Semiconductors / Electronics (Wafers) Abrasive Compounds and Abrasive Slurries
from Beijing Grish Hitech Co., Ltd.
GRISH CMP slurry is mainly based on colloids. The formula made through scientific proportioning can ensure the stability of pH value during the polishing process, thereby ensuring the stability of the polishing rate and saving time. CMP slurries are widely used in mechanical polishing of various... [See More]
- Materials / Substrates Finished: Ophthalmic or Optical; Wafers, Electronic, and Semiconductor Materials
- Form: Slurry
- Type: Polishing
- Compound / Abrasive Type: CMP
from Beijing Grish Hitech Co., Ltd.
GRISH detonation nano diamonds (DND) are made of carbon dissociated from explosives detonated under high temperature and pressure. They are spherical in shape without sharp edges and corners, and are more suitable for polishing workpieces that require high precision. [See More]
- Materials / Substrates Finished: CeramicsGlass; Ophthalmic or Optical; Wafers, Electronic, and Semiconductor Materials; Stainless Steel; Steel / Steel Alloys
- Form: Powder
- Type: Polishing
- Compound / Abrasive Type: Diamond
from Beijing Grish Hitech Co., Ltd.
GRISH Dewax Liquid is an eco-friendly cleaner that can remove the wax layer on the surface of the part very well. It is a mild chemical liquid, non-toxic and harmless, but has a strong cleaning ability. It is a very common cleaning solution in the field of LED and window chips. [See More]
- Materials / Substrates Finished: Ophthalmic or Optical; Wafers, Electronic, and Semiconductor Materials
from Beijing Grish Hitech Co., Ltd.
GRISH diamond microbead powder is a relatively basic polishing powder. Made of micron-sized diamond beads containing even smaller micron-sized diamond particles. Its special microstructure makes it have good performance, strong continuous polishing force, high removal rate, and less surface... [See More]
- Materials / Substrates Finished: CeramicsGlass; Ophthalmic or Optical; Wafers, Electronic, and Semiconductor Materials; Stainless Steel; Steel / Steel Alloys
- Form: Powder
- Type: Polishing
- Compound / Abrasive Type: Diamond
from Beijing Grish Hitech Co., Ltd.
GRISH High-efficiency lapping agent is a high-quality water-soluble high-efficiency lapping agent. It can be used in combination with B4C to efficiently polish the double-sided grinding process and easily achieve the ideal end face, giving the workpiece a brand-new appearance and protecting the... [See More]
- Materials / Substrates Finished: Ophthalmic or Optical; Wafers, Electronic, and Semiconductor Materials
- Form: Slurry
- Type: Lapping
from Beijing Grish Hitech Co., Ltd.
GRISH Liquid wax is a temporary adhesive commonly used in the processing of third-generation semiconductors such as sapphire substrates. The wax liquid is stable and not easy to generate air bubbles. When polishing, the workpiece can quickly reach the ideal end surface. [See More]
- Materials / Substrates Finished: Ophthalmic or Optical; Wafers, Electronic, and Semiconductor Materials
from Advanced Abrasives Corp.
Premasol CS colloidal Silica Suspension. Premasol CS colloidal silica suspension contains spherical silica particles with an average size of 50 nm and held in a suspension with a pH range of 9-11 that is formulated to resist drying. In the event that Premasol CS is left for a long period to dry on a... [See More]
- Materials / Substrates Finished: CeramicsGlass; Wafers, Electronic, and Semiconductor Materials; CMP of Sapphire Wafers, Silicon Wafers, Gallium Nitride, Quartz, Metallographic Specimens
- Form: Liquid / Dispersion; Other; Suspension
- Type: CMP / Wafer Planarization
- Compound / Abrasive Type: Silca; Ceramic
from Saint-Gobain Surface Conditioning Group
Saint-Gobain Ceramic Materials' sub-micron E-Powders are calcined aluminum oxide powders (99%+ purity), designed for use as a functional filler to enhance the properties of a product. In Magnetic Media applications, users report a reduced drop-out count due to the gentle, continuous cleaning action... [See More]
- Materials / Substrates Finished: Wafers, Electronic, and Semiconductor Materials
- Form: Powder
- Type: Polishing
- Compound / Abrasive Type: Aluminum Oxide
from Saint-Gobain Surface Conditioning Group
Saint-Gobain's sub-micron polishing slurries are calcined aluminum oxide particles (99%+ purity) suspended in aqueous solution, designed for use in electronics and industrial polishing applications. They are offered with only a minimal of additives, and are intended as the particle additive to your... [See More]
- Materials / Substrates Finished: Wafers, Electronic, and Semiconductor Materials
- Form: Powder
- Type: Polishing
- Compound / Abrasive Type: Aluminum Oxide
from Saint-Gobain Surface Conditioning Group
Alumina Submicron Polishing Particles, 7956. Industrial Lapping and Polishing. Product Code: 7956. Saint-Gobain Ceramic Materials' sub-micron polishing slurries are calcined aluminum oxide particles (99%+ purity) suspended in aqueous solution, designed for use in electronics and industrial polishing... [See More]
- Materials / Substrates Finished: Wafers, Electronic, and Semiconductor Materials
- Form: Powder
- Type: Polishing
- Compound / Abrasive Type: Aluminum Oxide
from Saint-Gobain Surface Conditioning Group
Saint-Gobain Ceramic Materials' sub-micron polishing slurries are calcined aluminum oxide particles (99%+ purity) suspended in aqueous solutions, designed for use in electronics and industrial polishing applications. They are offered with only minimal additives and are intended as the particle... [See More]
- Materials / Substrates Finished: Wafers, Electronic, and Semiconductor Materials
- Form: Slurry
- Type: Polishing
- Compound / Abrasive Type: Aluminum Oxide