Thermal Conductive Encapsulants

Description: Dow DOWSIL™ TC-6032 is a two component, thermally conductive encapsulant that is used for electronic and electric component applications. It is heat curing, flowable, and self leveling. 10 kg Kit.

• Thermal Conductivity: 3.2 W/m-K
• Elongation: 45 %
• Tensile Strength (Break): 72.5184196785985 psi
• Dielectric Strength: 457.20000000000095 kV/in

Description: Henkel Loctite STYCAST 2851MT Blue, formerly Emerson and Cuming, is a one component, heat cured, thermally conductive, epoxy encapsulant. It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial chemicals and solvents. 1 gal

• Thermal Conductivity: 1.9 W/m-K
• Tensile Strength (Break): 7,000 psi
• Viscosity: 115,000 to 165,000 cP
• Features: Encapsulant / Potting Compound

Description: Henkel Loctite STYCAST 2851FT Black, formerly Emerson and Cuming, is a one component, heat cured, thermally conductive, epoxy encapsulant. It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial chemicals and solvents. 1

• Thermal Conductivity: 1.36 W/m-K
• Tensile Strength (Break): 6,526.657771073865 to 7,977.026164645835 psi
• Viscosity: 3,000 to 10,000 cP
• Features: Encapsulant / Potting Compound

Description: Henkel Loctite STYCAST 2851FT Black, formerly Emerson and Cuming, is a one component, heat cured, thermally conductive, epoxy encapsulant. It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial chemicals and solvents. 1 qt

• Thermal Conductivity: 1.36 W/m-K
• Tensile Strength (Break): 6,526.657771073865 to 7,977.026164645835 psi
• Viscosity: 3,000 to 10,000 cP
• Features: Encapsulant / Potting Compound

Description: CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low

• Use Temperature: -94 to 482 F
• Thermal Conductivity: 1.17 W/m-K
• Elongation: 30 %
• Tensile Strength (Break): 117.47983987932957 psi

Description: LOCTITE STYCAST 2850FT IS A BLACK, THERMALLY CONDUCTIVE EPOXY ENCAPSULANT, 1GAL CAN

Description: (Known as E&C STYCAST 5952 A/B thermally conductive silicone encapsulant ) LOCTITE STYCAST 5952 RD PTA is a filled, addition cured, silicone encapsulant. It features good thermal conductivity, excellent electrical insulation properties. It was designed for encapsulating

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: low modulus, QSil 553 will minimize cooefficient of thermal expansion (CTE) strain. QSil 553 is thermally conductive to aid in efficient heat dissipation. This silicone elastomer is also flame retardant and is UL Listed in file QMFZ2.E205830.

• Use Temperature: -67 to 464 F
• Thermal Conductivity: 0.68 W/m-K
• Elongation: 240 %
• Tensile Strength (Break): 249.46336369437884 psi

Description: Master Bond EP93AOFR is a two component flame retardant epoxy system for bonding, sealing, coating and potting.

• Viscosity: 30,000 to 150,000 cP
• Use Temperature: -80 to 300 F
• Thermal Conductivity: 1.3 to 1.44 W/m-K
• Coeff. of Thermal Expansion (CTE): 13,888,888.888888888 to 16,666,666.666666666 µin/in-F

Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are

• Thermal Conductivity: 1.31247389 W/m-K
• Coeff. of Thermal Expansion (CTE): 15.222222222222221 µin/in-F
• Dielectric Strength: 369.99999999999903 kV/in
• Dielectric Constant (Relative Permittivity): 5.41

Description: Flame-retardant, thermally conductive epoxy potting compound designed for easy processing and enhanced thermal conductivity. Product Overview ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part epoxy resin designed to meet the increasing

• Type: Electrically Conductive, Thermal Compound / Thermally Conductive
• Features: Electronics, Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated)
• Chemical System: Epoxy (EP)
• Industry: Semiconductors / IC Packaging

Description: 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure.

• Viscosity: 15,000 cP
• Use Temperature: -94 to 302 F
• Thermal Conductivity: 1.7307348 W/m-K
• Dielectric Strength: 480.0000000000012 kV/in

Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile

• Viscosity: 6,000 to 12,000 cP
• Use Temperature: 662 F
• Thermal Conductivity: 0.7 W/m-K
• Coeff. of Thermal Expansion (CTE): 18.333333333333332 to 72.22222222222221 µin/in-F

Description: 50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.

• Viscosity: 32,000 cP
• Use Temperature: -85 to 410 F
• Thermal Conductivity: 1.7307348 W/m-K
• Tensile Strength (Break): 850 psi

Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper

• Use Temperature: 392 F
• Thermal Conductivity: 2.3076464 W/m-K
• Features: Air Setting / Film Drying, Encapsulating / Potting, Grease / Paste, Thermal / Heat Conductive
• Type: Electrical Insulation / Dielectric

Description: This thermally conductive polyurethane encapsulation and potting compound is a two-part system with a black finish. Product Overview UR5097 Thermally Conductive Polyurethane Potting Compound exhibits excellent thermal conductivity, making it ideal for applications where heat

• Type: Electrically Conductive
• Features: Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Thermal Compound / Heat Conductive
• Chemical System: Polyurethane (PU, PUR)
• Industry: Semiconductors / IC Packaging

Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics,

• Use Temperature: 392 F
• Thermal Conductivity: 2.3076464 W/m-K
• Features: Air Setting / Film Drying, Ceramic / Glass, Encapsulating / Potting, Grease / Paste, Metal, Paper / Paperboard, Plastic, Thermal / Heat Conductive
• Type: Electrical Insulation / Dielectric

Description: Toughened, two part epoxy Supreme 11ANHT withstands thermal cycling and is both thermally conductive and electrically insulative.

• Applied Thickness / Gap Fill: 0.002 to 0.004 inch
• Use Temperature: -112 to 400 F
• Thermal Conductivity: 2.88 to 3.1 W/m-K
• Coeff. of Thermal Expansion (CTE): 16.666666666666668 to 19.444444444444443 µin/in-F

Description: SEMICOSIL® 970 TC A/B is a pasty, but still flowable addition-curing, two component elastomeric silicone that cures at elevated temperature to an thermally conductive silicone rubber. Special features two-component thermal conductivity pasty, still flowable almost constant properties

• Viscosity: 25,000 to 120,000 cP
• Thermal Conductivity: 0.8 W/m-K
• Tensile Strength (Break): 580.147357428788 psi
• Elongation: 90 %

Description: LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant LOCTITE® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat dissipation

• Viscosity: 225,000 cP
• Chemical System: Epoxy (EP)
• Type: Thermal Compound / Thermally Conductive
• Cure / Technology: Two Component System

Description: LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.

• Use Temperature: -76 to 356 F
• Thermal Conductivity: 0.55 W/m-K
• Dielectric Strength: 254.00000000000054 kV/in
• Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial

Description: Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9

• Viscosity: 35,000 to 50,000 cP
• Use Temperature: -65 to 221 F
• Thermal Conductivity: 1.1538 to 1.2981 W/m-K
• Coeff. of Thermal Expansion (CTE): 61.11 to 77.77999999999999 µin/in-F

Description: properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as good physical strength properties. EP30AO is low viscosity with excellent flow characteristics making it ideal as a thermally conductive

• Viscosity: 50,000 to 70,000 cP
• Use Temperature: -60 to 250 F
• Thermal Conductivity: 1.441 W/m-K
• Coeff. of Thermal Expansion (CTE): 22 µin/in-F

Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include

• Viscosity: 8,000 to 10,000 cP
• Use Temperature: -55 to 200 F
• Thermal Conductivity: 1.3 W/m-K
• Coeff. of Thermal Expansion (CTE): 111.11111111111111 µin/in-F

Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock insulation and

• Industry: Electronics (PCB / SMT Assembly)
• Chemical System: Epoxy (EP)

Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure

• Viscosity: 150,000 cP
• Form / Function: Die Bonding Adhesive / Compound
• Features: Electronics, Grease / Paste, Plastic
• Chemical System: Silicone

Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when mixed

• Viscosity: 11,000 to 14,000 cP
• Form / Function: Die Bonding Adhesive / Compound
• Features: Electronics, Gap Filling Sealant / FIP Gasket, Grease / Paste, Metal, Plastic
• Chemical System: Silicone

Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature

• Viscosity: 400 cP
• Thermal Conductivity: 0.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 3,055.5555555555557 µin/in-F
• Dielectric Strength: 635.0000000000014 kV/in

Description: LOCTITE STYCAST 2850KT CAT 24LV EPOXY ENCAPSULANT THERMAL EPOXY, 2 PART (ORDER CATALYST SEPARATELY) 3 LB CONTAINER

Description: CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This

• Use Temperature: -67 to 399.2 F
• Thermal Conductivity: 0.88 W/m-K
• Elongation: 55 %
• Tensile Strength (Break): 118.93020827290154 psi

Description: BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to

• Use Temperature: -76 to 392 F
• Features: Gap Filling Compound, Pad, Thermal / Heat Conductive
• Industry: OEM / Industrial
• Chemical System: Silicone

Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which is

• Thermal Conductivity: 0.42 W/m-K
• Tensile Strength (Break): 333.584730521553 psi
• Elongation: 170 %
• Dielectric Strength: 457.20000000000095 kV/in

Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal Potting Cement No.

• Use Temperature: 2,200 F
• Thermal Conductivity: 0.70671671 W/m-K
• Coeff. of Thermal Expansion (CTE): 3.4 µin/in-F
• Tensile Strength (Break): 100 psi

Description: (Known as Hysol FP5001 ) LOCTITE ECCOBOND FP5001 is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent protection of integrated circuit electrical joints and provides resistance to

• Viscosity: 25,000 to 75,000 cP
• Features: Electronics, Encapsulant / Potting Compound
• Type: Thermal Compound / Thermally Conductive