MEMS Packaging

[1] L.G.Vettraino, S.H. Risbud [ 2000 NEMI Technology Roadmaps (National Electronics Manufacturing Initiative, Inc., Herndon, VA, 2000)]
[2] L.G.Vettraino, S.H.Risbud [ IEEE Transactions Compon. Packag. Technol (USA) vol.22 (1999) p.270 81]
[3] J.Secrest [ Adv. Packag. (USA) vol.11 (2002) p.34 6]
[4] E.G.Stassinopoulos, J.P.Raymond [ Proc. IEEE (USA) vol.76 (1988) p. 1423 42]
[5] E.G.Mullen, G.Ginet, M.S.Gussenhoven, D.Madden [ IEEE Trans. Nucl. Sci. (USA) vol.45 (1998) p.2954 63]
[6] J.R.Srour, J.M.McGarrity [ Proc. IEEE (USA) vol.76 (1988) p. 1443 69]
[7] J.P.Raymond, E.L.Peterson [ IEEE Trans. Nucl. Sci. (USA) vol.34 (1987) p.1622 8]
[8] J.Canaris, S.Whitaker [presented at IEEE Custom Integrated Circuits Conf . 1995]
[9] J.Bourgoin, M.Lannoo vol. 35. New York: Springer-Verlag, 1983
[10] B.Gudehus, R.W.Tallon [ Prompt Dose Effects in Microelectromechanical Systems (AFRL Space Vehicles Directorate, Kirtland AFB, New Mexico, 2002)]
[11] L.P.Schanwald et al. [ IEEE Trans. Nucl. Sci. (USA) vol.45 (1998) p.2789 97]
[12] L.D.Edmonds, G.M.Swift, C.I.Lee [ IEEE Trans. Nucl. Sci. (USA) vol.45 (1998) p.2779 88]
[13] C.I.Lee, A.M.Johnston, W.C.Tang, C.E.Barnes, J.C.Lyke [ IEEE Trans. Nucl Sci . vol.43 (1996) p.3127 31]
[14] J.Wertz et al. [ Space Mission Analysis and Design (Microcosm, Inc 1992)]
[15] D.G.Morrison [ Electron. Des. (USA) (2002) p.54 6]
[16] J.Xie, M.Pecht, D.Denato, A.Hassanzadeh [ Microelectron. Reliab. (UK) vol.41 (2001) p.281 6]
[17] K.Gilleo [ Adv. Micro electron. (USA) vol.27 (2000) p.42 9]
[18] J.Lyke, J.Comtois, Micro-ZIF Insertion Socket , US Patent, #6,322,274, issued by the USPTO on 27th Nov. 2001
[19] B.Brox [in MEMS: Infrastructure...