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  • Taking the Heat - and Leads - Out of Higher Power Designs
    The new surface mounted TO-Leadless (TOLL). packaging for MOSFETs reduces production costs and footprint. This leads to a MOSFET technology that enables designers, for the first time, to use an SMD package in hard-switching topologies such as PFC up to 3 kW.
  • Cut Your Outsourcing Risks
    In each of these areas, special tolling-related considerations are addressed. These include the process for locating and evaluating toll processing partners; the crucial importance of the technology transfer package and techniques for ensuring the comprehensive preparation of these critical
  • Cut Your Outsourcing Risks
    to toll processing relationships. CCPS issued the guidelines because recent incidents have shown the exchange of process technology and product safety information can be a major factor in contract manufacturing success. They are designed to improve the quality of tollers' production and packaging
  • The Global Supply-Chain: Or, Which Shell is the Pea Under?
    produced/expiry date seen on current OTC packages. It would be computer-generated, coded almost randomly, and need to be quite large, since each box of, say, 48 bottles would required 48 unique coded labels, preferably not in any easily seen series. Multiply this by the number of containers, size

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