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Supplier: Park Systems, Inc.
Description: The XE-WAFER is a fully automated industrial AFM designed specifically to address surface roughness, trench width, depth, and angle measurements on 200mm & 300mm wafers in a production environment. The system provides superior accuracy and precision nanometrology over any other
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Park Systems, Inc.
Description: The XE-WAFER is a fully automated industrial AFM designed specifically to address surface roughness, trench width, depth, and angle measurements on 200mm & 300mm wafers in a production environment. The system provides superior accuracy and precision nanometrology over any other
- Application: Semiconductor Inspection
- Digital Display: Yes
- Grade: Benchtop
- Image Analysis Processing Software: Yes
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Supplier: Filmetrics, Inc.
Description: Turn Your Microscope into a Film Thickness Measurement Tool The F40 product family is for applications that require a spot size as small as 1 micron. For most microscopes the F40 simply attaches to the c-mount adapter, which is the industry standard for video camera mounting. The
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Monitor / Instrument
- Measurement Capability: Optical Constants (n, k)
- Mounting / Loading: In-situ / System Mounted
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Supplier: MicroSense, LLC
Description: calibration Hiscan option for surface roughness and link profile measurement and other surface structures Applications Solar Wafers QA and QC, Cost effective, compact metrology tool for R&D labs for all type of wafers and surfaces.
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 156 mm
- Measurement Capability: Thickness - Wafer / Disc (TTV)
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Supplier: Filmetrics, Inc.
Description: Product-Wafer Metrology Made Affordable Process engineers want film thickness measurements fast and without a lot of hassle. Our innovative Thickness Imaging™ technology allows Filmetrics to offer easy recipe set up and industry-leading throughput, at a mere fraction of the cost
- Applications: Semiconductor Wafers, CVD / PVD Films
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Mounting / Loading: In-situ / System Mounted
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Supplier: Rigaku Corporation
Description: The Rigaku MFM65 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 to 300 mm
- Measurement Capability: Composition, Particle Contamination, Roughness / Waviness, Thickness - Film / Layer
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Supplier: MicroSense, LLC
Description: The Polar Kerr System for MRAM utilizes the polar Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM. Utilizing a non-contact full-wafer measurement technique, the
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: Up to 300 mm
- Measurement Capability: Magnetic Properties (Coercivity / Shift)
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Supplier: Bruker Corporation
Description: worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the
- Applications: Semiconductor Wafers, Other
- Measurement Capability: Defects / ADC, Roughness / Waviness
- Technology: Profilometer / AFM, X-ray Diffractometer
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Supplier: Rigaku Corporation
Description: , film composition, and element concentration with new functions and a low-COO design. A versatile and reliable tool for 200 mm and smaller wafers, the WDA-3650 incorporates our trademark X-Y-? sample stage system for superior results on difficult measurements, such as
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 mm
- Measurement Capability: Composition, Thickness - Film / Layer
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Supplier: Filmetrics, Inc.
Description: The Most Powerful Tool Available for Monitoring Thin-Film Deposition Measure deposition rates, film thickness, optical constants (n and k), and uniformity of semiconductors and dielectric layers in real-time with the F30 spectral reflectance system. Example Layers MBE
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Monitor / Instrument
- Measurement Capability: Deposition Rate, Optical Constants (n, k), Thickness - Film / Layer
- Mounting / Loading: In-line
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Supplier: Park Systems, Inc.
Description: , sidewall slope, and line width characterization. The completely automated XE-LCD is designed for characterization of flat panel displays as either an in-line or off-line inspection tool. • Automatic Non-Contact AFM measurement • Automatic navigation and focusing
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Zygo Corporation
Description: The APM650™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Depth Profiling: Yes
- Form Factor: Monitor / Instrument
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Supplier: Park Systems, Inc.
Description: 100 µm x 100 µm with low residual bow • Out of plane motion of less than 2 nm over entire scan range • Accurate height and angle measurements with PTR Gauge Sigma less than 0.1 nm. • Superior tool to tool matching. Longer Tip Life by True Non
- Applications: Semiconductor Wafers, Data Storage / Memory
- Form Factor: Monitor / Instrument
- Measurement Capability: Defects / ADC
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Conax Technologies
Description: application shown is the introduction of a laser into a photolithography tool used for interferometry measurements. Interferometers are used to accurately control stage movement for the proper positioning of the wafer and reticle stages relative to each other. The need for high
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Supplier: CoorsTek
Description: CoorsTek offers a full line of air bearing guideway components, and structural components and beams for precision measurement. High specific stiffness and excellent thermal stability make our ceramic beams and stage components ideal for coordinate measurement machines, semiconductor
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Supplier: Smartmore Corporation Limited
Description: precision positioning of the wafer ? Wear-free, fast, high precision, and reliable measurements Application Scenarios: It is widely used in step height measurement, thickness measurement, wafer surface testing, flatness measurement, center pointing,
- Applications / Capabilities: Alignment / Guidance, Assembly Quality, Bar / Matrix Code, Biotechnology or Medical, Color Mark / Color Recognition, Container or Product Counting, Edge Detection, Electronics or Semiconductor Inspection, Electronics Rework, Flaw Detection, Food & Beverage, Gauging, Scanning & Dimensioning, ID
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Supplier: SPIE - Education
Description: The measurement of light scattered by surfaces can be used to locate and identify roughness, particulates, and defects on a wide variety of materials. Applications include the inspection of silicon wafers, optics, and storage media, characterization of thin film roughness,
- Modality: On-site / In Plant
- Technology / Subject: Design / Engineering Methods (ESDU, DFx, etc.), Photonics / Optics
- Type: Course
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Supplier: Zygo Corporation
Description: range of operational features and data visualization tools for unmatched measurement capability in an easy-to-use interface. Mx software now includes SmartAveraging® technology that helps to obtain the best possible measurement in the shortest amount of time, and the built-in
- Aperture Size: 300 mm
- Laser Wavelength: 633 nm
- Light Source / Laser Type: HeNe
- Operating Temperature: 59 to 86 F
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Supplier: Zygo Corporation
Description: . Typical Applications Lithography tools: optical steppers and scanners, e-beam & laser mask writers Metrology tools: Mask, wafer and LCD inspection and measurement tools, CD-SEMs Process equipment: memory repair tools, probers, die bonders, drilling
- Measurement: Displacement / Position
- Optical Configuration: Other
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Supplier: ASML Optics
Description: The TWINSCAN NXT:1950i Step-and-Scan system is a high productivity, dual stage immersion lithography tool designed for volume production 300-mm wafers at the 32-nm node and beyond. Building on the successful in-line catadioptric lens design concept of the XT:1950Hi, the TWINSCAN
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Supplier: CoorsTek
Description: CoorsTek offers a full line of air bearing guideway components, and structural components and beams for precision measurement. High specific stiffness and excellent thermal stability make our ceramic beams and stage components ideal for coordinate measurement machines, semiconductor
- Type: Gage Block / Master
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Supplier: CoorsTek
Description: CoorsTek offers a full line of air bearing guideway components, and structural components and beams for precision measurement. High specific stiffness and excellent thermal stability make our ceramic beams and stage components ideal for coordinate measurement machines, semiconductor
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Supplier: Lake Shore Cryotronics, Inc.
Description: affordability make the CRX-6.5K the tool of choice for many researchers worldwide. I-V, C-V, and microwave measurements are standard on the CRX-6.5K. The 2-stage CCR allows the sample to be maintained at elevated temperature during cooldown, reducing the potential for condensation, a
- NDT Probe Technology: Magnetic / Hall Effect
- Special Features: Array
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Supplier: Lake Shore Cryotronics, Inc.
Description: holders, and options makes it possible to meet specific measurement applications. The TTPX is Lake Shore’s premium design for electro-optical materials characterization with the backside optical access option and compatible optical sample holders. I-V, C-V, and microwave measurements
- NDT Probe Technology: Magnetic / Hall Effect
- Special Features: Array
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Supplier: ValueTronics International, Inc.
Description: The 4145A is a Semiconductor Parameter Analyzer from Agilent. Semiconductor parameter analyzers are all-in-one tools used for a wide range of measurement capabilities. Semiconductor parameter analyzers can measure and analyze electrical characterizations of many types of electronic
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Supplier: ABTech, Inc.
Description: hand tools such as a micrometer. The part under test is positioned on the granite plate while the probes are slowly activated to come in contact with the part. These turn key systems are available in single or dual probe configurations and are ideal for measuring thickness of wafers,
- Gaging Technology: Mechanical
- General Gage Type: Custom / OEM Gage
- Graduation / Resolution: 3.94E-6 inch
- Material Thickness: Yes
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Supplier: ValueTronics International, Inc.
Description: dynamic range. Powerful automation and self-help tools make the instrument well suited for both R&D and manufacturing. The PNA Series features sixteen independent measurement channels, built-in hard drive and supplied mouse.
- Frequency Range: 6.00E6 kHz
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Supplier: Nikon Metrology
Description: stage rail designs normally seen on high-end machine tools. VMR-Z120X maximum magnification model Offers even greater precision, providing optical magnification to 120x. Ideal for wafer level CSP, wafer bump height and SIP, rerouted masks and masks for MEMS. Other features
- Applications / Capabilities: Electronics or Semiconductor Inspection
- Image Source: Optical Microscope
- System Type: Turnkey / Complete System
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Supplier: DigiPas Technologies Inc.
Description: at other angles User may use device without or with Bluetooth® Measurement when paired with smartphone & Digi-Pas Machinist level App (Optional) Bluetooth range: approx. 50ft. Operating temperature range: 10° to 120°F or -10°C to +50°C
- Angular Range: 0.0 to 2 degrees
- Measuring Technology: Electronic
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Supplier: DigiPas Technologies Inc.
Description: 0.04° at other angles User may use device without or with Bluetooth® Measurement when paired with smartphone & Digi-Pas Machinist level App (Optional) Bluetooth range: approx. 50ft. Operating temperature at 10°F to 120°F. or -10°C to +50°C
- Angular Range: Up to 5 degrees
- Measuring Technology: Electronic
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Supplier: Infineon Technologies AG
Description: XENSIV™ - TLI493D-W2BW A0 extremely small power-saving 3D magnetic sensor opens up new design options The Infineon XENSIVTM TLI493D-W2BW uses our latest 3D Hall generation and is housed in an extremely small wafer-level package. With an 87 percent smaller footprint and 46
- RoHS Compliant: Yes
- Sensor Grade / Operating Range: Industrial, Consumer
- Sensor Type: Magnetic Sensor
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Supplier: Brooks Instrument
Description: measurement without stopping the flow of process gas. It allows semiconductor manufacturers to verify process gas accuracy, check valve leak-by and monitor sensor stability in real time without removing the flow controller from the gas line. Combined with an all-metal wetted flow path, ultra
- Accuracy: 1 ±% FS
- Control Signal Output: Analog Voltage, Serial / Digital, Network / Fieldbus Output
- Media: Gas / Air
- Number of Control Outputs: 1 outputs
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Supplier: DigiPas Technologies Inc.
Description: & measurement. Digi-Pas® DWL-2000XY is used for aligning precision fixtures. Absolute levelling and positional accuracy are required in meeting tight tolerance for highest quality in many manufacturing processes within semiconductor wafer foundries
- Angular Range: 0.0 to 90 degrees
- Angular Resolution: 0.0100 degrees
- Measuring Technology: Electronic
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Supplier: DigiPas Technologies Inc.
Description: . Digi-Pas® DWL-3000XY 2-Axis model is used for installation, setup & maintenance precision measurement instruments in wafer foundry. Precise levelling with vibrometer diagnostic feature of DWL-3000XY enables machine to prevent unnecessary structural vibration affecting quality and
- Angular Range: 0.0 to 90 degrees
- Angular Resolution: 0.0100 degrees
- Measuring Technology: Electronic
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Supplier: Rigaku Corporation
Description: sensitivity on par with inductively coupled plasma optical emission spectroscopy (ICP-OES), NANOHUNTER provides part-per-billion (PPB) level detection limits in a fully automated tool. Direct measurement of solids and powders provides freedom from complex sample digestion or
- Computer Interface: Yes
- Detector Type: Other
- Excitation Source: X-Ray Tubes
- Module Type: Wavelength Dispersive
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Supplier: Infineon Technologies AG
Description: options with its powerful features in the extremely small wafer-level housing. New features were added such as sensor address read back, half mode range setting, focusing to half of the magnetic range ensuring higher accuracy, higher update frequency allows for an application field that
- RoHS Compliant: Yes
- Sensor Grade / Operating Range: Industrial, Consumer
- Sensor Type: Magnetic Sensor
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Supplier: Infineon Technologies AG
Description: indicate a valid measurement to the microcontroller Potential Applications Anti tempering protection in smart meters Joysticks e.g. for medical equipment, cranes, CCTV-control, game consoles Control elements e.g. white goods multifunction knobs Industrial joysticks Ergonomic push- and control
- Category: Development Board
- Supported System: Other
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Supplier: ASTM International
Description: an inner shield of 0.7 to 1.0 mm of aluminum is required. (See 8.2.2.2 and Practice E1249.) The X-ray tester has proven to be a useful ionizing radiation effects testing tool because: It offers a relatively high dose rate, in comparison to most cobalt-60 sources, thus offering reduced
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are widely used in wafer inspection stages, lithography scanners, metrology tools, and dicing equipment. Technical Highlights Uniform Air Permeation— Controlled porosity of 35–45% with pore sizes from 10μm to 100μm ensures consistent gas flow distribution across the (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
contamination. In a typical application, a laser is introduced into a photolithography tool used for interferometry measurements. Interferometers are used to accurately control stage movement for the proper positioning of the wafer and reticle stages relative to each other. The need for high accuracy (read more)
Browse Datasheets for Conax Technologies -
Chromatic Confocal Sensor for LCD Measurement The Hypersen chromatic confocal sensor is a high-precision, non-contact optical measurement tool designed for fast, accurate online (read more)
Browse Linear Position Sensors Datasheets for Hypersen Technologies Co., Ltd. -
. Typical Applications • Lithography tools: optical lithography steppers and scanners, e-beam & laser mask writers • Metrology tools: Mask and wafer inspection and measurement tools, CD-SEMs • Calibration: Measurement and calibration (read more)
Browse Semiconductor Metrology Instruments Datasheets for Zygo Corporation -
, crossbeams, and wafer tables Supports high-speed, high-precision wafer motion in advanced lithography tools. Engineering & Manufacturing Advantages (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for Fountyl Technologies Pte. Ltd. -
Maury automated tuners are precision instruments optimized for in-fixture and on-wafer, RF/microwave test and measurement applications. They are ideal for automated or manual application where the need is to match the impedance of a microwave circuit element, or to establish specific impedances (read more)
Browse Dimensional Gages and Instruments Datasheets for Maury Microwave -
essential. Horizon leverages interferometry to achieve nanometer-level resolution, ensuring exceptional repeatability and long-term measurement stability. By eliminating mechanical contact, it minimizes drift and wear, making it the ideal solution for wafer inspection (read more)
Browse Signal Conditioners Datasheets for Marposs Corp -
Marposs has been a trusted partner in delivering advanced measurement solutions for the semiconductor industry. Thanks to deep expertise in metrology and wafer inspection, we support customers in identifying the most suitable solutions for monitoring material thickness and the so (read more)
Browse Dimensional Gages and Instruments Datasheets for Marposs Corp -
-and-error) experienced when using those outdated single-axis 'bubble' or traditional rectangular-measurement, perpendicular profiling and precision 3-Dimentional alignment tasks. Digi-Pas® 2-axis precision VERTICAL digital level simultaneous displays of two (read more)
Browse Levels Datasheets for DigiPas Technologies Inc.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
into SOC business, says Taiwanese executive IMS to provide tools for Advantest logic testers Samsung orders RDRAM testers from Schlumberger Motorola tips its RF IC strategy, revealing GaAs FET and SiGe amp Zygo metrology tool increases precision of wafer planarity measurement Intel invests
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
family to support DDR-II memory, the JEDEX Conference here was told this week. Micro-Metric debuts measurement tool for IC wafers Micro-Metric Inc. here rolled out a system that provides non-contact depth and linewidth measurement for semiconductor wafers. Intel's processor sales in China surge 39%
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Development of an In-line Minority-Carrier Lifetime Monitoring Tool for Process Control during Fabrication of Crystalline Silicon Solar Cells: Final Technical ...
For the wafer measurement tools , this function has been implemented so that the measurement is taken automatically whenever a lifetime is measured.
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In-line E-beam wafer metrology and defect inspection: the end of an era for image-based critical dimensional metrology? New life for defect inspection
Unless there is no other in-line solution or the speed to acquire data increases significantly, these techniques will likely not be desirable replacements for an in-line image- based wafer measurement tool .
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Development of an In-Line Minority-Carrier Lifetime Monitoring Tool for Process Control during Fabrication of Crystalline Silicon Solar Cells: Annual Subcontra...
For the wafer measurement tools , this function has been implemented so that the measurement is taken automatically whenever a lifetime is measured.
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Researchers generate high-speed pulses of laser light on silicon, speeding data transmission.(TECHNOLOGY) - Photonics Components & Subsystems | HighBeam Resear...
Tool measures wafer thickness: Infrared laser light precisely gauges silicon wafers.
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Monitoring measurement tools: new methods for driving continuous improvements in fleet measurement uncertainty
However, few wafers or measurement tools are perfect in this regard.
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Post exposure bake unit equipped with wafer-shape compensation technology
We have measured temperature uniformity within wafer shown below using wireless wafer temperature measurement tool .
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Bulge testing of single- and dual-layer thin films
In order to assure the accuracy of the obtained results, the films were also investigated with a nanoindenter and a wafer curvature measurement tool .
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AZZURRO Semiconductors AG Produces 150 mm GaN On Si On Thomas Swan CCS
Moreover, the new in-situ wafer curvage measurement tool gives us even more control over the growth process, which is essential for large diameter growth as for our 150 mm GaN on Si wafers." .
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Interlaboratory Study of Eddy-Current Measurement of Excess-Carrier Recombination Lifetime
Of the 167 wafer lifetime testers sampled here, it is noted that for the wafer lifetime measurement tools , three tools measured lifetime values of the two qualification samples that were outside of the bounds determined by this study, none of them measured …
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Warpage and mechanical strength studies of ultra thin 150 mm wafers
An alternative technique used a non contact wafer thickness measurement tool which places the bowed wafers over an array of capacitive transducers.
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