Waffle Pack

Description: wireless frequencies of 2.5 GHz and higher. The SMV1705-099 is supplied as 100 percent electrically tested, fully singulated wafers mounted on a film frame. The SMV1705- 000 is supplied as a 100 percent electrically tested die in waffle packs.

• VR: 12 volts

Description: .2, which makes the SMV2025 series suitable for wide-bandwidth VCOs and wide phase-range phase shifters. The SMV2025-099 is supplied as 100-percent electrically tested, fully singulated wafers mounted on a film frame. The SMV2025-000 is supplied as a 100-percent electrically tested die in

• Diode Type: Varactor Diodes
• VR: 20 volts

Description: .2, which makes the SMV2025 series suitable for wide-bandwidth VCOs and wide phase-range phase shifters. The SMV2025-099 is supplied as 100-percent electrically tested, fully singulated wafers mounted on a film frame. The SMV2025-000 is supplied as a 100-percent electrically tested die in

• VR: 20 volts

Description: THIN FILM,2512,2W,300,5%, 100PPM,WAFFLE PACK

• Mounting / Packaging: 2512
• Power Rating: 2 watts
• Technology / Construction: Thin Film
• Tolerance: 5 +/- %

Description: NET DIVIDER,5K/10K,.1%,. 1% RATIO,WAFFLE PACK

• Tolerance: 0.1000 +/- %

Description: Current Mode PWM Controller 5.1V 2A 21-Pin DIE Waffle Pack

• Device Type / Applications: CardBus Controller
• IC Package Type: Other
• Pin Count: 0.0 #
• Supply Voltage: Other

Description: Res Thick Film 2010 1K Ohm 5% 1W ¦300ppm/¦C SMD Waffle Pack

• Mounting / Packaging: Surface Mount (SMT / SMD), 2010
• Power Rating: 1 watts
• Technology / Construction: Thick Film
• Temperature Coefficient (TCR): 300 ±ppm/°C

Description: Res Thin Film 2010 1 Ohm 5% 1W ¦300ppm/¦C SMD Waffle Pack

• Mounting / Packaging: Surface Mount (SMT / SMD), 2010
• Power Rating: 1 watts
• Technology / Construction: Thin Film
• Temperature Coefficient (TCR): 300 ±ppm/°C

Description: DICE (WAFER SAWN) - WAFFLE PACK

Description: DICE (WAFER SAWN) - WAFFLE PACK

Description: DICE (WAFER SAWN) - WAFFLE PACK

Description: DICE (WAFER SAWN) - WAFFLE PACK

Description: DICE (WAFER SAWN) - WAFFLE PACK

• Device Type / Applications: Storage Interface
• RoHS Compliant: Yes

Description: WAFFLE PACK 100 PCE,QUAD FET &PI

• IC Package Type: Other
• Technology: Other

Description: WAFFLE PACK 100 PCE,QUAD FET &PI

Description: Hyperabrupt Tuning Varactors Supplied on Film Frame and Waffle Packs

• Diode Type: Varactor Diodes, RF Diodes

Description: Bipolar Transistors - BJT NPN 2N2222A 75Vcbo Bare die-Waffle Pack

• Transistor Type: Bipolar RF Transistors

Description: Sensor Interface ZSSC3026CI4R IN DIE WAFFLE PACK

• IC Package Type: Other
• RoHS Compliant: Yes

Description: SCRs 35A Vrrm 600 350A 1.0A Waffle Pack

Description: Ultra Broadband DC Blocking. Benefits Resonance Free DC Blocking to > 40 GHz Surface Mountable by Solder or Epoxy Bonding Low Frequency Stability over Temperature Very Low Series Inductance Available in Tape & Reel or Waffle Pack 0201, 0402 or 0603 footprints

• Frequency Range: 1.60E-5 to 40 GHz

Description: CORDLESS, HEATED TYPE S SIZE GRAY COLOR WAFFLE WEAVE COTTON/POLYESTER BLEND LINING COTTON/POLYESTER BLEND FABRIC HEAVY DUTY, M12 BRAND HEAT ELEMENTS CORE ZONE R CHEST, L CHEST, BACK HEAT SETTINGS (3) HIGH, MEDIUM, LOW

• Clothing Type: Jacket/Coat
• Material: Cotton, Polyester

Description: , waffle pack Flexibility Sensitivity, resistance, bridge, constraint, etc. Benefits Performance Enjoy best-in-class performance due to Merit’s proprietary Sentium technology Cost Save money over time with high-performing die Security Feel confident doing business with an

• Device Category: Sensor
• Media: Gas
• Operating Temperature: -40 to 302 F
• Pressure Reading: Absolute, Differential, Gauge, Vacuum

Description: , chips can be supplied with only sample testing packaged in vials. Packaging in waffle packs with 100% electrical test and visual inspection is available if required.

• Applications: RF / Microwave Capacitors
• Capacitance Range: 4.70E-5 microF

Description: are listed on the Land & Maritime (DSCC, DESC) QPD (QPL). They are also qualified to JAN, JANTX (JTX), JANTXV (JTXV) and JANS quality levels and are available in bulk, tape and reel and waffle pack.

• Diode Applications: Rectifier Diode
• I_F: 100 to 6000 mA
• t_rr: 25 to 5000 ns

Description: suited for industrial, medical, space, marine and military applications. This product is qualified to JAN, JANTX (JTX), JANTXV (JTXV) and JANS quality levels. These rugged device types can be ordered in bulk, tape & reel and waffle pack.

• I_R: 5.00E-5 to 0.1500 mA
• V_Z: 6.2 to 220 volts
• Z_ZT: 1 to 1500 ohms

Description: based on a patented, all solid state, rechargeable energy cell with a nominal 3.8V output. Recharge is fast and simple, with a direct connection to a 4.1V voltage source and no current limiting components. Recharge time is 10 minutes to 80% capacity. Robust design offers thousands of

• Capacity, Amp Hours (AH): 1.20E-5 ampere-hr
• Operating Temperature: -4 to 158 F
• Specialty Cells: Thin Film
• Standard Battery Sizes: Other

Description: is based on a patented, all solid state, rechargeable energy cell with a nominal 3.8V output. Recharge is fast and simple, with a direct connection to a 4.1V voltage source and no current limiting components. Recharge time is 10 minutes to 80% capacity. Robust design offers thousands of

• Capacity, Amp Hours (AH): 1.20E-5 ampere-hr
• Operating Temperature: -4 to 158 F
• Standard Battery Sizes: Other
• Voltage: 3.8 volts

Description: dB. Packaging is bumped chip scale SMD configuration, with a size of 930?m x 580?m and an overall thickness of 350?m (including solder bumps). Optimum for 3mm microphones, the die is RoHS compliant, with lead free solder pads of 118?m diameter. Packing styles available are 2” x 2” Waffle

• Package Type: Other

Description: ) eutectic die attach on the 6500 Die Bonder provides customers with a complete microelectronic solution for P-side down laser diode attachment (die-to-wafer), pulsed heat pick tool for 80/20 Au/Sn pulsed reflow attachment, wafer stage with steady state heating, and waffle or gel pack