-
Supplier: Acromag, Inc.
Description: 8-lane PCI Express interface Holds one XMC module Acromag’s APCe8675 carrier card interfaces an XMC mezzanine module to a PCI Express bus in a PC-based desktop computer system. The APCe8675 is a PCIe bus adapter board that allows a PC (PCIe bus master
- Bus / Form Factor: PCI - Full Size
- Carrier Class: Non-intelligent Carrier
- Carrier Type: Other
- Voltage Supplied to Modules: -12 V, 3.3 V, 12 V
-
Supplier: Acromag, Inc.
Description: Non-intelligent PCIe bus carrier Holds four IP modules This board interfaces standard Industry Pack (IP) mezzanine modules to a PCI Express bus on a PC-based computer system. Four IP module slots give you the freedom to mix a variety of I/O functions (A/D, D
- Bus / Form Factor: PCI - Full Size
- Carrier Class: Non-intelligent Carrier
- Carrier Type: IndustryPack®
- Host Specifications: Bus Width: 16-bit, 32-bit
-
Supplier: Acromag, Inc.
Description: 4-lane PCI Express interface Holds one PMC module Acromag’s APCe8670 carrier card interfaces a PMC mezzanine module to a PCI Express bus in a PC-based desktop computer system. The APCe8670 is a PCIe bus adapter board that allows a PC (PCIe bus master) to
- Bus / Form Factor: PCI - Full Size
- Carrier Class: Non-intelligent Carrier
- Carrier Type: PMC
- Modules Specification: Bus Width: 32-bit, Other
-
-
Supplier: Sealevel Systems, Inc.
Description: Get your COM Express project off to a fast start with the TEVAL COM Express carrier board. The TEVAL supports Basic and Compact Type 6 COM Express modules. Standard features include six PCI Express X1 slots, one PCI Express X16 slot, one
-
Supplier: Acromag, Inc.
Description: One XMC mezzanine module slot 3/4-length Non-Intelligent carrier card PCIe x8 interface Acromag’s APCe8775 carrier card interfaces an XMC mezzanine module to a PCI
- Carrier Class: Non-intelligent Carrier
- Carrier Type: Other
- Voltage required by Carrier (Host): -12 V, 3.3 V, 12 V
-
Supplier: Aaeon Systems Inc.
Description: The ECB-916M is a microATX form factor board supporting Type 1 and Type 2 COM Express Modules. AAEON's standard carrier boards can be used in their default configuration or as a starting point for a custom carrier design reducing the cost and time of development.
-
Supplier: Sealevel Systems, Inc.
Description: Get your COM Express project off to a fast start with the Express-BASE6 COM Express carrier board. The Express-BASE6 supports Basic and Compact Type 6 COM Express modules. Standard features include seven PCI Express X1 slots, one
-
Supplier: Aaeon Systems Inc.
Description: storage. Common storage features include PATA, Floppy Disk Drive and two SATA ports. Another key feature of the ECB-910M is the robust expansion capabilities such as two PCI-Express©zx1©{ slots, ExpressCard, Mini Card, PCI, and mini-PCI. Applications Features
-
Supplier: SECO
Description: The Carrier-Trizeps-pCon XS is a very compact and multifunctional Carrier Board Trizeps SODIMM SOMs. In addition to numerous standard interfaces, an analog camera interface and a Mini PCI Express card edge connector are available. The baseboard supports a lot of
- Voltage required by Carrier (Host): Other
-
Supplier: Advantech
Description: The MIC-3954 is a rugged single Eurocard CompactPCI® Serial carrier board with two function options; Option 1: Supports the PCI Express® Mini Card, which offers two standard PCI Express® Mini Card slots, with dual on-board SIM slots for 3G
- Form Factor: 3U
- Technology: CompactPCI® Compliant
-
Supplier: American Portwell Technology Inc.
Description: ATX Form Factor Evaluation Carrier Board For COM Express Type II Module Features COM Express carrier board accepts Portwell Type II COM Express modules ATX form factor to meet most standard mounting space and provide more expansions slots
- Features: Watchdog Timer, Keyboard Support, Mouse Support, Speaker Support, RJ-45 Connectors
- Form Factor: COM Express Basic
- Operating Humidity: 5 to 90 %
- Operating Temperature: 32 to 140 F
-
Supplier: American Portwell Technology Inc.
Description: Micro-ATX Form Factor Evaluation Carrier Board For COM Express Type VI Module Features COM Express carrier board accepts Portwell Type VI COM Express modules Micro-ATX form factor to meet most standard mounting space and provide more expansions
- Features: Watchdog Timer, Keyboard Support, Mouse Support, Speaker Support
- Form Factor: COM Express Basic
- Operating Humidity: 5 to 90 %
- Operating Temperature: 32 to 140 F
-
Supplier: American Portwell Technology Inc.
Description: Micro-ATX Form Factor Carrier Board For COM Express Type VI Module for (BGA) CPU embedded Module Features COM Express carrier board accepts Portwell Type VI BGA COM Express modules Micro-ATX form factor to meet most standard mounting space and provide
- Features: Watchdog Timer, Keyboard Support, Mouse Support, Speaker Support, RJ-45 Connectors
- Form Factor: COM Express Basic
- Operating Humidity: 5 to 90 %
- Operating Temperature: 32 to 140 F
-
Supplier: ELMA Electronic Inc.
Description: with a variety OpenVPX profiles. Examples include: SLT3-PAY-1D-14.2.6 SLT3-PER-1F-14.3.2 SLT3-PER-1U-14.3.3 XMC Configuration: 8 lanes are routed from the VPX backplane to the XMC pn5 connector (x1, x2, x4 or x8 PCI-Express
- Bus / Form Factor: Other
- Carrier Class: Non-intelligent Carrier
- Carrier Type: PMC
- Modules Specification: Bus Width: 32-bit, Other
-
Description: card Conduction or air cooling Gen3 PCI Express Switch x4 PCI Express XMC interface 32-bit, 66 MHz PCI PMC interface P14 and P16 I/O routing No drivers needed Technical Specs VPX x4 PCI Express on port A
- Carrier Type: Other
-
Supplier: Sealevel Systems, Inc.
Description: bus, SMBus and I2C bus. The module includes three Digital Display Interfaces (DDI) for DisplayPort, HDMI or DVI displays. Sealevel specializes in COM Express carrier boards built to your specific application requirements. Our extensive library of proven I/O circuits including
- Capacity: 16000 MB
- Form Factor: COM Express Basic
- Operating Humidity: Up to 90 %
- Operating Temperature: -40 to 185 F
-
Supplier: Sealevel Systems, Inc.
Description: bus, SMBus and I2C bus. The module includes three Digital Display Interfaces (DDI) for DisplayPort, HDMI or DVI displays. Sealevel specializes in COM Express carrier boards built to your specific application requirements. Our extensive library of proven I/O circuits including
- Capacity: 16000 MB
- Form Factor: COM Express Basic
- Operating Humidity: Up to 90 %
- Operating Temperature: -40 to 185 F
-
Supplier: American Portwell Technology Inc.
Description: /O interfaces such as PCI Express, SDVO & SATA Plug-n-run with the carrier boards and save time to market Accept both socket type and BGA type Pentium® M and Celeron® M processors for low power or fan-less applications Maximum 1GB DDR2 memory Equipped with single
- Capacity: 1000 MB
- Features: Speaker Support
- Form Factor: COM Express Basic
- Memory Type: DDR2, SDRAM
-
Supplier: AAEON Electronics, Inc.
Description: COM Express Carrier Board Main Feature Supports COM Express Basic Module, Pin-out Type II VGA/ LVDS/ TV-out Connector RJ-45 x 2 CompactFlash Type II Slot x 1 PCI-Express [x16] Slot x 1, PCI-Express [x1] Slot x
- Bus / Form Factor: Other
- Carrier Type: Other
-
Supplier: WINSYSTEMS, INC.
Description: The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel Atom® E3900 processor. This low power, industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier
- Capacity: 8000 MB
- Certifications: RoHS
- Form Factor: COM Express Compact
- Memory Type: Other
-
Supplier: AAEON Electronics, Inc.
Description: COM Express Carrier Board Main Feature Supports COM Express Module Pin-out Type 1/ 2 RJ-45 x 2, Supports Gigabit Ethernet VGA, LVDS, TV-out Connector 7.1 Channel Audio PATA Connector x 1, SATA Port x 4 (3
- Bus / Form Factor: Other
- Carrier Type: Other
-
Supplier: AAEON Electronics, Inc.
Description: COM Express Carrier Board Main Feature Supports COM Express Module Pin-out Type 1/ 2 (COM.0 Rev. 1.0) RJ-45 x 2, Supports Gigabit Ethernet VGA, LVDS Connector 7.1 Channel Audio PATA Connector x 1, SATA Port x 4
- Bus / Form Factor: Other
- Carrier Type: Other
-
Supplier: AAEON Electronics, Inc.
Description: XTX Carrier Board Main Feature Supports XTX Module RJ-45 x 1, Support 10/100Base-TX Ethernet VGA, LVDS Connector 5.1 Channel Audio (Optional) PATA Connector x 1, SATA Port x 2 USB Port x 3, COM Port x
- Bus / Form Factor: Other
- Carrier Type: Other
-
Supplier: WINSYSTEMS, INC.
Description: The COMeT6-1100 is an industrial COM Express Type 6 Compact module with an Intel® 11th Gen Core™ i3/i5/i7 Processor. This industrial module is designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier
- Capacity: 32000 MB
- Certifications: Other
- Features: Speaker Support
- Form Factor: COM Express Compact
-
Supplier: Aitech Defense Systems, Inc.
Description: The CM870 provides an additional active interface between the 3U VPX backplane and the on-board PMC/XMC module site. Rugged/mil 3U VPX Carrier Board VPX Backplane Fabric Interface with Support for up to Four (4) PCIe x4 Ports per VITA 46.3 and 46.4 PCI Express
-
Supplier: e-con Systems™ Inc
Description: Linux : Ubuntu 14.04 Android : Lollipop 5.0.1 Propus TK1 development board kit contents: eSOMTK1 – TK1 evaluation Kit with Linux: Hardware: eSOMTK1 Module Carrier board (Propus
- Communication Networks: Ethernet
- Flash Memory (RAM): 1.60E7 KB
- I/O Bus Specifications: PCI Express
- Ports: USB
-
Description: 2.0-compliant Each PCIe Mini Card site supports PCIe Integration services with third-party modules available Conformal coating available Technical Specs P15 XMC Interface Up to x8 PCI Express port P14 PMC Interface
- Technology: XMC
-
Supplier: e-con Systems™ Inc
Description: eSOMiMX6PLUS Features NXP's i.MX6 QuadPlus/DualPLus/Qu ad/Dual/DualLite/Sol o ARM™ Cortex-A9 based Processor @ 1/1.2GHz per Core On-board 2GB DDR3L RAM (Expandable up to 4GB) On-board 8GB eMMC FLASH (Expandable up to 64GB) e
- Communication Networks: Ethernet
- Flash Memory (RAM): 8.00E6 KB
- I/O Bus Specifications: PCI Express
- Operating Temperature: -40 to 185 F
-
Supplier: e-con Systems™ Inc
Description: ) SPDIF IN & OUT (x1) iMX6 Micro Rapid Development Kit - Meissa-I e-con Systems™ provides rapid development kit - Meissa-I. This development kit features carrier board around eSOMiMX6-micro system on module with support for various peripherals. The
- Communication Networks: Ethernet
- Flash Memory (RAM): 4.00E6 KB
- I/O Bus Specifications: PCI Express
- Operating Temperature: -31 to 185 F
-
Supplier: e-con Systems™ Inc
Description: Development Kit e-con provides a Rapid development kit for eSOMiMX7 called Acacia. This Development kit features a carrier board around the eSOMiMX7 Module with peripherals. Acacia - Evaluation Kit for eSOMiMX7 SOM For more information, Visit Acacia Development Kit eSOMiMX7 software
- Communication Networks: Ethernet
- Flash Memory (RAM): 128000 to 6.40E7 KB
- I/O Bus Specifications: PCI Express
- Operating Temperature: -4 to 185 F
-
Supplier: SECO
Description: With dual independent display support, the COM-Express® Type 6 Computer on Module (CoM) with the Intel® Atom™ E3800 and Celeron® families offers broad connectivity options (HDMI, DVI, DP, DP++, LVDS, CRT), and it is also available in an Industrial temperature range and features an optional
- Capacity: 8000 MB
- Features: Speaker Support
- Form Factor: COM Express Compact
- Memory Type: DDR3, Other
-
Supplier: Aaeon Systems Inc.
Description: vibration and memory component incompatibility. The module could be ordered with 512MB or 1GB of onboard system memory. A high definition audio interface is available to connect to an audio codec on the carrier board. Moreover, one onboard PATA SSD (Master Device) and one SATAII
- Features: Watchdog Timer
- Memory Type: DDR2
- Operating Humidity: 0.0 to 90 %
- Operating Temperature: 32 to 140 F
-
Supplier: Aaeon Systems Inc.
Description: interfaces. NanoCOM-TC also has a 4-bit SDIO, three PCI-Express[x1], one LPC bus and one SMBus for ample expansion capabilities on the carrier board. "As a small form factor, NanoCOM-TC can easily be embedded into a small panel PC for HMI/Mobile Devices or into an embedded
- Features: Watchdog Timer
- Memory Type: DDR2
- Operating Humidity: 0.0 to 90 %
- Operating Temperature: 32 to 140 F
-
Description: per the NVMe® specification, including block erase and overwrite. All of the sanitization protocols can be invoked via in-band software commands. By utilizing solid-state NVM Express® technology, the XPort6107 provides a high-performance, high-density, reliable memory solution. The
- Capacity: 1000 GB
- Device Type: Solid State Disk
-
Supplier: VOXMICRO
Description: 1775Mbps (dynamic) Industrial Reference Based on Qualcomm reference design QCNFA544 (Hastings, QCA P/N NFA544) Communications Interface WLAN via PCI Express Standard 2.1 host I/O + Bluetooth via UART PIN mapping Antenna Type
-
Supplier: VOXMICRO
Description: .1 Data Transfer Rates Up to 1775Mbps (dynamic) Industrial Reference Based on Qualcomm reference design (Hastings) Communications Interface WLAN via PCI Express Standard 2.1 host I/O + Bluetooth via UART PIN mapping
-
Supplier: VOXMICRO
Description: .1 Data Transfer Rates Up to 1775Mbps (dynamic) Industrial Reference Based on Qualcomm reference design (Hastings) Communications Interface WLAN via PCI Express Standard 2.1 host I/O + Bluetooth via UART PIN mapping
Find Suppliers by Category Top
Featured Products Top
-
, including CompactPCI, COM Express, XMC, PrPMC, PMC, VME and AMC standards. X-ES products are used in a variety of commercial and industrial applications, such as: Semiconductor process equipment Aircraft simulators Industrial control Data centers (read more)
Browse Carrier Cards and Carrier Boards Datasheets for Extreme Engineering Solutions, Inc. (X-ES) -
redundancy) Up to 64 GB of NAND flash Hardware write protection for non-volatile memory XMC/PrPMC interface x4 PCI Express or Serial RapidIO or 10GbE XAUI fabric Fat Pipe P1.A fabric interconnect x4 PCI Express or Serial RapidIO Fat Pipe P1.B (read more)
Browse Single Board Computers (SBC) Datasheets for Extreme Engineering Solutions, Inc. (X-ES) -
consumption. Featuring Intel® Xeon® D-1500 family processors, four 10 Gigabit Ethernet ports on the data plane, two 10 Gigabit Ethernet ports on the control plane, and a configurable x16 PCI Express Gen3-capable expansion plane interface, the XCalibur4640 delivers enhanced performance (read more)
Browse Single Board Computers (SBC) Datasheets for Extreme Engineering Solutions, Inc. (X-ES) -
customers, application-specific carrier boards for standard module hosting?. KEY FEATURES (read more)
Browse Computer-on-Module (COM) Datasheets for SECO -
Rugged Systems High-performance, SWaP-C-optimized, rugged COTS embedded systems utilizing VPX, XMC/PMC, COM Express®, and cPCI modules to provide superior processing and networking performance in extreme (read more)
Browse Single Board Computers (SBC) Datasheets for Extreme Engineering Solutions, Inc. (X-ES) -
, including CompactPCI, COM Express, XMC, PrPMC, PMC, VME and AMC standards. X-ES products are used in a variety of commercial and industrial applications, such as: Semiconductor process equipment Aircraft simulators Industrial control Data centers (read more)
Browse Datasheets for Extreme Engineering Solutions, Inc. (X-ES) -
Communications X-ES provides a wide range of embedded computing products for communication applications. All of our embedded computing products are based on industry standards, including CompactPCI, COM (read more)
Browse Datasheets for Extreme Engineering Solutions, Inc. (X-ES) -
1GigE Vision area scan cameras, line scan cameras, and 3D profile sensors. Building on the field-proven technology and performance of Teledyne DALSA’s Xtium2 family of image acquisition boards, the new Xtium2-XGV PX8 is a half-length multi-port 10GigE frame grabber for PCI (read more)
Browse Frame Grabbers Datasheets for Teledyne DALSA -
memory module bay to host a removable PCI Express Solid-State Drive (SSD) flash memory module. The XPand6240 supports the rear I/O from the installed VPX modules with two 130-pin circular connectors. This fully ruggedized system is designed to meet the rigorous standards of MIL-STD-810 and DO (read more)
Browse VME, VPX, and VXI Bus Interfaces and Adapters Datasheets for Extreme Engineering Solutions, Inc. (X-ES) -
available I/O, such as multiple Gigabit Ethernet ports, multiple PCI Express ports, USB, and SATA, as well as ARM’s ultra-low power advantages, allow for an embedded processing solution without compromises. Proven Features Well-Suited for Embedded Applications ARM has long been (read more)
Browse Network Equipment Datasheets for Extreme Engineering Solutions, Inc. (X-ES)
More Information Top
-
G212 – CompactPCI® Serial PCIe® MiniCard Carrier
The G212 is a rugged single Eurocard CompactPCI® Serial carrier board supporting the PCI Express ® MiniCard standard or, as an option, the ExpressCard® standard.
-
F223 – 3U CompactPCI® PCIe® Mini Card Carrier for Wireless Functions
The F223 is a rugged single Eurocard CompactPCI® carrier board supporting the PCI Express ® Mini Card standard.
-
COM Express Design Guide
During the PCB layout of a COM Express Carrier Board, it is quite possible that the signals between the Modules connectors and the PCI Express device on the Carrier Board have to be crossed.
-
Pentek - Carrier Board Enables High-Performance Applications in the Emerging PCI Express Environment
Pentek, Inc., today released the 7800 series of high-performance I/O boards built upon a versatile half-length x8 PCI Express (PCIe) 2.0 carrier board .
-
Hot-plug based activation and deactivation of ATCA FRU devices
PCI Express connections on the prototype Carrier Board .
-
AMC PCIe 2.0 Protocol Analysis
The AMC Mezzanine Card Interposer for PCIe 2.0 is a specialty probe that makes it possible to analyze data traffic from an Advanced Mezzanine Card (AMC) that uses a PCI Express interface to connect to the carrier board system.
-
Fast ADC based multichannel acquisition system for the GEM detector
The back plane board has similar resources as the carrier board , in addition it contains the PCI Express switch connected to the main FPGA and the Mini-ITX board with dual core Atom processor.
-
Sub-nanosecond clock synchronization and trigger management in the nuclear physics experiment AGATA
When the event is accepted, the data are forwarded to the carrier board memory and hence, through a PCI express optical link, to the acquisition computer.
-
Universal communication module based on AMC standard
The LLRF system consists of a few ATCA carrier boards connected via available on the backplane PCI Express (PCIe) and RocketIO interfaces.
-
Distributed versus Centralized ATCA Computing Power
The mezzanine cards will communicate with a corresponding carrier board by means of available protocols such as PCI express and custom low latency links.