 kV/in
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Supplier: Techsil Limited
Description: MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Description: Dual-curing adhesives are specially designed for the assembly of temperature-sensitiv e electronic components. The formula of this product is to perform initial curing under ultraviolet radiation, and then perform secondary thermal curing to achieve the best performance.
- Cure Type / Technology: Thermoplastic / Hot Melt, UV / Radiation Cured (EB, Light), Specialty / Other
- Elongation: 85 %
- Industry: Electronics
- Viscosity: 85000 cP
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Supplier: Techsil Limited
Description: transfer. Strong water and chemical resistance. Product Benefits Thermal conductivity 1.44 W/m*K 1:1 mix ratio Working time: 4-hours Cure time 1 hour @ 80°C, or 96 hours at room temperature Good adhesive strength Strong resistance to water, brine, acids, bases, and aliphatic
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22.78 to 90 µin/in-F
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
- Filled / Reinforced: Yes
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Supplier: Accuris
Description: Adhesive - Thermal Cycling Resistant
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Dielectric Constant (Relative Permittivity): 4.7 to 4.8
- Dielectric Strength: 635 kV/in
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 10 to 41.67 µin/in-F
- Dielectric Constant (Relative Permittivity): 4.5 to 5.5
- Dielectric Strength: Over 381 kV/in
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Description: It is a single component, high-end adhesive with dual curing mechanism, specially designed for the optical device industry, typical applications include PLC packaging, semiconductor laser packaging, collimator lens bonding, filter bonding, optical detector lens and fiber bonding, isolator
- Cure Type / Technology: Thermoplastic / Hot Melt, UV / Radiation Cured (EB, Light)
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Dielectric Constant (Relative Permittivity): 4.7 to 4.8
- Dielectric Strength: 635 kV/in
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Supplier: Techsil Limited
Description: Momentive TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications. This grade cures quickly upon exposure to heat and adheres well to a wide variety of substrates. Recommended for use as a thermal interface material between dies
- Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
- Features: Thermal / Heat Conductive
- Industry: Electronics
- Use Temperature: -40 to 200 F
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Description: It is a one-component, high-viscosity anaerobic structural adhesive. Suitable for bonding most materials. The product will cure when exposed to suitable UV light. The bonding on the surface of the material can also be cured with a surfactant. Industry application in the bonding and sealing of
- Cure Type / Technology: Thermoplastic / Hot Melt, UV / Radiation Cured (EB, Light), Single Component System
- Elongation: 80 %
- Industry: Electronics
- Use Temperature: -67 to 248 F
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Supplier: Boyd
Description: Thermal Interface Materials - Gap Fillers and Pads, Films, Tapes, Hardware Electronic devices continue to become faster, smaller, and more powerful every day, enabling technological advancements across all industries. The Internet of Things, powered by embedded electronics and its complex
- Features: Thermal / Heat Conductive, Thermal / Heat Insulating
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Supplier: Boyd
Description: Low VOC (volatile organic compound) adhesives for sensitive or enclosed applications Heat & flame resistant solutions Thermally or electrically conductive adhesives & tapes Custom thicknesses, lengths, widths, colors, adhesion ratings Formatted for use
- Adhesive: Acrylic, Epoxy, Rubber, Silicone
- Backing: Plastic / Polymer, Acrylic / Acrylate, Rubber, Silicone
- Type: Double-Sided, Transfer
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Description: Thermal spraying -- Determination of tensile adhesive strength
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Supplier: DigiKey
Description: OMEGABOND ADHESIVES, THERMALLY C
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Supplier: Master Bond, Inc.
Description: resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of 4K to +250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Anti-static / ESD Control, Electrically Conductive Compound (Adhesive, Grease), Electrical Insulation / Dielectric Material, EMI / RFI Shielding Material
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
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Supplier: Datamax-O'Neil
Description: Datamax-O’Neil’s IQ Series thermal transfer and direct thermal label offering includes a wide range of products –thousands of custom labels designed for every application imaginable. We are committed to manufacturing superior labels u
- Backing / Base: Paper
- Features: Other
Find Suppliers by Category Top
Featured Products Top
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Introducing our curable phase-change thermal adhesive — a dual-function solution engineered for high-power server CPUs and GPUs. Applied as a manageable pre-form, it melts during assembly to flow into microscopic surface irregularities, displacing trapped air and achieving low thermal (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Battery systems face two simultaneous challenges: moving heat away from cells and electrical joints, and surviving exposure to harsh chemicals that may occur during manufacture, maintenance, or in-field abuse. The Sheen TIV series thermal adhesives solve both problems with a silicone (read more)
Browse Adhesive Tapes Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
TIV800 Series Thermal Conductive Adhesive is built for engineers who need a practical way to manage heat while keeping components firmly in place. Based on a silicone resin system, it combines thermal conductivity, electrical insulation, and strong bonding (read more)
Browse Epoxy Adhesives Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
of robots demand enhanced heat dissipation, protection, and operational stability. Thermal conductive potting adhesives, which combine thermal conductivity, electrical insulation, and structural encapsulation, have become an indispensable thermal management solution in modules such as robotic (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Silicone adhesives are chosen for their ability to remain flexible across a very wide range of temperatures and operating conditions and their resistance to moisture and many chemicals. Being particularly suitable for use in harsh environments, CHT’s silicone adhesives will bond (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for CHT USA Inc. -
This system is top notch for withstanding thermal cycling and shock. Minimal stress is generated when bonding dissimilar substrates. It is white in color, with a service temperature range spanning between -65°F to +400°F. MasterSil 153AO is a great choice for applications involving sensitive optical and electronic components where heat dissipation along with electrical insulation is critical. (read more)
Browse Silicone Adhesives and Sealants Datasheets for Master Bond, Inc. -
Adhesive product page. Thermally Conductive Adhesives The SILCOTHERM® range includes range includes thermally (read more)
Browse Elastomers and Rubber Compounds Datasheets for CHT USA Inc. -
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Visible light curable adhesives feature high bond strength, thermal stability, chemical and water resistance and excellent surface cure. These one component compounds are designed to provide safe and rapid cures upon exposure to LED light at ambient temperatures. Environmentally friendly, these (read more)
Browse UV Curing Adhesives Datasheets for Master Bond, Inc. -
Heat cured 1-part silicone adhesives cure in minutes reducing production time and improving output. Using platinum catalysts, they do not produce any harmful by-products, which make them suitable for a wide range of applications including electronics. 1-part - no need for (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc.
Conduct Research Top
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Tips for Thermal Adhesive Bonding Automation for Lightweight Aviation Applications
Here are a few tips for automating a bonding process for a lightweight aviation application. First, let's go over what a thermal adhesive bond is and what materials it bonds together.
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Thermally Conductive Adhesives Keep Things Cool
Thermally conductive adhesives. and potting compounds are an important. weapon in the war against heat raging within. today's powerful electronic devices.
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Fabrication Method Reference Guide: Standard Thermabond Compliant Thermal Interface Adhesives
Thermabond (R) Adhesives are used to bond two interfaces that require a thermal path between them. Thermabond (R) accomplishes this by using mineral or metallic fillers incorporated into a catalyzed silicone rubber base. Thermabond (R) vulcanizes and bonds to surfaces when heat and pressure
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Industrial Adhesive Solution for Transparent
Transparent adhesives are used in tropical electrical products, relays, small transformers, marine instruments, thermal instruments, precision instruments, carrier communication, protection of electronic components and machine protection, etc.
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Adhesives for Cryogenic Applications
Adhesives capable of functioning reliably at cryogenic temperatures play an essential role across a broad number of applications. Blended with specialized filler materials, epoxy systems are capable of maintaining performance and delivering required physical, thermal, and electrical characteristics
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Tensile Bond Strength Variance of Thermally Sprayed Coatings with Respect to Adhesive Type (.pdf)
A Round Robin study involving 19 coating suppliers and independent laboratories was conducted on tensile testing of thermally sprayed coatings to determine the accuracy and consistency of the tensile data among the participating labs and within a lab. One coating system (NiCrAl) and two adhesives
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Is Epoxy Stronger than Adhesive?
Epoxy is a term that covers a wide range of thermosetting polymer materials used in a wide range of industries today. They are adhesives, coatings, primers, sealants, and encapsulants with superior mechanical, electrical, and thermal properties. Epoxy products are typically two-part systems
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Thermally Conductive Microelectronics Adhesives and Encapsulants Bonding in Microelectronics and Photonics
The electronics world has grown tremendously, and today, we have microelectronics that are changing how we think and look at life. Because of how important they are, there has been a need to develop the highest quality microelectronics adhesives and encapsulants to make it possible to create faster
More Information Top
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
The PLC pigtailing consisted of two main steps: • The integrated optical polymer chip was first fixed on a submount with a thermal adhesive .
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Advanced Materials for Thermal Management of Electronic Packaging
(3) Available as electrically conductive or electrically insulating thermal adhe- sives , thermal greases, thermal gels, and thermal pads.
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Nano-Bio- Electronic, Photonic and MEMS Packaging
An Approach to Measurement and Evaluation of the Thermal Conductivity of the Thermal Adhesives in Electronic Packaging.
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Experimental Investigation on Effect of Adhesives
on Thermoelectric Generator Performance
(I) Arctic SilverÒ thermal adhesive (adhesive A).
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Interfacial thermal resistance and temperature dependence of three adhesives for electronic packaging
COMPOSITION AND DESIGNATION OF THERMAL ADHESIVES TESTED .
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Comparison of the adhesion strength of epoxy and silicone based thermal interface materials
This study primarily focuses on the adhesion performance of thermal adhesives .
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Design and fabrication of evaporators for thermo-adsorptive batteries
3-10 The potential effects of misapplication of thermal adhesive are pre- sented.
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Quad-Core Intel® Xeon® Processor 5300 Series
2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5300 .