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Supplier: Newark, An Avnet Company
Description: TA 33 68K 1% e / Waffle Pack
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Supplier: Newark, An Avnet Company
Description: TA 33 684K 1% e / Waffle Pack
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Supplier: Newark, An Avnet Company
Description: TA 22 150K 1% e / Waffle Pack
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Supplier: Newark, An Avnet Company
Description: TA 22 290K 1% e / Waffle Pack
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Supplier: ASAP Semiconductor LLC
Description: NET DIVIDER,5K/10K,.1%,.1% RATIO,WAFFLE PACK
- Tolerance: 0.1 +/- %
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Supplier: Skyworks Solutions, Inc.
Description: frequencies of 2.5 GHz and higher. The SMV1705-099 is supplied as 100 percent electrically tested, fully singulated wafers mounted on a film frame. The SMV1705- 000 is supplied as a 100 percent electrically tested die in waffle packs.
- VR: 12 volts
- Features: Varactor Diodes
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Supplier: Utmel Electronic Limited
Description: Current Mode PWM Controller 5.1V 2A 21-Pin DIE Waffle Pack
- TJ: 25 C
- Pin Count: 0 #
- Device Type: CardBus Controller
- Features: Other
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Supplier: ASAP Semiconductor LLC
Description: Res Thin Film 2010 1 Ohm 5% 1W ¦300ppm/¦C SMD Waffle Pack
- Tolerance: 5 +/- %
- Temperature Coefficient (TCR): 300 ±ppm/°C
- Power Rating: 1 watts
- Mounting / Packaging: 2010, Surface Mount (SMT / SMD)
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Supplier: ASAP Semiconductor LLC
Description: Res Thin Film 0603 511 Ohm 0.1% 3/20W ¦25ppm/¦C SMD Waffle Pack
- Tolerance: 0.1 +/- %
- Temperature Coefficient (TCR): 25 ±ppm/°C
- Power Rating: 20 watts
- Mounting / Packaging: 0603, Surface Mount (SMT / SMD)
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Supplier: ASAP Semiconductor LLC
Description: Res Thin Film 0603 2K Ohm 1% 3/20W ¦100ppm/¦C SMD Waffle Pack
- Tolerance: 1 +/- %
- Temperature Coefficient (TCR): 100 ±ppm/°C
- Power Rating: 20 watts
- Mounting / Packaging: 0603, Surface Mount (SMT / SMD)
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Supplier: Quarktwin Technology Ltd.
Description: DIE ON TRAY, WAFFLE PACK
- TJ: -40 to 150 C
- Features: Other, RoHS Compliant
- Device Type: Storage Interface
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Supplier: Acme Chip Technology Co., Limited
Description: DICE (WAFER SAWN) - WAFFLE PACK
- Device Type: Sensor Interface
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Supplier: ODG (Origin Data Global)
Description: DICE (WAFER SAWN) - WAFFLE PACK
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Supplier: Lingto Electronic Limited
Description: DICE (WAFER SAWN) - WAFFLE PACK
- Device Type: Sensor Interface
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Description: DICE (WAFER SAWN) - WAFFLE PACK
- Device Type: Sensor Interface
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Supplier: ODG (Origin Data Global)
Description: WAFFLE PACK 100 PCE,QUAD FET &PI
- Features: Other
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Supplier: Acme Chip Technology Co., Limited
Description: WAFFLE PACK 100 PCE,QUAD FET &PI
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Supplier: Richardson RFPD
Description: Hyperabrupt Tuning Varactors Supplied on Film Frame and Waffle Packs
- CDmin/CDmax: 3
- Features: Other, RF Diodes
- Configuration: Single
- Diode Type: Varactor Diodes
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Supplier: VAST STOCK CO., LIMITED
Description: Sensor Interface ZSSC3026CI4R IN DIE WAFFLE PACK
- Features: Other, RoHS Compliant
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Supplier: VAST STOCK CO., LIMITED
Description: SCRs 35A Vrrm 600 350A 1.0A Waffle Pack
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Supplier: VAST STOCK CO., LIMITED
Description: Bipolar Transistors - BJT NPN 2N2222A 75Vcbo Bare die-Waffle Pack
- Features: Bipolar RF Transistors
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Supplier: Knowles Precision Devices
Description: Ultra Broadband DC Blocking. Benefits Resonance Free DC Blocking to > 40 GHz Surface Mountable by Solder or Epoxy Bonding Low Frequency Stability over Temperature Very Low Series Inductance Available in Tape & Reel or Waffle Pack 0201, 0402 or 0603 footprints
- Frequency Range: 0.000016 to 40 GHz
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Supplier: Milwaukee Electric Tool Corporation
Description: CORDLESS, HEATED TYPE S SIZE GRAY COLOR WAFFLE WEAVE COTTON/POLYESTER BLEND LINING COTTON/POLYESTER BLEND FABRIC HEAVY DUTY, M12 BRAND HEAT ELEMENTS CORE ZONE R CHEST, L CHEST, BACK HEAT SETTINGS (3) HIGH, MEDIUM, LOW BATTERY TYPE 12 VOLT M12 LITHIUM ION INCLUDES (1) M12 REDLITHIUM COMPACT
- Material: Cotton, Polyester
- Clothing Type: Jacket/Coat
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Supplier: Knowles Precision Devices
Description: space-saving footprints and more Benefits Resonance Free DC Blocking to > 40 GHz Surface Mountable by Solder or Epoxy Bonding Low Frequency Stability over Temperature Very Low Series Inductance Available in Tape & Reel or Waffle Pack 0201, 0402 or 0603 footprints
- Configuration / Form Factor: Leaded Capacitor
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Supplier: Merit Sensor Systems
Description: The J Series is ideal for high-volume, low-pressure applications. Features Pressure 1 to 300 psi (0.07 to 21 bar; 7 to 2100 KPa) Temperature -40 to 150 °C Configuration Absolute, gage, differential or vacuum Media Clean, dry air and non-corrosive gases Shipping Wafers on tape, waffle
- Impedance: 4 to 6 kohms
- Operating Temperature: -40 to 150 C
- Pressure Range: 1 to 300 psi
- Pressure Type: Absolute, Differential, Gauge, Vacuum
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: WAFFLE PACK 100 PCE,QUAD FET &PI Product overview: MADR-009190-000DIE from MACOM Technology Solutions is a MOSFET Transistor for power switching, load control, motor drives, DC-DC converters, battery systems, and board-level power design. It is useful for engineers and buyers comparing
- Features: MOSFET, Other
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Supplier: Merit Sensor Systems
Description: to 150 °C Configuration Absolute, gage, differential, or vacuum Media Clean, dry air and non-corrosive gases Shipping Wafers on tape or waffle pack Flexibility Sensitivity, resistance, bridge, constraint, etc. Benefits Performance Enjoy best-in-class performance due to Merit’s
- Operating Temperature: -40 to 150 C
- Pressure Range: 15 to 300 psi
- Pressure Type: Absolute, Differential, Gauge, Vacuum
- Applications: Automotive, Industrial
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Supplier: Semtech Corp.
Description: applications. This product is qualified to JAN, JANTX (JTX), JANTXV (JTXV) and JANS quality levels. These rugged device types can be ordered in bulk, tape & reel and waffle pack.
- IR: 0.00005 to 0.15 mA
- VZ: 6.2 to 220 volts
- ZZT: 1 to 1,500 ohms
- Features: Voltage Regulation, Zener Diodes
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Supplier: Skyworks Solutions, Inc.
Description: be supplied with only sample testing packaged in vials. Packaging in waffle packs with 100% electrical test and visual inspection is available if required.
- Capacitance Range: 0.000033 microF
- Applications: RF / Microwave Capacitors
- Configuration / Form Factor: Surface Mount / Chip Capacitor
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Supplier: Cymbet Corporation
Description: rechargeable energy cell with a nominal 3.8V output. Recharge is fast and simple, with a direct connection to a 4.1V voltage source and no current limiting components. Recharge time is 10 minutes to 80% capacity. Robust design offers thousands of charge/discharge cycles. tape-and-reel, or
- Voltage: 3.8 volts
- Capacity, Amp Hours (AH): 0.000012 ampere-hr
- Operating Temperature: -4 to 158 F
- Features: Other, Rechargeable (Secondary) Batteries
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Supplier: Palomar Technologies, Inc
Description: customers with a complete microelectronic solution for P-side down laser diode attachment (die-to-wafer), pulsed heat pick tool for 80/20 Au/Sn pulsed reflow attachment, wafer stage with steady state heating, and waffle or gel pack presentation of laser diode applications. The 6500 Die
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Supplier: Microchip Technology, Inc.
Description: 2” Waffle Pack or Tape and Reel." Additional Features Selectable gain configurations - 16dB and 19dB Ultra low input capacitance - 0.35pF typical Ultra low equivalent input noise performance - 1.9?VRMS to 2.5?VRMS (Cmic = SC, varies with gain) 8kV ESD tolerance High RFI tolerance, low
- Features: Other
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(VSWR) – increases transmitted power Multiple attenuation values – available in 1-10dB, 15dB and 20dB options Up to 1 watt power handling – reliable performance in demanding environments Available in waffle packs or optional tape-and-reel formats for streamlined assembly (read more)
Browse Chip Resistors Datasheets for Molex Signal Tech Industrial Ltd.
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Point of Care Diagnostics Success Story
sizes from waffle packs and placing to plastic housings without damage.
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http://dspace.mit.edu/bitstream/handle/1721.1/34671/71302772-MIT.pdf?sequence=2
Issuance of Full Waffle Packs to the Floor.
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Adsorbed contamination on ceramic surfaces stored in industrial ambient conditions and its effect on epoxy bleed
Samples were stored in commercial polymer waffle packs in a variety of atmospheres which they might experience in industry, on an industrial site, for one month.
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Bare die tape and reel for high volume manufacturing
Die in waffle packs .
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Multilayer Ceramic Chip Capacitor
9 Packaging: B=Bulk, M=7" reel, R=13" reel, W= Waffle pack .
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Selecting methods for packing, shipping, and handling of low cost good die
Small quantities of die in each waffle pack limit preload capabilities on placement machines and require frequent reloading within a relatively large area on the placement machine component input platen.