UV Cure Encapsulants

Description: LOCTITE ECCOBOND UV 9061F, Acrylate, Assembly LOCTITE® ECCOBOND UV 9061F no flow, UV/moisture cure encapsulant is designed for local circuit board protection. This product is fluorescent when viewed with ultraviolet (black) light. Fast cure Cures in

• Coeff. of Thermal Expansion (CTE): 43.33 µin/in-F
• Cure Type / Technology: UV / Radiation Cured (also EB, Light)

Description: LOCTITE ECCOBOND UV 9052, Acrylate, Encapsulant, fast UV cure LOCTITE® ECCOBOND UV 9052 is a single component, UV light/moisture curable adhesive for ink jet applications. One component Fast UV cure Withstands exposure to ink Cures in

Description: LOCTITE ECCOBOND UV 9030, Acrylate, Adhesive and Sealant, Thixotropic, Solvent resistant LOCTITE® ECCOBOND UV 9030 is a dual cure sealant and adhesive that can be syringe dispensed. One component UV curable Thixotropic Solvent resistant Cures in shadowed areas with

• Viscosity: 39000 cP

Description: UV Cure 60-7155 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7155 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant.

• Chemical / Polymer System Type: Epoxy (EP)
• Features: Encapsulanting / Potting
• Industry: Electronics, OEM / Industrial
• Tensile Strength (Break): 6200 psi

Description: UV Cure 60-7156 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7156 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. It's

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Features: Encapsulanting / Potting, Elastomeric
• Industry: OEM / Industrial
• Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic

Description: LOCTITE ECCOBOND EN 3410, Acrylate, Encapsulant, Coating LOCTITE® ECCOBOND EN 3410 encapsulant is designed for COG/COF of LCD module or micro patterned FPC substrate of OLED module assembly applications. It is designed to improve crack/fracture resistance and delamination for overall

• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Viscosity: 680 cP

Description: UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE).

• Coeff. of Thermal Expansion (CTE): 19.44 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.5
• Dielectric Strength: 450 kV/in
• Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting

Description: UV Cure 60-7157 is a good choice for potting and encapsulating applications due to its ability to deep section cure up to ¾ inch. Another unique and important feature is its ability to "dark cure." Once exposed to UV light the UV Cure 60-7157 will

• Chemical / Polymer System Type: Epoxy (EP)
• Dielectric Strength: 425 kV/in
• Features: Encapsulanting / Potting
• Industry: OEM / Industrial

Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Dielectric Constant (Relative Permittivity): 4.41 to 4.63
• Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting, Flexible / Dampening
• Filled / Reinforced: Yes

Description: EPO-TEK® UV Epoxies are your alternative to traditional oven cured optical products. They are fast curing and photo curable. These UV cure adhesives simplify the handling process by using a single component system. Our adhesives require no mixing, cure in

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 22.78 to 94.44 µin/in-F
• Features: Encapsulanting / Potting
• Index of Refraction: 1.57 to 1.58

Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market requires their

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 32.78 to 82.78 µin/in-F
• Features: Encapsulanting / Potting
• Index of Refraction: 1.57

Description: Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed

• Applied Thickness / Gap Fill: 0.0500 inch
• Features: Encapsulanting / Potting
• Industry: Electronics, Medical / Food (Sanitary / FDA), OEM / Industrial, Other
• Substrate / Material Compatibility: Plastic

Description: Krylex KU3104 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed

• Applied Thickness / Gap Fill: 0.1500 inch
• Features: Encapsulanting / Potting
• Industry: Electronics, Medical / Food (Sanitary / FDA), OEM / Industrial, Other
• Substrate / Material Compatibility: Plastic

Description: One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength.

• Applied Thickness / Gap Fill: 1.00E-6 to 3.00E-6 inch
• Chemical / Polymer System Type: Specialty / Other
• Coeff. of Thermal Expansion (CTE): 1.67E7 to 1.94E7 µin/in-F
• Dielectric Constant (Relative Permittivity): Over 4.1

Description: DYMAX 9102 Light/Moisture Cure Encapsulant Clear is a one component, UV light and moisture curing, acrylated urethane that is used for wire bonding and as a chip-encapsulant. It is flexible, tack free, moisture and thermal resistant. 30 mL MR Syringe.

• Cure Type / Technology: Single Component System
• Elongation: 34 %
• Form / Function: Encapsulant / Potting Compound
• Tensile Strength (Break): 703 psi

Description: (Known as Electrodag PF-021 UV Curable Encapsulant ) LOCTITE EDAG PF-021 E&C is a dot dispensable, UV curable encapsulating photopolymer designed to secure low profile surface mount devices to rigid or flexible substrates.

• Industry: Electronics

Description: Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling.

• Applied Thickness / Gap Fill: 1.00E-3 to 0.0030 inch
• Chemical / Polymer System Type: Epoxy (EP), Specialty / Other
• Dielectric Constant (Relative Permittivity): 4.7
• Dissimilar Substrates: Yes

Description: A low-viscosity, single-part conformal coating that cures within seconds of exposure to the correct dose of UV light. Product Overview UVCL UV cure conformal coating is a single-part solution that cures in seconds when exposed to the correct dose of UV

• Cure Type / Technology: UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured, Single Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
• Form / Function: Conformal / Encapsulating Coating

Description: DYMAX Ultra Light-Weld 9008 UV Curable Encapsulant is used for sealing and encapsulating electronic devices such as chip-on-flex or chip-on-board applications. It is flexible, solvent free, and moisture resistant. 10 mL MR Syringe.

• Cure Type / Technology: Single Component System
• Elongation: 300 %
• Form / Function: Encapsulant / Potting Compound
• Tensile Strength (Break): 900 psi

Description: DYMAX Ultra Light-Weld 9008 UV Curable Encapsulant is used for sealing and encapsulating electronic devices such as chip-on-flex or chip-on-board applications. It is flexible, solvent free, and moisture resistant. 170 mL Cartridge.

• Cure Type / Technology: Single Component System
• Elongation: 300 %
• Form / Function: Encapsulant / Potting Compound
• Tensile Strength (Break): 900 psi

Description: source of UV light, Master Bond UV15 produces durable, strong, tough and chemically resistant coatings, bonds and seals with excellent electrical insulation properties. Fast cures take place using light sources emitting at a wave length of 250-365 nm, at as low as 20-40

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 33 to 39 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.76
• Dissimilar Substrates: Yes

Description: DYMAX 9001-E-V3 Series Encapsulant Clear is a one component, UV light and heat curing, acrylated urethane that is used for bonding electronic devices, print circuit boards, glass, multi-chip modules, chip-on-flex, and chip-on-board applications. It offers flexibility, good

• Cure Type / Technology: Single Component System
• Dielectric Strength: 12700 kV/in
• Elongation: 150 %
• Form / Function: Encapsulant / Potting Compound

Description: temperature. When exposed to a source of UV light these compounds form strong bonds, coatings, seals and castings with superior chemical resistance. Fast cures take place using light sources emitting at a wavelength of 320-360 nm at as low as 20-40 milliwatts per cm² of energy and

• Coeff. of Thermal Expansion (CTE): Over 33 µin/in-F
• Dielectric Constant (Relative Permittivity): Over 3.45
• Dissimilar Substrates: Yes
• Elongation: 4 %

Description: LOCTITE UV8800M is a UV cure encapsulant for smart card and other COB applications.

• Coeff. of Thermal Expansion (CTE): 22.78 µin/in-F
• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Gap Filling Compound, Specialty / Other

Description: ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations.

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 31.11 µin/in-F
• Dielectric Strength: 450 kV/in
• Features: Encapsulanting / Potting

Description: CHT's QGEl 311UV is a 2-part, platinum cure, special purpose silicone gel. It is designed with convenient 1:1 mix ratio, and low viscosity for easy dispensing. QGel 311UV is soft, but resilient and is amoderately cross-linked silicone polymer. QGel 311UV is clear but

• Cure Type / Technology: Two Component System, Specialty / Other
• Dielectric Strength: 500 kV/in
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Index of Refraction: 1.4

Description: CE Marked - Available Globally Dymax BlueWave® 200 version 3.1 is a high-intensity, light-curing spot-lamp system. This unit emits energy in the UVA and visible portion of the spectrum (300-450 nm) for light curing of adhesives, coatings, and encapsulants

• Configuration: Spot / Wand

Description: It is a single-component, VOC-free conformal coating. This product is specially designed to quickly gel and cure under ultraviolet light, even if exposed to moisture in the air in the shadow area, it can be cured to ensure the best performance. The thin layer of coating can solidify to

• Chemical / Polymer System Type: Acrylic / Polyacrylate
• Cure Type / Technology: UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured
• Form / Function: Conformal / Encapsulating Coating

Description: SEMICOSIL® 936 UV is an RTV-1 amine cure system that cures on contact with moisture in the air and/or through exposure to high energy ultraviolet light. Special features Rapid UV acceleration Shadow cure solvent free Application SEMICOSIL® 936 UV is intended

• Chemical / Polymer System Type: Silicone
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured, Single Component System
• Dielectric Constant (Relative Permittivity): 2

Description: Dual-Cure 9101 light/moisture-cure encapsulant is an improved, resilient, chip-encapsulating material designed with a UV/Visible light and secondary ambient moisture-cure system, making it ideal for encapsulation applications where shadowed areas are present. 9101

• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Form / Function: Encapsulant / Potting Compound
• Viscosity: 7000 cP

Description: (Known as HYSOL UV9060 ) LOCTITE ECCOBOND UV 9060 is a no-flow UV/moisture cure encapsulant designed for local circuit board protection. It is fluorescent when viewed with ultraviolet (black) light.

• Industry Applications: Electronics (PCB / SMT Assembly)

Description: ELASTOSIL® CAT PT-F very low hardness (silicone gel) inherent tack excellent mechanical damping properties rapid UV curing at room temperature in combination with long potlife (with ELASTOSIL® CATUV) Application encapsulation of electronic components for the automotive and power

• Chemical / Polymer System Type: Silicone
• Composition: Two Component System
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
• Features: Optical Grade / Material

Description: Non-corrosive, single component silicone coating

• Chemical / Polymer System Type: Silicone
• Composition: Unfilled
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured, Single Component System

Description: Techsil® VT2420LV is a crystal clear two-part, low viscosity room temperature curing polyurethane resin with high shore hardness. VT2420LV offers excellent outdoor weathering properties, due to the incorporation of both UV resistant base materials and the addition of UV

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound

Description: be employed in areas where the transmission of light is important. The cured product is a hard, medium to high modulus elastomer that can be repaired. Non Yellowing under UV light. Optically clear. Low Viscosity. No messy mixing. Ideal for use with LEDs. Small volume twin pack Product

• Form / Function: Specialty / Other, Encapsulant / Potting Compound
• Thermal Conductivity: 0.1800 W/m-K
• Use Temperature: -76 to 399 F