UV Curable Epoxy

Description: Epoxy adhesive formulated with 100% solids, has no odor, and no solvents

• Coeff. of Thermal Expansion (CTE): 41.67 µin/in-F
• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Dielectric Strength: 400 kV/in
• Industry: Electronics, OEM / Industrial

Description: ELC-2728 is a semi-rigid tough material for tacking, wire bonding and gap filling.

• Coeff. of Thermal Expansion (CTE): 37.78 µin/in-F
• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Dielectric Strength: 400 kV/in
• Industry: Electronics, OEM / Industrial

Description: UV Cure 60-7158 is a UV Curable Epoxy Adhesive formulated to bond rigid substrates. This adhesive bonds extremely well to aluminum while also providing good water and chemical resistance. UV Cure 60-7158 is a semi-rigid adhesive and it is well suited for bonding

• Cure Type / Technology: Single Component System, UV / Radiation Cured (also EB, Light)
• Dielectric Strength: 425 kV/in
• Features: Encapsulating / Potting
• Industry: OEM / Industrial

Description: Panacol Vitralit® UC 1619 is a uv-curable compound designed for opto-electronic components like LED and VCSEL. This product features excellent transmission (650-1300nm) along with ionic pureness, non-yellowing and extremely good thermal shock resistance when operating between -55°C and

• Chemical / Polymer System Type: Epoxy (EP)

Description: UV Cure 7155TM and 7156TM are low intensity UV Curable Resins. These products are water clear and cure to a smooth, bubble free finish. Low cost, low intensity lights are all that is needed to cure these unique polymer systems. UV Cure 7155TM and 7156TM also have superior

• Chemical / Polymer System Type: Epoxy
• Compound Type: Liquid
• Dielectric Constant: 3.16
• Electrical Resistivity: 1.62E9 ohm-cm

Description: Low intensity UV Curable Resins. These products are water clear and cure to a smooth, bubble free finish. Low cost, low intensity lights are all that is needed to cure these unique polymer systems.

• Chemistry: Epoxy, Resin Base / Polymer Binder
• Features: Protective, Weather / UV Resistant
• Form: Liquid
• Industry: Other

Description: ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations.

• Coeff. of Thermal Expansion (CTE): 31.11 µin/in-F
• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Dielectric Strength: 450 kV/in
• Features: Encapsulating / Potting

Description: Our UV curable resins are materials that are polymerized and cured in a short time by the energy radiated from ultraviolet irradiation devices. We offer our UV curing adhesives in many variations to meet almost any industrial need. Curing is completed in several seconds through

• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Substrate / Material Compatibility: Rubber / Elastomer
• Viscosity: 270000 cP

Description: Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles.

• Coeff. of Thermal Expansion (CTE): Over 33 µin/in-F
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
• Dielectric Constant (Relative Permittivity): 3.76
• Dissimilar Substrates: Yes

Description: Master Bond Polymer System UV22 represents a remarkable technological breakthrough in the utilization of nanotechnology in the formulation of a one component UV curable epoxy for coating, sealing, and encapsulation applications. This nano silica filled system features

• Coeff. of Thermal Expansion (CTE): 19 to 22 µin/in-F
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
• Dielectric Constant (Relative Permittivity): 3.94
• Dissimilar Substrates: Yes

Description: UV Cure 60-7155 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7155 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant.

• Cure Type / Technology: Single Component System, UV / Radiation Cured (also EB, Light)
• Features: Encapsulating / Potting
• Industry: Electronics, OEM / Industrial
• Tensile Strength (Break): 6200 psi

Description: Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles.

• Coeff. of Thermal Expansion (CTE): 33 to 39 µin/in-F
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
• Dielectric Constant (Relative Permittivity): 3.76
• Dissimilar Substrates: Yes

Description: Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles.

• Chemistry: Epoxy, Resin Base / Polymer Binder
• Features: Protective
• Form: Liquid
• Operating / Use Temperature: -60 to 300 F

Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our

• Coeff. of Thermal Expansion (CTE): 30.56 to 97.22 µin/in-F
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Index of Refraction: 1.57
• Industry: Aerospace, Medical / Food (Sanitary / FDA), Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging

Description: EPO-TEK® UV Epoxies are your alternative to traditional oven cured optical products. They are fast curing and photo curable. These UV cure adhesives simplify the handling process by using a single component system. Our adhesives require no mixing, cure in seconds or

• Coeff. of Thermal Expansion (CTE): 22.78 to 94.44 µin/in-F
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
• Features: Encapsulating / Potting
• Index of Refraction: 1.57 to 1.58

Description: COATING/SEALER, EPOXY, UV CURABLE, CONFORMAL

Description: ThreeBond 3114 is an epoxy resin based solvent- free ultraviolet-curing resin. Since the resin cures through optical cationic polymerization it is not inhibited from curing by oxygen, and it excels in surface curability. TB3114 cures to a free, fast setting anaerobic reactive pipe

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)

Description: LOCTITE ECCOBOND UV 4003, Epoxy, Opto/Photonics, UV Cure Adhesive LOCTITE® ECCOBOND UV 4003 UV cure adhesive is designed for high throughput assembly operations. One component UV curable

• Viscosity: 1250 cP

Description: UV-curable cationic epoxy adhesive. Designed for use in sealing glass lid of packages of area image sensors such as CCD and CMOS.

• Industry: Electronics
• Viscosity: 27000 cP

Description: COATING/SEALER, EPOXY, UV CURABLE, CONFORMAL, RED ***TO BE USED WITH FORD WSS-M99P1111-A***

Description: COATING/SEALER, EPOXY, UV CURABLE, CONFORMAL, HIGHER VISCOSITY ***TO BE USED WITH FORD WSS-M99P1111-A***

Description: Dymax 9803 low shrinkage optical epoxy adhesive offers superior adhesion for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. The adhesive has the unique flexibility to cure in seconds with LED and/or UV/Visible

• Dissimilar Substrates: Yes
• Industry: Other
• Substrate / Material Compatibility: Ceramic / Glass, Metal, Other
• Viscosity: 80000 cP

Description: Dymax 846-GEL structural adhesive utilizes activators to form excellent high-strength bonds to a variety of metal surfaces, glass, ceramics, filled nylon, thermoset plastics, and epoxy boards. The product is ideal for applications where dissimilar substrates are to be joined and maximum

• Industry: Other
• Substrate / Material Compatibility: Ceramic / Glass, Other
• Viscosity: 29000 cP

Description: Dymax 9008 is engineered for chip encapsulation on flex circuits cures upon exposure to UV/Visible light and is designed for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications. Dymax 9008 encapsulant forms flexible, highly moisture-resistant bonds to

• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Form / Function: Encapsulant / Potting Compound
• Industry Applications: Other
• Viscosity: 4500 cP

Description: Dymax 9906-AA is a heat and/or LED light-curable epoxy adhesive designed specifically for use in Asia. This active alignment adhesive meets NASA ASTM E595 low-outgassing specifications making it ideal for critical optical components, camera modules, LiDAR (Light Detection and Ranging,

• Dissimilar Substrates: Yes
• Industry: Other
• Substrate / Material Compatibility: Ceramic / Glass, Metal, Other
• Viscosity: 86000 cP

Description: LOCTITE ABLESTIK NCA 2380, Acrylated Epoxy, Assembly, Dual Cure Adhesive LOCTITE® ABLESTIK NCA 2380 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. This product is formulated to temporarily cure when exposed to UV light, followed

• Coeff. of Thermal Expansion (CTE): 31.11 µin/in-F
• Viscosity: 35000 cP

Description: LOCTITE ABLESTIK NCA 2340, Acrylated Epoxy, Assembly, Dual Cure Adhesive LOCTITE® ABLESTIK NCA 2340 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. This product is formulated to temporarily cure when exposed to UV light, followed

• Coeff. of Thermal Expansion (CTE): 33.89 µin/in-F
• Viscosity: 35000 cP

Description: functional trialkoxy silane ?c of treated surfaces: 31 mN/m pKb 25H2O: 5.18 Used in microparticle surface modification Coupling agent for UV cure and epoxy systems Orients liquid crystals Reacts with urethane prepolymers to form moisture-curable resins

• Flash Point: 180 F
• Ionic Component: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)
• Purity: 97 %

Description: Additional Properties Hydrolytic Sensitivity 7: reacts slowly with moisture/water Application Forms UV-curable coating resins by controlled hydrolysis.1 Used to make epoxy-organosilica particles w/ high positive Zeta potential.2

• Flash Point: 295 F
• Ionic Component: Metalloids (B, Si, Ge, etc.), Non-Metals (C, N, O, P, S)
• Purity: 97 %

Description: DYMAX Ultra Light-Weld GA-201 Gasketing Resin is a UV/Visibile light-curable, tack-free, moisture and chemical-resistant FIP/CIP gasket for sealing heat sensitive substrates such as plastic, glass, and metal enclosures. This product is used as an alternative to tapes, PSA die-cut

• Cure Type / Technology: Single Component System
• Elongation: 330 %
• Substrate / Material Compatibility: Metal, Plastic
• Tensile Strength (Break): 135 psi

Description: DYMAX Ultra Light-Weld GA-201 Gasketing Resin is a UV/Visibile light-curable, tack-free, moisture and chemical-resistant FIP/CIP gasket for sealing heat sensitive substrates such as plastic, glass, and metal enclosures. This product is used as an alternative to tapes, PSA die-cut

• Cure Type / Technology: Single Component System
• Elongation: 165 %
• Substrate / Material Compatibility: Metal, Plastic
• Tensile Strength (Break): 135 psi

Description: . Not affected by UV light. Resistant to PCB cleaning solvents. Medium strength cure allows component removal for rework. Hardness (shore) 85. Dielectric constant 3.5 @ 1 kHz Type = Thermal Conductive Adhesive Product Material = Epoxy Package Type = Syringe Package Size = 10 ml

• Compound Type: Thermally Conductive
• Material Form: Specialty / Other
• Thermal Conductivity: 0.2500 to 0.3000 W/m-K
• Use Temperature: -40 to 266 F

Description: A heat curable, one part thixotropic paste adhesive for holding components in place during soldering operations on surface mount assemblies. High â??green strengthâ??, or stickiness, ensures components do not move during handling, before curing has taken place

• Industry: Semiconductors / IC Packaging
• Use Temperature: 284 F

Description: raw component. Or the factory should use a UV-curable mask to move the circuit from the glass PCB. These masks may be used with smaller track widths that are UV-curable. This strategy is used Even in large-scale glass PCB material manufacturing. When exposed to UV- radiation

• Materials of Construction: Specialty / Other
• Thickness: 0.0197 to 0.1575 inches