Products & Services
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Supplier: Richardson RFPD
Description: ADHESIVE, ACRYLIC, SYRINGE, 25ML
- Features: Thermal / Heat Conductive
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Supplier: Henkel Corporation - Industrial
Description: will benefit from the extremely low thermal impedance of BERGQUIST TGR 4000. The BERGQUIST TGR 4000 compound wets-out the thermal interface surfaces and flows to produce low thermal impedance. The compound requires pressure of the assembly to cause flow. BERGQUIST TGR 4000
- Features: Thermal / Heat Conductive
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Supplier: Budnick Converting, Inc.
Description: Nitto Denko thermal conductive adhesive tape TR-5325F offers superior thermal conductive property by using the thermal conductive adhesive layer. TR-5325F acquires flammability UL94 V-0 certification. TR-5325F offers excellent workability and processability by
- Thickness: 0.00984 inches
- Backing: PET / Polyester, Plastic / Polymer
- Features: Specialty / Other
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Supplier: Newark, An Avnet Company
Description: THERMALLY CONDUCTIVE ADHESIVE TAPE; Thermal Conductivity:0.4W/m.K; Conductive Material:-; Thickness:0.19mm; Thermal Impedance:-; Dielectric Strength:55kV/mm; External Length:100mm; External Width:100mm; Product Range:8940 Series RoHS Compliant: Yes
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Description: The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft, reducing
- Use Temperature: -58 to 392 F
- Thermal Conductivity: 6 W/m-K
- Tensile Strength (Break): 4.35110518071591 psi
- Elongation: 30 %
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Supplier: Budnick Converting, Inc.
Description: Nitto Denko thermal conductive adhesive tape TR-5925F offers superior thermal conductive property by using the thermal conductive adhesive layer. TR-5925F acquires flammability UL94 V-0 certification. It can be used various industries, including electronics.
- Thickness: 0.0098 inches
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Supplier: Newark, An Avnet Company
Description: THERMAL TAPE, ADHESIVE, 150MM SQ; Thermal Conductivity:0.95W/m.K; Conductive Material:Acrylic, Fiberglass; Thickness:0.25mm; Thermal Impedance:1.8°C/W; Dielectric Strength:-; External Length:150mm; External Width:150mm; Length:150mm RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: ADHESIVE, THERMAL, JAR, 80G; Thermal Conductivity:0.034°C/W; Conductive Material:-; Thickness:-; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:-; Product Range:-; Adhesive Colour:Grey; Colour:Grey RoHS Compliant: Yes
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Description: The no-flow package is designed for local circuit board protection. This adhesive can be cured in a few seconds under UV light of appropriate intensity. In addition to light curing, the adhesive also contains a secondary thermal curing initiator.
- Viscosity: 3,480 cP
- Features: Conformal Coating
- Industry: Electronics
- Cure / Technology: Thermoplastic / Hot Melt, UV / Radiation Cured (EB, Light)
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Supplier: Win Source Electronics
Description: Category: Fans, Thermal Management>Thermal>Adhesives, Epoxies, Greases, Pastes Mfr: TE Connectivity Aerospace, Defense and Marine Packaging: Bulk Part Status: Obsolete Resistance (Ohms): 5 Tolerance: ±20% Power (Watts): 30 W Composition: Wirewound Features: Bootstrap Circuit,
- Resistance Range: 5 ohms
- Tolerance: 20 +/- %
- Temperature Coefficient (TCR): 1,200 ±ppm/°C
- Power Rating: 30.000000000000004 watts
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Description: The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m·K. ◆ High bonding performance. ◆ Good stability, long-term high temperature
- Use Temperature: -58 to 392 F
- Thermal Conductivity: 1.5 W/m-K
- Industry: Electronics
- Chemical System: Silicone
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Supplier: Accuris
Description: General Requirements for Thermally Conductive Adhesives
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Supplier: Techsil Limited
Description: thermal. 8329TCM epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is required alongside good
- Industry: Electronics
- Chemical System: Epoxy (EP)
- Features: Thermal / Heat Conductive, Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: thermal. 8329TCS epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is required alongside good
- Industry: Electronics
- Chemical System: Epoxy (EP)
- Features: Thermal / Heat Conductive, Thermosetting / Crosslinking
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Supplier: Allied Electronics, Inc.
Description: Thermalbond™ is a thermally conductive, high strength epoxy adhesive. Green in color, it provides exceptional adhesion to copper, aluminum, steel, glass, ceramics and most plastics. Thermalbond™ also has a coefficient of thermal expansion compatible with aluminum, copper and brass,
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Supplier: Ellsworth Adhesives
Description: Dow TC-2030 Thermally Conductive Adhesive Gray is a two component, heat curing, silicone compound that is used for bonding electrical components. It provides heat dissipation, mechanical stability, and electrical insulation. 50 kg Kit.
- Viscosity: 200,000 to 250,000 cP
- Thermal Conductivity: 2.7 W/m-K
- Tensile Strength (Break): 682 psi
- Elongation: 51 %
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties.
- Viscosity: 150,000 cP
- Use Temperature: -58 to 356 F
- Thermal Conductivity: 2 W/m-K
- Features: Die Bonding Adhesive / Compound, Gel, Grease / Paste, Specialty / Other, Thermal / Heat Conductive
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Supplier: Hernon Manufacturing, Inc.
Description: Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Cure / Technology: Room Temp. Cure / Vulcanizing
- Chemical System: Silicone
- Features: Thermal / Heat Conductive
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Supplier: IPC International, Inc.
Description: Covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place.
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 315 is a one component, thermally conductive acrylic adhesive used for bonding electrical components to heat sinks with an insulating gap. 300 mL Cartridge.
- Viscosity: 360,000 to 850,000 cP
- Thermal Conductivity: 0.808 W/m-K
- Tensile Strength (Break): 2,180 psi
- Elongation: 1 %
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Supplier: Accuris
Description: Adhesive - Thermal Cycling Resistant
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 1-4173 Thermally Conductive Adhesive Gray is a one component, solvent free adhesive that is used for bonding electronic components, housings, lids, base plates, and dispensing equipment. It is heat curing, self-leveling, flowable, good thermal conductivity, and has
- Viscosity: 61,000 cP
- Thermal Conductivity: 1.8 W/m-K
- Cure / Technology: Single Component System
- Features: Thermal / Heat Conductive
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Supplier: Techsil Limited
Description: Momentive TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications. This grade cures quickly upon exposure to heat and adheres well to a wide variety of substrates. Recommended for use as a thermal interface material between dies and
- Use Temperature: -40 to 200 F
- Industry: Electronics
- Chemical System: Rubber Based / Elastomeric, Silicone
- Features: Thermal / Heat Conductive
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Description: General-purpose classic product, tough and flexible after curing, impact resistance, moisture resistance, often used for glass bonding.
- Substrate Compatibility: Ceramic / Glass
- Cure / Technology: Thermoplastic / Hot Melt, UV / Radiation Cured (EB, Light)
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic temperatures as well as bonding ceramics, metal, and heat sinks. It offers a low coefficient of
- Thermal Conductivity: 1.22 to 1.44 W/m-K
- Dielectric Strength: 449.58000000000095 kV/in
- Substrate Compatibility: Ceramic / Glass, Metal
- Features: Thermal / Heat Conductive
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Supplier: Newark, An Avnet Company
Description: THERMAL TAPE, ADHESIVE, UL, 1.0W/M.K; Thickness:0.25mm; Conductive Material:Acrylic Polymer; Thermal Conductivity:1W/m.K; Thermal Impedance:0.85°C/W; Volume Resistivity:-; External Length:305mm; External Width:305mm; Product Range:-;RoHS Compliant: Yes
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Supplier: Accuris
Description: Adhesives, Fire-Resistant, Thermal Insulation
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Supplier: ToneCooling Technology Co., Ltd
Description: where both structural integrity and thermal management are essential. This article delves into the features, benefits, and applications of thermally conductive structural adhesive solutions. Key Features 1. High Thermal Conductivity • Description: These adhesives are
- Device: Thermo-Electric Cooler
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Supplier: Accuris
Description: ADHESIVES, FIRE-RESISTANT, THERMAL INSULATION
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,
- Viscosity: 1,800 to 3,600 cP
- Use Temperature: -67 to 572 F
- Thermal Conductivity: 12.6 to 26.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.11111111111111 to 52.22222222222222 µin/in-F
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Supplier: Master Bond, Inc.
Description: excellent adhesive/sealant forming durable, flexibilized bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents. It has a wide service temperature range of -60°F to 250°F. EP30FLAO has a desirably low coefficient of themal expansion
- Viscosity: 10,000 to 15,000 cP
- Use Temperature: -60 to 275 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 17 µin/in-F
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Supplier: Datamax-O'Neil
Description: Datamax-O’Neil’s IQ Series thermal transfer and direct thermal label offering includes a wide range of products –thousands of custom labels designed for every application imaginable. We are committed to manufacturing superior labels u
- Features: Other
- Materials of Construction: Paper
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Supplier: CHT USA Inc.
Description: CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In
- Use Temperature: -85 to 446 F
- Thermal Conductivity: 3.3 W/m-K
- Tensile Strength (Break): 263.96704763009853 psi
- Elongation: 11 %
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Supplier: Heilind Electronics, Inc.
Description: THERMAL PAD FOR 1-PHASE S /ADHESIVE
Find Suppliers by Category Top
Featured Products Top
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Introducing our curable phase-change thermal adhesive — a dual-function solution engineered for high-power server CPUs and GPUs. Applied as a manageable pre-form, it melts during assembly to flow into microscopic surface irregularities, displacing trapped air and achieving low thermal (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Battery systems face two simultaneous challenges: moving heat away from cells and electrical joints, and surviving exposure to harsh chemicals that may occur during manufacture, maintenance, or in-field abuse. The Sheen TIV series thermal adhesives solve both problems with a silicone (read more)
Browse Adhesive Tapes Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
TIV800 Series Thermal Conductive Adhesive is built for engineers who need a practical way to manage heat while keeping components firmly in place. Based on a silicone resin system, it combines thermal conductivity, electrical insulation, and strong bonding (read more)
Browse Epoxy Adhesives Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
of robots demand enhanced heat dissipation, protection, and operational stability. Thermal conductive potting adhesives, which combine thermal conductivity, electrical insulation, and structural encapsulation, have become an indispensable thermal management solution in modules such as robotic (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Silicone adhesives are chosen for their ability to remain flexible across a very wide range of temperatures and operating conditions and their resistance to moisture and many chemicals. Being particularly suitable for use in harsh environments, CHT’s silicone adhesives will bond (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for CHT USA Inc. -
This system is top notch for withstanding thermal cycling and shock. Minimal stress is generated when bonding dissimilar substrates. It is white in color, with a service temperature range spanning between -65°F to +400°F. MasterSil 153AO is a great choice for applications involving sensitive optical and electronic components where heat dissipation along with electrical insulation is critical. (read more)
Browse Silicone Adhesives and Sealants Datasheets for Master Bond, Inc. -
Adhesive product page. Thermally Conductive Adhesives The SILCOTHERM® range includes range includes thermally (read more)
Browse Elastomers and Rubber Compounds Datasheets for CHT USA Inc. -
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Visible light curable adhesives feature high bond strength, thermal stability, chemical and water resistance and excellent surface cure. These one component compounds are designed to provide safe and rapid cures upon exposure to LED light at ambient temperatures. Environmentally friendly, these (read more)
Browse UV Curing Adhesives Datasheets for Master Bond, Inc. -
Heat cured 1-part silicone adhesives cure in minutes reducing production time and improving output. Using platinum catalysts, they do not produce any harmful by-products, which make them suitable for a wide range of applications including electronics. 1-part - no need for (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc.
Conduct Research Top
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Tips for Thermal Adhesive Bonding Automation for Lightweight Aviation Applications
Here are a few tips for automating a bonding process for a lightweight aviation application. First, let's go over what a thermal adhesive bond is and what materials it bonds together.
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Thermally Conductive Adhesives Keep Things Cool
Thermally conductive adhesives. and potting compounds are an important. weapon in the war against heat raging within. today's powerful electronic devices.
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Fabrication Method Reference Guide: Standard Thermabond Compliant Thermal Interface Adhesives
Thermabond (R) Adhesives are used to bond two interfaces that require a thermal path between them. Thermabond (R) accomplishes this by using mineral or metallic fillers incorporated into a catalyzed silicone rubber base. Thermabond (R) vulcanizes and bonds to surfaces when heat and pressure
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Industrial Adhesive Solution for Transparent
Transparent adhesives are used in tropical electrical products, relays, small transformers, marine instruments, thermal instruments, precision instruments, carrier communication, protection of electronic components and machine protection, etc.
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Adhesives for Cryogenic Applications
Adhesives capable of functioning reliably at cryogenic temperatures play an essential role across a broad number of applications. Blended with specialized filler materials, epoxy systems are capable of maintaining performance and delivering required physical, thermal, and electrical characteristics
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Tensile Bond Strength Variance of Thermally Sprayed Coatings with Respect to Adhesive Type (.pdf)
A Round Robin study involving 19 coating suppliers and independent laboratories was conducted on tensile testing of thermally sprayed coatings to determine the accuracy and consistency of the tensile data among the participating labs and within a lab. One coating system (NiCrAl) and two adhesives
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Is Epoxy Stronger than Adhesive?
Epoxy is a term that covers a wide range of thermosetting polymer materials used in a wide range of industries today. They are adhesives, coatings, primers, sealants, and encapsulants with superior mechanical, electrical, and thermal properties. Epoxy products are typically two-part systems
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Thermally Conductive Microelectronics Adhesives and Encapsulants Bonding in Microelectronics and Photonics
The electronics world has grown tremendously, and today, we have microelectronics that are changing how we think and look at life. Because of how important they are, there has been a need to develop the highest quality microelectronics adhesives and encapsulants to make it possible to create faster
More Information Top
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
The PLC pigtailing consisted of two main steps: • The integrated optical polymer chip was first fixed on a submount with a thermal adhesive .
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Advanced Materials for Thermal Management of Electronic Packaging
(3) Available as electrically conductive or electrically insulating thermal adhe- sives , thermal greases, thermal gels, and thermal pads.
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Nano-Bio- Electronic, Photonic and MEMS Packaging
An Approach to Measurement and Evaluation of the Thermal Conductivity of the Thermal Adhesives in Electronic Packaging.
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Experimental Investigation on Effect of Adhesives
on Thermoelectric Generator Performance
(I) Arctic SilverÒ thermal adhesive (adhesive A).
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Interfacial thermal resistance and temperature dependence of three adhesives for electronic packaging
COMPOSITION AND DESIGNATION OF THERMAL ADHESIVES TESTED .
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Comparison of the adhesion strength of epoxy and silicone based thermal interface materials
This study primarily focuses on the adhesion performance of thermal adhesives .
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Design and fabrication of evaporators for thermo-adsorptive batteries
3-10 The potential effects of misapplication of thermal adhesive are pre- sented.
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Quad-Core Intel® Xeon® Processor 5300 Series
2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5300 .