Semiconductors / Electronics (Wafers) Abrasive Compounds and Abrasive Slurries Datasheets

Premasol CS colloidal Silica Suspension
from Advanced Abrasives Corp.

Premasol CS colloidal Silica Suspension. Premasol CS colloidal silica suspension contains spherical silica particles with an average size of 50 nm and held in a suspension with a pH range of 9-11 that is formulated to resist drying. In the event that Premasol CS is left for a long period to dry on a... [See More]

  • Materials / Substrates Finished: CeramicsGlass; Wafers, Electronic, and Semiconductor Materials; CMP of Sapphire Wafers, Silicon Wafers, Gallium Nitride, Quartz, Metallographic Specimens
  • Form: Liquid / Dispersion; Other; Suspension
  • Type: CMP / Wafer Planarization
  • Compound / Abrasive Type: Silca; Ceramic
Final Polishing Suspensions
from Buehler, an ITW Company

Final polish solutions remove the final layer of surface deformation often invisible to the naked eye. Yet the removal of this deformation is essential when evaluating with high magnification, polarized light, differential interfence contrast as well as using EBSD techniques. A variety of... [See More]

  • Materials / Substrates Finished: Wafers, Electronic, and Semiconductor Materials; Minerals, Ferrous Metals, Low Melting Point Alloys, Carbides, Precious Metals
  • Form: Liquid / Dispersion
  • Type: Polishing
  • Compound / Abrasive Type: Silca
Cerium Oxide
from Ferro Corporation-Electronic Material Systems

Offer a range of purities, average particle size can be smaller than 100nm [See More]

  • Materials / Substrates Finished: CeramicsGlass; Ophthalmic or Optical; Wafers, Electronic, and Semiconductor Materials
  • Form: Powder
  • Type: CMP / Wafer Planarization; Polishing
  • Compound / Abrasive Type: Cerium Oxide
Alumina E-Powder -- E266
from Saint-Gobain Surface Conditioning Group

Saint-Gobain Ceramic Materials' sub-micron E-Powders are calcined aluminum oxide powders (99%+ purity), designed for use as a functional filler to enhance the properties of a product. In Magnetic Media applications, users report a reduced drop-out count due to the gentle, continuous cleaning action... [See More]

  • Materials / Substrates Finished: Wafers, Electronic, and Semiconductor Materials
  • Form: Powder
  • Type: Polishing
  • Compound / Abrasive Type: Aluminum Oxide