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  • Success Story: Electromechanical Assembly
    A major semiconductor company requested a custom motor coil winding assembly for use in their laser lithography machine. The motor assembly is used in conjunction with the magnet portion of the assembly to adjust the stage on which the wafer is mounted to position the wafer as desired. The assembly
  • Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination
    used to mount the wafer during the die sawing operation. The analytical equipment and methodology used to determine the failure mechanism are described. Auger Electron Spectroscopy and X-ray Photoelectron spectroscopy are used to identify the elements and their chemical states on the die bonding
  • Avago Introduces 18 GHz and 26.5 GHz Low-Noise E-pHEMT in 0402 Compatible Packages Produced by Advanced Wafer-Scale Packaging Technology (.pdf)
    the size and performance advantage of bare die assembly and the reliability of encapsulated devices, while permitting automated assembly processes and low production costs. According to the IPC/JEDEC J-STD-012 definition, a chip scale package is a single-die, surface-mountable pack¬age with an area
  • Application: Instrumentation Grade Reed Relays
    Today's high tech electronic fields continue to. prosper with innovative new products using finer and finer integrations that drive components smaller and smaller. Whether the electronic components are mounted on PCBs, at the wafer level or the finished component level, testing these components
  • From Silicone to the Smartphone: Intelligent Production Logistics for the Electronics Industry
    This white paper describes the value chain in the electronics industry. The value chain encompasses the manufacturing of semiconductor chips based on silicon wafers and electronic components like connectors and capacitors, their placement on printed circuit boards, and the mounting of subassemblies
  • Measuring the Volume of Integrated Circuit Chipping After the Dicing Process Using a Digital Microscope
    Integrated circuit (IC) manufacturing can be broken down into two processes-forming circuits on bare wafers and packaging. The circuit formation process begins with cylindrical pieces of semiconductor material. The cylinders are sliced into thin, circular pieces called bare wafers. The bare wafers
  • Hernon Supertacker Used in UConn Application
    Supertacker (R) involves bonding mounting wires to diamond wafers. Project lead Igor Senderovich is a Graduate Student at UConn. The diamond radiators are part of a larger project of building a Tagger Microscope, which is a movable, high-resolution hodoscope that counts post- bremsstrahlung
  • Three Common Types of Pressure-Sensor Packages
    At the heart of every MEMS pressure sensor is a MEMS silicon die. Merit Sensor owns and operates a wafer fab, where it produces all of its own MEMS die. Packaging a MEMS die requires specialized equipment and skills to handle the small and sensitive die and to perform delicate wire bonding

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