Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Henkel Corporation - Industrial
Description: Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE® PE 3164 is a clear epoxy resin hardener which forms a black, fast gelling, low viscosity, room temperature cure potting compound with high thermal
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant LOCTITE® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive Good elongation strength
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 580 psi
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Tensile Strength (Break): 7250 psi
-
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large and complex
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Viscosity: 25000 cP
-
Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
-
Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
-
Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 18.33 to 72.22 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
-
Supplier: CHT USA Inc.
Description: CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 470 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 FT Black, formerly Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal conductivity. It is
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 400 kV/in
- Thermal Conductivity: 1.34 W/m-K
-
Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
-
Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 3056 µin/in-F
- Composition: Unfilled
- Compound Type: Electrically Conductive, Thermally Conductive
-
Supplier: Hernon Manufacturing, Inc.
Description: Dissipator® 319 is a room temperature curing, two component thermal conductive epoxy adhesive for potting applications. Dissipator® 319 offers low viscosity for potting applications, is recommended for encapsulation of components that require heat dissipation and thermal shock
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-6032 is a two component, thermally conductive encapsulant that is used for electronic and electric component applications. It is heat curing, flowable, and self leveling. 10 kg Kit.
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 457 kV/in
- Elongation: 45 %
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity, and low
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 1.2 W/m-K
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND, is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity, and low
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 1.2 W/m-K
-
Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 to 72.22 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
-
Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 8.89 to 37.78 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
-
Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals,
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
-
Supplier: CHT USA Inc.
Description: its low modulus, QSil 553 will minimize cooefficient of thermal expansion (CTE) strain. QSil 553 is thermally conductive to aid in efficient heat dissipation. This silicone elastomer is also flame retardant and is UL Listed in file QMFZ2.E205830.
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 600 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
-
Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 78.89 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
-
Supplier: Epoxies Etc...
Description: 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
-
Supplier: Epoxies Etc...
Description: 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal for
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 16.67 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
-
Supplier: Master Bond, Inc.
Description: Master Bond EP93AOFR is a two component flame retardant epoxy system for bonding, sealing, coating and potting.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 1.39E7 to 1.67E7 µin/in-F
- Composition: Unfilled
- Compound Type: Thermally Conductive
-
Supplier: Epoxies Etc...
Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.72 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
-
Supplier: Henkel Corporation - Electronics
Description: (Known as E&C STYCAST 5952 A/B thermally conductive silicone encapsulant ) LOCTITE STYCAST 5952 RD PTA is a filled, addition cured, silicone encapsulant. It features good thermal conductivity, excellent electrical insulation properties. It was designed for
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
-
Supplier: MacDermid Alpha Electronics Solutions
Description: Flame-retardant, thermally conductive epoxy potting compound designed for easy processing and enhanced thermal conductivity. Product Overview ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part epoxy resin designed to meet the
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
-
Encapsulants and Potting Compounds - Thermally Conductive Silicone Compound -- SEMICOSIL® 970 TC A/BSupplier: Wacker Chemical Corp.
Description: SEMICOSIL® 970 TC A/B is a pasty, but still flowable addition-curing, two component elastomeric silicone that cures at elevated temperature to an thermally conductive silicone rubber. Special features two-component thermal conductivity pasty, still
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
-
Supplier: Chemence Inc.
Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound, Die Bonding Adhesive / Compound
-
Supplier: Techsil Limited
Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
-
Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Dielectric Strength: 254 kV/in
-
Supplier: Sauereisen, Inc.
Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal Potting Cement No.
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 3.4 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
-
Supplier: Techsil Limited
Description: operating temperatures. In addition, this grade also offers superior thermal conductivity properties when compared to other conventional silicone encapsulants. Product Benefits Convenient 1:1 mixing ratio Solvent free Low shrinkage Reversion resistant and
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Rubber Based / Elastomeric: Yes
-
Supplier: Bluestar Silicones USA Corp.
Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which is
- Chemical / Polymer System Type: Silicone
- Compound Type: Liquid
- Dielectric Constant: 3.2
- Dielectric Strength: 457 kV/in
Find Suppliers by Category Top
Featured Products Top
-
flame retardant non-halogenated system is thermally conductive, 9 (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
. For more information, view our Thermally Conductive Adhesives page. Encapsulation and potting compounds Using a thermally conductive encapsulant has become (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for CHT USA Inc. -
Thermally Conductive Adhesives page. Encapsulation and potting compounds Using a thermally conductive encapsulant has become a very attractive option when trying to remove heat from (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
QSil-553 2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to (read more)
Browse Conductive Compounds Datasheets for CHT USA Inc. -
. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants & adhesives. Applications Automotive vehicle lighting Signage and displays for sports and advertising Back lighting for LCD (read more)
Browse Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Industrial Adhesives Datasheets for CHT USA Inc. -
. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants & adhesives. Applications Automotive vehicle lighting Signage and displays for sports and advertising Back lighting for LCD (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc.
Conduct Research Top
-
Thermally Conductive Microelectronics Adhesives and Encapsulants Bonding in Microelectronics and Photonics
The electronics world has grown tremendously, and today, we have microelectronics that are changing how we think and look at life. Because of how important they are, there has been a need to develop the highest quality microelectronics adhesives and encapsulants to make it possible to create faster
More Information Top
Indicates content that may require registration and/or purchase.
-
Liquid Crystalline Polymers
The capability of phase transformation of LCER at elevated temperature is used by Hitachi Company as heat sink or thermal conducting encapsulants in the electronic industry (Tanaka et al. 2007).
-
Small Area Array-Based LED Luminaire Design
investigate alternative paths for heat removal such as the use of transparent thermal conducting encapsulants around the chip. o .
-
Hygrothermal Failures From Small Defects in Lead-Free Solder Reflowed Electronic Packages
Portable and mobile electronics which have low profiles and are made of high thermal conductive encapsulants are at higher risk when switched to lead-free solder reflow.
-
Hygrothermal Failures From Small Defects in Lead-Free Solder Reflowed Electronic Packages
Portable and mobile electronics which have low profiles and are made of high thermal conductive encapsulants are at higher risk when switched to lead-free solder reflow.
-
A study on improvement of thermal conductivity of underfill materials for electronic packaging
Koh, Wei, High thermal conductance liquid encapsulants for direct chip attach, Technology Information (Dexter), May 1996.
-
Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging
[13] W. H. Koh, “High thermal conductance liquid encapsulants for direct chip attach,” in Proc. 46th IEEE Electron. Comp. Technol. Conf., 1996, pp. 343–346.
-
Enhanced Thermal Conductivity of Polymer Matrix Composite via High Solids Loading of Aluminum Nitride in Epoxy Resin
7 W. H. Koh, ‘‘High Thermal Conductance Liquid Encapsulants for Direct Chip Attach,’’ Electron Components Technol. Conf., 343–6 (1996).
-
Rheology and Thermal Conductivity of Diamond Powder-Filled Liquid Epoxy Encapsulants for Electronic Packaging
[9] W. H. Koh, “High thermal conductance liquid encapsulants for direct chip attach,” in Proc. 46th Electron.
-
An improvement of thermal conductivity of underfill materials for flip-chip packages
[3] W. Koh, “High thermal conductance liquid encapsulants for direct chip attach,” in Technology Information.
-
Thermal conductivity behavior of SiC–Nylon 6,6 and hBN–Nylon 6,6 composites
Therefore, incorpora- tion of high-thermal-conductivity fillers in polymers to develop high-performance thermally conducting encapsulants or thermal interface materials has been widely investigated [5–7].