Help with Smart Card Chips specifications:
General Specifications
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| Type | |||
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| Contact | An independent card reader must read the chip. This is supported by ISO 7816 contact. | ||
| Contactless | The chip does not require a card reader to operate, but rather uses radio frequency signals. This is supported by ISO 14443A Contactless. | ||
| Combi Chip | Combi cards are plastic cards with a central processing unit (CPU), chip operating system (COS), security module and memory embedded in the surface as an IC chip. They incorporate both contact and contactless functions. A single card can serve as an ID, be used in place of cash, and pay for public transportation among many other applications. In short, users only have to carry one card. Since these contactless cards do not require a reader, they are composed of a serial interface for the computer and an antenna to connect to the card. Readers for contactless smart cards may or may not have a slot, as some smart cards can be read when within 1.5 meters of the reader, while others need to be positioned a few millimeters from the reader to be read accurately. | ||
| Other | Other unlisted smart card chips type. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Interface | |||
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| USB | Universal serial bus (USB) is an external bus standard that supports data transfer rates of 12 Mbps. A single USB port can be used to connect up to 127 peripheral devices, such as mice, modems, and keyboards. USB also supports Plug-and-Play installation and hot plugging. | ||
| PCMCIA | Personal Computer Memory Card International Association (PCMCIA) is an organization consisting of some 500 companies that has developed the standards for small, credit card-sized devices called PC cards. Originally designed for adding memory to portable computers, PCMCIA standards have been expanded several times and are now suitable for many types of devices. There are in fact three types of PCMCIA cards. All three have the same rectangular size (85.6 by 54 millimeters), but different widths: Type I cards can be up to 3.3 mm thick, and are used primarily for adding additional ROM or RAM to a computer; Type II cards can be up to 5.5 mm thick. These cards are often used for modem and fax modem cards. Type III cards can be up to 10.5 mm. | ||
| Serial | General serial interface (UART, and other). | ||
| I2C | Inter-IC (I2C) is a bus designed by Philips Semiconductors in the early 1980s, which is used to connect integrated circuits (ICs). I2C is a multi-master bus, which means that multiple chips can be connected to the same bus and each one can act as a master by initiating a data transfer. | ||
| Other | Other unlisted interface types. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Microprocessor Architecture | Microprocessor units (MPU) execute programmed instructions. Typically, older version smart cards are based on relatively slow, 8-bit embedded microcontrollers. The trend since the 1990s has been toward using customized controllers with a 32-bit reduced instruction set computing (RISC) processor running at 25 to 32 MHz. | ||
| Your choices are... | |||
| 8-Bit | 8-bit microprocessor. | ||
| 12-Bit | 12-bit microprocessor. | ||
| 16-Bit | 16-bit microprocessor. | ||
| 32-Bit | 32-bit microprocessor. | ||
| 64-Bit | 64-bit microprocessor. | ||
| Other | Other unlisted microprocessors. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Performance
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| Clock Speed | The speed at which the microprocessor operates and executes instructions. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Application Memory (Flash / EEPROM) | Electrically erasable programmable read-only memory (EEPROM) and Flash are generally referred to as application memory. EEPROM can be erased electronically and rewritten. By international standards, this memory should retain data for up to 10 years without electrical power and should support at least 10,000 read-write actions during the life of the card. Application memory is used by an executing application to store information on the card. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Internal ROM (Mask) | Read only memory (ROM) or program memory are instructions permanently burned into memory by the chip manufacturer. These instructions (such as when the power supply is activated and the program that manages the password) are the fundamentals of the chip operating system (COS), or as often called, the “Mask.” | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Internal RAM | Random access memory (RAM) or working memory serves as a temporary storage of results from calculations or input/output communications. RAM is a volatile memory and loses information immediately when the power supply is switched off. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Supply Voltage Range (VCC) | The range of voltages needed to drive the chip. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Package Characteristics
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| IC Package Type | |||
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| Bare Die | The device is sold in semiconductor die form. It does not have a case or packaging. | ||
| PBGA | Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm. | ||
| TBGA | Tape ball-grid array (TBGA) uses a fine, polyimide substrate and provides good thermal performance with high pin counts. | ||
| SBGA | Super ball-grid array (SBGA) provides a high-power BGA package with a very low profile. With SBGA, the IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated, providing a significant improvement in electrical performance (inductance). | ||
| FLGA | Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras. | ||
| QFP | Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications. | ||
| LQFP | Low quad flat package (LQFP). | ||
| VQFP | Very thin quad flat package (VQFP). | ||
| SOP | Small outline package (SOP). | ||
| SOIC | Small outline integrated circuit (SOIC). | ||
| TSOP Types I, II | Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II. | ||
| SSOP | Shrink small outline package (SSOP). | ||
| TSSOP | Thin shrink small outline L-leaded package (TSSOP). | ||
| TVSOP | Thin very small outline package (TVSOP). | ||
| SOJ | Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device. | ||
| PLCC | Plastic leaded chip carrier (PLCC). | ||
| LCCC | Leadless ceramic chip carrier (LCCC) | ||
| PDIP | Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications. | ||
| CDIP | Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. | ||
| SIP | Single in-line package (SIP). | ||
| SDIP | Shrink dual in-line package (SDIP). | ||
| SZIP | Shrink zigzag in-line package (SZIP). | ||
| Other | Other unlisted, specialized, or proprietary packages. | ||
| Search Logic: | Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Pin Count | Total number of pins in package. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Features
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| DES Key Encryption | Data Encryption Standard (DES) is a popular symmetric-key encryption method developed in 1975 and standardized by ANSI in 1981 as ANSI X.3.92. DES uses a 56-bit key and uses the block cipher method, which breaks text into 64-bit blocks and then encrypts them. A type of encryption where the same key is used to encrypt and decrypt the message. This differs from asymmetric (or public-key) encryption, which uses one key to encrypt a message and another to decrypt the message. Symmetric-key encryption is an encryption system in which the sender and receiver of a message share a single, common key that is used to encrypt and decrypt the message. Contrast this with public-key cryptology, which utilizes two keys - a public key to encrypt messages and a private key to decrypt them. Symmetric-key systems are simpler and faster, but their main drawback is that the two parties must somehow exchange the key in a secure way. Public-key encryption avoids this problem because the public key can be distributed in a non-secure way, and the private key is never transmitted. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| Triple DES | Triple DES, also referred to as 3DES or TDES, is a mode of the DES encryption algorithm that encrypts data three times. Three 64-bit keys are used, instead of one, for an overall key length of 192 bits (the first encryption is encrypted with second key, and the resulting cipher text is again encrypted with a third key). | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| AES Support | Advanced Encryption Standard (AES). | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| ECC Support | Elliptic Curve Cryptography (ECC). | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| Anti-Intrusion Security | Anti-intrusion features designed to prevent unauthorized device tampering | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| Unique Chip Identification Number | This is a unique number that identifies the smart card chip. A value of 1 denotes the presence of a unique serial number per die. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| ESD Protection | Electrostatic discharge (ESD) protection for the internal pins based on the charged device model (CDM) as defined in JESD-22C-101. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| CRC Supported | Cyclic redundancy check (CRC) algorithms are included in the mask ROM. CRCs are algorithms used to check for transmission errors. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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