Laboratory / Pilot System Plating and Anodizing Equipment
from Technic, Inc.
Mini Plating Plant 3 – Standard Features. Four (4) polypropylene tanks 11 ” x 15 ” x 11 ” deep (7 gallon). Two (2) 1000 watt Teflon heaters with digital thermostats and low level protection. Two (2) 10 amp/18 volt DC CC/CV power supplies. Two (2) 60 minute manual timers. [See More]
- Machinery Type: Laboratory / Pilot System
- Process / Technology: Electroplating
from ECSI Fibrotools
WHAT IT DOES: The Contact Electroplating Technology (CET) enables metallization of isolated electronic patterns by electroplating, without sacrificing the substrate real-estate for establishing direct contact to the power supply. The best way to form or deposit isolated microscopic and nano features... [See More]
- Machinery Type: Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer
- Process / Technology: Electroplating; Electrochemical Depostion (ECD)
from Technic, Inc.
Mini Plating Plant 5 – Standard Features. Six (6) polypropylene tanks 10 ½ ” x 6 ½ ” x 11 ” deep (3 gallon). Two (2) 500 watt Teflon heaters with digital thermostats and low level protection. Two (2) 10 amp/18 volt DC CC/CV power supplies. Two (2) 60 minute... [See More]
- Machinery Type: Laboratory / Pilot System
- Process / Technology: Electroplating
from ECSI Fibrotools
IKo ™ Jr. is a practical benchtop tool with the smallest footprint on the market capable of efficiently electroplating 4 ” wafers with just 1 gallon of solution. Designed for fast electroplating of high-resolution interconnects and fine metallic features on wafers and substrates. [See More]
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
from Technic, Inc.
Light Induced Solar Plating of Front-Side Contacts (For Research and development applications). The plating station is 14"x28"x10" deep (approx. 12 gal.) constructed from ½" thick polypropylene with flange. Stainless steel anode fixture with hinge assembly (anode fixture is designed to... [See More]
- Machinery Type: Laboratory / Pilot System
- Application / Industry: Solar / Photovoltaic
- Process / Technology: Electroplating
from ECSI Fibrotools
The Slim version of IKo ™ CLASSIC ™ is designed to fit a fume hood. With the footprint of 17 ″ x 28 ″ it enables fitting up to 3 modules in a fume hood for multiple simultaneous operating sites within a single electroplating Station. The power supply is located in prefered... [See More]
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
from Technic, Inc.
Designed for small scale testing of copper plating of PCBs plating. Mini Electroless Copper Line – Standard Features. Seven (7) polypropylene tanks 10 ½ ” x 6 ½ ” x 11 ” deep (3 gallon). One (1) Stainless steel tank 10 ½ ” x 6 ½ ” x 11... [See More]
- Machinery Type: Laboratory / Pilot System
- Application / Industry: Printed Circuit Boards (PCB)
- Process / Technology: Electroless
from ECSI Fibrotools
The IKo ™ STATION ™ is a self-contained, complete plating system for MEMS and NANO fabrication – wafer installation, cleaning, activation, DI rinsing and electroplating – ideal for a wide range, 2 cm2 to 8 ″ odd shape substrates and wafers. Easily retrofitted to a... [See More]
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
from Technic, Inc.
Technic ’s Mini Mods are self-contained plating units with a built-in utility shelf for rectifiers, meters and additional controls. Mini Mod 2 - Standard Features. Two (2) polypropylene tanks 11 ” x 15 ” x 11 ” deep (7 gallon). One (1) 1000 watt Teflon heater with digital... [See More]
- Machinery Type: Laboratory / Pilot System
- Application / Industry: Printed Circuit Boards (PCB)
- Process / Technology: Electroplating
from ECSI Fibrotools
The original. The IKo ™ CLASSIC ™ is a practical benchtop tool with the smallest footprint for up to 8 ″ wafers on the market. It ’s designed simply to electroplate high-resolution interconnects and fine metallic features on wafers and substrates. Contamination Resistant. [See More]
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
from Technic, Inc.
Technic ’s Mini Mods are self-contained plating units with a built-in utility shelf for rectifiers, meters and additional controls. Mini Mod 3 - Standard Features. Three (3) polypropylene tanks 10 ½ ” x 6 ½ ” x 11 ” deep (3 gallon). One (1) 500 watt Teflon... [See More]
- Machinery Type: Laboratory / Pilot System
- Application / Industry: Printed Circuit Boards (PCB)
- Process / Technology: Electroplating
from Technic, Inc.
Technic's EBA, unlike other control methods, it utilizes both DC & AC voltammetry for precise analysis of plating additives. Technic EBA provides precise measurements with real time data with SPC controllability. It is a fully automated system with a self-contained probe that eliminates... [See More]
- Machinery Type: Laboratory / Pilot System
- Application / Industry: Electrical / Electronic Parts (Connectors, Pins, etc.)
- Process / Technology: Electroplating