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  • Cut Your Outsourcing Risks
    In each of these areas, special tolling-related considerations are addressed. These include the process for locating and evaluating toll processing partners; the crucial importance of the technology transfer package and techniques for ensuring the comprehensive preparation of these critical
  • Taking the Heat - and Leads - Out of Higher Power Designs
    The new surface mounted TO-Leadless (TOLL). packaging for MOSFETs reduces production costs and footprint. This leads to a MOSFET technology that enables designers, for the first time, to use an SMD package in hard-switching topologies such as PFC up to 3 kW.

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