UV Cure Encapsulants

Description: DYMAX Ultra Light-Weld 9008 UV Curable Encapsulant is used for sealing and encapsulating electronic devices such as chip-on-flex or chip-on-board applications. It is flexible, solvent free, and moisture resistant. 170 mL Cartridge.

• Viscosity: 4,500 cP
• Tensile Strength (Break): 900 psi
• Elongation: 300 %
• Features: Encapsulating / Potting Compound, Metal

Description: DYMAX 9102 Light/Moisture Cure Encapsulant Clear is a one component, UV light and moisture curing, acrylated urethane that is used for wire bonding and as a chip-encapsulant. It is flexible, tack free, moisture and thermal resistant. 30 mL MR Syringe.

• Viscosity: 17,000 cP
• Tensile Strength (Break): 703 psi
• Elongation: 34 %
• Features: Encapsulating / Potting

Description: DYMAX 9001-E-V3 Series Encapsulant Clear is a one component, UV light and heat curing, acrylated urethane that is used for bonding electronic devices, print circuit boards, glass, multi-chip modules, chip-on-flex, and chip-on-board applications. It offers flexibility, good electrical

• Viscosity: 10,000 to 24,000 cP
• Tensile Strength (Break): 750 psi
• Elongation: 150 %
• Dielectric Strength: 12,700.000000000027 kV/in

Description: DYMAX Ultra Light-Weld 9008 UV Curable Encapsulant is used for sealing and encapsulating electronic devices such as chip-on-flex or chip-on-board applications. It is flexible, solvent free, and moisture resistant. 10 mL MR Syringe.

• Viscosity: 4,500 cP
• Tensile Strength (Break): 900 psi
• Elongation: 300 %
• Features: Encapsulating / Potting Compound, Metal

Description: LOCTITE ECCOBOND UV 9061F, Acrylate, Assembly LOCTITE® ECCOBOND UV 9061F no flow, UV/moisture cure encapsulant is designed for local circuit board protection. This product is fluorescent when viewed with ultraviolet (black) light. Fast cure Cures in

• Coeff. of Thermal Expansion (CTE): 43.333333333333336 µin/in-F
• Cure / Technology: UV / Radiation Cured (also EB, Light)

Description: UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE).

• Viscosity: 70,000 to 90,000 cP
• Coeff. of Thermal Expansion (CTE): 19.444444444444443 µin/in-F
• Dielectric Strength: 449.9999999999993 kV/in
• Dielectric Constant (Relative Permittivity): 3.5

Description: UV Cure 60-7157 is a good choice for potting and encapsulating applications due to its ability to deep section cure up to ¾ inch. Another unique and important feature is its ability to "dark cure." Once exposed to UV light the UV Cure 60-7157 will

• Viscosity: 600 cP
• Use Temperature: -58 to 392 F
• Tensile Strength (Break): 6,200 psi
• Dielectric Strength: 425.0000000000001 kV/in

Description: UV Cure 60-7156 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7156 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. It's

• Viscosity: 600 cP
• Use Temperature: -58 to 311 F
• Tensile Strength (Break): 6,200 psi
• Features: Ceramic / Glass, Encapsulanting / Potting, Metal, Plastic

Description: UV Cure 60-7112 is a non-yellowing UV Curable urethane system. It is designed to provide low stress on electronic components and outstanding adhesion to a variety of substances. UV Cure 60-7112 also has high impact strength and flexibility. This material is a good

• Viscosity: 7,000 cP
• Use Temperature: -58 to 311 F
• Elongation: 230 %
• Dielectric Strength: 449.9999999999993 kV/in

Description: A low-viscosity, single-part conformal coating that cures within seconds of exposure to the correct dose of UV light. Product Overview UVCL UV cure conformal coating is a single-part solution that cures in seconds when exposed to the correct dose of UV

• Form / Function: Conformal / Encapsulating Coating
• Industry: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
• Cure / Technology: Reactive / Moisture Cured, Single Component System, UV / Radiation Cured (also EB, Light)

Description: For gasket and sealing applications. The product has high resilience. This product is usually used from -53°C to 250°C.

• Cure / Technology: Reactive / Moisture Cured, UV / Radiation Cured (EB, Light)

Description: pot-life. UV hybrid is a UV tacking post-thermal cure required adhesive solution. Our EPO-TEK® UV Hybrids are a cutting edge technology that allows for tacking, alignment, positioning, or flow control to occur in seconds of UV illumination. Parts can be batched and

• Viscosity: 20,000 to 30,000 cP
• Use Temperature: 572 F
• Coeff. of Thermal Expansion (CTE): 22.77777777777778 to 94.44444444444444 µin/in-F
• Index of Refraction: 1.5665 to 1.5842

Description: (Known as Electrodag PF-021 UV Curable Encapsulant ) LOCTITE EDAG PF-021 E&C is a dot dispensable, UV curable encapsulating photopolymer designed to secure low profile surface mount devices to rigid or flexible substrates.

• Industry: Electronics
• Cure / Technology: UV / Radiation Cured (EB, Light)

Description: CHT's QGEl 311UV is a 2-part, platinum cure, special purpose silicone gel. It is designed with convenient 1:1 mix ratio, and low viscosity for easy dispensing. QGel 311UV is soft, but resilient and is amoderately cross-linked silicone polymer. QGel 311UV is clear but contains a UV

• Use Temperature: -67 to 399.2 F
• Dielectric Strength: 500.00000000000006 kV/in
• Index of Refraction: 1.4
• Viscosity: 1,000 cP

Description: One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength.

• Applied Thickness / Gap Fill: 0.000001 to 0.000003 inch
• Viscosity: 8,000 to 12,000 cP
• Use Temperature: -60 to 350 F
• Coeff. of Thermal Expansion (CTE): 16,666,666.666666666 to 19,444,444.444444444 µin/in-F

Description: Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling.

• Applied Thickness / Gap Fill: 0.001 to 0.003 inch
• Viscosity: 25,000 to 50,000 cP
• Use Temperature: -80 to 300 F
• Tensile Strength (Break): 100 to 200 psi

Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market requires

• Viscosity: 20,000 to 30,000 cP
• Use Temperature: 662 F
• Coeff. of Thermal Expansion (CTE): 32.77777777777778 to 82.77777777777777 µin/in-F
• Index of Refraction: 1.57

Description: LOCTITE ECCOBOND UV 9060F, Acrylate, Assembly LOCTITE® ECCOBOND UV 9060F no flow, UV/moisture cure encapsulant is designed for local circuit board protection. This product is fluorescent when viewed with ultraviolet (black) light. Fast cure Cures in

• Coeff. of Thermal Expansion (CTE): 45.27777777777778 µin/in-F
• Features: UV / Radiation Cured (EB, Light)

Description: LOCTITE UV8800M is a UV cure encapsulant for smart card and other COB applications.

• Coeff. of Thermal Expansion (CTE): 22.77777777777778 µin/in-F
• Viscosity: 2,500 to 4,000 cP
• Industry: Electronics (PCB / SMT Assembly)
• Form / Function: Gap Filling Compound

Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and bond

• Viscosity: 1,500 cP
• Use Temperature: -55 to 125 F
• Dielectric Constant (Relative Permittivity): 4.41 to 4.63
• Features: Ceramic / Glass, Electrical Insulation / Dielectric Material, Electrical Power / HV, Electronics, Encapsulanting / Potting, Filled / Reinforced, Flexible / Dampening, Liquid, Metal, Paper / Paperboard, Plastic, UV / Radiation Cured (EB, Light)

Description: Krylex KU3104 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas

• Applied Thickness / Gap Fill: 0.15 inch
• Viscosity: 180 to 220 cP
• Features: Anaerobic, Cyanoacrylate, Electronics, Encapsulating / Potting, Liquid, Medical / Food (Sanitary / FDA), Other, Plastic
• Form / Function: Die Bonding Adhesive / Compound

Description: deepest cures. Dual-cure 9483-Z is in full compliance with RoHS2 Directives 2015/863/EU. Features Cures with UV/Visible light Dual-cure - secondary moisture cure for shadow areas Fluoresces blue under black lights Excellent thermal shock resistance High

• Coeff. of Thermal Expansion (CTE): 43,333,333.333333336 to 9,444,444.444444444 µin/in-F
• Elongation: 19 %
• Tensile Strength (Break): 1,500 psi
• Viscosity: 750 cP

Description: exceptionally effective latent UV curing agent system. The fast curing mechanism is triggered by any convenient source of UV light such as a 200 watt per inch medium pressure mercury vapor lamp. With commercial UV lamps, cures have been effected in very short time

• Viscosity: 300 to 400 cP
• Use Temperature: -60 to 250 F
• Thermal Conductivity: 0.029 W/m-K
• Coeff. of Thermal Expansion (CTE): 33 µin/in-F

Description: (Known as HYSOL UV9060 ) LOCTITE ECCOBOND UV 9060 is a no-flow UV/moisture cure encapsulant designed for local circuit board protection. It is fluorescent when viewed with ultraviolet (black) light.

• Form / Function: Conformal / Encapsulating Coating
• Industry: Electronics (PCB / SMT Assembly)

Description: higher intensities for faster cures. Shrinkage upon cure is 2-3%, significantly lower than that exhibited by free radical types of UV curable compositions. UV15 can be used over the exceptionally wide temperature range of -60°F to 300°F. UV15 will cure in thicknesses up

• Viscosity: 120 to 150 cP
• Use Temperature: -60 to 300 F
• Thermal Conductivity: 0.029 W/m-K
• Coeff. of Thermal Expansion (CTE): 33 to 39 µin/in-F

Description: LOCTITE ECCOBOND DP 1002UV one component material is designed for use as a wire and tab bond lead encapsulant, damming or edgebond material. It can be applied by using non-contact dispensing methods. This adhesive cures in seconds when exposed to the appropriate intensity of UV

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: CE Marked - Available Globally Dymax BlueWave® 200 version 3.1 is a high-intensity, light-curing spot-lamp system. This unit emits energy in the UVA and visible portion of the spectrum (300-450 nm) for light curing of adhesives, coatings, and encapsulants. Ideally suited for either manual or

• Type: Spot / Wand

Description: SEMICOSIL® 936 UV is an RTV-1 amine cure system that cures on contact with moisture in the air and/or through exposure to high energy ultraviolet light. Special features Rapid UV acceleration Shadow cure solvent free Application SEMICOSIL® 936 UV is intended

• Viscosity: 8,000 cP
• Dielectric Strength: 398.7800000000008 kV/in
• Dielectric Constant (Relative Permittivity): 2
• Form / Function: Conformal / Encapsulating Coating

Description: ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electronic casting and encapsulating applications that require a

• Viscosity: 625 cP
• Use Temperature: -85 to 347 F
• Dielectric Constant (Relative Permittivity): 4.3
• Water Absorption: 1.5 %

Description: many wire bonding applications. 9037-F cures under broad-spectrum UV/Visible light, but also includes secondary heat cure to address applications where shadow areas are present. The encapsulant has great flexibility and provides high moisture as well as thermal

• Viscosity: 55,000 cP
• Features: Encapsulant / Potting Compound
• Cure / Technology: UV / Radiation Cured (also EB, Light)

Description: For gasket and sealing applications. The product has high resilience. This product is usually used from -53°C to 250°C.

• Form / Function: Conformal / Encapsulating Coating
• Cure / Technology: Reactive / Moisture Cured, UV / Radiation Cured (also EB, Light)
• Chemical System: Silicone

Description: Dual-Cure 9101 light/moisture-cure encapsulant is an improved, resilient, chip-encapsulating material designed with a UV/Visible light and secondary ambient moisture-cure system, making it ideal for encapsulation applications where shadowed areas are present. 9101

• Viscosity: 7,000 cP
• Features: Encapsulant / Potting Compound
• Cure / Technology: UV / Radiation Cured (also EB, Light)

Description: It is a single-component, VOC-free conformal coating. This product is specially designed to quickly gel and cure under ultraviolet light, even if exposed to moisture in the air in the shadow area, it can be cured to ensure the best performance. The thin layer of coating can solidify to a

• Chemical System: Acrylic / Polyacrylate
• Form / Function: Conformal / Encapsulating Coating
• Cure / Technology: Reactive / Moisture Cured, UV / Radiation Cured (also EB, Light)

Description: ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations.

• Viscosity: 500 cP
• Use Temperature: -40 to 350 F
• Coeff. of Thermal Expansion (CTE): 31.11111111111111 µin/in-F
• Dielectric Strength: 449.9999999999993 kV/in

Description: One-component UV cure system designed for fast curing and bonding in various applications, including coating and component fixing. Product Overview ALPHA HiTech UP44-5566T is particularly suitable for mobile wireless charger chip coating. It is halogen-free and complies with the RoHS

• Features: Electronics, UV / Radiation Cured (EB, Light)
• Industry: Semiconductors / IC Packaging