Electrical -- E2001
from Epoxy Technology

EPO-TEK ® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. [See More]

  • Features: Thermally Conductive; Electrically Conductive Compound
  • Chemical System: Epoxy
  • Type: CastingResin
  • Filler: Metal or MIM
EP21CLV
from Master Bond, Inc.

Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more... [See More]

  • Features: Anti-static or ESD Control; Electrically Conductive Compound; EMI / RFI Shielding Material
  • Chemical System: Epoxy
  • Type: CastingResin
  • Form / Shape: Liquid