Wafer Measurement Tool

Description: The FTI-1000 is a purpose-built ATE system designed for high-coverage wafer-level testing of power discrete devices, wide-bandgap components, and gate-driver-integrated power ICs. Suitable for both engineering characterization and high-volume wafer sort, the system integrates

• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: The FTI-1000 is a purpose-built ATE system designed for high-coverage wafer-level testing of power discrete devices, wide-bandgap components, and gate-driver-integrated power ICs. Suitable for both engineering characterization and high-volume wafer sort, the system integrates

• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: The XE-WAFER is a fully automated industrial AFM designed specifically to address surface roughness, trench width, depth, and angle measurements on 200mm & 300mm wafers in a production environment. The system provides superior accuracy and precision nanometrology over any other

• Measurements: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument
• Features: Non-contact, Non-destructive

Description: roughness and link profile measurement and other surface structures Applications Solar Wafers QA and QC, Cost effective, compact metrology tool for R&D labs for all type of wafers and surfaces.

• Maximum Wafer / Part Size: 156 mm
• Mounting / Loading: Manual Loading
• Form Factor: Monitor / Instrument
• Technology: Optical / Imaging System

Description: metrology tools. Unlike conventional metrology tools that measure the thickness at a single spot, the F80 quickly generates a thickness image by collecting thousands of thickness readings in the vicinity of the measurement location. Configurations available from low-cost,

• Measurements: Area Mapping
• Applications: CVD / PVD Films, Semiconductor Wafers
• Features: In-situ / System Mounted, Non-contact, Non-destructive
• Form Factor: Monitor / Instrument

Description: The wafer edge grinders are designed to grind edge and circumference of a wide variety of wafers including silicon, compound semiconductors, such as, SiC, GaN, GaAs, and InP, oxide wafers, such as sapphire, quartz, LT, and LN, and glass, at high precision through numerical

• Type: Belt Grinder - Platen / Edge, Precision Grinder
• Applications / Materials Abraded: Ceramics / Glass, Semiconductors / Electronics
• Mounting: Floor / Stationary (Machine Tool)

Description: Turn Your Microscope into a Film Thickness Measurement Tool The F40 product family is for applications that require a spot size as small as 1 micron. For most microscopes the F40 simply attaches to the c-mount adapter, which is the industry standard for video camera mounting. The F40

• Applications: CVD / PVD Films, Semiconductor Wafers
• Features: In-situ / System Mounted, Non-contact, Non-destructive
• Form Factor: Monitor / Instrument
• Measurements: Optical Constants (n, k)

Description: The Rigaku MFM65 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer

• Maximum Wafer / Part Size: 200 to 300.00000000000006 mm
• Measurements: Composition, Particle Contamination, Roughness / Waviness, Thickness - Film / Layer
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: CoorsTek offers a full line of air bearing guideway components, and structural components and beams for precision measurement. High specific stiffness and excellent thermal stability make our ceramic beams and stage components ideal for coordinate measurement machines, semiconductor

Description: introduction of a laser into a photolithography tool used for interferometry measurements. Interferometers are used to accurately control stage movement for the proper positioning of the wafer and reticle stages relative to each other. The need for high accuracy in this area

Description: The Polar Kerr System for MRAM utilizes the polar Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM. Utilizing a non-contact full-wafer measurement technique, the

• Maximum Wafer / Part Size: 300.00000000000006 mm
• Mounting / Loading: Floor Mounted / Stand-alone
• Measurements: Magnetic Properties (Coercivity / Shift)
• Technology: Magnetometer

Description: composition, and element concentration with new functions and a low-COO design. A versatile and reliable tool for 200 mm and smaller wafers, the WDA-3650 incorporates our trademark X-Y-θ sample stage system for superior results on difficult measurements, such as ferrodielectric

• Maximum Wafer / Part Size: 200 mm
• Measurements: Composition, Thickness - Film / Layer
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued

• Measurements: Defects / ADC, Roughness / Waviness
• Features: Other
• Technology: Profilometer / AFM, X-ray Diffractometer
• Applications: Semiconductor Wafers

Description: Atomic Force Microscopy (AFM) is emerging as an essential tool in many industries. With its ability to accurately measure critical dimensions in the micrometer to nanometer regime, the AFM is becoming an essential tool choice in applications involving surface roughness, trench width,

• Measurements: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument
• Features: Non-contact, Non-destructive

Description: • Out of plane motion of less than 2 nm over entire scan range • Accurate height and angle measurements with PTR Gauge Sigma less than 0.1 nm. • Superior tool to tool matching. Longer Tip Life by True Non-Contact Mode • 10 times larger Z-scan bandwidth than a piezotube • Less

• Features: Data Storage / Memory, Non-contact, Non-destructive
• Measurements: Defects / ADC
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: The APM650™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral

• Maximum Wafer / Part Size: 650.0000000000001 mm
• Measurements: Area Mapping, Critical Dimension / Trench Geometry, Depth Profiling, Roughness / Waviness, Shape / Flatness
• Technology: Interferometer
• Mounting / Loading: Manual Loading

Description: range • Accurate feature measurements with industry leading gauge sigma • Superior tool to tool matching Longer Tip Life by True Non-Contact Mode • 10 times larger Z-scan bandwidth than a piezotube • 10 times or longer tip life for general purpose & defect imaging • Less tip

• Features: Data Storage / Memory, Non-contact, Non-destructive
• Measurements: Defects / ADC
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: The Most Powerful Tool Available for Monitoring Thin-Film Deposition Measure deposition rates, film thickness, optical constants (n and k), and uniformity of semiconductors and dielectric layers in real-time with the F30 spectral reflectance system. Example Layers MBE and MOCVD: Smooth and

• Mounting / Loading: Autoloading / In-line
• Applications: CVD / PVD Films, Semiconductor Wafers
• Features: Deposition Rate, Non-contact, Non-destructive
• Form Factor: Monitor / Instrument

Description: Typical Applications Lithography tools: optical steppers and scanners, e-beam & laser mask writers Metrology tools: Mask, wafer and LCD inspection and measurement tools, CD-SEMs Process equipment: memory repair tools, probers, die bonders, drilling

• Measurement Capability: Displacement / Position
• Features: Other

Description: Application Scenarios: It is widely used in step height measurement, thickness measurement, wafer surface testing, flatness measurement, center pointing, positioning of the needle of the dispenser, CNC tool positioning, and the positioning of the industrial robot.

• Applications: Alignment / Guidance, Assembly Quality, Bar / Matrix Code, Biotechnology or Medical, Color Mark / Color Recognition, Container or Product Counting, Edge Detection, Electronics Rework, Electronics or Semiconductor Inspection, Flaw Detection, Food & Beverage, Gauging, Scanning & Dimensioning, ID

Description: The TWINSCAN NXT:1950i Step-and-Scan system is a high productivity, dual stage immersion lithography tool designed for volume production 300-mm wafers at the 32-nm node and beyond. Building on the successful in-line catadioptric lens design concept of the XT:1950Hi, the TWINSCAN

Description: The measurement of light scattered by surfaces can be used to locate and identify roughness, particulates, and defects on a wide variety of materials. Applications include the inspection of silicon wafers, optics, and storage media, characterization of thin film roughness,

• Type: Course
• Technology / Subject Expertise: Design / Engineering Methods (ESDU, DFx, etc.), Photonics / Optics
• Delivery: On-site / In Plant

Description: designed for minimal sensitivity to gravitational sag, and includes a full-area calibration file to enable optimum system accuracy. Mx™ Software ZYGO's proprietary Mx™ measurement and analysis software offers a wide range of operational features and data visualization tools for

• Zoom: 1 to 50 X
• Aperture Size: 300 mm
• Laser Wavelength: 633 nm
• Operating Temperature: 59 to 86 F

Description: CoorsTek offers a full line of air bearing guideway components, and structural components and beams for precision measurement. High specific stiffness and excellent thermal stability make our ceramic beams and stage components ideal for coordinate measurement machines, semiconductor

Description: CoorsTek offers a full line of air bearing guideway components, and structural components and beams for precision measurement. High specific stiffness and excellent thermal stability make our ceramic beams and stage components ideal for coordinate measurement machines, semiconductor

• Gage / Instrument Type: Gage Block / Master
• Features: Rectangular Gage Block

Description: of 4.2 K to 475 K with options to extend as low as 3.2 K or to a higher range of 20 K to 675 K. This model accommodates full and partial wafers up to 51 mm (2 in) in diameter. A wide selection of probes, cables, sample holders, and options makes it possible to meet specific measurement

• Features & Format: Array
• NDT Probe Technology: Magnetic / Hall Effect

Description: The 4145A is a Semiconductor Parameter Analyzer from Agilent. Semiconductor parameter analyzers are all-in-one tools used for a wide range of measurement capabilities. Semiconductor parameter analyzers can measure and analyze electrical characterizations of many types of electronic

Description: into both existing and next-generation production lines via FieldBus technology. Synchronized Multi-Point Measurement: The system supports up to three encoders for synchronized measurements and dynamic data acquisition. For complex applications requiring multiple measurement

Description: ABTech’s standard thickness gages include Heidenhain Metro probes, Gage-Chek DRO®, Granite plate, stainless steel probe stands and probe actuator control box. These thickness gages allow the user to accurately measure thickness down to 1 micron without having to hold the part or using hand

• Range: 0.984 inch
• Graduation / Resolution: 0.00000393701 inch
• Resolution: 0.00000393701 inch
• Mounting / Loading Options: Benchtop / Floor

Description: semiconductor wafer foundries. Digi-Pas® DWL-1500XY dual axis model is used for monitoring a precision wafer manufacturing equipment's performance. Digi-Pas® DWL-1500XY is used in railway maintenance & operation to detect rail tracks deformation and elevation variations. It is a useful

• Angular Range: 0 to 2 degrees
• Measuring Technology: Electronic

Description: stage rail designs normally seen on high-end machine tools. VMR-Z120X maximum magnification model Offers even greater precision, providing optical magnification to 120x. Ideal for wafer level CSP, wafer bump height and SIP, rerouted masks and masks for MEMS. Other features: High

• Applications: Electronics or Semiconductor Inspection
• Image Source: Optical Microscope
• System Type: Turnkey / Complete System

Description: quality in many manufacturing processes within semiconductor wafer foundries. Digi-Pas® DWL-1300XY dual axis model is used for monitoring a precision wafer manufacturing equipment's performance. Digi-Pas® DWL-1300XY is used in railway maintenance & operation to detect rail tracks

• Angular Range: 5 degrees
• Measuring Technology: Electronic

Description: calibration (four-receiver enabled) for in-fixture and on-wafer devices, standard bias-tees for active devices and standard direct receiver access for extended dynamic range. Powerful automation and self-help tools make the instrument well suited for both R&D and manufacturing. The PNA

• Frequency Range: 6,000,000 kHz

Description: display of angular in real-time digital & analogue display for angles monitoring, data logging & analysis HIGH PRECISION ANGLE MEASUREMENT High resolution of 0.01° angular measurement. USB PC links (optional) for remote data logging capability. Graphical display of real-time measuring

• Angular Range: 0 to 90 degrees
• Angular Resolution: 0.01 degrees
• Measuring Technology: Electronic

Description: resolution down to typ. 65 µT Extremely small form factor: typ. 1.13 mm * 0.93 mm * 0.59 mm X-Y angular measurement mode Power down mode with 7 nA (typ.) power consumption 12-bit data resolution for each measurement direction plus 10-bit temperature sensor Variable update frequencies

• Applications: Consumer, Industrial
• Features: Magnetic Sensor
• Standards and Certifications: RoHS Compliant
• Packing Method: Tape Reel