Aerospace Thermosets and Thermoset Resins

10 Results
ELAN-Tron® -- E 4141 White Resin / C 4141 Hardener
from ELANTAS North America LLC

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Aerospace; Electronics; OEM or Industrial; Tooling
  • Chemical System: Epoxy
  • Type: MoldingCompound; CastingResin
  • Filler: Mineral or Inorganic
Electrically Insulative, Two Component Epoxy System -- EP30M3LV-NV
from Master Bond, Inc.

Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin
  • Form / Shape: Liquid
Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE-LO
from Master Bond, Inc.

Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing and casting. This new two component epoxy resin compound which cures... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: Optical; CastingResin
  • Form / Shape: Liquid
Flexibilized and Toughened Low Viscosity Epoxy -- EP21FL
from Master Bond, Inc.

Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin
  • Form / Shape: Liquid
Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity -- Supreme 121AO
from Master Bond, Inc.

Key Features. Free flowing viscosity. High temperature resistance. Exceptionally long open time. Passes NASA low outgassing. Product Description. Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a... [See More]

  • Industry: Aerospace; Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Epoxy
  • Type: Optical; CastingResin
  • Form / Shape: Liquid
GP® 445D05 Resin
from Georgia-Pacific Chemicals LLC

A high temperature phenolic resin developed for use in the manufacture of fiber-reinforced polymer (FRP) that meets the requirements of Military Specification MIL-R-9299C, Type II, Class 2. The product is formulated to provide low smoke generation, flame resistance and strength as well as fire... [See More]

  • Industry: Aerospace; Military
  • Filler: Unfilled
  • Chemical System: Phenolics or Formaldehyde Resins
  • Form / Shape: Liquid
Fluoroelastomer Polymers -- 3M™ Dyneon™ Fluoropolymers
from 3M Advanced Materials Division

In 1969, astronauts boarded the Apollo 11 spacecraft wearing boots containing 3M ™ Dyneon ™ Fluoroelastomers. Today, these synthetic elastomeric materials are used in some of the toughest environments on earth. From hot-running automotive engines to harsh chemicals of semiconductor... [See More]

  • Industry: Aerospace; Automotive; Electronics; Energy Conversion (Battery / Fuel Cell); Electrical Power or High Voltage; Marine; Sanitary; Military; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Oil &Gas Exploration
  • Chemical System: Fluoropolymer
  • Type: Optical; ExtrusionGrade; FilmGrade; MoldingCompound
  • Filler: Unfilled
Silicone Glazing, Perimeter, & Joint Sealant -- ELASTOSIL® 4100
from Wacker Chemical Corp.

One-component, acid-curing, low-modulus silicone sealant for glazing and industrial applications. ELASTOSIL ® 4100 cures at room temperature under the action of atmospheric moisture to give a permanently flexible silicone rubber. Special features. suitable for use in sanitary areas. [See More]

  • Industry: Aerospace; Automotive; Marine; Repair or Construction; OEM or Industrial
  • Chemical System: Silicone
  • Type: ExtrusionGrade
  • Filler: Unfilled
Spectrally Transparent Epoxy -- EPO-TEK® 301
from Epoxy Technology

We have served the optical market since 301 was introduced in 1969.   Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK ® fabricated components are the building blocks of camera, laser,... [See More]

  • Industry: Aerospace; Optoelectronics or Photonics; Semiconductors or IC Packaging
  • Chemical System: Epoxy
  • Type: Optical; CastingResin
  • Filler: Unfilled
Unfilled Polyimide -- TECASINT 2011 Brown
from Ensinger North America

TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has... [See More]

  • Industry: Aerospace; Electronics; Sanitary; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Chemical System: Bismaleimide (BMI)
  • Deflection Temperature: 600